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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
CICHLID II Sheet 1. COVER
Sheet 2 - 5. DIAGRAM (Block/Power) & ANNOTATIONS
Sheet 6. CLOCK GENERATOR
Sheet 7 - 9. DOTHAN533 / YONAH CPU(TBD)
Sheet 10. THERMAL SENSOR / FAN CONTROL
Sheet 11 - 15. ALVISO-MCH
CPU :Intel Dothan533 Sheet16. DDR II SODIMM
Sheet17. DDR TERMINATION
Chip Set :Intel Alviso & ICH6-M Sheet18 - 21. ICH6-M
Sheet22. FWH
Remarks : Mobility Platform Sheet23 - 26. NVIDIA 43M GRAPHIC CONTROLLER C
Sheet27. VIDEO MOAD STRAP
Sheet28 - 29. VIDEO MEMORY
Sheet30. VIDEO S.S / LCD CONN.
Model Name : CICHLID II Sheet31. CRT PORT
PBA Name : MAIN Sheet32 - 33. CARDBUS / 1394 / MEDIA CARD
Sheet34. MINI PCI
Sheet35. AUDIO AZALIA CODEC ( AD 1986A )
PCB Code : BA41-00489A (TPT) Sheet36. AUDIO AGC / AMP
Sheet37. HDD & ODD Connector
BA41-00537A (GCE) Sheet38. MICOM
Dev. Step : MP Sheet39. LAN ( Broadcom BCM5788 )
Sheet40. MDC MODEM / USB0 / LAN CONN.
Revision : 1.0 Sheet41. B'D TO B'D Connector
Sheet42. MAIN DDR POWER B
Sheet43. SWITCHED POWER
T.R. Date : 2005.07.06 Sheet44. CHARGER
Sheet45. CPU POWER (VCC_CORE)
Sheet46. P3.3V_AUX / P5V_AUX POWER
Sheet47. P1.5V_AUX, VTT
DRAW CHECK APPROVAL Sheet48. POWER SEQUENCE LOGIC
Sheet49. GRAPHIC CORE POWER / P1.2V / P2.5V
Sheet50. TPM, MOUNT HOLE
Sheet51. DOCKING CONNECTOR , SUPER I/O
Sheet52. AUDIO WOOFER ( PLYMOUTH )
Sheet53. AUDIO SUB BOARD
A
SAMSUNG
Owner : SEC Mobile R & D Signature : X ELECTRONICS
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU
Mobile Processor DC/DC
PG 10 System DC/DC
IMVP-IV
Dothan(w/533MHz) R 1.3
Smart
D CPU Charging Battery D
PCIE Graphics Module Thermistor PG 45
Circuit Module
EMC6N300
PG 10 L2 Cache : 2 MB PG 44
PG 7,8,9 478pin
44P DDR II
PSB Thermistor
533 MT/S PG 17 DDR II DC/DC
LCD LVDS nVidia NV43M External Graphics
VRM
PEG x16
Channel A (Standard) DDR II PG 16 DC/DC Module
820 FCBGA PG 42
CRT/TV
PG 23 ~ 26
SODIMM 0
PG 30
MCH-M Dual channel DDR II 533/400
DDR II PG 16
Alviso Channel B (Reverse)
SODIMM 1
Video Memory
1257 FCBGA
64MB : K4D26323QG
128MB : K4D55323QF PG 11,12,13,14,15
PG 28 ~ 29
PG 41 CRT Direct Media Interface
( to VGA B'D ) x4/x2, 1.5V
C C
DB400 Clocking ANT
PG 5
CK-410M
PG 40 TV SSDC PG 6 Wireless LAN SD/MS PG 32
( to LCD I/F B'D ) PG 5
SVHS / HDTV CARDBUS CardBus PG 33
PG 36 USB 0 Mini PCI CONN. R5C841
PG 40 USB 1, 2
