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GSM TELEPHONE
SGH-D820
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting
This Service Manual is a property of Samsung Electronics Co.,Ltd. Samsung Electronics Co.,Ltd. March. 2006
Any unauthorized use of Manual can be punished under applicable Printed in Korea.
International and/or domestic law.
Code No.: GH68-09648A
BASIC.
1. Specification
1-1. GSM General Specification
GSM900 EGSM 900 DCS1800
GSM850 PCS1900
Phas e 1 Phas e 2 Phas e 1
Fr eq.
824~849 890~915 880~915 1710~1785 1850~1910
Ba nd[MHz]
869~864 935~960 925~960 1805~1880 1930~1990
Uplink/ Downli nk
0~124 &
ARFCN r ange 128~251 1~124 512~885 512~810
975~1023
Tx/ Rx s pacing 45MHz 45MHz 45MHz 95MHz 80MHz
Mod. Bit r ate 270.833kbps 270.833kbps 270.833kbps 270.833kbps 270.833kbps
/ Bit Pe r iod 3.692us 3.692us 3.692us 3.692us 3.692us
Ti me Slot
576.9us 576.9us 576.9us 576.9us 576.9us
Per iod
4.615ms 4.615ms 4.615ms 4.615ms 4.615ms
/ Frame Peri od
Modulat ion 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 5pcl ~ 19pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl
Sensit ivit y -102dBm - 102dBm - 102dBm - 100dBm - 100dBm
TDMA Mux 8 8 8 8 8
Cell Radius 35Km 35Km 35Km 2Km 2Km
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Specification
1-2. GSM TX power class
TX Power TX Power TX Power TX Power
control GSM850 control GSM900 control DCS1800 control PCS1900
level level level level
5 33±3 dBm 5 33±3 dBm 0 30±3 dBm 0 30±3 dBm
6 31±3 dBm 6 31±3 dBm 1 28±3 dBm 1 28±3 dBm
7 29±3 dBm 7 29±3 dBm 2 26±3 dBm 2 26±3 dBm
8 27±3 dBm 8 27±3 dBm 3 24±3 dBm 3 24±3 dBm
9 25±3 dBm 9 25±3 dBm 4 22±3 dBm 4 22±3 dBm
10 23±3 dBm 10 23±3 dBm 5 20±3 dBm 5 20±3 dBm
11 21±3 dBm 11 21±3 dBm 6 18±3 dBm 6 18±3 dBm
12 19±3 dBm 12 19±3 dBm 7 16±3 dBm 7 16±3 dBm
13 17±3 dBm 13 17±3 dBm 8 14±3 dBm 8 14±3 dBm
14 15±3 dBm 14 15±3 dBm 9 12±4 dBm 9 12±4 dBm
15 13±3 dBm 15 13±3 dBm 10 10±4 dBm 10 10±4 dBm
16 11±5 dBm 16 11±5 dBm 11 8±4dBm 11 8±4dBm
17 9±5 dBm 17 9±5 dBm 12 6±4 dBm 12 6±4 dBm
18 7±5 dBm 18 7±5 dBm 13 4±4 dBm 13 4±4 dBm
19 5±5 dBm 19 5±5 dBm 14 2±5 dBm 14 2±5 dBm
15 0±5 dBm 15 0±5 dBm
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2. Circuit Description
2-1. SGH-D820 RF Circuit Description
2-1-1. RX PART
- FRONT END MODULE(ANTENNA SWITCH MODULE + RX SAW FILTER) (F101)
It performs to switch Tx & Rx paths for GSM850, GSM900, DCS1800 and PCS1900 with logic controls below.
- FEM Control Logic Table
FESW1 FESW2 FESW2
Tx Mode (GSM850/900) H L L
Tx Mode (DCS1800/1900) L H L
Rx Mode (GSM900/850) L L L
Rx Mode (DCS1800) L L L
Rx Mode (PCS1900) L L H
- VC-TCXO (TCX100)
This module generates the 26MHz reference clock to drive the logic and RF systems.
It is turned on when the supply voltage (+VCC_SYN) is applied.
After buffering, the 26MHz reference clock is supplied to the other parts of the system through the transceiver pin
CLKOUT.
