Text preview for : UAA3515A_2.pdf part of Philips UAA3515A 900 Nhz analog cordless phone IC
Back to : UAA3515A_2.rar | Home
INTEGRATED CIRCUITS
DATA SHEET
UAA3515A 900 MHz analog cordless telephone IC
Product specification Supersedes data of 2001 Dec 12 2002 Sep 09
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
CONTENTS 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 2 3 4 5 6 7 7.1 7.1.1 7.1.2 7.1.3 7.2 7.2.1 7.3 7.4 7.4.1 7.5 7.6 7.7 7.8 7.9 7.9.1 7.9.2 7.9.3 7.9.4 7.9.5 7.9.6 7.9.7 7.9.8 7.9.9 7.9.10 7.9.11 7.9.12 7.9.13 FEATURES Single frequency conversion FM receiver Receiver baseband Synthesizer Transmitter Transmitter baseband Microcontroller interface Power supplies APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Power supply and power management Power supply Power saving Current consumption FM receiver Data comparator Transmitter Synthesizer Calculation example Receiver baseband TX baseband Voltage regulator Low-battery detection Microcontroller interface Data registers Active modes Clock output divider FM-PLL centre frequency TX and RX gain control registers Carrier detector threshold programming Low-battery detection Power amplifier output level PLL charge pump current Volume control Crystal tuning capacitors Voltage reference adjustment Test mode 14 15 16 8 9 10 11 12 13 13.1 13.2 13.3 13.4 13.5 LIMITING VALUES HANDLING
UAA3515A
THERMAL CHARACTERISTICS CHARACTERISTICS PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS
2002 Sep 09
2
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
1 1.1 FEATURES Single frequency conversion FM receiver 1.4 Transmitter
UAA3515A
· Integrated Low Noise Amplifier (LNA) · Image reject mixer · FM detector (10.7 MHz) with: IF limiter wide band PLL demodulator output amplifier Received Signal Strength Indicator (RSSI) output. · Carrier Detector (CD) with programmable threshold · Programmable data amplifier (slicer) phase. 1.2 Receiver baseband
· Internal buffered Power Amplifier (PA) with programmable gain · Data transmission summing amplifier. 1.5 Transmitter baseband
· Programmable transmitter gain · Microphone amplifier · Compressor with Automatic Level Control (ALC) and hard limiter. 1.6 Microcontroller interface
· Three-wire serial interface. 1.7 Power supplies
· Programmable receiver gain · Expander · Earpiece amplifier with volume control feature · Data amplifier. 1.3 Synthesizer
· Voltage regulator for internal PLL supplies · Selectable voltage doubler · Programmable Low-Battery Detection (LBD) (time-multiplexed with RSSI carrier detector). 2 APPLICATIONS
· Crystal reference oscillator with integrated tuning capacitor · Reference frequency divider · Narrow band receiver PLL including VCO with integrated variable capacitance diodes · Narrow band transmitter PLL including VCO with integrated variable capacitance diodes · Integrated VCO circuits designed to function with external inductors etched directly as part of the printed-circuit board (cost-saving feature) · Programmable clock divider with output buffer to drive the microcontroller. 4 ORDERING INFORMATION TYPE NUMBER UAA3515AHL
· Analog cordless telephone sets (900 MHz). 3 GENERAL DESCRIPTION
The UAA3515A is a BiCMOS integrated circuit that performs all functions from antenna to microcontroller in reception and transmission for both base station and handset of a 900 MHz cordless telephone set. In addition, the implemented programming reduces significantly the amount of external components, board space and external adjustments required.
PACKAGE NAME LQFP64 DESCRIPTION plastic, low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm VERSION SOT314-2
2002 Sep 09
3
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
andbook, full pagewidth
2002 Sep 09
VCC(LNA) MIXO 64 63 VCC(MIX) 62 61 MIXGND 1 RFIX 2 RFIY 3 LNA
5
Philips Semiconductors
900 MHz analog cordless telephone IC
BLOCK DIAGRAM
IF 10.7 MHz
IF 10.7 MHz
IF 10.7 MHz
VCC(BLO)
VRXGND 60
RXLOY RXLOX 59 58
VCC(VRX) IFA1I LFA1O VCC(IF) IFA2I 57 56 55 54 53
LFA2O 52
IFGND 51
LIMI 50 VCO tune
PLLO 49 Amp 48 DETO
IF AMP 1
SFS
IF AMP 2
LIMITER DEMODULATOR
×
IMAGE REJECTION FILTER SBS
+ 90°
+ ×
QUADRATURE PHASE SHIFTER
RX VOLTAGE REGULATOR
47 LPFD RSSI EXPANDER RX MUTE RX GAIN 46 RXAI RSSI 45 ECAP 44 VCC(ARX)
VB
LNAGND 4
RXLF 5 VCC(CP) RX PHASE DETECTOR 10-BIT MAIN RX DIVIDER 6-BIT PRESCALER RX
UAA3515A
CD/LBD VCO RX VCC VB RSSI CD LBD VB EARPIECE AMP Rint
43 EARI
RXPD 6
42 EARO 41 ARXGND 40 DATI
RSSI 7 VREG 8 VOLTAGE REGULATOR VOLTAGE REFERENCE ADJUSTMENT VOLTAGE REFERENCE VB
VB VCC(CP) VDen
4
VCC
VCC DATA AMP 39 DATO 38 DATA MICROCONTROLLER SERIAL INTERFACE 37 CLK 36 EN 35 CLKOUT VCC 34 CDLBD 33 XTALO
DGND 9 VCC(CP) 10 CPGND 11 VCC(PS) 12 TXPD 13 VCC(CP) TX PHASE DETECTOR 10-BIT MAIN TX DIVIDER 6-BIT PRESCALER TX ALC COMPRESSOR HARD LIMITER TX MUTE TX GAIN
VOLTAGE DOUBLER
CLOCK DIVIDER
TX VCO TXLF 14 PAGND1 15 PAO 16 VBmod VB TX VOLTAGE REGULATOR VB
10-BIT REFERENCE DIVIDER
MIC AMP VB
17 PAGND2
18 MODI
19 MODO
20 VTXGND
21 VCC(VTX)
22 TXLOX
23 TXLOY
24 VCC(ATX)
25
26
27 MICI
28 MICO
29 CMPI
30
31
32 XTALI
CCAP TXO
VB ATXGND
Product specification
UAA3515A
FCA293
Fig.1 Block diagram.
