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TDA1175
LOW-NOISE VERTICAL DEFLECTION SYSTEM
. . . .
COMPLETE VERTICAL DEFLECTION SYSTEM LOW NOISE SUITABLE FOR HIGH DEFINITION MONITORS ESD PROTECTED
DESCRIPTION The TDA1175 is a monolithic integrated circuit in FINDIP plastic package. It is intended for use in black and white and colour TV receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. PIN CONNECTIONS
FINDIP (Plastic Package) ORDER CODE : TDA1175
RAMP OUTPUT SUPPLY VOLTAGE FLYBACK GROUND POWER AMPLIFLIER OUTPUT POWER AMPLIFLIER SUPPLY VOLTAGE REGULATED VOLTAGE
1 2 3
12 11 10
RAMP GENERATOR COMPENSATION AMP. INPUT GROU ND
4 5 6
9 8 7
OSCILLATOR SYNC. INPUT HEIGHT ADJUSTMENT
September 1993
1/8
1175-01.EPS
TDA1175
BLOCK DIAGRAM
+ VS C4 DA
FREQ
6
2
3
5 RH C9
P1
9 C1
OSCILLATOR
VOLTAGE REGULATOR
FLYBACK GENERATOR
POWER AMPLIFIER
4
RG C8 SYNC 8
YOKE
SYNC CIRCUIT
RAMP GENERATOR
BUFFER STAGE
PREAMPLIFI ER
11
C5 C7 RE RD
7 TABS C2 P2 RA
12 1 LINEARITY
10
P3 C3
RB
RC C6 RF
1175-02.EPS
HEIGHT
ABSOLUTE MAXIMUM RATINGS
Symbol Vs V4, V5 V10 Io Io Io I3 I3 I8 Ptot Tstg, Tj Supply Voltage at Pin 2 Flyback Peak Voltage Power Amplifier Input Voltage Output Peak Current (non repetitive) at t = 2ms Output Peak Current at f = 50Hz, t 10µs Output Peak Current at f = 50Hz, t > 10µs Pin 3 DC Current at V4 < V2 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly 1.5ms Pin 8 Current Power Dissipation : at Ttab = 90°C at Tamb = 80°C (free air) Storage and Junction Temperature Parameter Value 35 60 + 10 0.5 2 2.5 1.5 100 1.8 ± 20 5 1 40, + 150 Unit V V V V A A A mA A mA
1175-01.TBL 1175-02.TBL
W W °C
THERMAL DATA
Symbol Rth (j-tab) Rth (j-amb) Parameter Thermal Resistance Junction-tab Thermal Resistance Junction-ambient Max. Max. Value 12 70 Unit °C/W °C/W(1)
(1) Obtained with tabs soldered to printed circuit with minimized copper area.
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TDA1175
ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. DC CHARACTERISTICS (Refer to the test circuits, VS = 35V) I2 I5 I9 I 10 I 12 I 12 I12 I12 Vs V1 V3 V4 V4L V4H V6 V7 Pin 2 Quiescent Current Pin 5 Quiescent Current Oscillator Bias Current Amplifier Input Bias Current Ramp Generator Bias Current Ramp Generator Current Ramp Generator Non-linearity Supply Voltage Range Pin 1 Saturation Voltage to Ground Pin 3 Saturation Voltage to Ground Qiuescent output Voltage Output Saturation Voltage to Ground I1 = 1mA I3 = 10mA Vs = 10V, R1 = 1k, R2 = 1k Vs = 35V, R1 = 3k, R2 = 1k I4 = 0.1A I4 = 0.8A 4.1 8.2 I3 = 0 I4 = 0 V9 = 1V V10 = 1V V12 = 0 I7 = 20µA, V12 = 0 V12 = 0 to 12V, I7 = 20µA 10 1 1.5 4.4 8.8 0.9 1.8 1.4 2.8 6.5 I7 = 20µA Vs = 10 to 35V V8 0.4V 2.20 6.6 6.7 6.8 1 2.27 18.5 7 8 0.1 1 0.02 20 0.2 14 17 1 10 0.3 21.5 1 35 1.4 2.5 4.7 9.4 1.2 2.2 2.1 3.1 6.9 7 2 2.35 mA mA µA µA µA µA % V V V V V V v V V V V mV/V V 1a 1a 1a 1c 1c 1d 1d 1b 1b 1b 1b 1b 1a 1b 1a 1b 1b
Output Saturation Voltage to Supply I4 = 0.1A I4 = 0.8A Regulated Voltage at Pin 6 Regulated Voltage at Pin 7
|V6| |V7| Regulated Voltage Drift with Supply , VS VS Voltage V10 Amplifier Input Reference Voltage
AC CHARACTERISTICS (Refer to the AC test circuit, VS = 22V, f = 50Hz) Is I8 V4 tfly VON fo fOPER f f VS |f| T ab Supply Current Sync. Input Current (positive or negative) Flyback Voltage Flyback Time Peak to Peak Output Noise Free Running Frequency Operating Frequency Range Synchronization Range I 8 = 0.5mA, C9 = 0.1µF (P1+R1) = 300k Iy = 1APP Iy = 1APP Pin 9 Connected to GND (P1 + R1) = 300k C9 = 0.1 µF 36 10 14 0.005 0.01 Iy = 1APP 0.5 45 0.7 18 43.5 120 30 140 2 mA mA V ms mVpp Hz Hz Hz Hz/V Hz/°C 2 2 2 2 2 2 2 2 2 2
