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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
Table of Contents D
SEDONA_plus Sheet 1. COVER
Sheet 2 - 7. DIAGRAM (Block/Power) & ANNOTATIONS
Sheet 8. CLOCK GENERATOR
Sheet 9 - 11. YONAH667 / MEROM CPU(TBD)
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Sheet 12. THERMAL SENSOR / FAN CONTROL
Sheet 13 - 17. CALISTOGA-GMCH
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Sheet18. DDR II SODIMM
CPU :Intel Yonah667 Sheet19. DDR TERMINATION
Sheet20 - 23. ICH7-M
u ti
Chip Set :Intel Calistoga & ICH7-M Sheet24. FWH
Sheet25. ATI M56-P GRAPHIC CONTROLLER
Remarks : Mobility Platform
s n
C
Sheet29 - 30. VIDEO MEMORY
Sheet31. VIDEO S.S / T.S / LD CONN.
Sheet32. DVI CONTROLLER
Sheet33 - 34. CRT & SWITCH
Model Name
PBA Name
:
:
SEDONA_plus
MAIN
m e
a id
Sheet35 - 36. CARDBUS / 1394 / MEDIA CARD
Sheet37. EXPRESS CARD
Sheet38. MINE PCI EXPRESS & DMB
Sheet39. AUDIO CODEC(AD1986A)
S f
Sheet40. AUDIO AGC / AMP
PCB Code : BA41-00697A Sheet41. AUDIO WOPER & AUDIO CONNECTOR
Sheet42. HDD & ODD CONNEDTOR & REMOTE CNTR
Dev. Step : PV Sheet43. MICOM
Sheet44 - 45. LAN(Intel 82573EZ)
n
Revision : 1.0 Sheet46. MDC MODEM / USB0 / LAN CONN.
Sheet47. B'D TO B'D Connector B
o
T.R. Date : 2006/06/26 Sheet48. CHARGER
Sheet49. P1.5V_AUX, VCCP
Sheet50. MAIN DDR2 POWER
C
Sheet51. CPU VRM(VCC_CORE)
Sheet52. SWITCHED POWER
DRAW CHECK APPROVAL Sheet53. P3.3V_ALWS & P5.0V_AUX
Sheet54. GRAPHIC CORE POWER / P1.2V / P2.5V
Sheet55. HDD PARK, TPM, MOUNT HOLE
Sheet56. DOCKING CONNECTOR , SUPER I/O
Sheet57. USB BOARD
A
SAMSUNG
Owner : SEC Mobile R & D Signature : X ELECTRONICS
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU
D
Mobile Processor VRM System DC/DC D
PG 12
IMVP-6
Yonah - 2M Connector Graphic
CPU Charging Core
LCD Thermal (667MHz) PG 51
Circuit
30P Sensor
PG 12 L2 Cache : 2 MB PG 47 PG 53
PG 32 PG 9,10,11 478pin ITP
DDR II
CRT/TV
LVDS PSB PG 11 Thermistor
667 MT/S PG 16 DDR II Switche PWR
CRT VRM
PG 46
Ext. PEG
g l
External Graphics PG 52
PEG x16 DDR II PG 18 PG 50
Channel A (Standard)
ATI M56-P
TV PG 25 ~ 28
SODIMM 0
PG 46
GMCH-M Dual channel DDR II 667/533
n a
( to DCDC B'D ) PG 18
SVHS / HDTV
DDR II
Calistoga-GM Channel B (Reverse)
SODIMM 1
Video Memory
u ti
1466 FCBGA
64MB : K4D26323QG
128MB : K4D55323QF ANT