- Transceiver (U102)
This chip is fully integrated GSM & GPRS quad-band transceiver with RF VCO, loop filters and most of the
passive components required in it.
It also fully integrated fractional N RF synthesizer with AFC control possibility, RF VCO with integrated supply
regulator. Semi integrated reference oscillator with integrated supply regulator.
RF Receiver front-end amplifies the E-GSM900(GSM850), DCS1800 and PCS1900 aerial signal, convert the chosen
channel down to a low IF of 100kHz.
In IF section, further amplifies the wanted channel, performs gain control to tune the output level to the desired value and
rejects DC.
2-1-2. TX PART
The transmitter is fully differential using a direct up conversion architecture. It consists of a signal side band
power up mixer. Gain is controlled by 6 dB via 3-wire serial bus programing. The fully integrated VCO and power
mixer achieve LO suppression, quadrature phase error, quadrature amplitude balance and low noise floor specification.
Output matching/balun components drive a standard 50 ohms single ended load.
2-1
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Circuit Description
2-2. Baseband Circuit description of SGH-D820
2-2-1. PCF50603 (U400)
- Power Management
Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal
system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,
while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions,
such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system
complexity.
I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor
full control of the PCF50603 and enables system designers to maximize both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable
system design. These functions work together to ensure proper system behavior during start-up or in the event of a
fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
- Pulse-Width Modulator
The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) to modulate the
intensity of a series of LED's or to control a DC/DC converter that drives LCD backlight.
This phone is using PWM control to modulate the LCD backlight brightness.
- Clock Generator
The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator
provides an accurate low clock frequency for the PCF50603 and other circuitry.
2-2-2. LCD
D820 has just one 2.12" TFT LCD. 16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. There are
couple of control signals such as RS, LCD_MAIN_CS, L_WRB, etc. RS stands for "Register Select pin." When RS = 0,
data can be written to the index register or status can be read, and when RS = 1, an instruction can be issued or data
can be written to or read from RAM. Read or write operation is selected according to L_WRB signals. The data is
received when the R/W bit is 0, and is transmitted when the R/W bit is 1. At the falling edge of LCD_MAIN_CS
input, serial data transfer is initiated. On the other hand, at the rising edge of LCD_MAIN_CS input, the data
transfer is ceased.
2-2-3. Key
Key recognition part is consisted of 8 ports from PCF5213EL1. KEY_ROW(0:4) & KEY_COL(0:4)
These signals performs with the matrix. Any input from the matrix informs the key status to key interface in the
PCF5213EL1. Power on/off key is independent of the matrix. Therefore, 'power on/off' signal is directly connected with
PCF50603 to turn PCF50603 on.
Two 3.3V LDOs(U716, U823) enable Main and Sub Key LED on. Main and Sub Key LED are controlled by
KEYLED_ON and SLIDER_KEY_ON signal respectively.
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Circuit Description
2-2-4. EMI ESD Filter (F500)
This system uses the EMI ESD filter (F500) to protect the device from noises from IF CONNECTOR part.
2-2-5. IF connetor (IFC500)
It has 20-pin. They are designed to allocate not only 'power and data lines'(VBAT, V_EXT_CHARGE, USB_D+, +VBUS,
USB_D-, TXD1, RXD1, AUX_ON, EXT1, EXT2 and GND) but also Earphone lines(EAMMIC_P/N, EARSPK_R/L,
EAR_SWITCH, EARSPK_COM and EAR_ADC). They connected to power supply IC, microprocessor, signal processor IC
and Earphone.
2-2-6. Battery Charge Management
D820 has a complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries inside.
If Travel Adapter is connected, "V_EXT_CHARGE" begins to provide the charger IC (to battery) with power (current).
When the charging operation is done, "END_OF_CHG" informs it to PCF5213EL1 to stop the operation. "CHG_ON"
signal enables the charger IC to operate in adequate circumstances.
2-2-7. Audio - Part
D820 has several audio-outputs such as stereo speaker, receiver, earphone, etc. HFR P/N signals from CPU are connected
to the receiver. MIC_CP/N are connected to the main MIC and MIC_CP2/N2 as well.
