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Process Flow, Electrical
Process Flow, Electrical
Applicable for V800/ V802se
Contents
1 Process Flow, HVC .........................................................................................................2
1.1 Block Diagram...................................................................................................2
1.2 Textual Description ...........................................................................................3
2 Revision History ..............................................................................................................4
00021-2/FEA 209 544/88 B Approved according to 000 21-LXE 107 42/1
Company Internal Sony Ericsson Mobile Communications AB
Process Flow, Electrical
1 Process Flow
This document is about the Electrical Process Flow in the HVC. First in this document there
is a block diagram followed by a textual description of the flow.
1.1 Block Diagram
The Process Flow follows the Block Diagram below:
Unit in
No trouble found Determine
or SW fault fault
HW fault
Fault not repairable on
this level or cause of
failure not found
Trouble shoot
Fault not repairable on
this level
Repair
SW upgrade to
latest revision
if needed
Failure Test
OK
Next repair
Unit out
level
00021-2/FEA 209 544/88 B 2(4)
Company Internal Sony Ericsson Mobile Communications AB
Process Flow, Electrical
1.2 Textual Description
The Process Flow follows the Textual Description below:
Box Reference
Unit in Process the phone according to local requirements.
Determine fault Determine if the phone is faulty or not and if it possible confirm the
customer's complaint.
If a HW fault is found, or a HW and SW fault is found, continue
with Trouble shoot.
If only a SW fault is found Software upgrade to latest revision,
continue to Test, and Unit out. Report as SW upgrade
If no HW or SW fault is found, continue to Software upgrade to
latest revision, continue to Test, and Unit out.
Report as No Trouble Found, NTF.
Trouble shoot Trouble Shooting Guide, Mechanical and Electrical
Determine the cause of the failure. Trouble-shoot the phone
according to the guide for the most common faults.
Repair Working Instruction Mechanical and Electrical
Repair the faulty phone according to the instruction. Replace parts as
required. (Product Change Survey, Mechanical)
Flashing the latest software into the phone at this point may "repair"
some problems.
If a repair that requires calibration has been done, calibrate the unit
in SERP.
Calibration can only be done by authorized repair locations.
SW upgrade to latest Control the SW revision in the product, update to latest revision if
revision if needed needed.
Test Test Instruction, Electrical
To verify that the phone works, all test actions must be performed.
Unit Out Process and package the phone according to local requirements.
Next Repair Level If the cause of the failure cannot be found or is not repairable at this
level, the phone can be Scrapped, Swapped or returned to the
customer at the customer's request.
Scrap:
According to local directives
Swap:
Swap the phone according to the instruction in Working
Instructions, Swap and Customize and according to local directives
00021-2/FEA 209 544/88 B 3(4)
Company Internal Sony Ericsson Mobile Communications AB
Process Flow, Electrical
2 Revision History
The revision history of the process flow in the HVC is as follows:
Rev. Date Changes / Comments
A 2004-11-26 First Release
B 2004-12-16 Due to system problem
00021-2/FEA 209 544/88 B 4(4)
Company Internal Sony Ericsson Mobile Communications AB