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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
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EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
Table of Contents
HAINAN3_EXT 1. COVER
2-7. DIAGRAM & ANNOTATION
8. CLOCK
g l
9-11. MEROM
12. THERMAL & FAN
CPU : Intel Santarosa Merom
n a
13-17. RS600
18. DDR2 SODIMM
Chip Set : RS600&SB600&M64S
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19 . DDR2 TERMINATION
20-22. GFX
Remarks : Mobility Platform
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C 23. GFX MEMORY C
24-27. SB600
28. SB600 TERMINATION
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29. SPI ROM
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30. LCD
Model Name : HAINAN3_EXT 31. CRT
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32. 4 IN 1 CARD
PBA Name : MAIN 33. EXPRESS CARD
34. MINICARD/DMB/BT
S f
PCB Code : BA41-00809A GCE 35-37. AUDIO
38. HDD & ODD
BA41-00810A NANYA 39. MICOM
40. LAN
Dev. Step : MP1.1
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41. LAN & MDC & USB CONN
B 42. KBD & TOUCH-PAD CONN B
Revision : 1.0 43. CHARGE
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44. P3.3V_AUX & P5.0V_AUX
T.R. Date : 2007.09.08 45. P1.2V & VCCP_CORE
46. GRAPHIC CORE POWER
C
47. DDR2 POWER
48. CPU VRM
49. SWITCH POWER
DRAW CHECK APPROVAL 50. POWER SWITCH AND LED
51. POWER STRAPS
52-53. TP
ELLEN ZHANG ROKY ZHENG KEVIN LEE
A A
DRAW DATE TITLE
CHECK
ELLEN ZHANG
DEV. STEP
9/8/2007
HAINAN3_EXT SAMSUNG
ROKY ZHENG MP1.1
ELECTRONICS
APPROVAL REV PART NO.
KEVIN LEE 1.0 COVER BA41-00809/810A
MODULE CODE LAST EDIT
undefined September 8, 2007 12:02:16 PM PAGE 1 OF 53
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU
D Mobile Processor VRM D
PG 12
IMVP-6
Merom - 4M
CPU Charging
LCD Thermal (667MHz/800) PG 43
Circuit
Sensor
30P
PG 12 L2 Cache : 2 MB PG 39
PG 25 PG 9,10,11 478pin
LVDS PSB
667 MT/S
DDR II Switche PWR
CRT VRM
Ext. PEG
g l
External Graphics PG 44
PEG x16 PG 42
PG 27 CRT
AMD M64S
DDR II PG 18
GMCH-M
n a
SODIMM 0
Single channel DDR II 667/533
RS600M DDR II PG 18
u ti
Video Memory
1021 FCBGA SODIMM 1
ANT
GFx Board Internal Graphics PG 13 ~ 17
s n
C LVDS C
CRT/TV Wireless LAN
Direct Media Interface
x4/x2, 1.5V
Ext. - Int. Option
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Clocking MiniCARD CONN.
PG 30
m e
ICS95461
64 PIN MiniPCIE USB 6
PG 8
USB 5 4 IN 1 CARD
a id
AU6366 SD/xD/MS PG 28
USB 0,1,2
PG 37 USB 0,1,2 PG 28
ANT
S f
AUDIO SB600 USB 7
BT PG 30
Audio 549 BGA PCIE x1 Lane 2 26P
AZALIA AZALIA Primary USB 4 Express Card
AMP PG 29
Codec PG 29
ALC262 12P
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PG 32 PG 31
AZALIA
AZALIA Secondary
B RJ11 MDC PG 20 ~ 23 PCI LAN B
RTL8100CL RJ45
HP Modem
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PG 37
PG 36-37
MIC-IN PG 37 PG 37
PG 33
SPI SPI
C
2P
MX25L8005
Pri. IDE slave
PG 25
SATA PG 38
SPKR R
PG 34
HDD CD-ROM Touch
PG 32 SATA MICOM PAD
PG 34 3.3V LPC, 33MHz
Hitachi H8S
H8S-2110B KBD
PG 35 PG 38
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PROPRIETARY INFORMATION THAT IS
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Power Diagram