SAPA1D2 is a Class-D amplifier for outputting sounds that are used by mobile phones including MP3 playback, melodies,
voice output on speaker phone mode and so on..
STG3699(U515) is an analog switch to connect SAPA1D2 input port to main DSP or CODEC Chip.
2-2-8. Memory (UME307)
D820 has KBH10PD00M-D414 as a memory module.
The KBH10PD00M-D414 is a Multi Chip Package Memory which combines 256Mbit Synchronous Burst Multi Bank NOR
Flash Memory and 1Gbit OneNAND Flash and 256Mbit Synchronous Burst UtRAM.
It has 16 bit data line, HD[0~15] which is connected to PCF5213 and CL8522S5(Multi-media chip), also has 24 bit
address lines, HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS1n_RAM, and CS4n_NAND.
In the writing process, WEn is fallen to low and it enables writing process to operate. During reading process,
OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choose
different types of memory.
2-2-9. PCF5213EL1 (UCP200)
The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn
DSP core with embedded RAM and ROM, and a set of peripherals. It has 24k×16 bits PRAM, 104k×16 bits,
32k×16 XYRAM and 63k×16 XYROM in the DSP.
The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,
tightly-coupled ITCM (Instruction Tightly Coupled Memory) and DTCM (Data Tightly Coupled Memory) memories, a
memory protection unit, and an AMBA (Advanced Microcontroller Bus Architecture) AHB (Advanced High-performance
Bus) bus interface with a write buffer. HD(0:15), data lines and HA(0:23), address lines are connected to
KBH10PD00M-D414(memory) and CL8522S5(Multi-media chip)
. It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap loader in the ARM core.
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Circuit Description
HD(0:15), data lines and HA(0:23), address lines are connected to memory and CL8522S5 to communicate.
ARM core and DSP core. OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input
status. It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM
and DSP core. ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.
2-2-10. TCO-5871U (TCX100, 26MHz)
This system has the 26MHz TCXO, TCO-5871U from Toyocom. AFC controlling signal form PCF5213EL1 controls
frequency from 26MHz X-tal. It generates the clock frequency. This clock is connected to PCF5213EL1 and UAA3587.
2-2-11. CL8522S5 (U303)
CL8522S5 provides rich video functions up to 30-frame display with minimized tasks in the handset main processor
as well as hardware based real-time JPEG compression and decompression. CL8522S5 directly transmits and previews
the RGB data to the LCD graphic memory by processing the sensor output data according to the handset's command.
It can save the raw RGB data up to VGA resoultion into its image buffer and allows the host processor to download
with scalable sized compressed data. It also provides I2S data bus to playback MP3 formatted data.
It utilizes 16 bit data bus for communication with the main processor, including bus interface types.
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3. Exploded View and its Parts list
3-1. Exploded View
QFL01
QMW02
QVO02 QAN06
QVO09 QAN02
QSP01
QCR06
QFU01 QCR09
QSP02
QMO01
QHI01
QKP01
QKP02
QVK06
QLC01
QMI01
QSH01
QME01
QCH04 QMP01
QCA01 QVK01
QCH10
QCR06
QCW01
QCH05
QRE01
QSC11
QSC12 QIF01
QCR26 QRF01
QCR12
QCR17
QBA01
QPC01
QBA00
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Exploded view and its Part list
3-2. Parts List
Location NO. Description SEC CODE
QAN06 MEC-TAPE ANTENNA RUBBER GH75-08483A
QAR01 AUDIO-RECEIVER 3009-001178
QBA00 MEC-BATTERY COVER GH75-08553A
QBA01 INNER BATTERY PACK-800MAH,BLAC GH43-02098A
QCA01 UNIT-CAMERA GH59-02787B