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
6 PINNING SYMBOL MIXGND RFIX RFIY LNAGND RXLF RXPD RSSI VREG DGND VCC(CP) CPGND VCC(PS) TXPD TXLF PAGND1 PAO PAGND2 MODI MODO VTXGND VCC(VTX) TXLOX TXLOY VCC(ATX) CCAP TXO MICI MICO CMPI VB ATXGND XTALI XTALO CDLBD CLKOUT EN CLK DATA 2002 Sep 09 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 mixer ground LNA voltage (X) input LNA voltage (Y) input LNA ground RX PLL filter output RX phase detector voltage output RSSI output pin for internal voltage regulator digital ground DESCRIPTION
UAA3515A
internal voltage doubler supply voltage (or positive supply voltage input) for charge pumps charge pump ground prescaler positive supply voltage input TX phase detector voltage input TX PLL filter output power amplifier ground 1 power amplifier output power amplifier ground 2 summing amplifier input summing amplifier output transmitter VCO ground transmitter VCO positive supply voltage input transmitter VCO voltage (X) to external inductor transmitter VCO voltage (Y) to external inductor transmitter audio positive supply voltage input external capacitor for compressor audio transmitter output microphone amplifier input microphone amplifier output compressor input reference voltage transmitter audio ground crystal input crystal output CD or LBD open collector output (out-of-lock synthesizer receiver and/or transmitter in test mode) clock output (CMOS levels) enable input for serial interface clock input for serial interface data input for serial interface 5
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
SYMBOL DATO DATI ARXGND EARO EARI VCC(ARX) ECAP RXAI LPFD DETO PLLO LIMI IFGND IFA2O IFA2I VCC(IF) IFA1O IFA1I VCC(VRX) RXLOX RXLOY VRXGND VCC(BLO) VCC(MIX) MIXO VCC(LNA)
PIN 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 data amplifier input audio receiver ground earpiece amplifier output earpiece amplifier input
DESCRIPTION data amplifier open collector output
audio receiver positive supply voltage input external capacitor for expander audio receiver input demodulator loop filter output demodulator amplifier output demodulator amplifier negative input limiter input IF negative supply voltage IF second amplifier output IF second amplifier input IF positive supply voltage input IF first amplifier output IF first amplifier input receiver VCO positive supply voltage input receiver VCO voltage (X) to external inductor receiver VCO voltage (Y) to external inductor receiver VCO ground receiver LO buffer positive supply voltage input mixers positive supply voltage input mixer output LNA positive supply voltage input
2002 Sep 09
6
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
62 VCC(MIX)
60 VRXGND
handbook, full pagewidth
57 VCC(VRX)
61 VCC(BLO)
64 VCC(LNA)
54 VCC(IF)
59 RXLOY
58 RXLOX
51 IFGND
55 IFA1O
52 IFA2O
MIXGND 1 RFIX 2 RFIY 3 LNAGND 4 RXLF 5 RXPD 6 RSSI 7 VREG 8 DGND 9 VCC(CP) 10 CPGND 11 VCC(PS) 12 TXPD 13 TXLF 14 PAGND1 15 PAO 16 VCC(VTX) 21 VTXGND 20 TXLOX 22 TXLOY 23 VCC(ATX) 24 CCAP 25 TXO 26 MICI 27 MICO 28 CMPI 29 VB 30 ATXGND 31 PAGND2 17 MODO 19 XTALI 32 MODI 18
49 PLLO
63 MIXO
56 IFA1I
53 IFA2I
50 LIMI
48 DETO 47 LPFD 46 RXAI 45 ECAP 44 VCC(ARX) 43 EARI 42 EARO 41 ARXGND
UAA3515AHL
40 DATI 39 DATO 38 DATA 37 CLK 36 EN 35 CLKOUT 34 CDLBD 33 XTALO
FCA294
Fig.2 Pin configuration.
2002 Sep 09
7
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7 7.1 7.1.1 FUNCTIONAL DESCRIPTION Power supply and power management POWER SUPPLY
UAA3515A
· Inactive mode: with the exception of the microcontroller interface, all circuits are powered-down. The crystal reference oscillator, the output clock buffer, the voltage regulator and the voltage doubler can be disabled separately. To reduce microcontroller current consumption, the crystal frequency to the clock output can be divided by 128. A low current consumption mode for the crystal oscillator can be programmed. Latch memory is maintained in all modes. Blocks that are powered are shown in Table 1 per operating mode. The crystal oscillator, the clock output buffer, the voltage reference adjustment, the power amplifier, the voltage doubler, the earpiece, the hard limiter and the ALC can be activated separately. Blocks that can be activated in each mode are shown in Table 2.
The UAA3515A is used in a cordless telephone handset and in a base unit. The handset unit is battery powered and operates on three NiCd cells. The minimum supply voltage (VCC) is 2.9 V. 7.1.2 POWER SAVING
When the UAA3515A is used in a handset, it is important to minimize current consumption. The main operating modes are: · Active mode (talk): all blocks are powered · RX mode: all circuits in the receiver part are powered Table 1 Power operating modes CIRCUIT BLOCK Voltage reference adjustment RF receiver RX PLL RX and TX audio paths RF TX (and PA, when enabled) Table 2 Powered circuit blocks CIRCUIT BLOCK Crystal oscillator; note 1 Clock output buffer Voltage reference enable; note 2 Power amplifier (PA2 = 1) Voltage doubler enable; note 3 Hard limiter and ALC not disabled Earpiece amplifier (earpiece enable = 1); note 4 Notes
ACTIVE MODE power ON power ON power ON power ON power ON
RX MODE power ON power ON power ON power OFF power OFF
INACTIVE MODE power OFF power OFF power OFF power OFF power OFF
ACTIVE MODE power ON power ON power ON power ON power ON power ON power ON
RX MODE power ON power ON power ON power OFF power ON power OFF power ON
INACTIVE MODE power ON power ON power ON power OFF power ON power OFF power OFF
1. In RX and active mode, the crystal oscillator is activated automatically. An external frequency can be forced at the crystal pins XTALI and XTALO. 2. In RX and active mode, the voltage reference is enabled automatically (whether bit VREG enable is logic 0 or 1). 3. If the voltage doubler is enabled, the crystal oscillator is activated automatically. 4. In inactive mode the amplifier is disabled automatically.
2002 Sep 09
8
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.1.3 CURRENT CONSUMPTION
UAA3515A
The control bit values for selection of each mode and typical current consumption for the modes are shown in Table 3. When clock out is activated there is an extra power demand proportional to the programmed output level (see Table 4 for examples). When bit Xtal high = 0 (oscillator is in low current consumption mode), the crystal in use must have losses less than 20 to ensure oscillator start-up. Table 3 Typical current consumption VCC = 3.3 V; Tamb = 25 °C; f(i)xtal = 10.24 MHz. POWER OPERATING MODE Active mode RX mode Inactive mode xtal active = 0; VREG enable = 0; note 1 xtal active = 1; VREG enable = 0; Xtal high = 0; note 1 xtal active = 1; VREG enable = 0; Xtal high = 1; note 1 xtal active = 1; VREG enable = 1; Xtal high = 1; note 1 xtal active = 1; VREG enable = 1; Xtal high = 0; note 2 Notes 1. Voltage doubler and clock output buffer disabled. 2. Voltage doubler enabled, clock output buffer disabled. Table 4 Examples of additional current consumption VCC = 3.3 V; Tamb = 25 °C; f(i)xtal = 10.24 MHz; CL(CLKOUT) = 14 pF. CURRENT CONSUMPTION ADDITIONAL TO TYPICAL VALUE DIVIDER RATIO CLKO level = 0 1, 2, 2.5, 4 or 128 off 7.2 FM receiver 770 µA 0 CLKO level = 1 530 µA 0 CONDITIONS TYPICAL CURRENT CONSUMPTION 76 mA 58 mA <10 µA 230 µA 330 µA 550 µA 690 µA
The FM receiver (see Fig.3) has a single frequency conversion architecture with integrated image rejection mixer that makes an external RF filter unnecessary. The Side Band Select (SBS) feature allows choice of frequency for RXLO to be in or out of the ISM band allowing use of the same IC type for both base station and handset. IF channel filtering (a compromise between price and performance) can be implemented by simply using two or three external 10.7 MHz filters. The integrated FM PLL demodulator with limiter decreases significantly the number of pins and external components required.