PG 34
PG 30 ~ 31 Internal Graphics
s n
LVDS PG 13 ~ 17 SD/xD/MS
C PG 34 C
CRT/TV Wireless LAN CARDBUS
Direct Media Interface CardBus
x4/x2, 1.5V R5C841 PG 34
Ext. - Int. Option EEPROM
Clocking Mini PCI CONN. R5532V002
PG 33
m e
CK-410M PG 34 ~ 35 1394
64 PIN CARDBUS Module PG 35
33MHz, 3.3V PCI 4 pin
PG 8
ANT
a id
PCIE x1 Lane 1 52P
USB 0,1,2,3
PG 45,46 USB 0,1,2,3 USB 6 Mini PCIE CONN. Wireless LAN
ANT PG 37
USB4 PG 37
PG 38
S f
Bluetooth
AUDIO PG 46
ICH7-M Golan
USB5
Audio PORT REPLICATOR 652 BGA PCIE x1 Lane 2 26P
AZALIA PG 55 AZALIA Primary USB 7 Express Card TBD
AMP PG 36
Codec PG 36
ALC880 12P
n
PG 39 PG 38
AZALIA
AZALIA Secondary
RJ11 MDC PG 20 ~ 23 PCI INTEL
B B
HP & SPDIF. Modem 82573EZ RJ45
o
PG 45
PG 45 PG 43~44
PG 40 MIC-IN PG 45
FWH
C
2P 2P
82802AC
PG 24
HDD SATA
PG 41
S-ATA
TPM PG 54
PG 46
SPKR R
Touch
Pri. IDE master PATA 3.3V LPC, 33MHz
MICOM PAD
PG 41
HDD Hitachi H8S
U-ATA 100
Pri. IDE slave
HD64F2169/2160
SPKR L KBD
PG 42 PG 46
A A
CD-ROM
PG 41 2ND HDD SAMSUNG
ELECTRONICS
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
Power Diagram
D KBC3_SUSPWR KBC3_PWRON KBC3_VRON VCCP3_PWRGD D
AC Adapter VCC_CORE
P1.05V_AUX P1.05V YONAH
CALISTOGA
(VCCP) ICH7-M
YONAH
ICH7-M
DOCK DC VDC * Made by ICH7-M Internal VR
(P3.3V_AUX, INTVRMEN high)
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*ICH7-M Sequence SODIMM (DDR II)
P1.8V_AUX P1.8V GPU (NV43M)
P1.05V_Sus GDDR
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P3.3V_Sus SODIMM (DDR II)
Battery DC CALISTOGA
P1.2V GPU (NV43M)
u ti
* Intel used 0.9V_AUX for DDR-2
(LT validation)
s n
P0.9V DDR II-Termination
C DDR II for PEG (TBD)
C
MICOM_P3V
ICH7-M PCMCIA HDD
MICOM CRT USB M_PCI
P5V_AUX P5V PS/2 PEG
m e
MICOM
R5C841 HEATSINK FAN CIRCUIT
DDR2 Power VRM
a id
PCMCIA
P12V R5C841
S f
CALISTOGA Thermal Sensor MICOM
ICH7-M SODIMM R5C841
P3.3V_ALWAYS P3.3V CK410-M FWH M_PCI
P3.3V_AUX SUPER I/O PCMCIA
PEG LEDs
LAN 82573L ICH7-M TPM LCD
LAN
MDC CALISTOGA
BT P2.5V ICH7-M
n
P2.5V_LAN R5C841
GPU(NV43M)
B B
LAN 82573L
o
P1.5V CALISTOGA VCCA YONAH
P1.2V_LAN ICH7-M P1.5V
GPU (NV43M)
C
LAN 82573L
Rail
+V*Always +V*AUX +V SUSPWR PWRON VRON
State GFX_CORE GPU NV43M : P1.0V - P1.2V
Full On ON ON ON ON ON ON
S3 ON ON OFF ON OFF OFF
S4 ON ON OFF ON OFF OFF
S5 ON OFF OFF OFF OFF OFF
S5 / S4 S3 S0