1175-03.TBL
Frequency Drift with Supply Voltage Vs = 10 to 35V Frequency Drift with tab Temperature Ttab = 40 to 120°C
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TDA1175
Figure 1 : DC Test Circuits Figure 1a
I3 +V S
Figure 1b
I2 +V S
V3
I5
3 8 2 5
2
4
5
TDA1175
9 I8 7 12 TABS - I 12 8V 10
9
R1
TDA1175
6 12 7
10
TABS - I 10 1V
1175-04.EPS
1k 1V
- I9 1V
V4 R2
V6
- I 12
V7
100k
1175-03.EPS
Figure 1c
+V S
Figure 1d
+V S
2
5
I4
2
5
V 4H
9
TDA1175
10 TABS
4
9
TDA1175
10 TABS
4
V 4L 4V
1175-05.EPS
I4
1V
1175-06.EPS
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TDA1175
Figure 2 : AC Test and Application Circuit for Large Screen B/W TV Set 10/20mH/1APP
V S = 22V 0.1µF 10 0µF 5 1N4001 47 0µF
TABS
2
0.1µF 3.3
4
3
220k
11
100pF
5.6k
Yoke Ry = 10 Ly = 20mH
560*
SYNC. INPUT
8
470pF
1000µF
TDA1175
10
5.6k
10µF
22k
1 9
100k R1
6 7 12
P1 100k
47k 220k 100k 0.1µF
1.8k
* on appl ication only
Figure 3 : Typical Application Circuit for Small Screen 90o CTV Set (RY = 15, LY = 30mH, IY = 0.82APP)
C1 0.1µF C4 100µF D1 1N4001 TABS
5 2
C5 470µF C10 0.1µF
V S = 26V
R8 3.3
4
3
R5 390k C2 0.1µF f sync. = 50Hz R1 4.7k
8
11
C9 100pF
R11 5.6k
Yoke Ry = 15 Ly = 30mH C12 1000µF
TDA1175
10
C6 470pF R10 5.6k C11 10µF
R6 18k
1 9
P1 100k R2
P3 100k
6 7
12
P2 150k 100k R3 100k R4 680k
R7 47k C7 0.1µF C8 0.1µF
R9 1.5k
5/8
1175-08.EPS
C3 0.15µF
R12 1
1175-07.EPS
C9 0.1µF
120k
910k
1
0.1µF
TDA1175
Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale)
C5 D1 R8 R11 C10 R5 C4 C9 GND C1
R6 R10
C11
VS YOKE
TDA1175
R7 R9 R12 C12
YOKE ( VO )
SYNC. IN C6 C3 R1 C2 R3
R4 C7 C8
P1
P2
P3
MOUNTING INSTRUCTION During soldering the tab temperature must not exceed 260°C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. The junction to ambient thermal resistance can be Figure 5 : Example of P.C. Board Copper Area Used as Heatsink
COPPER AREA 35µ THICKNESS
HEATSINK R th = 30°C/W
reduced by soldering the tabs to a suitable copper area of the printed circuit board (Figure 5) or to an external heatsink (Figure 6). The diagram of Figure 7 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side "e" of two equal square copper areas having a thicknessof 35 µ (1.4 mil). Figure 6 : Example of External Heatsink
e
e
1175-10.EPS
P.C. BOARD
P.C. BOARD
6/8
1175-11.EPS
1175-09.EPS
R2
TDA1175
Figure 7 : Maximum Power Dissipation and Junction-ambient Thermal Resistance versus "e" 8 6 4 2 Ptot ( T amb = 55°C) 20 Ptot ( T amb = 70°C) 0 10 20 30
1175-12.EPS
Figure 8 : Maximum Allowable Power Dissipation versus Ambient Temperature
Ptot (W) R wi th He th ats (ta ink bam ha b) =2 ving 5° C/ W Fre e Ai r T amb (°C) 0 -50 0 50 100 150 h wit
Ptot (W)
R th
(°C/W) 80 60 40
2 1 5 4 3
k sin eat eH nit Infi
R th (j-a)
40
0 50
7/8
1175-13.EPS
e (mm)
TDA1175
PACKAGE MECHANICAL DATA : 12 PINS - PLASTIC FINDIP
D G e4
A
a1
I
b c c1 e5 e6 e3 K D E2 E e E1
12
7
1
6
F
L
M
b1
Dimensions A a1 b b1 c c1 D E E1 E2 e e3 e4 e5 e6 F G I K L M
Min. 3.8 1.5 0.55 0.3
Millimeters Typ.
Max. 4.05 1.75 0.6 0.35
Min. 0.150 0.059 0.022 0.012
Inches Typ.
Max. 0.159 0.069 0.024 0.014
1.32 0.94 19.2 16.8 4.86 10.11 2.29 17.43 7.27 12.35 6.3 7.8 6.1 2.5 2.5 17.2 19.9 17.6 5.56 10.81 2.79 18.13 7.97 13.05 7.1 8.6 6.5 2.9 3.1 0.756 0.661 0.191 0.398 0.090 0.686 0.286 0.486 0.248 0.307 0.240 0.098 0.098
0.052 0.037 0.677 0.783 0.693 0.219 0.426 0.110 0.714 0.314 0.514 0.280 0.339 0.256 0.114
2.54 17.78 7.62 7.62 12.7 9.8
0.100 0.700 0.300 0.300 0.500 0.386
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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FINDIP.TBL
PM-FDIP.EPS