2002 Sep 09
9
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 2002 Sep 09
IF 10.7 MHz MIXO 63 RXLOY 59 RXLOX 58 57 RFIX 2 RFIY 3 LNA VB VCO + 90° VOLTAGE REGULATOR
Philips Semiconductors
VCC(VRX) IFA1I 56
IF AMP 1
handbook, full pagewidth
IF 10.7 MHz IF 10.7 MHz IFA1O 55 IFA2I 53 IFA2O 52 LIMI 50 LPFD PLLO 47 49 AMP SFS IF AMP 2 LIMITER
900 MHz analog cordless telephone IC
×
48 DETO LOOP FILTER
10
SBS RXLF 5 QUADRATURE PHASE SHIFTER RSSI RXPD 6 DUAL PLL FREQUENCY SYNTHESIZER VCO RX VCC VB OL RX/TX RSSI 7 VB
UAA3515A
40 DATI DATA AMP 39 DATO
CD/LBD LBD 34 CDLBD CD 33 XTALO
VCC
32 XTALI
FCA295
Product specification
UAA3515A
Fig.3 FM receiver block diagram.
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.2.1 DATA COMPARATOR 7.3 Transmitter
UAA3515A
The data comparator is an inverting hysteresis comparator. An external bandpass filter is connected between pins DETO and DATI (AC-coupled). The open-collector output is current limited to control the output signal slew rate. An external resistor of 180 k should be connected between pin DATO and VCC. An external capacitor in parallel with this resistor will reduce the slew rate.
The transmitter architecture is of the direct modulation type. The transmit VCO can be frequency modulated by speech or data (see Fig.4). An amplifier sums the modulating signal with the data TX signal before the VCO. Frequency control is affected by integrated variable capacitance diodes. To obtain the correct frequency, external inductors in series with the bonding wires and leadframe are required. The power amplifier is capable of driving a 50 load. The level of the output signal PAO is programmed with two bits via the serial bus interface.
handbook, full pagewidth
VCC LP PAO 16 CS TXPD 13 XTAL DUAL PLL FREQUENCY SYNTHESIZER
UAA3515A
TX VCO
TXLF 14 SUMMING AMPLIFIER
VBmod
VB 18 MODI 19 MODO
TX VOLTAGE REGULATOR 21 VCC(VTX) 22 TXLOX 23 TXLOY 26 TXO
FCA296
Data TX
Fig.4 Transmitter block diagram.
2002 Sep 09
11
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.4 Synthesizer 7.4.1 Given: RF input frequency fi(RF) = 903 MHz VCO RX fVCO(RX) = 892.3 MHz fIF = 10.7 MHz VCO TX fVCO(TX) = 925.6 MHz CALCULATION EXAMPLE
UAA3515A
The crystal local oscillator and reference divider (see Fig.5) provide the reference frequency for the RX and TX PLLs. The 10-bit reference divider is programmed with respect to the crystal frequency and the desired RX and TX frequencies. The microcontroller operating frequency of 4.096 MHz is derived from a 16.384 MHz crystal frequency. The clock divider ratio can be programmed to 1, 2, 2.5, 4 or to 128; ratio 128 is chosen in sleep mode to save current in the microcontroller section. Clock output (pin CLKOUT) is an emitter follower output. The 16-bit TX counter is programmed for the desired transmit channel frequency. Similarly, the 16-bit RX counter is programmed for the desired local oscillator frequency. The divider counter comprises a 6-bit prescaler with division ratios (R) from 64 to 127, and a 10-bit CMOS divider with division ratios (C) from 8 to 1023. The full counter provides division ratios from 512 to 65535. Settings of RX and TX counters are calculated as follows: M C = int ----64 R = M - C × 64 (where M is the division ratio between VCO frequency and the reference frequency).
Internal comparison frequency = 20 kHz (fXTAL = 10.24 MHz) We have: Reference divider = 512 (1000000000) 892.3 × 10 M RX = ----------------------------- = 44615 3 20 × 10 C RX = 697 (1010111001) and R RX = 7 (000111) and 925.6 × 10 M TX = ----------------------------- = 46280 3 20 × 10 C TX = 723 (1011010011) and R TX = 8 (001000) VCOs and variable capacitance diodes are integrated. Resonance inductors are shared between bonding wires, leadframe of the package and external inductors. Costs can be reduced by etching external inductors directly onto the printed-circuit board. An on-chip selectable voltage doubler is provided to enable a larger tuning range of both VCOs. The phase detectors have current drive type outputs with selection possibilities between 400 and 800 µA.
6 6
2002 Sep 09
12
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
andbook, full pagewidth
2002 Sep 09
RXLF 5 VCC(CP) RX PHASE DETECTOR 10-BIT MAIN RX DIVIDER 6-BIT PRESCALER RX 59 RXPD 6 VCC(CP) TX PHASE DETECTOR 10-BIT MAIN TX DIVIDER 6-BIT PRESCALER TX
Philips Semiconductors
900 MHz analog cordless telephone IC
RXLOY
RXLOX 58
VCC(VRX) 57
VCC(CP) 10 VDen
VCO RX
RX VOLTAGE REGULATOR
VOLTAGE DOUBLER
VB CLOCK DIVIDER TX VCO 10-BIT REFERENCE DIVIDER TX VOLTAGE REGULATOR 21 VCC(VTX) 35 CLKOUT
13
TXPD 13
TXLF 14
33 XTALO
VB
MODO
UAA3515A
22 TXLOX 23 TXLOY
32 XTALI
FCA297
Product specification
UAA3515A
Fig.5 Synthesizer block diagram.
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.5 Receiver baseband
UAA3515A
The earpiece amplifier is a rail-to-rail inverting operational amplifier. The non-inverting input is connected to the internal reference voltage at pin VB. Software volume control on the earpiece amplifier is achieved by using an integrated switched feedback resistor Rint. The volume control tuning range is 14 dB. Hardware volume control is achieved by switching externally the earpiece feedback resistor Rext.
This section covers the RX audio path from pins RXAI to EARO (see Fig.6). The RXAI input signal is AC-coupled. The microcontroller sets the value of the RX gain in 32 linear steps of 0.5 dB. The RX baseband has a mute function and an expander with characteristics as shown in Fig.7. For audio level adjustment and, potentially for software volume control, setting the RX gain provides a dynamic range of 31 dB. This is achieved by the expander slope that multiplies the RX gain by a factor of two for each gain step thus giving 1 dB steps measured at the earpiece amplifier output.
handbook, full pagewidth
EXPANDER RX MUTE
RX GAIN 46 RXAI 45 ECAP 44 VCC(ARX) 43 EARI Cext 42 EARO Rext
Rint VB EARPIECE AMPLIFIER
FCA298
UAA3515A
Fig.6 RX baseband block diagram.
2002 Sep 09
14
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
FCA168
handbook, halfpage
20
Vo(EARO) (dBV) 0
-20
y = 2 × + 20 -40
-60 -40
-30
-20
-10 0 Vi(RXAI) (dBV)
RX gain adjusted to 0 dB. No external resistor. VCTL = 00. EXPout = -7 dB at THD < 4%.
Fig.7 Expander characteristic.
7.6
TX baseband
This section covers the TX audio path from pins MICI to TXO (see Fig.8). The input signal at pin MICI is AC-coupled. There is another AC-coupling at the microphone amplifier output. The microphone amplifier is an inverting operational amplifier whose gain can be set by external resistors. The non-inverting input is connected to the internal reference voltage VB. External resistors are used to set the gain and frequency response.
