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PRODUCT SPECIFICATION
Tentative Specification
Preliminary Specification
Approval Specification
MODEL NO.: V315H3
SUFFIX: LE7
Customer:
APPROVED BY SIGNATURE
Name / Title
Note
Please return 1 copy for your confirmation with your
Approved By Checked By Prepared By
Chao-Chun Chung Vincent Chou Archer Chang
Version 1.0 1 Date Dec. 20, 2010
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
CONTENTS
1. GENERAL DESCRIPTION ......................................................................................................................................5
1.1 OVERVIEW ....................................................................................................................................................5
1.2 FEATURES ....................................................................................................................................................5
1.3 APPLICATION................................................................................................................................................5
1.4 GENERAL SPECIFICATIONS ........................................................................................................................5
1.5 MECHANICAL SPECIFICATIONS ..................................................................................................................6
2. ABSOLUTE MAXIMUM RATINGS ...........................................................................................................................7
2.1 ABSOLUTE RATINGS OF ENVIRONMENT....................................................................................................7
2.2 PACKAGE STORAGE ....................................................................................................................................8
2.3 ELECTRICAL ABSOLUTE RATINGS..............................................................................................................8
2.3.1 TFT LCD MODULE...............................................................................................................................8
2.3.2 BACKLIGHT CONVERTER UNIT .........................................................................................................8
3. ELECTRICAL CHARACTERISTICS ........................................................................................................................9
3.1 TFT LCD MODULE.........................................................................................................................................9
3.2 BACKLIGHT CONVERTER UNIT .................................................................................................................12
4. BLOCK DIAGRAM OF INTERFACE ......................................................................................................................15
4.1 TFT LCD MODULE.......................................................................................................................................15
5. INPUT TERMINAL PIN ASSIGNMENT ..................................................................................................................16
5.1 TFT LCD Module Input .................................................................................................................................16
5.2 BACKLIGHT UNIT........................................................................................................................................18
5.3 CONVERTER UNIT......................................................................................................................................18
5.4 BLOCK DIAGRAM OF INTERFACE .............................................................................................................20
5.5 LVDS INTERFACE .......................................................................................................................................22
5.6 COLOR DATA INPUT ASSIGNMENT............................................................................................................23
6. INTERFACE TIMING.............................................................................................................................................24
6.1 INPUT SIGNAL TIMING SPECIFICATIONS..................................................................................................24
6.2 POWER ON/OFF SEQUENCE.....................................................................................................................26
7. OPTICAL CHARACTERISTICS.............................................................................................................................27
7.1 TEST CONDITIONS.....................................................................................................................................27
7.2 OPTICAL SPECIFICATIONS ........................................................................................................................28
Version 1.0 2 Date Dec. 20, 2010
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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Global LCD Panel Exchange Center www.panelook.com
PRODUCT SPECIFICATION
8 PRECAUTIONS .....................................................................................................................................................33
8.1 ASSEMBLY AND HANDLING PRECAUTIONS .............................................................................................33
8.2 SAFETY PRECAUTIONS .............................................................................................................................33
9. DEFINITION OF LABELS......................................................................................................................................34
9.1 CMI MODULE LABEL...................................................................................................................................34
10. PACKAGING .......................................................................................................................................................35
10.1 PACKAGING SPECIFICATIONS.................................................................................................................35
10.2 PACKAGING METHOD ..............................................................................................................................35
11. INTERNATIONAL STANDARD ............................................................................................................................37
11.1 SAFETY .....................................................................................................................................................37
11.2 EMC ...........................................................................................................................................................37
12. MECHANICAL CHARACTERISTIC .....................................................................................................................38
Appendix