| T1 | 1,544 Mb/s |
| T3 | 44,736 Mb/s |
| Ta | Tantalum |
| TAB | Technical Advisory Board; Tape automated bonding |
| TAFF | Thermally Activated Flux Flow |
| TAP | Tool Application Program |
| TAS | Trace analysis system |
| TAT | Turnaround time |
| Tb | Terbium |
| TB | Tight Binding |
| TBA | Tertiary-Butyl Arsine |
| TBAH | Tetrabutylammonium hydroxide |
| TBC | Time-based competitiveness |
| TBP | Tertiary-Butyl Phosphine |
| Tc | Technetium |
| TC | Time constant; Temperature coefficient; Thermocouple |
| T/C | Thermocompression |
| TCA | Test calibration assembly; 1,1,1-trichloroethane; Trichloroethate |
| TCAD | Technology computer-aided design |
| TCC | Tactical cell controller; Temperature coefficient of capacitance |
| TCDM | Tool development cost model |
| TCE | Temperature coefficient of expansion |
| TCI | Tele-Communications, Inc. |
| TCM | Tunneling current microscopy |
| TCN | Transparent Content Negotiation |
| TCO | Total Cost of Ownership |
| TCP | Transformer-Coupled Plasma; Tape Carrier Package; Transmission Control Protocol |
| TCP/IP | Transmission Control Protocol/Internet Protocol |
| TCR | Temperature Coefficient of Resistance |
| TCS | Temperature Coefficient Sensitivity |
| TD | Thermal Donor(s); Thermal desorption |
| TDD | Time Division Duplex |
| TDDB | Time-dependent dielectric breakdown |
| TDEAT | Tetrakis (diethylamino) titanium |
| TDEV | Transport-level deviation |
| TDMAT | Tetrakis (dimethylamido) titanium |
| TDMS | Thermal Desorption Mass Spectrometry |
| TDR | Time-Domain Reflectometry |
| TDS | Thermal Desorption Spectroscopy |
| TD-SCDMA | Time Division Synchronous Code-Division Multiple-Access |
| Te | Tellurium |
| TE | Tail End; Transverse electric; Transmitted electron |
| TEA | Transverse excited atmosphere |
| TEC | Thermal expansion coefficient; Test and Electrical Characterization; Thermo electric coolers |
| TECAP | Transistor electrical characterization and analysis program |
| TED | Transient enhanced diffusion; transmitted electron detection |
| TEG | Technical exchange group |
| TEGFET | Two-dimensional Electron Gas Field-Effect Transistors |
| TEM | Transmission Electron Microscopy; Tunneling Electron Microscopy; Transverse electromagnetic mode |
| TEOS | Tetraethoxysilane; Tetraethylorthosilicate; Tetraethelorthosilicate |
| tera | 1.00E+12 (1,000,000,000,000/1; symbolized by the prefix T) |
| TES | Two Electron Satellite |
| TFA | Tree-based Floorplanning Algorithm |
| TFC | Total fault coverage |
| TFE | Tetrafluorethylene (teflon) |
| TFED | Thin Film Electroluminescent Display |