The TX baseband has a compressor with the characteristic shown in Fig.9. The ALC provides a `soft' limit to the output signal swing as the input voltage increases slowly (i.e. a sine wave is maintained at the output). A hard limiter clamps the compressor output voltage at 1.26 V (peak-to-peak). The ALC and the hard limiter can be disabled via the microcontroller interface. The hard limiter is followed by a mute circuit. The TX gain is digitally programmable in 32 steps of 0.5 dB.
2002 Sep 09
15
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
handbook, full pagewidth
UAA3515A
MICROPHONE AMPLIFIER VB ALC COMPRESSOR HARD LIMITER TX MUTE TX GAIN 26 TXO
27 MICI
28 MICO
29 CMPI
25 CCAP
FCA299
Fig.8 TX baseband block diagram.
handbook, halfpage
0
FCA170
VTXO (dBV) -10
(3)
(2)
y = 1/2 × - 5
(1)
-20
-30
(1) Slowly changing ALC signals: VCPMI = -16 dBV; VTXO = -13 dBV. (2) VCPMI = -2.5 dBV; VTXO = -11.5 dBV. (3) Hard limiting signals: VCPMI = -4 dBV; VTXO = -1.26 V (p-p).
-40 -60 -40 -20 0 20 VCMPI (dBV)
Fig.9 Compressor characteristic showing TXO as a function of CMPI.
2002 Sep 09
16
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.7 Voltage regulator 7.9 Microcontroller interface
UAA3515A
Pin VREG provides the internal supply voltage for the RX and TX PLLs. It is regulated at 2.7 V nominal voltage. Two capacitors of 4.7 µF and 100 nF must be connected to pin VREG to filter and stabilize this regulated voltage. The tolerance of the regulated voltage is initially ±8% but is improved to ±2% after the internal bandgap voltage reference is adjusted through the microcontroller. 7.8 Low-battery detection
The DATA, CLK and EN pins provide a 3-wire unidirectional serial interface for programming the reference counters, the transmit and receive channel divider-counters and the control functions. The interface consists of 19-bit shift registers connected to a matrix of registers organized as 7 words of 16 bits (all are control registers). The leading 16 bits include the data D15 to D0. The trailing 3 bits set up the address AD2 to AD0. The data is entered with the most significant bit D15 first and the last bit is AD0. Pins DATA and CLK are used to load data into the shift register. Figure 10 shows the timing required on all pins. Data is clocked into the shift registers on negative clock transitions. A new clock divider ratio is enabled using an extra EN rising edge. Minimum hold time is 50 ns and during this time no clock cycle is allowed. These extra EN edges can be applied to all the data programmed but will have no effect on the serial interface programming. The pins DATA, CLK and EN are supplied by VREG. The ESD protection diodes on these pins are connected to VCC.
The low-battery detector measures the voltage level of the VCC using a resistance divider and a comparator. One input of the comparator is connected to VB, the other to the middle point of the resistance divider. The comparator has a built-in hysteresis to prevent spurious switching. The precision of the detection depends on the divider accuracy, the comparator offset and the accuracy of the reference voltage VB. The output is multiplexed at pin CDLBD. When the battery voltage level is under the threshold voltage the output CDLBD is going LOW.
2002 Sep 09
17
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
handbook, full pagewidth
data bits (16)
address bits (3)
DATA
D15 t SU;DC
D14
D13
AD1
AD0
CLK
50%
50%
t HD;EC t SU;CE
t END t w(1)
EN
50%
data bits latched
FCA193
(1) The minimum pulse width should be equal to the period of the comparison frequency. The synthesizer prevents the internal EN signal occurring during a comparison phase to avoid any phase error jump. The enable pulse width can be reduced to 100 ns for words that do not influence the synthesizer (words 1, 2 and 3)
Fig.10 Digital signals timing requirement (except clock divider programming).
handbook, full pagewidth
data bits (16)
address bits (3)
DATA
D15 t SU;DC
D14
D13
AD1
AD0
CLK
50%
50% t END t END
t HD;EC t SU;CE
EN
50%
data bits latched
FCA194
Fig.11 Digital signals timing requirement for clock divider programming.
2002 Sep 09
18
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 7.9.1 DATA REGISTERS 2002 Sep 09 19 Notes 1. With a 10 k pull-up resistor connected to pin EN or the microcontroller, guarantees that VIH > 0.9VCC for the EN signal 2. Undefined zone; should always be programmed with 0. 3. In the inactive mode programming VREG enable from 1 to 0 might reset all of the registers. We therefore recommend that this register be set to 1 and not to change it. Table 6 ADDR 000 001 010 011 100 101 110 Data register default values at power-on (undefined zones shown programmed with 0) D15 0 0 0 0 0 0 0 D14 0 0 0 0 0 0 1 D13 0 0 0 1 0 1 0 D12 0 0 0 0 0 1 0 D11 0 0 0 0 0 0 0 D10 1 1 0 0 1 0 0 D9 1 0 0 0 1 0 1 D8 1 0 1 0 1 0 1 D7 1 1 0 1 1 0 0 D6 1 1 0 1 1 0 0 D5 0 0 0 1 0 0 0 D4 0 1 0 0 0 0 0 D3 1 1 0 0 1 1 0 D2 1 0 0 0 1 x 1 D1 1 1 0 1 0 x 1 D0 1 0 0 0 0 x 1 Product specification Philips Semiconductors
900 MHz analog cordless telephone IC
Table 5 shows the data latches and addresses that select each of the registers; bit D15 is the MSB, this is written and loaded first. Table 5 ADDR 000 Data register addresses: note 1 D15 SBS D14 D13 D12 D11 D10 D9 D8 D7 D6 SFS D5 DATA phase D4 D3 D2 D1 D0
VCTL[1 and 0] ear piece enable RX prescaler [5 to 0] note 2 TX prescaler [5 to 0]
RX gain control [4 to 0]
FM PLL VCO tuning [4 to 0]
001 010 011 100 note 2
RX main divider [9 to 0] reference divider [9 to 0] TX main divider [9 to 0] TX gain control [4 to 0] TX mute hard ALC Xtal limiter disable active enable LBD active RX mute note 2
CLKO level
note 2 doubler enable Xtal high TX RX charge charge pump pump current current
101 110
VREG enable(3)
active modes [1 and 0]
CD levels [4 to 0] voltage reference adjust [2 to 0]
LBD levels [2 to 0] test mode [2 to 0] note 2
clock div [2 to 0]
PA output [2 to 0]
Xtal tuning cap [3 to 0]
UAA3515A
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
Table 7 SBS(1) SFS CLKO level(3) Xtal active Xtal high(4) DATA phase(5) ALC disable Hard limiter enable RX mute TX mute VREG enable Doubler enable(6) Earpiece enable Data register content description BIT 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 DESCRIPTION
UAA3515A
DATA REGISTER NAME
sideband select: (LO + IF) frequency is rejected sideband select: (LO - IF) frequency is rejected second filter select: the second IF filter is selected second filter select: the second IF filter is deselected; note 2 clock output signal is regulated with respect to VREG; VCLKOUT(p-p) = 1 V clock output signal is regulated with respect to VCC; VCLKOUT(p-p) = 1.4 V crystal oscillator is active crystal oscillator is disable oscillator is in normal operation oscillator is in low current consumption mode DATA signal is inverted DATA signal is not inverted (inverter bypassed) ALC disabled normal operation hard limiter enabled hard limiter disabled RX channel muted normal operation TX channel muted normal operation VREG enabled VREG disabled and tied to VCC (in inactive mode) voltage doubler is enabled voltage doubler is disabled earpiece enabled (can be used in RX mode for specific features) earpiece disabled
Notes 1. Sideband select enables the user to have the RX local oscillator in or out of the ISM band and to use the same IC in both handset and base. 2. A 4.5 dB insertion loss in the filter is assumed. 3. The clock output signal will be AC-coupled with the XTALI pin of the microcontroller. The external resonator from the microcontroller can be removed. Caution needs to be taken that no radiation is present on the PCB 4. In inactive mode, the crystal oscillator is a major contributor to the full current consumption. When Xtal high = 0, the current mode can be programmed to save current and in inactive mode this comes to full current consumption at 230 µA (see Section 7.1.3). When Xtal high = 1, the crystal oscillator current is increased by 100 µA. 5. Depending on the SBS-bit and the protocol chosen, the data may be inverted between the base and handset data transmission. 6. Minimum supply voltage for the IC is 2.9 V which limits the voltage swing on both charge pumps to approximately 2.3 V. With the voltage doubler or with an external high supply voltage on pin VCC(CP), the extra voltage availability can be used to enhance the tuning range of the VCOs variable capacitance diodes. To save current in inactive mode, XTAL voltage doubler clock is the same as CLKO clock (can be programmed to -------------- ); in other modes the voltage doubler 128 clock is XTALI divided by two. 2002 Sep 09 20
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.9.2 Table 8 ACTIVE MODES Active mode bit selection; note 1 BIT 0 X 0 1 DESCRIPTION inactive mode RX mode active mode
UAA3515A
When the clock output signal is used, an external RC filter connected to pin CLKOUT can be added to limit clock waveform edges and therefore clock radiation on the printed-circuit board. To supply the clock to the microcontroller and save current in the handset, an external low power resonator may be used and the clock output disabled (000) as well as the crystal oscillator (Xtal active = 0). In power saving mode, the divider ratio can be programmed down to 128 to reduce the microcontroller power consumption.