KBC3_SUSPWRON KBC3_PWRON KBC3_VRON VCCP3_PWRGD
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AC Adapter MEROM
P1.05V NB CPU_CORE
P12.0V_ALWS SB
P1.5V (VCCP_CORE) MEROM
VDC P5.0V_ALWS
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P1.8V_AUX P1.8V
P1.2V_ALWS
n a
Battery DC
P1.2V
P3.3V_MICOM
C
u ti
s n
P1.2V_ALWS
P0.9V C
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m e
P5.0V_AUX P5.0V
a id
S f
P3.3V_AUX
P2.5V_LAN
P3.3V
B
o n B
C
Rail
State +V*Always +V*AUX +V SUSPWR PWRON VRON
Full On ON ON ON H H H
S3 ON ON OFF H L L
S4 ON ON OFF H L L
S5 ON OFF OFF L L L
S5 / S4 S3 S0
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PROPRIETARY INFORMATION THAT IS
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DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER SEQUENCE
VDC
ADT3_SEL
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P3.3V_MICOM
KBC3_RST*
P5.0V_ALWS
P1.2V_ALWS
PRTC_BAT T1
KBC3_PWRSW*
g l
KBC3_SUSPWRON T2=10mS
P5V_AUX/P3.3V_AUX/P1.8V_AUX/1.2V_AUX
n a
u ti
KBC3_RSMRST*
MEM1_VREF
KBC3_PWRBTN*
T3=40mS
T5=10mS
T14=50mS
s n
C T16=170mS C
CHP3_SLPS5*
T4=120mS
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CHP3_SLPS3* T5=3mS
m e
KBC3_PWRON
T15=30mS
KBC3_CLKPWRGD#
a id
S f
P5.0V
PWRON
P1.8V/P1.5V/P0.9V/P1.2V
KBC3_RUNSCI#
KBC3_VRON
n
T6=100mS
B VCCP_CORE B
o
VCCP3_PWRGD
CPU_CORE
C
VRM3_CPU_PWRGD T8=50mS
KBC3_NBPWRGD T7=15mS T9=110mS
KBC3_SBPWRGD
T10=(47-66)mS
CPU1_PWRGDCPU
CHP3_ALINK_RST* T11=80nS
PCI3_RST* T12=72mS
CPU1_CPURST* T13=73mS
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PROPRIETARY INFORMATION THAT IS
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DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER RAILS ANALYSIS
ADAPTER
D 220V BATTERY D
MAX1909ETI+T
g l
n a ISL6227CAZ-T
P1.2V
VCCP_CORE
u ti P0.9V
19V
s n
C C
P5.0V_ALWS P1.5V
MIC5219
MAX8632ETI+
P1.8V_AUX P1.8V
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FDS6680A
m e
a id MAX8734AEEI+T
P3.3V_AUX FDS6680A
P3.3V
S f P5.0V_ALWS
P5.0V_AUX SI4435DY
P5.0V
SC452
CPU_CORE
n
MAX8734
B B
o
P3.3V_MICOM
P1.2V_ALWS
C
MIC5258
MIC5219B
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CLK0_HCLK0
CLK0_HCLK0* MEROM
CLK0_HCLK1
CLK0_HCLK1#
CLK1_PCIEICH
RS600MF
g l
CLK1_PCIEICH#
CLK1_PCIENB
n a
CLK1_PCIENB#
CLK3_NB14M
C
u ti
s n
CLK1_PCIEGFX
M64S
C
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CLK1_PCIEGFX#
m e
a id
CLOCK GENERATOR CLK1_PCIERCLK
CLK1_PCIERCLK#
CLK3_PCLKLAN
CLK3_DBGLPC
RTL8100
S f
DEBUG CARD
SB600
CLK3_USB48 CLK3_PCLKMICOM 10MHz
MICOM
n
B CLK3_ICH14 25MHz
B
C o CLK1_EXPCARD
CLK1_EXPCARD#
CLK1_MINPCIEB
CLK1_MINPCIEB#
EXP CARD
MINI CARD
14.318 MHz
A A
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
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SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
D D
PCI Devices Crystal / Oscillator
Devices IDSEL# REQ/GNT# Interrupts TYPE FREQUENCY DEVICE USAGE
AD21 1 Crystal 32.768KHz SB600 Real Time Clock
LAN G Crystal 10MHz MICOM HD64F2110B
USB AD30(internal) - - Crystal 14.318MHz CLOCK-Generator ICS95461
- Crystal 12MHz AU6366 4 IN 1 CARD
- Crystal 25MHz LAN LOM
Hub to PCI AD31(internal) - -
g l