QCH04 MEC-CAMERA UPPER GH75-08984A
QCH10 MEC-CAMERA LOWER GH75-08107A
QCR06 SCREW-MACHINE 6001-001155
QCR09 SCREW-MACHINE 6001-001670
QCR12 SCREW-MACHINE 6001-001530
QCR17 SCREW-MACHINE 6001-001460
QCR26 SCREW-MACHINE 6001-001850
QCW01 PCT-CAMERA WINDOW GH72-25223A
QFL01 MEC-FRONT SLIDER LOWER GH75-08922A
QFU01 MEC-SLIDER UPPER GH75-09284A
QHI01 MEC-HINGE(CAMERA) GH75-06936A
QKP01 MEC-KEYPAD MAIN(EU/IKA) GH75-08928A
QKP02 MEC-KEYPAD SUB GH75-08927A
QLC01 ELA ETC-SGHD820 SUB LCD ASSY GH96-02105A
QME01 UNIT-METAL DOME(SUB) GH59-02384A
QMI01 MICROPHONE-ASSY GH30-00220A
QMP01 PBA MAIN-SGHD820 GH92-02534A
QMW02 PCT-MAIN WINDOW GH72-25222A
QPC01 MEA-SLIDER FPCB KIT GH97-05501A
QRF01 PMO-RF COVER GH72-25131A
QSC11 PMO-S/LOWER SCREW CAP R GH72-26494A
QSC12 PMO-S/LOWER SCREW CAP L GH72-26493A
QSH01 MEC-SHIELD CAN GH75-09439A
QVK01 UNIT-VOLUME KEY GH59-02935A
QVK06 UNIT-KEYPAD FPCB(MAIN) GH59-02379A
QVO02 PMO-KEY VOLUME GH72-24204A
QVO09 NDC-VOLUME KEY COVER GH71-05436A
QSP01 UNIT-SPK MOT INTENNA MODULE GH59-02915A
QAN02 INTENNA-SGHD820 GH42-00767A
QSP02 UNIT-MODULE SPEAKER GH59-02851A
QMO01 MOTOR DC-SGHT809 GH31-00196A
QRE01 MEC-REAR COVER GH75-08929A
QCH05 PMO-T FLASH COVER V3 GH72-26991A
QIF01 PMO-IF COVER V4 GH72-26995A
3-2
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Exploded view and its Part list
Description SEC CODE
BAG PE 6902-000297
BAG PE 6902-000378
CBF INTERFACE-AV CABLE GH39-00442A
CBF INTERFACE-DATA LINK CABLE GH39-00444A
ADAPTOR-SGHD800 TA(EU) GH44-01060A
S/W CD-SAMSUNG PC STUDIO GH46-00191A
UNIT-EARPHONE GH59-02499A
LABEL(P)-IMEI GH68-01335D
LABEL(P)-WATER SOAK GH68-02026A
MANUAL-USER GH68-08207A
LABEL(R)-SGHD820(EU) GH68-08973A
BOX(P)-UNIT MAIN GH69-03456A
BOX(P)-SLIP CASE(EU) GH69-03553A
MPR-BOHO VINYL LCD CONN GH74-15350A
MPR-TAPE MAIN WINDOW GH74-17833A
MPR-TAPE SUB INSULATION GH74-17843A
MPR-TAPE SUB INSULATION GH74-17843A
MPR-TAPE MAIN CONNECTOR GH74-17844A
MPR-TAPE RF COVER GH74-17845A
MPR-TAPE EL FIXED GH74-18873A
MPR-TAPE HOT BAR FIXED GH74-18878A
MPR-BOHO VINYL INPUT BEF GH74-18886A
MPR-BOHO VINYL INPUT AFT GH74-18887A
MPR-TAPE VOLKEY SOLDER GH74-18904A
MPR-BOHO VINYL KEYPAD GH74-19130A
MPR-BOHO VINYL M/KEYPAD GH74-19246A
MPR-TAPE SUB MIC SOLDER GH74-19264A
MPR-TAPE LCD FPVB SUB 2 GH74-21187A
MPR-TAPE LCD FPCB MAIN 1 GH74-21189A
MPR-VINYL BOHO MAIN WIN FINAL GH74-21556A
MPR-TAPE LCD ESD 1 GH74-21557A
MPR-TAPE LCD ESD 2 GH74-21558A
MPR-TAPE SUB CONNECTOR 2 GH74-21559A
MPR-TAPE LCD HOT BAR 2 GH74-21560A
MPR-GASKET MAIN CONN 2 GH74-22079A
MPR-VINYL BOHO WIN DUST GH74-22082A
MPR-TAPE EMI 1 GH74-22084A
3-3
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Exploded view and its Part list
3-3.Disassembling Procedure
1 2
Open the rear case with Put the disassembly tool
your finger on lower end of rear
case
Remove the 3 screws on rear case & Volume
Do not disassemble the phone by compulsion
Key
3 4
Remove the Antenna & Audio part by
tweezer
Remove the 4 screws on Antenna & Audio When remove the Antenna part, make
Parts ensure the Vibrator part carefully
5 6
When you remove the FPCB, you must pull up
the actuator
Remove the Main PCB and Key pad then
Slide up then remove the green tape
remove the 2 screws
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7 8
Make a Slide up, then remove the 4 screws Disassemble the Slide Part
9 10
Remove the green tape then remove the FPCB
Before disassemble the Camera part, remove the When you remove the FPCB, first pull up the
green tape actuator then removethe FPCB
11 12
Before disassemble the slider PCB, remove When you remove the audio part, using a
the Receiver part removal hole by tweezer