BIT 1 0 1 1 Note
1. See details on activated blocks in Section 7.1.2. 7.9.3 CLOCK OUTPUT DIVIDER
The crystal oscillator produces a reference frequency that is divided and buffered to drive a microcontroller. Table 9 gives the division ratios. The buffer is a CMOS output which can drive up to 20 pF at 10 MHz in both CLKO level modes. Table 9 Clock division register BIT 2 0 0 0 0 1 1 BIT 1 0 0 1 1 0 0 BIT 0 0 1 0 1 0 1 SELECT 0 1 2 3 4 5 CLOCK DIVISION RATIO output disabled 2 2.5 4 1 128
2002 Sep 09
21
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.9.4 FM-PLL CENTRE FREQUENCY
UAA3515A
This register allows the centre frequency of the VCO to be calibrated within the FM PLL to align the frequency as close as possible to the nominal 10.7 MHz frequency. Table 10 FM-PLL VCO tuning register BIT 4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 BIT 3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BIT 2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BIT 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 SELECT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 CENTRE FREQUENCY SHIFT (MHz) 3.0 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -2.6 -2.8 -3.0 -3.2
2002 Sep 09
22
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.9.5 TX AND RX GAIN CONTROL REGISTERS
UAA3515A
The TX and RX audio signal paths each have a programmable gain block. If a TX or RX voltage gain other than the nominal power-up default is desired it can be programmed through the microcontroller interface. The gain blocks can be used during final telephone testing to adjust electronically gain tolerances in the telephone system. The RX gain and the TX gain controls have steps of 0.5 dB covering a dynamic range of -7.5 to +8.0 dB. Measured on the earpiece amplifier output, RX gain steps are multiplied by 2 due to the expander slope. A dynamic range of -15 to +16 dB at the earpiece amplifier supports a volume control feature that can be implemented in the telephone and compensate for gain tolerances. Volume control can also be performed externally with hardware switches on various resistor values. Table 11 RX and TX gain control registers BIT 4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 BIT 3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BIT 2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BIT 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 GAIN CONTROL 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 RX GAIN (dB) -7.5 -7.0 -6.5 -6.0 -5.5 -5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 EARO (dB) -15.0 -14.0 -13.0 -12.0 -11.0 -10.0 -9.0 -8.0 -7.0 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 TX GAIN (dB) -7.5 -7.0 -6.5 -6.0 -5.5 -5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0
2002 Sep 09
23
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.9.6 CARRIER DETECTOR THRESHOLD PROGRAMMING
UAA3515A
When the LBD active register = 0, the carrier detector is enabled and the signal CDout is sent to the output pin CDLBD. If RSSI is above the programmed RSSI level, CDLBD = 0; if RSSI is below the programmed level then CDLBD = 1. The carrier detector gives an indication if a carrier signal is present on the selected channel. The carrier detector has a nominal value and tolerance, if a different carrier detect threshold value is desired, this can be programmed through the microcontroller interface. If the carrier detect range is to be scaled, an external resistor should be connected between pin RSSI and ground. CD control = 10011 which corresponds to RSSI = 0.86 V (typical DC value). Table 12 CD levels register BIT 4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 BIT 3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BIT 2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BIT 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 SELECT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 RSSI VOLTAGE THRESHOLD DETECT (V) 0.1 0.14 0.18 0.22 0.26 0.3 0.34 0.38 0.42 0.46 0.5 0.54 0.58 0.62 0.66 0.7 0.74 0.78 0.82 0.86 0.9 0.94 0.98 1.02 1.06 1.1 1.14 1.18 1.22 1.26 1.3 1.34
2002 Sep 09
24
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.9.7 LOW-BATTERY DETECTION
UAA3515A
When the LBD active register = 1, the low battery detector is enabled and the signal BDout passes to the output CDLBD. If VCC is below the programmed LBD level, CDLBD = 0; if not below the programmed level, CDLBD = 1. The power-up default value is 110. Table 13 LBD level register BIT 2 0 0 0 0 1 1 1 1 7.9.8 BIT 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 SELECT 0 1 2 3 4 5 6 7 LOW BATTERY VOLTAGE DETECTION; NOMINAL VALUE (V) 3.5 3.4 3.3 3.2 3.1 3.0 2.9 2.8
POWER AMPLIFIER OUTPUT LEVEL
The power amplifier output register has two bits to modify the output power and one bit to disable the power amplifier (PA output bit 2 = 0). Duplexer matching (300 to 50 ) is performed using a parallel inductive/series capacitive network. Output power on 50 is specified in Table 14. To get power on the antenna, duplexer insertion loss should be removed. At maximum power, 3 mA extra DC current is consumed compared with the current at the minimum power settings. Table 14 PA output register BIT 2 0 1 1 1 1 7.9.9 BIT 1 X 0 0 1 1 BIT 0 X 0 1 0 1 SELECT - 0 1 2 3 PA OUTPUT POWER (dBm) PA inactive 1.0 1.9 2.5 3.1 2nd HARMONIC (dBm) - -17 -19 -23 -23 3rd HARMONIC (dBm) - -327 -29 -33 -36 4th HARMONIC (dBm) - -34 -34 -36 -40
PLL CHARGE PUMP CURRENT
Performance of the PLLs can be improved by increasing charge pump current. Then a programmable current on both RX and TX charge pump can be programmed. RX and TX charge pump currents are programmed independently. When the RX or TX charge pump current register = 0, charge pump current is 400 µA; when it is set to 1, charge pump current is 800 µA.
