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PRODUCT SPECIFICATION
Tentative Specification
Preliminary Specification
Approval Specification
MODEL NO.: V315H3
SUFFIX: LE2
Customer:
APPROVED BY SIGNATURE
Name / Title
Note
Please return 1 copy for your confirmation with your
signature and comments.
Approved By Checked By Prepared By
Chao-Chun Chung Vincent Chou Samuel Huang
Version 2. 0 1 D a te 28 J u l , 20 10
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
CONTENTS -
1 . GE N E RAL D E S C RIP T ION ...................................................................................................................................................5
1 .1 OVE RVIE W ................................................................................................................................................... 5
1 .2 F E AT U RE S .................................................................................................................................................... 5
1 .3 AP P L IC AT ION ............................................................................................................................................. 5
1 .4 GE N E RAL S P E C IF IC AT ION S ..................................................................................................................... 5
1 .5 M E C H AN IC AL S P E C IF IC AT ION S ............................................................................................................ 5
2. AB S OL U T E M AX IM U M RAT IN GS ....................................................................................................................................6
2.1 AB S OL U T E RAT IN GS OF E N VIRON M E N T ............................................................................................. 6
2.2 P AC K AGE S T ORAGE .................................................................................................................................. 7
2.3 E L E C T RIC AL AB S OL U T E RAT IN GS ......................................................................................................... 7
2.3.1 T F T L C D M OD U L E ....................................................................................................................7
2.3.2 B AC K L IGH T C ON VE RT E R U N IT ..............................................................................................7
3. E L E C T RIC AL C H ARAC T E RIS T IC S ...................................................................................................................................8
3.1 T F T L C D M OD U L E ...................................................................................................................................... 8
3.2 B AC K L IGH T C ON N E C T OR P IN C ON F IGU RAT ION ........................................................................... 10
3.2.1 LED LIGHT BARCHARACTERISTICS ................................................................................................ 11
3.2.2 C ON VE RT E R C H ARAC T E RIS T IC S .......................................................................................... 11
4 . B L OC K D IAGRAM OF IN T E RF AC E ................................................................................................................................ 1 3
4.1 TFT LCD MODULE5. INPUT TERMINAL PIN ASSIGNMENT.................................................................. 13
5. IN T E RF AC E P IN C ON N E C T ION ..................................................................................................................................... 1 5
5.1 TFT LCD Module Input................................................................................................................................. 14
5.2 B AC K L IGH T U N IT .................................................................................................................................... 17
5.3 C ON VE RT E R U N IT ................................................................................................................................... 17
5.4 B L OC K D IAGRAM OF IN T E RF AC E ........................................................................................................ 19
5.5 L VD S IN T E RF AC E ..................................................................................................................................... 21
5.6 COLOR DATA INPUT ASSIGNMENT ......................................................................................................... 23
6. IN T E RF AC E T IM IN G......................................................................................................................................................... 23
6.1 INPUT SIGNAL TIMING SPECIFICATIONS............................................................................................... 23
6.2 P OW E R ON / OF F S E Q U E N C E ................................................................................................................. 26
7 . OP T IC AL C H ARAC T E RIS T IC S ........................................................................................................................................ 27
7 .1 T E S T C ON D IT ION S ................................................................................................................................... 27
7 .2 OP T IC AL S P E C IF IC AT ION S .................................................................................................................... 27
8. D E F IN IT ION OF L AB E L S .................................................................................................................................................. 31
8.1 CMI MODULE LABEL ................................................................................................................................ 31
Version 2. 0 2 D a te 28 J u l , 20 10
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PRODUCT SPECIFICATION
9 . P AC K AGIN G...................................................................................................................................................................... 32
9.1 PACKING SPECIFICATIONS ...................................................................................................................... 32
9.2 PACKING METHOD.................................................................................................................................... 32
1 0. P RE C AU T ION S ................................................................................................................................................................ 34
10.1 ASSEMBLY AND HANDLING PRECAUTIONS ....................................................................................... 34
10.2 SAFETY PRECAUTIONS .......................................................................................................................... 34
10.3 STORAGE PRECAUTIONS ....................................................................................................................... 34
1 1 . RE GU L AT ORY S T AN D ARD S ......................................................................................................................................... 35
11.1 SAFETY ..................................................................................................................................................... 35
1 2. M E C H AN IC AL C H ARAC T E RIS T IC .............................................................................................................................. 36
Version 2. 0 3 D a te 28 J u l , 20 10
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
R E VI S I O N H IS T O R Y
Ve rs i on D a te P a g e (N e w ) S e c t i on D e s c ri p t i on
Ve r. 2.0 J u l.28, 201 0 All All Approval specification was first issued.
!
Version 2. 0 4 D a te 28 J u l , 20 10
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
1. G E N E R A L D E S C R I P T I O N
1.1 OVERVIEW
V315H3- LE2 is a TFT Liquid Crystal Display module with LED Backlight unit and 2ch-LVDS interface. The
display diagonal is 31.5". This module supports 1920 x 1080 Full HDTV format and can display true 16.7M
colors (8-bit/color).
1.2 F EA T U RES
- Optimized Brightness 450nits
- Contrast Ratio (6000:1)
- Fast Response Time (8.5ms)
- Color Saturation NTSC 72%
- Full HDTV (1920 x 1080 pixels) resolution, true HDTV format
- DE (Data Enable) Only Mode
- LVDS (Low Voltage Differential Signaling) Interface
- Viewing Angle: 176(H)/176(V) (CR>20) MVA Technology
- Color Reproduction (Nature Color)
1.3 A P P L IC A T ION
-TFT LCD TVs
-Optimized Brightness, Multi-Media Displays
1.4 G EN ERA L S P EC IF IC A T ION S
Item Specification Unit Note
Active Area 698.4(H) x 392.85(V) mm
(1)
Bezel Opening Area 705.4(H) x 399.8 (V) mm
Driver Element a-si TFT active matrix - -
Pixel Number 1920x R.G.B. x 1080 pixel -
Pixel Pitch(Sub Pixel) 0.12125 (H) x 0.36375 (V) mm -
Pixel Arrangement RGB vertical stripe - -
Display Colors 16.7M color -
Display Operation Mode Transmissive mode / Normally Black - -
Surface Treatment Anti-Glare coating (Haze 11%) Hard Coating (3H) - (2)
1.5 M EC H A N IC A L S P EC IF IC A T ION S
Item Min. Typ. Max. Unit Note
Horizontal (H) 740.4 741.4 742.4 mm Module Size
Vertical (V) 434.8 435.8 436.8 mm
Module Size
14.2 15.2 16.2 mm To Rear
Weight Depth (D)
34.9 35.9 36.9 mm To Boss
Weight 4530 g
Note (1)Please refer to the attached drawings for more information of front and back outline dimensions.
Note (2) Module Depth does not include connectors.
Version 2. 0 5 D a te 28 J u l , 20 10
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
2 .A B S O L U T E M A X I M U M R A T IN G S
2 .1 A B S OL U T E RA T IN G S OF EN VIRON M EN T
Va lu e
It e m S y mb ol U n it N ot e
M in . M a x .
S t ora g e T e mp e ra t u re T S T -20 + 60