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13
When you disassemble the slide part, push
the slide part to the upper end
3-6
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3-4. Assembling Procedure
1 2
Check the guide holes for The lower part of dome sheet should
dome sheet be attached on the rear side of PCB
3 4
Soldering
Point
Solder the sub_microphone guided by Adhere the non-conductive tape on
it's soldering point the soldering point of SUB_MIC
5 6
.Check the guide hole on right Check the Hot Bar, Backlight FPCB,
position Heat seal and Guide poles
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7 8
Check the guide hole on right Adjust between each corners of LCD
position module and Guiding edges on PCB
9 10 GUIDE MARK
Be careful of two guide marks on
Solder the backlight FPCB
soldering process
11 12
Guide hole
NG
OK
Receiver's FPCB should be parallel to
Solder the Receiver on PCB
the PCB
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13 14
Adhere the non-conductive tape on Adhere the non-conductive tape on
left side of PCB the charger pump
15 16
Adhere the non-conductive tape on Adhere the non-conductive tape on
Hot-bar backlight FPCB
17 18
Solder and bond the vibrator's wire Paste the Bluetooth Ant. on the right
and bend it on picture's direction side Speaker
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19 20
Higher side
Push lightly
Lower side
Solder the side key FPCB. Adjust the
PCB outline and be careful of Insert the rubber for intenna contact
electrical shortage.
21 22
Rubber should be place on aligned Adhere the non-conductive tape on
position on the red line the solder point of side key
23 24 Bending point
of FPCB (the
form of 'U')
This point
should not be
bended
Bend the SPK FPCB The bending point of SPK FPCB
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25
Check the white Push & Paste
silk line
Check the alignment between FPCB
Remove the protection cover
and white silk line
26
Adhere the non-conductive tape on Check the alignment between FPCB
FPCB connector of Sub PCB and white silk line
27 28
Put the Sub Key Pad on the slide Remove the protection tape on LCD
upper case window
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29 30
Insert the receiver and Sub MIC into Put the sub PBA assy. on the slide
each holder on the slide upper case upper case
from '2' to '1'
direction
31 32
1 2
Wind the FPCB twice
Insert the camera module on the
Wind the camera's FPCB on the its
fron case
hinge
(put on the camera's hinge first)
33 34
Adhere the non-conductive tape on Pull out the Main FPCB through the
the cameras FPCB slider case's hole(red circle)
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35 36
Push the slide lower to the slide If there is no problems until now,
upper's direction the current state will be like this
37 38
SCREW SCREW
HOLE HOLE
Screw down the upper's 4 points Screw down the lower's 2 points
39
Insert the screw cap Be careful of each direction
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shield can's
40 MAIN KEY PAD's GUIDE HOLE 41
guide line
Put the main key pad on the front Place the shield can over the main
case key pad
42 43
Confirm the
alignment
Confirm the bending state of Main Push the main FPCB into the Main
FPCB connector
Push the whole parts
44 45 Push the middle of actuator
of FPCB equaly
first and the both sides later
2 1 2
Insertion guide Insertion guide II ;
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46 47
Adhere the non-conductive tape on Adhere the gold gasket over the non-
the Main connector of Main PCB conductive tape
48 49
Bending line should be aligned with If the other point is bent, the critical
