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SERVICE MANUAL
CAUTION : Before servicing this chassis, read the "PRODUCT SAFETY SERVICE FOR VIDEO PRODUCTS" section
MODEL
DVD-400
on page 2 of this manual.
CONTENTS
SERVICE PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . 2,3
BLOCK DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
IC INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5,18
PRINTED CIRCUIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19,25
REPLACEMENT PARTS LIST . . . . . . . . . . . . . . . . . . . . . . 26,30
PRODUCT SAFETY SERVICING GUIDELINES FOR VIDEO PRODUCTS
CAUTION: DO NOT ATTEMPT TO MODIFY THIS PRODUCT IN ANY WA AND Y SUBJECT: X-RADIATION
N E V E R P E R F O R M C U S T O M I Z E D I N S T A L L AT I O N S W I T H O U T
MANUFACTURER'S APPROVAL. UNAUTHORIZED MODIFICATIONS WILL NOT 1. BE SURE PROCEDURES AND INSTRUCTIONS TO ALL SERVICE PERSONNEL
ONLY VOID THE WARRANTY BUT MAY LEAD TO YOUR BEING LIABLE FOR
, COVER THE SUBJECT OF X-RADIATION. THE ONLY POTENTIAL SOURCE OF
ANY RESULTING PROPERTY DAMAGE OR USER INJURY . X-RAYS IN CURRENT T.V. RECEIVERS IS THE PICTURE TUBE. HOWEVER,
THIS TUBE DOES NOT EMIT X-RYS WHEN THE HIGH VOLTAGE IS AT THE
SERVICE WORK SHOULD BE PERFORMED ONLY AFTER YOU ARE FACTORY SPECIFIED LEVEL. THE PROPER VALUE IS GIVEN IN THE
THOROUGHLY FAMILIAR WITH ALL OF THE FOLLOWING SAFETY CHECKS APPLICABLE SCHEMATIC. OPERATION A HIGHER VOLTAGES MA CAUSE A
T Y
AND SERVICING GUIDELINES. TO DO OTHERWISE, INCREASES THE RISK OF FAILURE OF THE PICTURE TUBE OR HIGH VOLT AGE SUPPLY AND, UNDER
POTENTIAL HAZARDS AND INJURY TO THE USER. CERTAIN CIRCUMSTANCES, MAY PRODUCE RADIATION IN EXCESS OF
WHILE SERVICING, USE AN ISOLATION TRANSFORMER FOR PROTECTION DESIRABLE LEVELS.
FROM A.C. LINE SHOCK. 2. ONLY FACTORY SPECIFIED C.R.T ANODE CONNECTORS MUST BE USED.
DEGAUSSING SHIELDS ALSO SERVE AS AN X-RAY SHIELD IN COLOR SETS,
SAFETY CHECKS ALWAYS RE-INSTALL THEM.
AFTER THE ORIGINAL SERVICE PROBLEM HAS BEEN CORRECTED, A CHECK 3. IT IS ESSENTIAL THAT SERVICE PERSONNEL HAVE AVAILABLE AN
SHOULD BE MADE OF THE FOLLOWING. ACCURATE AND RELIABLE HIGH VOLTAGE METER. THE CALIBRATION OF
SUBJECT: FIRE & SHOCK HAZARD THE METER SHOULD BE CHECKED PERIODICALLY AGAINST A
REFERENCE STANDARD, SUCH AS THE ONE AVAILABLE AT YOUR
1. BE SURE THAT ALL COMPONENTS ARE POSITIONED IN SUCH A WAY AS DISTRIBUTOR.
TO AVOID POSSIBILITY OF ADJACENT COMPONENT SHORTS. THIS IS
ESPECIALLY IMPORTANT ON THOSE MODULES WITCH ARE 4. WHEN THE HIGH VOLTAGE CIRCUITRY IS OPERATING PROPERL THERE IS
Y,
TRANSPORTED TO AND FROM THE REPAIR SHOP. NO POSSIBILITY OF AN X-RADIATION PROBLEM. EVERY TIME A COLOR
CHASSIS IS SERVICED, THE BRIGHTNESS SHOULD BE RUN UP AND DOWN
2. NEVER RELEASE A REPAIR UNLESS ALL PROTECTIVE DEVICES SUCH AS WHILE MONITORING THE HIGH VOLTAGE WITH A METER TO BE CERTAIN
INSULATORS, BARRIERS, COVERS, SHIELDS, STRAIN RELIEFS, POWER THAT THE HIGH VOLTAGE DOES NOT EXCEED THE SPECIFIED VALUE AND
SUPPLY CORDS, AND OTHER HARDWARE HAVE BEEN REINSTALLED PER THAT IT IS REGULATING CORRECTLY WE SUGGEST THAT YOU AND YOUR
.