USB 0,1,2,3 ICH6-M PG 34 PG 32,33
R5532V002 EEPROM PG 32
PG 41 USB 3 609 BGA 33MHz, 3.3V PCI
1394
CARDBUS Module 6 pin
USB5 PG 33
PORT REPLICATOR
PG 51 AZALIA Primary PG 18,19,20,21
AUDIO 12P PCI
BROADCOM
RJ45
BCM5788
Audio MDC AZALIA Secondary PG 39 PG 40
AZALIA RJ11
AMP Codec Modem
PG 40
B
AD1986A PG 40
B
PG 35, 36
FWH
HP & SPDIF. 82802AC
MIC-IN PG 22
LINE-IN S-ATA S-ATA
SPK R
PG 37
HDD
TPM
PG 50
SPK L
PG 41
Touch
PAD
3.3V LPC, 33MHz
MICOM Bluetooth
USB4
CD-ROM Hitachi H8S
PG 37
ODD PATA IDE slave HD64F2111B
KBD
PG 38 PG 41
A A
SAMSUNG
ELECTRONICS
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SAMSUNG PROPRIETARY
Power Diagram
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
ADAPTOR
BATTERY ALVISO-PM
P1.5V ICH6-M
P1.5V_AUX PEG
ICH6-M GPU (NV43M)
P1.2V
ICH6-M Thermal Sensor MICOM
P3.3V_AUX P3.3V CK410-M SODIMM R5C841
PEG FWH M_PCI
LCD PCMCIA TPM
ICH6-M MDC
LAN MDC LEDs
C C
ALVISO-PM
ICH6-M
P2.5V R5C841
PEG
ICH6-M PCMCIA HDD
CRT USB M_PCI
P5V_AUX P5V
PEG MICOM FAN CIRCUIT
R5C841 MDC HEATSINK
VDC DDR Power
SODIMM (DDR II)
P1.8V_AUX P1.8V PEG
GDDR (x4)
SODIMM (DDR II)
ALVISO-PM
B MICOM_P3V B
P0.9V DDR II-Termination
DDR II for PEG (TBD)
GFX_
nVidia NV43M : P1.05V
CORE
ALVISO-PM
VTT ICH6-M
CPU ( Dothan )
VCC_CORE
Rail
+V*Always +V*AUX +V SUSPWR PWRON VRON
State
DOTHAN533 / YONAH
A Full On ON ON ON ON ON ON A
S3 ON ON OFF ON OFF OFF
S4 ON ON OFF ON OFF OFF SAMSUNG
S5 ON OFF OFF OFF OFF OFF ELECTRONICS
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. S0 - S5
S0 - S3
OFF IN S3 - S5
D D
RTC BATTERY ( 0.01A )
Vtt ( 1.05V, 5.634A )
0.01A
0.014A
0.9A
0.4A Mini PCI
P1.5V ( 4.55A ) 2.95A
P2.5V ( 0.01A ) 0.01A
P3.3V ( 4.567A )
P5V ( 4.477A )
0.19A
0.001A ICH6-M
P1.5V_AUX ( 0.27A ) 0.27A
P3.3V_AUX ( 0.69A ) 0.39A 0.14A
P5V_AUX ( 1.51A ) 0.01A 0.2A R5C841
0.1A SD Card
1.2A CARDBUS
1.0A
0.003A THERM SENSOR
0.096A AC 97 AUDIO AMP
0.44A
AD1986A
2.62A
1.3A
MCH
P1.8_AUX ( 5.7A ) 2.7A Intel 915PM
C 0.004A TOUCH PAD C
Vcore ( 1.356V, 27A ) 27A
3A
DOTHAN 0.94A HDD
0.3A CPU
1.5A ODD
P0.9V ( 1A )
3A
1A DDR2 SODIMM
2.0A USB x 4
LCD_VDD ( 3.3V , 0.23A )
VDC_INV ( 19V, 0.23A )
1.5A
0.23A LCD
0.1A FAN
GFX_CORE ( 1.2 V, 9.25A ) 9.25A
B P1.8V ( 2.99 )
P1.2V (1.25A )
1.3A
1.25A
Nvidia NV43 B
0.35A 0.35A MDC
0.067A FWH 1.6A Video MEM x 4
0.38A CLOCK
0.06A KEYBOARD
MICOM_3V ( 0.35A ) 0.35A MICOM
A A
P1.2V_LAN ( 1.05A ) 1.05A Gb LAN SAMSUNG