2002 Sep 09
25
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.9.10 VOLUME CONTROL
UAA3515A
The register VCTL enables the volume control of the earpiece amplifier to be set to a predefined gain. This is achieved by switched feedback resistor Rint. The optional resistor Rext, connected between pins EARI and EARO provides the hardware control. Table 15 Volume control bit selection BIT 1 0 0 1 1 1 1 1 7.9.11 BIT 0 0 1 0 1 1 1 1 Rint (k) 14 24 41 70.2 70.2 70.2 70.2 Rext (k) none none none none 100 33 15 GEAR (dB) 0 4.7 9.3 14 9.4 4.1 -1
CRYSTAL TUNING CAPACITORS
On-chip crystal reference tuning is provided to compensate for frequency spread over process and temperature changes. An external capacitor should be connected at pin XTALI; the value of the capacitor should be approximately 3 pF less than the capacitance of pin XTALO. Internally, a programmable capacitance is available in parallel with the XTALI pin. Tuning capacitance values are in the range 0 to 4.5 pF; see Table 16. Table 16 Xtal tuning cap register BIT 3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BIT 2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BIT 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 SELECT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 CAPACITANCE (pF) 0.2 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7
2002 Sep 09
26
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
7.9.12 VOLTAGE REFERENCE ADJUSTMENT
UAA3515A
An internal 1.5 V bandgap voltage reference provides the voltage reference for the low battery detect circuits, the VREG voltage regulator, the VB reference and all internal analog references. In inactive mode, the adjustment is disabled. Table 17 Voltage reference adjust register BIT 2 0 0 0 0 1 1 1 1 7.9.13 TEST MODE BIT 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 SELECT 0 1 2 3 4 5 6 7 NOMINAL VOLTAGE REFERENCE -7% -5% -3% -1% 1% 3% 5% 7%
Test mode bits are used only for test in production and application tuning. The test bits must be set to 0 for normal operation. Out-of-lock of synthesizers RX or TX can be monitored indirectly on pin CDLBD: the width of the `glitch' that occurs with out-of-lock gives a direct indication of the phase error on the PLL RX and/or TX. To tune the external inductors of the RX and TX VCOs, a defined division ratio has to be programmed into the dividers, and then the image frequency of the VCO can be read on pin CDLBD. Test mode can also be used to check the division ratio: a frequency can be forced on the VCO or crystal pins and the programmed frequency can be read on pin CDLBD. There is a divide-by-2 stage before the CDLBD pin, therefore all frequencies are divided-by-2. When both charge pumps are in the high-impedance state, the VCOs can be measured as stand alone. Table 18 Test mode register BIT 2 0 0 0 0 1 1 1 1 BIT 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 normal operation XOR between internal signals `up' and `down' of the RX synthesizer XOR between internal signals `up' and `down' of the TX synthesizer XOR between internal signals `up' and `down' of the RX or TX synthesizers reference divider output divided by 2 prescaler and main divider RX divided by 2 prescaler and main divider TX divided by 2 both synthesizer charge pumps are in high-impedance-state SELECT
2002 Sep 09
27
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCC Tstg Tamb 9 HANDLING supply voltage storage temperature ambient temperature PARAMETER -55 -20 MIN. -0.3
UAA3515A
MAX. +6.0 +125 +80 V °C °C
UNIT
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. Do not operate or store near strong electrostatic fields. Meets Class 1 ESD test requirements (human body model) in accordance with "EIA/JESD22-A114-B (June 2001)" and class A ESD test requirements (machine model) in accordance with "EIA/JESD22-A115-B (October 1997)". 10 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 68 UNIT K/W
2002 Sep 09
28
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
11 CHARACTERISTICS VCC = VCC(PS) = VCC(ATX) = VCC(ARX) = VCC(IF) = VCC(BLO) = VCC(MIX) = VCC(LNA) = 3.3 V; Tamb = 25 °C; unless otherwise specified. SYMBOL Supplies VCC positive supply voltage to pins VCC(PS); VCC(ATX); VCC(ARX); VCC(IF); VCC(BLO); VCC(MIX); VCC(LNA) regulated output voltage VREG enable = 0 VREG enable = 1 inactive mode before Vref adjustment after Vref adjustment Io(VREG) VLBD VLBD Vhys VCC/VCC output current CVREG = 1 µF LOW BATTERY DETECTION: LBD active = 1 detection voltage range number of detection voltage steps comparator hysteresis V VB [ V CC ( high ) V CC ( low ) ] × --------V th measured after Vref adjusted; LBD = 010 2.8 - - - - 8 18 3.5 - - V steps mV 2.5 2.5 2.65 - 2.7 2.7 2.7 - 2.9 2.9 2.75 3 V V V mA 2.9 3.3 5.5 V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
PLL VOLTAGE REGULATOR Vo(VREG) - VCC - V
LBD accuracy
0.5
5
%
Receiver section LNA AND IMAGE REJECTION MIXER; fi(RX) = 903 MHz Ri(RX) Ci(RX) fi(RX) RLi(RX) Gconv(p)(RX) CP1RX IP3RX NFRX IR RL(RX) CL(RX) RF input resistance RF input capacitance RF input frequency return loss on match RF input conversion power gain 1 dB input compression point 3rd order intercept point overall noise figure, RF front end IF resistive output load IF capacitive output load IF section excluded note 1 balun input to MIXO pin; matched to 330 note 1 balanced balanced - - 902 10 - - - - 26 - - 110 0.7 903 - 22 -23 -13 4 45 330 - - - 928 - - - - 5 - - 3 pF MHz dB dB dBm dBm dB dB pF
image frequency rejection in band of interest on pin MIXO on pin MIXO
2002 Sep 09
29
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
SYMBOL
PARAMETER
CONDITIONS 330 matched input and output; SFS = 1; measured at amplifier output 330 matched input and output 330 matched input and output; SFS = 1; measured at amplifier output 330 matched input and output 330 matched input and output; SFS = 0 -
MIN.
TYP. -
MAX.
UNIT
IF AMPLIFIER SECTION: f0 = 10.7 MHz GIFAMP1 voltage or power gain of first IF amplifier noise figure of first IF amplifier voltage or power gain of second IF amplifier noise figure of second IF amplifier gain of IF amplifier section noise figure of IF amplifier section 22.5 dB
NFIFAMP1 GIFAMP2
- -
7 25
- -
dB dB
NFIFAMP2 GIFAMP NFIFAMP
- - -
14 43 7.5
- - -
dB dB dB
PLL DEMODULATOR: f0 = 10.7 MHz; fdev = ±25 kHz; fmod = 1 kHz fVCO/V fVCO fVCO fVCO(step) BWdemod fdev(max) RL(DETO) Vo(DETO)(RMS) Vo(DETO)(DC) VCO gain VCO centre frequency (free running) VCO frequency adjustment VCO centre frequency step size demodulator -3 dB bandwidth maximum frequency deviation demodulator external load on pin DETO PLL output voltage on pin DETO (RMS value) TX mode; RL(DETO) = 10 k; amplifier gain = 10; note 3 loop filter: see note 2 after calibration open loop; all conditions see Table 10 - 7.0 - - 10 - 5 - 1.2 760 10.7 32 200 - - - 100 1.4 - 15.0 - - - ±75 - 350 1.6 kHz/V MHz steps kHz kHz kHz k mV V
PLL output DC voltage on microcontroller adjustable DC pin DETO component
FM RECEIVER: f0 = 903 MHz; fdev = ±25 kHz; fmod = 1 kHz; RL(EARO) = 150 in series with 10 µF (all with CCITT filter) sRFI receiver sensitivity measured at antenna; duplexer insertion loss = 3 dB; input level for 12 dB SINAD; bandwidth = 100 kHz RX mode TX mode; PA = 10; VEARO(RMS) = 200 mV; TX to RX duplexer isolation is 35 dB minimum - - -115 -113.5 - - dBm dBm
2002 Sep 09
30
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
SYMBOL S/NFM
PARAMETER signal-to-noise ratio
CONDITIONS TX mode; Vi(RF) = -80 and -40 dBm; PA = 10; CLKO level = 0; VEARO(RMS) = 200 mV TX mode; fdev = ±60 kHz; Vi(RF) = -80 and -40 dBm; PA = 10; CLKO level = 0; VEARO(RMS) = 500 mV; measured without CCITT filter
MIN. 40
TYP. 45 -
MAX.