the red line display error will be occurred
50 51
Bend and push the side key FPCB Put the Main PCB on the shield can
into the front case in the order described above
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52 53
Insert the shield can's connector Insert the Speaker's connector
54 55
Reference position of the vibrator's Bend as the form of 'U' and push the
wire SPK's FPCB into the inner space
56 57
SCREW
The picture of side key FPCB on
Screw down the side key's holder
normal condition
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58 59
Two red circles' point should be
Screw down on each 4 points of
inserted first at the rear case
intenna module
assembly procedure
60 61
SCREW
Push each 5 points sufficiently Screw down on the last 2 points
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3-5. Slide FPCB KIT Assembling Procedure
- Sub PCB Part
1 2 Check the white 3
Push & Paste
silk line
1. Check the condition of FPCB and remove the protection cover of Sub PCB
2. Check the alignment between FPCB and white silk line
3. Push and Paste evenly by pushing tool
4 5 6
4. Adhere the non-conductive tape on FPCB connector of Sub PCB
5. Check the condition of attachment
6. Bend the FPCB upward and check the alignment between FPCB and
white silk line
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- Main PCB Part
7 8
Confirm the bending state of FPCB Remove the protection cover
9 10
Confirm the
alignment
Push the main FPCB into the Main
Push the whole parts of FPCB
connector and confirm the alignment
equally
with - line
11 12 The tape should cover
this audio chip
2 1 2
Push the middle of actuator first and Adhere the non-conductive tape on
the both sides later the Main connector of Main PCB
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13
The gold gasket should
not exceed this non-
conductive tape
Adhere the gold gasket over the non- Bending line should be aligned with
conductive tape the red line
14
Important :
If the other point is bent, the critical
display error will be occurred
3-20
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Exploded view and its Part list
3-6. LCD KIT Assembling Procedure
1 2
2
4
1
3
1. Remove the double-sided tape on
Sub PCB by tweezer.
2. Align the guide holes on hot bar
Check the (1)Hot Bar, (3) Backlight FPCB with guide silk on Sub PCB.
FPCB, (2) Heat seal and (4)Guide
3. Paste the flux evenly on the
poles
solder PAD .
4. Solder by the soldering iron
5. Check the soldered condition
3
OK NG
FILLET should be formed
Check the condition of HOT BAR by a magnifying glass
3-21
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Exploded view and its Part list
4 5
1. Remove the double-sided tape on
bottom side of LCD by tweezer 1. Attach the LCD module after
inserting the back light FPCB first
2. Adjust between each corners of
2. LCD module should be attached
LCD module and Guiding edges on
closely on Sub PCB
PCB 3. Check the LCD's GUIDE POLE
3. Pay attention the Hot bar not to fitting on the guide groove on Sub
be bent when you remove the PCB
tape by tweezer
6 7 GUIDE MARK
1. Remove the cover of double-sided
1. Pay attention the backlight FPCB
tape beside the soldering pad by
not to be cracked
tweezer
2. Do not paste the Flux too much
2. Adjust the end of Backlight FPCB's
3. Be careful of two guide marks on
Land with the guide mark on PCB
soldering process
3. Paste the flux on the solder land
3-22
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Exploded view and its Part list
8 9
Check the Guide hole
NG
OK
1. Solder the Receiver
1. Check the soldered position
(Temp. recommend : 350 ~ 380)