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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION D
PCI Devices Voltage Rails
Devices IDSEL# REQ/GNT# Interrupts
Cardbus AD25 0 A,B,C VDC Primary DC system power supply (7 to 21V)
LAN AD21 2 G VCC_CORE Core voltage for DOTHAN (1.308~1.068V)
MiniPCI SLOT1 AD23 1 E, F VTT DOTHAN/ALVISO Processor System Bus(PSB) Termination (1.05V)
MiniPCI SLOT2 AD22 3 D, G <-- PLYMOUTH MCH-M Core Voltage
USB AD29(internal) - USB2.0 #0 : A
USB2.0 #1 : D P0.9V 0.9V switched power rail (off in S3-S5)
USB2.0 #2 : C P1.2V 1.2V switched power rail (off in S3-S5)
USB2.0 #3 : ??? P1.5V 1.5V switched power rail (off in S3-S5)
Hub to PCI AD30(internal) - - P1.5V_AUX 1.5V power rail (off in S4-S5)
LPC bridge/IDE/AC97/SMBUS AD31(internal) - B P1.8V 1.8V switched power rail (off in S3-S5)
Internal MAC AD24(internal) - E P1.8V_AUX 1.8V power rail(off in S4-S5)
AC Link - - B P2.5V 2.5V switched power rail (off in S3-S5)
MICOM_P3V 3.3V always on power rail for MICOM
P3.3V 3.3V switched power rail (off in S3-S5)
P3.3V_AUX 3.3V power rail (off in S4-S5)
P3.3V_DTV 3.3V power rail (off in S4-S5)
C P5V 5.0V switched power rail (off in S3-S5) C
P5V_AUX 5.0V power rail (off in S4-S5)
CPU Core Voltage Table
2
VID5 VID4 VID3 VID2 VID1 VID0 Voltage VID5 VID4 VID3 VID2 VID1 VID0 Voltage
0 0 0 0 0 0 1.708 V 1 0 0 0 0 0 1.196 V Northwood-B
I C / SMB Address
0 0 0 0 0 1 1.692 V 1 0 0 0 0 1 1.180 V (Interposer B'd) Devices Address Hex Bus
0 0 0 0 1 0 1.676 V 1 0 0 0 1 0 1.164 V
0 0 0 0 1 1 1.660 V 1 0 0 0 1 1 1.148 V ICH6 Master - SMBUS Master
0 0 0 1 0 0 1.644 V 1 0 0 1 0 0 1.132 V EMC6N300(CPU Thermal Sensor) 1001 110X 9Ch Thermal Sensor
0 0 0 1 0 1 1.628 V 1 0 0 1 0 1 1.116 V SODIMM0 1010 0000 A0h -
0 0 0 1 1 0 1.612 V 1 0 0 1 1 0 1.100 V SODIMM1 1010 001X A2h -
-
0 -
0 0 1 1 1 1.596 V 1 0
- 0 1 1 1 1.084 V CK-408 (Clock Generator) 1101 001x D2h Clock, Unused Clock Output Disable
0 0 1 0 0 0 1.580 V 1 0 1 0 0 0 1.068 V
0 0 1 0 0 1 1.564 V 1 0 1 0 0 1 1.052 V
0 0 1 0 1 0 1.548 V 1 0 1 0 1 0 1.036 V
0 0 1 0 1 1 1.532 V 1 0 1 0 1 1 1.020 V
0 0 1 1 0 0 1.516 V 1 0 1 1 0 0 1.004 V
0
0
0
0
1
1
1
1
0
1
1
0
1.500 V
1.484 V
1
1
0
0
1
1
1
1
0
1
1
0
0.988 V
0.972 V USB PORT Assign
0 0 1 1 1 1 1.468 V 1 0 1 1 1 1 0.956 V
0 1 0 0 0 0 1.452 V 1 1 0 0 0 0 0.940 V PORT NUMBER ASSIGNED TO