UNIT dB
THDFM
total harmonic distortion
-
0.6
2
%
RSSI AND CARRIER DETECTION: VB = 1.5 V RSSI VOH VOL Rint output current dynamic range - 68 - - 175 - - 0.1VCC - dB V V k
HIGH-level output voltage Vi(LIM)(RMS) = 0 mV; CD = 10011 0.9VCC at pin CDLBD LOW-level output voltage at pin CDLBD internal resistance between pin RSSI and VCC voltage detection range voltage detection step hysteresis carrier sense threshold microcontroller programmable Vi(LIM) = 0.1 V (RMS); CD = 10011 - -
Vdet Vdet Vhys Vth(CD) Vi(DATC)(p-p) Vhys(DATC) Vth(DATC) Zi(DATC) VOH VOL IOHsink
0.05 - - - 100 25 - 150 0.9VCC - - Vi(DATI) = VCC - 0.4 V Vi(DATI) = VCC - 0.4 V; Vo(DATO) = 0.1VCC
- 40 45 32 - 40
1.6 - - - - 75
V mV mV steps
DATA COMPARATOR comparator input signal (peak-to-peak value) hysteresis pin DATI threshold voltage pin DATI input impedance HIGH-level output voltage Vi(DATI) = VCC - 1.4 V LOW-level output voltage pin DATO output sink current mV mV V k V V µA
VCC - 0.9 - 240 - - 40 - - 0.1VCC -
Transmitter section SUMMING AMPLIFIER Vo(p-p) Rfb Vbias pin MODO output voltage (peak-to-peak value) pin MODI bias voltage - 94 - 2.2 240 - - mV k V
external feedback resistor between pins MODI and MODO 10 -
2002 Sep 09
31
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
SYMBOL
PARAMETER
CONDITIONS -
MIN.
TYP. - - - - -
MAX.
UNIT
TX VOLTAGE-CONTROLLED OSCILLATOR AND POWER AMPLIFIER fVCO(TX) QL(VCO)(TX) f VCO ( TX ) ------------------------V TXLF f VCO ( TX ) ------------------------V mod NVCO(TX) VCO free running frequency quality factor of external inductor VCO gain note 1 L = 3.9 nH; fVCO = 902 to 928 MHz VTXLF = 0.5 V VTXLF = 1.5 V VCO modulation gain VMODO = 2.2V 910 - 50 25 530 MHz
30 - - -
MHz/V MHz/V kHz/V
VCO and power amplifier phase noise
Po = 0 dBm; fcarrier = 925.6 MHz; TX to RX duplexer isolation is 35 dB minimum; Lext = 3.9 nH (both base and handset); loop filter: see note 4 foffset = 20 MHz foffset = 10 kHz foffset = 1 kHz -139 - - - - - Ro = 50 , LP = 22 nH, CS = 1.6 pF (see Fig.4); remove duplexer insertion loss to get power on the antenna fdev = ±60 kHz; VMODO = 225 mV (p-p); CCITT filter included note 1 - -150 -85 -60 2 4 1 - - - - - - dBc/Hz dBc/Hz dBc/Hz dB steps dBm
Po(PA) Po(PA) Po(PA)(max)
PA output power range PA output power adjustment PA maximum output power
Ro = 50 , LP = 22 nH; CS = 1.6 pF (see Fig.4)
TRANSMIT SYSTEM THDTX total harmonic distortion after demodulation RXVCO crosstalk on PA output with respect to output power 1 2 %
ct(RX-TX)
-
-45
-
dBc
Synthesizer CRYSTAL OSCILLATOR: external capacitor on pin XTALO is 8.2 pF; on pin XTALI is 5.6 pF (indicative) f(i)XTAL CXTALI CXTALO CTUNE crystal input frequency input capacitance on pin XTALI input capacitance on pin XTALO crystal tuning capacitance range indicative; XTAL tuning cap = 8 (see Table 5) indicative on XTALI pin 4 - - - 10.24 4 1.5 4.5 20 - - - MHz pF pF pF
2002 Sep 09
32
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
SYMBOL NTUNE
PARAMETER number of capacitance tuning steps
CONDITIONS -
MIN.
TYP. 16 -
MAX.
UNIT steps
REFERENCE AND CLOCK DIVIDER RDR CDR CL(CLKOUT) VCLKOUT(p-p) tsw(f1-f2) reference divider ratio clock divider ratio clock output load capacitance CLKOUT voltage swing (peak-to-peak value) switching time from frequency f1 to f2 5 steps (2, 2.5, 4, 1 and 128) external to pin CLKOUT CLKO level = 0 CLKO level = 1 8 1 - - - - - - - 1.4 1 2 ---f2 1023 128 20 - - - pF V V s
RF TX AND RX PRESCALER AND MAIN DIVIDERS fRF RPDR RMDR IRXCPsink IRXCPsource ITXCPsink ITXCPsource RX VCO fVCO QL(VCO)(RX) f VCO ( RX ) -------------------------V RXLF oscillator free running frequency external inductor quality factor VCO gain note 1 f = 920 MHz; L = 3.9 nH Lext = 4.7 nH at 890 MHz (3.9 nH for 935 MHz operation) VRXLF = 0.5 V VRXLF = 1.5 V NVCO(RX) VCO RX phase noise; (indicative: cannot be measured directly) fcarrier = 892.3 MHz; Lext = 4.7 nH (3.9 nH for 935 MHz operation); loop filter: see note 5 foffset = 1 kHz foffset = 10 kHz foffset = 100 kHz - - - -58 -82 -102 - - - dBc/Hz dBc/Hz dBc/Hz - - 55 30 - - MHz/V MHz/V - 30 910 - - - MHz RF input frequency prescaler divider ratio main divider ratio 902 64 8 - - - - - - - - 903 - - 400 800 -400 -800 400 800 -400 -800 928 127 1023 - - - - - - - - µA µA µA µA µA µA µA µA MHz
Charge pump current
RX charge pump sink current RX charge pump source current TX charge pump sink current TX charge pump source current RXCPI = 0 RXCPI = 1 RXCPI = 0 RXCPI = 1 TXCPI = 0 TXCPI = 1 TXCPI = 0 TXCPI = 1
2002 Sep 09
33
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
SYMBOL
PARAMETER
CONDITIONS -
MIN.
TYP. -
MAX.