2. Check the short/open condition
2. Soldering time : within 3 sec.
10 11
Adhere the non-conductive tape on Adhere the non-conductive tape on
left side of PCB the charger pump
12 13
Adhere the non-conductive tape on Adhere the non-conductive tape on
Hot-bar backlight FPCB
3-23
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Exploded view and its Part list
3-7. Test Jig (GH80-03306A) 3-7-1. USB JIG Cable
3-7-2. RF Test Cable 3-7-3. Test Cable 3-7-4. Serial Cable
(GH39-00397A) (GH39-00459A) (CSA LL64151-A)
3-7-5. Power Supply Cable 3-7-6. DATA CABLE 3-7-7. TA
(GH39-00444A) (GH44-01060A)
3-24
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4. Electrical Parts List
DESIGN LOC DESCRIPTION SEC CODE STATUS
ANT101 NPR-ANTENNA CONTACT GH71-05796A SA
ANT102 NPR-ANTENNA CONTACT GH71-05796A SA
BAT409 BATTERY-LI(2ND) 4302-001181 SA
BTC600 CONNECTOR-BATTERY 3711-006003 SA
C102 C-CER,CHIP 2203-003054 SA
C103 C-CER,CHIP 2203-001259 SA
C105 C-CER,CHIP 2203-000812 SA
C106 C-CER,CHIP 2203-000812 SA
C107 C-CER,CHIP 2203-000854 SA
C109 C-CER,CHIP 2203-001201 SA
C112 C-CER,CHIP 2203-000812 SA
C114 C-CER,CHIP 2203-000233 SA
C116 C-CER,CHIP 2203-002709 SA
C118 C-CER,CHIP 2203-000812 SA
C121 C-CER,CHIP 2203-000425 SA
C122 C-CER,CHIP 2203-000425 SA
C124 C-CER,CHIP 2203-000233 SA
C126 C-CER,CHIP 2203-002668 SA
C127 C-CER,CHIP 2203-006120 SA
C131 C-CER,CHIP 2203-006120 SA
C134 C-CER,CHIP 2203-000233 SA
C135 C-CER,CHIP 2203-000254 SA
C136 C-CER,CHIP 2203-000330 SA
C138 C-CER,CHIP 2203-000812 SA
C139 C-CER,CHIP 2203-000854 SA
C141 C-CER,CHIP 2203-000995 SA
C142 C-CER,CHIP 2203-000995 SA
C147 C-CER,CHIP 2203-002709 SA
C148 C-CER,CHIP 2203-000654 SA
C152 C-CER,CHIP 2203-000812 SA
C157 C-CER,CHIP 2203-000995 SA
C160 C-CER,CHIP 2203-005682 SA
C161 C-CER,CHIP 2203-005050 SA
C162 C-CER,CHIP 2203-005050 SA
C163 C-CER,CHIP 2203-000812 SA
C165 C-CER,CHIP 2203-000854 SA
C166 C-CER,CHIP 2203-000359 SA
C201 C-CER,CHIP 2203-006194 SA
C202 C-CER,CHIP 2203-006423 SA
C203 C-CER,CHIP 2203-006423 SA
C204 C-CER,CHIP 2203-006423 SA
C205 C-CER,CHIP 2203-006423 SA
C206 C-CER,CHIP 2203-006423 SA
C207 C-CER,CHIP 2203-006423 SA
C208 C-CER,CHIP 2203-006423 SA
C209 C-CER,CHIP 2203-006423 SA
C210 C-CER,CHIP 2203-006562 SA
C211 C-CER,CHIP 2203-006423 SA
C212 C-CER,CHIP 2203-006423 SA
C213 C-CER,CHIP 2203-006423 SA
4-1
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Electrical Parts List
DESIGN LOC DESCRIPTION SEC CODE STATUS
C218 C-CER,CHIP 2203-006048 SA
C219 C-CER,CHIP 2203-006423 SA
C221 C-CER,CHIP 2203-005682 SA
C301 C-CER,CHIP 2203-006048 SA
C302 C-CER,CHIP 2203-000254 SA
C303 C-CER,CHIP 2203-006423 SA
C304 C-CER,CHIP 2203-006423 SA
C305 C-CER,CHIP 2203-006423 SA
C306 C-CER,CHIP 2203-006423 SA
C307 C-CER,CHIP 2203-000330 SA
C308 C-CER,CHIP 2203-000330 SA
