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SEMICONDUCTOR KF16N50P/F
N CHANNEL MOS FIELD
TECHNICAL DATA EFFECT TRANSISTOR


General Description
KF16N50P

This planar stripe MOSFET has better characteristics, such as fast A
O
C
switching time, low on resistance, low gate charge and excellent
F
avalanche characteristics. It is mainly suitable for active power factor
E G DIM MILLIMETERS
correction and switching mode power supplies. A _
9.9 + 0.2
B
B 15.95 MAX
Q C 1.3+0.1/-0.05
FEATURES I D _
0.8 + 0.1
E _
3.6 + 0.2
VDSS=500V, ID=16A
K P F _
2.8 + 0.1
Drain-Source ON Resistance : M G 3.7
L
H 0.5+0.1/-0.05
RDS(ON)(Max)=0.36 @VGS=10V J I 1.5
Qg(typ.)= 40.8nC D J _
13.08 + 0.3
N N H K 1.46
L _
1.4 + 0.1
MAXIMUM RATING (Tc=25 ) M _
1.27 + 0.1
N _
2.54 + 0.2
RATING O _
4.5 + 0.2
CHARACTERISTIC SYMBOL UNIT P _
2.4 + 0.2
1 2 3 1. GATE
KF16N50P KF16N50F 2. DRAIN Q _
9.2 + 0.2
3. SOURCE
Drain-Source Voltage VDSS 500 V
Gate-Source Voltage VGSS 30 V
TO-220AB
@TC=25 16 16*
ID
Drain Current @TC=100 9.7 9.7* A
IDP KF16N50F
Pulsed (Note1) 45 45*
A C
Single Pulsed Avalanche Energy EAS 870 mJ
(Note 2) F



O
Repetitive Avalanche Energy EAR 22.5 mJ
(Note 1) E DIM MILLIMETERS
B


A _
10.16 + 0.2
Peak Diode Recovery dv/dt
G




dv/dt 4.5 V/ns B _
15.87 + 0.2
(Note 3) _
C 2.54 + 0.2
Tc=25 225 51 W D _
0.8 + 0.1
Drain Power
PD E _
3.18 + 0.1
Dissipation
K




Derate above 25 1.78 0.41 W/ F _
3.3 + 0.1
G _
12.57 + 0.2
Maximum Junction Temperature Tj 150 L M
R H _
0.5 + 0.1
J




J _
13.0 + 0.5
Storage Temperature Range Tstg -55 150 _
K 3.23 + 0.1
D
L 1.47 MAX
Thermal Characteristics
M 1.47 MAX
N N H
Thermal Resistance, Junction-to-Case RthJC 0.58 2.43 /W N _
2.54 + 0.2
O _
6.68 + 0.2
Thermal Resistance, Q _
4.7 + 0.2
RthJA 62.5 62.5 /W 1. GATE
_
Junction-to-Ambient 2. DRAIN R 2.76 + 0.2
Q




1 2 3
3. SOURCE
* : Drain current limited by maximum junction temperature.



TO-220IS (1)
PIN CONNECTION
D




G



S



2008. 10. 2 Revision No : 1 1/7
KF16N50P/F

ELECTRICAL CHARACTERISTICS (Tc=25 )
CHARACTERISTIC SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT

Static
Drain-Source Breakdown Voltage BVDSS ID=250 A, VGS=0V 500 - - V
Breakdown Voltage Temperature Coefficient BVDSS/ Tj ID=250 A, Referenced to 25 - 0.5 - V/
Drain Cut-off Current IDSS VDS=500V, VGS=0V - - 10 A
Gate Threshold Voltage Vth VDS=VGS, ID=250 A 2 - 4 V
Gate Leakage Current IGSS VGS= 30V, VDS=0V - - 100 nA
Drain-Source ON Resistance RDS(ON) VGS=10V, ID=8A - 0.3 0.36
Dynamic
Total Gate Charge Qg - 40.8 -
VDS=400V, ID=16A
Gate-Source Charge Qgs - 9 - nC
VGS=10V (Note4,5)
Gate-Drain Charge Qgd - 17 -
Turn-on Delay time td(on) - 30 -
VDD=250V
Turn-on Rise time tr - 21 -
ID=16A ns
Turn-off Delay time td(off) - 162 -
RG=25 (Note4,5)
Turn-off Fall time tf - 43 -
Input Capacitance Ciss - 1630 -
Output Capacitance Coss VDS=25V, VGS=0V, f=1.0MHz - 244 - pF
Reverse Transfer Capacitance Crss - 22 -
Source-Drain Diode Ratings
Continuous Source Current IS - - 16
VGS Pulsed Source Current ISP - - 64
Diode Forward Voltage VSD IS=16A, VGS=0V - - 1.4 V
Reverse Recovery Time trr IS=16A, VGS=0V, - 370 - ns
Reverse Recovery Charge Qrr dIs/dt=100A/ s - 4.8 - C
Note 1) Repetivity rating : Pulse width limited by junction temperature.
Note 2) L =6.1mH, IS=16A, VDD=50V, RG=25 , Starting Tj=25 .
Note 3) IS 16A, dI/dt 200A/ , VDD BVDSS, Starting Tj=25 .
Note 4) Pulse Test : Pulse width 300 , Duty Cycle 2%.
Note 5) Essentially independent of operating temperature.

Marking




1
1
KF16N50
KF16N50 F 801 2
P 801 2




1 PRODUCT NAME

2 LOT NO




2008. 10. 2 Revision No : 1 2/7
KF16N50P/F



Fig1. ID - VDS Fig2. ID - VGS
2
100 10
VDS=20V
VGS=10V
Drain Current ID (A)




Drain Current ID (A)
VGS=6V
1 100 C 25 C
10 10
VGS=5V


0
1 10




-1
0.1 10
0.1 1 10 100 3 4 5 6 7 8 9 10

Drain - Source Voltage VDS (V) Gate - Source Voltage VGS (V)




Fig3. BVDSS - Tj Fig4. RDS(ON) - ID
Normalized Breakdown Voltage BVDSS




1.2 0.7
VGS = 0V
On - Resistance RDS(ON) ()




IDS = 250

1.1
0.5

1.0 VGS=6V
VGS=10V
0.3
0.9



0.8 0.1
-100 -50 0 50 100 150 0 5 10 15 20 25 30

Junction Temperature Tj ( C ) Drain Current ID (A)




Fig5. IS - VSD Fig6. RDS(ON) - Tj
2 3.0
10 VGS =10V
Reverse Drain Current IS (A)




IDS = 8A
2.5
Normalized On Resistance




1 2.0
10

100 C 1.5
25 C

10
0 1.0

0.5

-1 0.0
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 -100 -50 0 50 100 150

Source - Drain Voltage VSD (V) Junction Temperature Tj ( C)




2008. 10. 2 Revision No : 1 3/7
KF16N50P/F



Fig 7. C - VDS Fig8. Qg- VGS

104 12
ID=16A




Gate - Source Voltage VGS (V)
VDS = 400V
10
Ciss VDS = 250V
Capacitance (pF)




103 8 VDS = 100V

6
Coss
102 4

2
Crss
101 0
0 10 20 30 40 0 5 10 15 20 25 30 35 40

Gate - Charge Qg (nC)
Drain - Source Voltage VDS (V)



Fig9. Safe Operation Area Fig10. Safe Operation Area
(KF16N50P) (KF16N50F)
102 102

10