UNIT
VOLTAGE DOUBLER (Doubler enable = 1) VCC(CP) charge pump supply voltage from voltage doubler voltage doubler current consumption VCC = 3 V 5.2 V
ICC(CP)
PLL locked RX or TX mode CDR = 128 - - 300 130 - - µA µA
RX baseband RX AUDIO PATH (see Fig.6): VVB = 1.5 V; fmod = 1 kHz; RX gain set for 0 dB at VI(RXAI) = -20 dB; earpiece amplifier gain set by VCTL to 4.7 dB; with no external resistor and Cext = 560 pF; measured with a CCITT filter, except THD; ZL(EARO) = 150 in series with 10 µF GRX GRX(steps) GRX(mute) GEXP RX gain adjustment range on RX gain amplifier on EARO -7.5 -15 - - -1 -22 -34 - - - - 32 -70 0 -20 -30 -13 -7 +8 +16 - -60 +1 -18 -26 - - dB dB steps dB dB dB dB dBV dBV
RX gain adjustment steps programmable through microcontroller interface RX gain with mute on expander gain Vi(RXAI) = -20 dBV Vi(RXAI) = -20 dBV Vi(RXAI) = -30 dBV Vi(RXAI) = -35 dBV
Vi(RXAI)(max) Vo(EXP)(max)
maximum input voltage
THD < 4%
maximum expander indicative; THD < 4% output voltage (indicative: cannot be measured directly) RX audio path noise input impedance BW = 300 Hz to 3.4 kHz note 3 TX mode RX mode
NRX Zi(RXAI)
- - 100 - - -
-83 15 - 2.0 5.0 80
- - - - - -
dBVp k k ms ms dB
tatt(EXP) trel(EXP) ct(TX-RX)
expander attack time expander release time TX compressor to RX expander crosstalk attenuation
CECAP = 0.47 µF CECAP = 0.47 µF measured between pins CMPI and EARO; VRXAI = 0; VCMPI = -20 dBV THD < 4% in series with 10 µF capacitor
VEARO(max)(p-p) maximum output voltage (peak-peak value) RL(EARO) load resistance on pin EARO for stable earpiece amplifier earpiece amplifier gain set by internal resistors without external components (Rext and Cext)
- -
2.2 0.15
- 100
V k
GEAR
Rint = 14 k Rint = 24 k Rint = 41 k Rint = 70.2 k
-1 3.7 8.3 13
0 4.7 9.3 14
+1 5.7 10.3 15
dB dB dB dB
2002 Sep 09
34
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
SYMBOL GEAR(dyn) THDARX TX baseband
PARAMETER dynamic earpiece amplifier gain audio receiver total harmonic distortion
CONDITIONS
MIN. 13
TYP. 14 0.2
MAX. 15 2
UNIT dB %
Vi(RXAI) = -20 dBV
-
MICROPHONE AMPLIFIER: VVB = 1.5 V; fmod = 1 kHz VMICO(max) GV GCOMP GCOMP maximum output voltage voltage gain range RL = 10 k; THD < 4% -12 0 - - 10 10 -10 23 1.26 - 34 dBV dB
TX AUDIO PATH (see Fig.8): VVB = 1.5 V; fmod = 1 kHz; TX gain set for 10 dB at VCMPI = -30 dBV compressor gain level change in compressor gain referenced to VCMPI = -30 dBV maximum compressor gain ALC disable = 1; hard limiter enable = 0 VCMPI = -10 dBV VCMPI = -50 dBV VCMPI = -70 dBV 9 8 -12 - - 11 12 -8 - - dB dB dB dB V
GCOMP(max) VHLIM(p-p)
hard limiter output voltage ALC disable = 1; (peak-to-peak value) hard limiter enable = 1; VCMPI = -4 dBV maximum output voltage range ALC disable = 0 VCMPI = -12 dBV VCMPI = -10 dBV VCMPI = -2.5 dBV
VTXO(max)
- - - - -
-12.5 -12.3 -11.5 0.3 15 4.0 8.0 65
- - - 1 - - - -
dBV dBV dBV % k ms ms dB
THDCOMP ZCMPI tatt(COMP) trel(COMP) ct(RX-TX)
compressor total harmonic distortion input impedance on pin CMPI compressor attack time compressor release time RX expander to TX compressor crosstalk attenuation
ALC disable = 1; VCMPI = -10 dBV
CCCAP = 0.47 µF CCCAP = 0.47 µF measured between pins RXAI and TXO; VCMPI = 0; VRXAI = -10 dBV
- - -
GTX GTX(steps) GTX(mute) Zo(TXO)
TX gain adjustment range programmable through microcontroller interface TX gain adjustment steps programmable through microcontroller interface TX gain with mute on output impedance at pin TXO ALC disable = 1; VCMPI = -10 dBV
-7.5 - - -
- 32 -70 500
+8 - -60 -
dB steps dB
2002 Sep 09
35
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
UAA3515A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Microcontroller interface DC CHARACTERISTICS FOR DIGITAL PINS VIL VIH IIL IIH IOL VOL VOH Ci Co tsu(CLK-EN) tsu(DATA-CLK) th(EN-CLK) fCLK tr tf tEND tw tstrt Notes 1. Measured and guaranteed only on the Philips UAA3515A test board. 2. Loop filter: C1 = 1.8 nF; R2 = 4.7 k; C2 = 150 nF (see "Report CTT01001", available on request). 3. RXAI level will be higher in RX mode than in TX mode. 4. Loop filter: C1 = 3.9 nF; R2 = 6.8 k; C2 = 47 nF (see "Report CTT01001", available on request). 5. Loop filter: C1 = 470 nF; R2 = 1.8 k; C2 = 4.7 µF (see "Report CTT01001", available on request). LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current LOW-level output current LOW-level output voltage input capacitance output capacitance serial interface serial interface serial interface; VIL = 0.3 V serial interface; VIH = VREG - 0.3 V pin CDLBD pin CDLBD; RL = 470 k serial bus pins RXPD and TXPD - V VREG ---------------1.5 -5 - 20 - 0.9VCC - - 50 50 50 - 10% to 90% 10% to 90% - - 100 see Fig.10 90% of VVREG to DATA, CLK and EN present 1 --------------fcomp - - - - - - - - - - - - - - - - - - - 0.5 VCC - 5 - 0.1VCC - 8 8 - - - 3 50 50 - - 200 V V µA µA µA V V pF pF
HIGH-level output voltage pin CDLBD; RL = 470 k
SERIAL INTERFACE TIMING; CLK, DATA and EN (see Fig.10) clock to enable set-up time input data to clock set-up time enable to clock hold time clock frequency input rise time input fall time delay from last falling clock edge enable pulse width microcontroller interface start-up time 50% signal level 50% signal level 50% signal level ns ns ns MHz ns ns ns ns µs
2002 Sep 09
36
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
12 PACKAGE OUTLINE LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
UAA3515A
SOT314-2
c
y X A 48 49 33 32 ZE
e E HE wM bp 64 1 pin 1 index 16 ZD bp D HD wM B v M B v M A 17 detail X L Lp A A2 A1 (A 3)
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.60 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.5 HD HE L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 7 0o
o
12.15 12.15 11.85 11.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT314-2 REFERENCES IEC 136E10 JEDEC MS-026 EIAJ EUROPEAN PROJECTION
ISSUE DATE 99-12-27 00-01-19
2002 Sep 09
37
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
13 SOLDERING 13.1 Introduction to soldering surface mount packages
UAA3515A
· Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. · For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. · For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.4 Manual soldering
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. 13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
2002 Sep 09
38
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
13.5 Suitability of surface mount IC packages for wave and reflow soldering methods
UAA3515A
SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
2002 Sep 09
39
Philips Semiconductors
Product specification
900 MHz analog cordless telephone IC
14 DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
UAA3515A
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 15 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 16 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products,