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L6210
DUAL SCHOTTKY DIODE BRIDGE
. . . . . .
MONOLITHIC ARRAY OF EIGHT SCHOTTKY DIODES HIGH EFFICIENCY 4A PEAK CURRENT LOW FORWARD VOLTAGE FAST RECOVERY TIME TWO SEPARATED DIODE BRIDGES
DESCRIPTION The L6210is a monolithic IC containing eight Schottky diodes arranged as two separated diode bridges. This diodes connection makes this device versatile in many applications. They are used particular in bipolar steppermotor applications, where high efficient operation, due to low forward voltagedrop andfast reverse recoverytime, are required. The L6210 is available in a 16 Pin Powerdip Package (12 + 2 + 2) designed for the 0 to 70xC ambient temperature range. PIN CONNECTION (top view)
N DIP16 (Plastic Package))
ORDERING NUMBER : L6210
April 1993
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BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol If Vr Tamb Tstg Parameter Repetitive Forward Current Peak Peak Reverse Voltage (per diode) Operating Ambient Temperature Storage Temperature Range Value 2 50 70 55 to +150 Unit A V
o o
C C
THERMAL DATA
Symbol Rth j-case R th j-amb Parameter Thermal Impedance Junction-case Thermal Impedance Junction-ambient without External Heatsink Max. Max. Value 14 65 Unit
o o
C/W C/W
ELECTRICAL CHARACTERISTICS (Tj = 25oC unless otherwise specified)
Symbol Vf Parameter Forward Voltage Drop Test Conditions If = 100 mA if = 500 mA If = 1 A IL
No te : odes.
Min.
Typ. 0.65 0.8 1
Max. 0.8 1 1.2 1
Unit V mA
Leakage Current
VR = 40 V, Tamb = 25 C
o
At forward currents of greater than 1A, a parasiti c current of approxim ately 10mA may be collected by adiacent di-
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Figure 1 : Reverse Current verus Voltage Figure 2 : Forward Voltage versus Current
MOUNTING INSTRUCTIONS The Rth j-amb of the L6210 can be reduced by soldering the GND pins to suitable copper area of the printed circuit boards as shown in figure 3 or to an external heatsink (figure 4). During soldering the pin Figure 3 : Example of P.C. Board Copper Area which is used as Heatsink temperaturemust not exceed260oC andthe soldering time must not be longer then 12s. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 4 : Example of an External Heatsink
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POWERDIP16 PACKAGE MECHANICAL DATA
DIM. MIN. a1 B b b1 D E e e3 F I L Z 3.30 1.27 8.80 2.54 17.78 7.10 5.10 0.130 0.050 0.38 0.51 0.85 0.50 0.50 20.0 0.346 0.100 0.700 0.280 0.201 0.015 1.40 mm TYP. MAX. MIN. 0.020 0.033 0.020 0.020 0.787 0.055 inch TYP. MAX.
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Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A.
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