ORIGINAL DESIGN. BE SURE THAT THE SAFETY PURPOSE OF THE SERVICE ORGANIZATION REVIEW TEST PROCEDURES SO THAT VOLTAGE
POLARIZED LINE PLUG HAS NOT BEEN DEFEATED. REGULATION IS ALWAYS CHECKED AS A STANDARD SERVICING
3. SOLDERING MUST BE INSPECTED TO DISCOVER POSSIBLE COLD PROCEDURE AND THAT THE HIGH VOLTAGE READING BE RECORDED ON
SOLDER JOINTS, SOLDER SPLASHES OR SHARP SOLDER POINTS. BE EACH CUSTOMER'S INVOICE.
CERTAIN TO REMOVE ALL LOOSE FOREIGN PARTICLES. 5. WHEN TROUBLESHOOTING AND MAKING TEST MEASUREMENTS IN A
4. CHECK FOR PHYSICAL EVIDENCE DF DAMAGE OR DETERIORATION TO PRODUCT WITH A PROBLEM OF EXCESSIVE HIGH VOLTAGE A VOID BEING
PARTS AND COMPONENTS, FOR FRAYED LEADS AND DAMAGED UNNECESSARILY CLOSE TO THE PICTURE TUBE AND THE HIGH VOLTAGE
INSULATION (INCLUDING A.C. CORD), AND REPLACE IF NECESSARY SUPPLY DO NOT OPERATE THE PRODUCT LONGER THAN IT IS NECESSARY
FOLLOW ORIGINAL LAYOUT, LEAD LENGTH AND DRESS. TO LOCATE THE CAUSE OF EXCESSIVE VOLTAGE.
5. NO LEAD OR COMPONENT SHOULD TOUCH A RECEIVING TUBE OR A 6. REFER TO HV. B+ AND SHUTDOWN ADJUSTMENT PROCEDURES
RESISTOR RATED AT 1 WATT OR MORE. LEAD TENSION AROUND DESCRIBED IN THE APPROPRIATE SCHEMATIC AND DIAGRAMS(WHERE
PROTRUDING METAL SURFACES MUST BE AVOIDED. USED).
6. ALL CRITICAL COMPONENTS SUCH AS FUSES. FLAMEPROOF RESISTORS, SUBJECT: IMPLOSION
CAPACITORS, ETC. MUST BE REPLACED WITH EXACT FACTORY TYPES, 1. ALL DIRECT VIEWED PICTURE TUBES ARE EQUIPPED WITH AN INTEGRAL
DO NOT USE REPLACEMENT COMPONENTS OTHER THAN THOSE IMPLOSION PROTECTION SYSTEM, BUT CARE SHOULD BE TAKEN TO
SPECIFIED OR MAKE UNRECOMMENDED CIRCUIT MODIFICATIONS. AVOID DAMAGE DURING INSTALLA TION, AVOID SCRATCHING THE TUBE. IF
7. AFTER RE-ASSEMBLY OF THE SET, ALWAYS PERFORM AN A.C. LEAKAGE SCRATCHED REPLACE IT.
TEST ON ALL EXPOSED METALLIC PARTS OF THE CABINET, (THE 2. USE ONLY RECOMMENDED FACTORY REPLACEMENT TUBES.
CHANNEL SELECTOR KNOB, ANTENNA TERMINALS. HANDLE AND
SCREWS) TO BE SURE THE SET IS SAFE TO OPERATE WITHOUT DANGER SUBJECT: TIPS ON PROPER INSTALLATION
OF ELECTRICAL SHOCK. DO NOT USE A LINE ISOLATION TRANSFORMER
DURING THIS TEST, MAKE SURE TO USE AN A.C. VOL TMETER. HAVING 1. NEVER INSTALL ANY PRODUCT IN A CLOSED-IN RECESS. CUBBYHOLE OR
5000 OHMS PER VOLT OR MORE SENSITIVITY IN THE FOLLOWING
, CLOSELY FITTING SHELF SPACE, OVER OR CLOSE TO HEAT DUCT OR IN
,
MANNER; CONNECT A 1500 OHMS 10 WATT RESISTOR, PARALLELED BY THE PATH OF HEATED AIR FLOW.
A.15 MFD. 150V A.C. TYPE CAPACITOR BETWEEN A KNOWN GOOD EARTH 2. AVOID CONDITIONS OF HIGH HUMIDITY SUCH AS: OUTDOOR PA TIO
GROUND (WATER PIPE, CONDUIT ETC.) AND THE EXPOSED METALLIC
, INSTALLATIONS WHERE DEW IS A F ACTOR, NEAR STEAM RADIATORS
PARTS, ONE AT A TIME. MEASURE THE A.C. VOLTAGE ACROSS THE WHERE STEAM LEAKAGE IS A FACTOR, ETC.
COMBINATION OF 1500 OHM RESISTOR AND 15 MFD CAPACITOR.
REVERSE THE A.C. PLUG AND REPEAT A.C. ANY VOLTAGE 3. AVOID PLACEMENT WHERE DRAPERIES MAY OBSTRUCT REAR VENTING.