C309 C-CER,CHIP 2203-006048 SA
C317 C-CER,CHIP 2203-006562 SA
C318 C-CER,CHIP 2203-006562 SA
C319 C-CER,CHIP 2203-006838 SA
C320 C-CER,CHIP 2203-006562 SA
C321 C-CER,CHIP 2203-006562 SA
C325 C-CER,CHIP 2203-006048 SA
C326 C-CER,CHIP 2203-005659 SA
C328 C-TA,CHIP 2404-001240 SA
C329 C-TA,CHIP 2404-001088 SA
C330 C-CER,CHIP 2203-006562 SA
C331 C-CER,CHIP 2203-006562 SA
C350 C-CER,CHIP 2203-006324 SA
C401 C-CER,CHIP 2203-006562 SA
C402 C-CER,CHIP 2203-006838 SA
C403 C-CER,CHIP 2203-006824 SA
C405 C-CER,CHIP 2203-006048 SA
C406 C-CER,CHIP 2203-006257 SA
C407 C-CER,CHIP 2203-000550 SA
C408 C-CER,CHIP 2203-000550 SA
C411 C-CER,CHIP 2203-000812 SA
C412 C-CER,CHIP 2203-006824 SA
C413 C-CER,CHIP 2203-006257 SA
C414 C-CER,CHIP 2203-006824 SA
C415 C-CER,CHIP 2203-006257 SA
C418 C-CER,CHIP 2203-006824 SA
C419 C-CER,CHIP 2203-006048 SA
C422 C-CER,CHIP 2203-006824 SA
C423 C-CER,CHIP 2203-006824 SA
C424 C-CER,CHIP 2203-006257 SA
C425 C-CER,CHIP 2203-006257 SA
C426 C-CER,CHIP 2203-000233 SA
C429 C-CER,CHIP 2203-006257 SA
C430 C-CER,CHIP 2203-006708 SA
C501 C-CER,CHIP 2203-006048 SA
C504 C-CER,CHIP 2203-001412 SA
C505 C-CER,CHIP 2203-006048 SA
C508 C-CER,CHIP 2203-000278 SA
C509 C-CER,CHIP 2203-001437 SA
4-2
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Electrical Parts List
DESIGN LOC DESCRIPTION SEC CODE STATUS
C511 C-CER,CHIP 2203-005050 SA
C512 C-CER,CHIP 2203-001259 SA
C514 C-CER,CHIP 2203-006048 SA
C516 C-CER,CHIP 2203-001437 SA
C518 C-CER,CHIP 2203-000278 SA
C519 C-CER,CHIP 2203-001153 SA
C520 C-CER,CHIP 2203-005281 SA
C521 C-CER,CHIP 2203-006048 SA
C522 C-CER,CHIP 2203-006648 SA
C538 C-CER,CHIP 2203-006562 SA
C539 C-CER,CHIP 2203-005344 SA
C541 C-CER,CHIP 2203-006047 SA
C542 C-CER,CHIP 2203-005344 SA
C544 C-CER,CHIP 2203-005481 SA
C545 C-CER,CHIP 2203-006047 SA
C546 C-CER,CHIP 2203-005481 SA
C550 R-CHIP 2007-000148 SA
C551 R-CHIP 2007-000148 SA
C552 R-CHIP 2007-000148 SA
C553 R-CHIP 2007-000148 SA
C554 C-CER,CHIP 2203-005344 SA
C555 C-CER,CHIP 2203-006562 SA
C556 C-CER,CHIP 2203-006048 SA
C558 C-CER,CHIP 2203-006562 SA
C559 C-CER,CHIP 2203-005344 SA
C563 C-CER,CHIP 2203-000854 SA
C564 C-CER,CHIP 2203-003054 SA
C566 C-CER,CHIP 2203-006048 SA
C567 C-CER,CHIP 2203-000812 SA
C568 C-CER,CHIP 2203-000812 SA
C569 C-CER,CHIP 2203-000627 SNA
C570 C-CER,CHIP 2203-000627 SNA
C571 C-CER,CHIP 2203-000386 SA
C600 C-CER,CHIP 2203-005779 SA
C601 C-CER,CHIP 2203-006562 SA
C602 C-CER,CHIP 2203-006626 SA
C604 C-CER,CHIP 2203-006048 SA
C605 C-CER,CHIP 2203-006048 SA
C606 C-CER,CHIP 2203-006048 SA
C607 C-CER,CHIP 2203-002443 SA
C608 C-CER,CHIP 2203-006562 SA
C609 C-CER,CHIP 2203-006562 SA
C610 C-CER,CHIP 2203-006048 SA
C611 C-CER,CHIP 2203-006048 SA
C613 C-CER,CHIP 2203-006562 SA
C615 C-CER,CHIP 2203-006838 SA
C617 C-CER,CHIP 2203-006562 SA
C618