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ALUMINUM ELECTROLYTIC CAPACITOR
Unit: mm
Case Land Size
SURFACE MOUNT TYPE Dx L
Code X Y W
Recommended pad pattern and size
4x5.3 D55 1.6 2.6 1.0
4x5.7 D60 1.6 2.6 1.0
5x5.3 E55 1.6 3.0 1.4
5x5.7 E60 1.6 3.0 1.4
6.3x5.3 F55 1.6 3.5 1.9
6.3x5.7 F60 1.6 3.5 1.9
6.3x7.7 F80 1.6 3.5 1.9
8x6.5 G68 1.6 4.0 2.1
Recommended soldering methods
8x10 G10 2.5 3.5 3.0
10x10 H10 2.5 4.0 4.0
(1) Reflow soldering condition.
The following temperature profile condition should be
observed for soldering. (For higher temperature,
pleases contact us after measuring the capacitor's
product temperature profile at your side.)
Product temperature will rise slower as the product
size gets bigger. It is not necessary to adjust the reflow
furnace temperature setting according to the product
size, for example, 4 and10 products can be mixed
on one PCB for reflowing.
(2) Soldering precautions
1. Elements related to the reflow soldering temperature
*Product size: The temperature rises slower as the
size gets bigger.
*Product location: The center part of the PCB tends
to have a lower temperature than the PCB edges.
*PCB size: The PCB temperature rises slower as the
area and / or thickness of the PCB gets greater.
2. Repeated reflowing
*Avoid reflowing twice if possible.
*If repeated reflowing is unavoidable, contact us after
measuring the first and the second reflow profiles
and reflow interval at your side.
*Do not attempt to reflow three times.
3. Soldering with soldering iron
Observe the following conditions.
*The iron tip temperature : 350