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER SEQUENCE Rev. 0.7
16
1 11) P3.3V
CLOCK 16) CLK3_PWRGD*
2 Thermal
D
3) RTC_PWR3.3V
VDC RTC 1-2) CHP3_RTCRST
Monitor CHIP 17 17) Clock Running
D
SI4435 Battery Sheet 12
Sheet 8
2) VDC Sheet 20 18) VRM3_CPU_PWRGD
Sheet47
3) P3.3V_ALWS
3) MICOM_P3V
3 P3.3V_LAN & P5V_AUX
16) CLK3_PWRGD*
13) KBC3_PWRGD
POWER RHU002N06 MAX 1999 CPU 16) VRM3_CPU_PWRGD
(KBC3_RST*)
(1/2) VRM 15) VCC_CORE
S/W 13) KBC3_PWRGD
P3.3V_AUX
14 15
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Sheet52 (MICOM_P3V)
Sheet 51
Sheet48
DC/DC B'd INTVRMEN
5 PWROK
19 CPU
n a
13 13) KBC3_PWRGD
5) POWER_SW*
VRMPWRGD
20) PLT3_RST* 19) CPU1_PWRGDCPU 19) CPU1_PWRGDCPU
19
20) PLT3_RST* 11) P1.5V
u ti
9 9) CHP3_SLPS5*/S3*
9 20 20) PCI3_RST* 12) P1.05V
21
KBC 8) KBC3_PWRBTN*
8
s n
Sheet 9-11
C 12) ICH_CORE (P1.05V) C
7) P3.3V_AUX
22) CPU1_CPURST*
7) P1.05V_AUX
10) KBC3_PWRON 10-1) KBC3_VRON 11) P2.5V 11) P2.5V Sheet 13 - 17
10 11) P3.3V 11) P1.5V
ICH7-M
m e
6) KBC3_SUSPWRON 20) PLT3_RST* GMCH
6 Sheet 20-23
20 7) P1.8V_AUX
KBC Sub B'd 7
a id
11) P0.9V
P1.5V & VCCP 11) P1.5V
12 18
S f
12) P1.05V (VCCP) 12) MCH_CORE
10) KBC3_PWRON SC1485 1.5V_AUX_PWRGD
14) VCCP3_PWRGD 11) P3.3V
Sheet 49
10-1) KBC3_VRON
P5V_AUX_PWRGD P5V_AUX & P3V_AUX
6) KBC3_SUSPWRON
DDR2
MAX 1999 7) P5V_AUX
DDR2 POWER 7) P1.8V_AUX 7) P1.8V_AUX
Memory
n
3 (2/2) SC486
11) 0.9V ( or 7) 0.9V_AUX ) 11) P0.9V
Sheet 18 - 19
B
3) P3.3V_ALW
Sheet48
7 11) P5V
B
1.8V_AUX_PWRGD 20) PLT3_RST*
o
Sheet 50
6) KBC3_SUSPWRON 11) P1.8V
3) P3.3V_ALW 11 NV43M
FDS6680 7) P3.3V_AUX
7) P5V_AUX 11) P2.5V
Ext.GPU
C
11) P5V
DC/DC B'd
7 10) KBC3_PWRON* FDS4465
Sheet 52 11) GFX_CORE
3) P3.3V_ALW 7) P3.3V_AUX
11) P3.3V 11) P1.2V
10) KBC3_PWRON* FDS6680A Sheet 25 - 28
4) P2.5V_ALW Sheet 46 Sheet 52
4
7) P3.3V_AUX 11) P2.5V 11) P1.8V GDDR
LOM 4) P2.5V_ALW 7) P1.8V_AUX Sheet 30 - 31
SC338A
82573EZ 10) KBC3_PWRON
Sheet 52 11) P3.3V
Sheet 43-44
4) P1.2V_ALW
7) P1.8V_AUX 11) P1.8V MiniPCI
10) KBC3_PWRON FDS6680A 20) PCI3_RST* CardBus
Sheet 52 Sheet 34-35
A 2) VDC Ext. GPU CORE 11 A
LTC1778 11) GFX_CORE SAMSUNG
ELECTRONICS
10) KBC3_PWRON
10 Sheet 53
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
POWER RAILS ANALYSIS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. Rev. 0.7 S0 - S5
S0 - S3
OFF IN S3 - S5
D