0 1 0 0 0 1 1.436 V 1 1 0 0 0 1 0.924 V
0 1 0 0 1 0 1.420 V 1 1 0 0 1 0 0.908 V 0 SYSTEM PORT A
0 1 0 0 1 1 1.404 V 1 1 0 0 1 1 0.892 V 1,2 SYSTEM PORT B
B 0 1 0 1 0 0 1.388 V 1 1 0 1 0 0 0.876 V 3 AUDIO B'D B
0 1 0 1 0 1 1.372 V 1 1 0 1 0 1 0.860 V 4 BLUETOOTH
Highest Freq. 0 1 0 1 1 0 1.356 V 1 1 0 1 1 0 0.844 V Lowest Freq. 5 PORT REPLICATOR
0
- 1 0 1 1 1 1.340 V 1 1 0 1 1 1 0.828 V
0 1 1 0 0 0 1.324 V 1 1 1 0 0 0 0.812 V
0 1 1 0 0 1 1.308 V 1 1 1 0 0 1 0.796 V
0 1 1 0 1 0 1.292 V 1 1 1 0 1 0 0.780 V
0
0
1
1
1
1
0
1
1
0
1
0
1.276 V
1.260 V
1
1
1
1
1
1
0
1
1
0
1
0
0.764 V
0.748 V Deeper Sleep System Power States
0 1 1 1 0 1 1.244 V 1 1 1 1 0 1 0.732 V CHP3_SLPS1* S1, Powered-On-Suspend(POS) : In this state, all clocks(except the 32.768KHz clock) are stopped.
0 1 1 1 1 0 1.228 V 1 1 1 1 1 0 0.716 V The system context is maintained in system DRAM. Power is maintained to PCI, the CPU, memory controller, memory, and all other criticial subsystems.
0 1 1 1 1 1 1.212 V 1 1 1 1 1 1 0.700 V Note that this state does not preclude power being removed from non-essential devices, such as disk drives. During this state, CPU can be selected
for either Deep Sleep or Deeper Sleep.
In Deeper Sleep, CPU voltage reduced in this state to reduce the leakage power.
CHP3_SLPS3* S3, Suspend-To-RAM(STR) : The system context is maintained in system DRAM, but power is shut off to non-critical circuits.
Memory is retained, and refreshes continue. All clocks stop except RTC clock.
CHP3_SLP4S* S4, Suspend-To-Disk(STD) : The Context of the system is maintained on the disk. All power is then shut off to the system except for the logic required to resume.
Externally appears same as S5, but may have different wake events.
CHP3_SLPS5* S5, Soft Off(SOFF) : System context is not maintained. All power is shut off except for the logic required to restart. A full boot is required when waking.
REVISION HISTORY
A A
See rev notes in the changes file for more information.
SAMSUNG
ELECTRONICS
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
MMZ1608S121AT P3.3V
B37
TP936
C426 10000nF
1000nF
100nF
100nF
100nF
10nF
10nF
47nF
47nF
47nF
C419
C423
C414
C415
C425
C416
C424
C422
C420
6.3V
FSA FSB FSC
HOST CLK
BSEL2 BSEL1 BSEL0
0 0 0 266 MHz U723
10K
0 0 1 333 MHz ICS954201BGLF
10000nF
MMZ1608S121AT
C418 100nF
C417 100nF
21 48 B38
C421 47nF
0 1 0 200 MHz 28
VDD_SRC0 VDD_