LPC bridge/IDE/AC97/SMBUS AD31(internal) - -
Internal MAC AD31(internal) - -
AC Link - - -
CPU Core Voltage Table
n a
IMVP-6
Voltage Rails
Active/Deeper Sleep
u ti
CPU_CORE CPU Active Mode Deeper Sleep/Extended Deeper Sleep
Dual Mode Region
VCCP_CORE CPU RS600 SB600 Dual Mode Region
P1.2V RS600 SB600
VID(6:0) Voltage VID(6:0) Voltage VID(6:0) Voltage
s n
C C
P1.5V CPU EXPCARD 0 0 0 0 0 0 0 1.5000 V 0 1 0 1 0 0 0 1.0000 V 1 0 1 0 0 0 1 0.4875 V
P1.8V RS600 0 0 0 0 0 0 1 1.4875 V 0 1 0 1 0 0 1 0.9875 V 1 0 1 0 0 1 0 0.4750 V
P0.9V DDR2 0 0 0 0 0 1 0 1.4750 V 0 1 0 1 0 1 0 0.9750 V 1 0 1 0 0 1 1 0.4625 V
P5.0V FAN THERMAL CRT SB600 AU6366 MINIPCI ALC262 HDD ODD MICOM USB TOUCH-PAD CPU_CORE 0 0 1
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0 0 0 0 1 1 1.4625 V 1 0 1 0 1 1 0.9625 V 0 1 0 1 0 0 0.4500 V
P3.3V SYSTEM POWER 0 0 0 0 1 0 0 1.4500 V 0 1 0 1 1 0 0 0.9500 V 1 0 1 0 1 0 1 0.4375 V
P2.5V_LAN RTL8100 0 0 0 0 1 0 1 1.4375 V 0 1 0 1 1 0 1 0.9375 V 1 0 1 0 1 1 0 0.4250 V
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0 0 0 0 1 1 0 1.4250 V 0 1 0 1 1 1 0 0.9250 V 1 0 1 0 1 1 1 0.4125 V
0 0 0 0 1 1 1 1.4125 V 0 1 0 1 1 1 1 0.9125 V 1 0 1 1 0 0 0 0.4000 V
P1.8V_AUX DDR2 P1.8V RS600 0 0 0 1 0 0 0 1.4000 V 0 1 1 0 0 0 0 0.9000 V 1 0 1 1 0 0 1 0.3875 V
P5.0V_AUX THERMAL LCD P1.2V P5.0V 0 0 0 1 0 0 1 1.3875 V 0 1 1 0 0 0 1 0.8875 V 1 0 1 1 0 1 0 0.3750 V
a id
0 0 0 1 0 1 0 1.3750 V 0 1 1 0 0 1 0 0.8750 V 1 0 1 1 0 1 1 0.3625 V
P3.3V_AUX MDC MICOM MINIPCI EXP-CARD SB600 THERMAL 0 0 0 1 0 1 1 1.3625 V 0 1 1 0 0 1 1 0.8625 V 1 0 1 1 1 0 0 0.3500 V
0 0 0 1 1 0 0 1.3500 V 0 1 1 0 1 0 0 0.8500 V 1 0 1 1 1 0 1 0.3375 V
P12.0V_ALWS P1.5V P3.3V P1,8V 0 0 1
0 0 1 1 0 1 1.3375 V 1 1 0 1 0 1 0.8375 V 0 1 1 1 1 0 0.3250 V
P5.0V_ALWS P3.3V DDR2-PWR 0 0 0 1 1 1 0 1.3250 V 0 1 1 0 1 1 0 0.8250 V 1 0 1 1 1 1 1 0.3125 V
P3.3V_MICOM THERMAL SB600 MICOM LED P1.8V_ALWS
S f
0 0 0 1 1 1 1 1.3125 V 0 1 1 0 1 1 1 0.8125 V 1 1 0 0 0 0 0 0.3000 V
P1.2V_ALWS SB600,P1.2V 0 0 1 0 0 0 0 1.3000 V 0 1 1 1 0 0 0 0.8000 V 1 1 0 0 0 0 1 0.2875 V
0 0 1 0 0 0 1 1.2875 V 0 1 1 1 0 0 1 0.7875 V 1 1 0 0 0 1 0 0.2750 V
0 0 1 0 0 1 0 1.2750 V 0 1 1 1 0 1 0 0.7750 V 1 1 0 0 0 1 1 0.2625 V
VDC Primary DC system power supply (7 to 21V) 0 0 1 0 0 1 1 1.2625 V 0 1 1 1 0 1 1 0.7625 V 1 1 0 0 1 0 0 0.2500 V
0 0 1 0 1 0 0 1.2500 V 0 1 1 1 1 0 0 0.7500 V 1 1 0 0 1 0 1 0.2375 V
2 0 0 1 0 1 0 1 1.2375 V 0 1 1 1 1 0 1 0.7375 V 1 1 0 0 1 1 0 0.2250 V
0 0 1 0 1 1 0 1.2250 V 0 1 1 1 1 1 0 0.7250 V 1 1 0 0 1 1 1 0.2125 V
I C / SMB Address 0
0
0 1
1
0 1 1 1 1.2125 V 0
1
1 1
0
1 1 1 1 0.7125 V 1
1
1 0
0
1 0 0 1
0 0.2000 V
0 1 0 0 0 1.2000 V 0 0 0 0 0 0.7000 V 1 1 0 0 1 0.1875 V
n
Devices Address Hex Bus 0 0 1 1 0 0 1 1.1875 V 1 0 0 0 0 0 1 0.6875 V 1 1 0 1 0 1 0 0.1750 V
0 0 1 1 0 1 0 1.1750 V 1 0 0 0 0 1 0 0.6750 V 1 1 0 1 0 1 1 0.1625 V
SB600 Master - SMBUS Master 0 0 1 1 0 1 1 1.1625 V 1 0 0 0 0 1 1 0.6625 V 1 1 0 1 1 0 0 0.1500 V
B EMC6N300(CPU Thermal Sensor) 1001 110X 9Ch Thermal Sensor 0 1 1 0 1 0
B
0 1 1 0 0 1.1500 V 0 0 1 0 0 0.6500 V 1 1 1 0 1 0.1375 V
SODIMM0 1010 0000 A0h - 0 1 1 0 1 0
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