MEASUREMENTS FOR EACH EXPOSED METALLIC PART. VOLTAGE THE CUSTOMER SHOULD ALSO AVOID THE USE OF DECORATIVE
MEASURED MUST NOT EXCEED 75 VOLTS R.M.S. THIS CORRESPONDS SCARVES OR OTHER COVERINGS WHICH MIGHT OBSTRUCT VENTILATION.
TO 0.5 MILLIAMP A.C. ANY VALUE EXCEEDING THIS LIMIT CONSTITUTES A 4. WALL AND SHELF MOUNTED INSTALLATIONS USING A COMMERCIAL
POTENTIAL SHOCK HAZARD AND MUST BE CORRECTED IMMEDIATELY . MOUNTING KIT, MUST FOLLOW THE FACTORY APPROVED MOUNTING
INSTRUCTIONS. A PRODUCT MOUNTED TO A SHELF OR PLATFORM MUST
RETAIN ITS ORIGINAL FEET (OR THE EQUIVALENT THICKNESS IN SPACERS)
TO PROVIDE ADEQUATE AIR FLOW ACROSS THE BOTTOM. BOLTS OR
SCREWS USED FOR FASTENERS MUST NOT TOUCH ANY PARTS OR
WIRING. PERFORM LEAKAGE TEST ON CUSTOMIZED INSTALLATIONS.
5. CAUTION CUSTOMERS AGAINST THE MOUNTING OF A PRODUCT ON
SLOPING SHELF OR A TILTED POSITION, UNLESS THE PRODUCT IS
PROPERLY SECURED.
GOOD EARTH GROUND PLACE THIS PROBE 6. A PRODUCT ON A ROLL-ABOUT CART SHOULD BE STABLE ON ITS
SUCH AS THE WATER ON EACH EXPOSED MOUNTING TO THE CART CAUTION THE CUSTOMER ON THE HAZARDS OF
PIPE, CONDUIT, ETC. METAL PART TRYING TO ROLL A CART WITH SMALL CASTERS ACROSS THRESHOLDS
OR DEEP PILE CARPETS.
7. CAUTION CUSTOMERS AGAINST THE USE OF A CART OR STAND WHICH
SUBJECT GRAPHIC SYMBOLS HAS NOT BEEN LISTED BY UNDERWRITERS LABORATORIES, INC. FOR USE
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN WITH THEIR SPECIFIC MODEL OF TELEVISION RECEIVER OR
EQUILATERAL TRIANGLE, IS INTENDED TO ALERT THE SERVICE GENERICALLY APPROVED FOR USE WITH TV'S OF THE SAME OR LARGER
PERSONNEL TO THE PRESENCE OF UNINSULATED "DANGEROUS SCREEN SIZE.
VOLTAGE" THA MAY BE OF SUFFICIENT MAGNITUDE TO
T 8. CAUTION CUSTOMERS AGAINST THE USE OF EXTENSION CORDS. EXPLAIN
CONSTITUTE A RISK OF ELECTRIC SHOCK. THAT A FOREST OF EXTENSIONS SPROUTING FROM A SINGLE OUTLET
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS CAN LEAD TO DISASTROUS CONSEQUENCES TO HOME AND FAMILY.
INTENDED TO ALERT THE SERVICE PERSONNEL TO THE
PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE
LITERATURE.
2
SERVICING PRECAUTIONS
CAUTION : Before servicing the DVD covered by this Electrostatically Sensitive (ES) Devices
service data and its supplements and ADDENDUMS, read Some semiconductor (solid state) devices can be damaged
and follow the SAFETY PRECAUTIONS NOTE : if easily by static electricity. Such components commonly are
unforeseen circumstances create conflict between the called Electrostatically Sensitive (ES) Devices. Examples of
following servicing precautions and any of the safety typical ES devices are integrated circuits and some field
precautions in this publications, always follow the safety effect transistors and semiconductor chip components.
precautions.
The following techniques should be used to help reduce the
Remember Safety First: incidence of component damage caused by static electricity.
General Servicing Precautions 1. Immediately before handling any semiconductor
1. Always unplug the DVD AC power cord from the AC component or semiconductor-equipped assembly, drain
power source before: off any electrostatic charge on your body by touching a
(1) Removing or reinstalling any component, circuit board, known earth ground. Alternatively, obtain and wear a
module, or any other assembly. commercially available discharging wrist strap device,
which should be removed for potential shock reasons
(2) Disconnection or reconnecting any internal electrical prior to applying power to the unit under test.
plug or other electrical connection.
(3) Connecting a test substitute in parallel with an
electrolytic capacitor 2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface
Caution : A wrong part substitution or incorrect such as aluminum toil, to prevent electrostatic charge
polarity installation of electrolytic capacitors may buildup or exposure of the assembly.
result in an explosion hazard.
3. Use only a GROUNDED-tip soldering iron to solder or
2. Do not spray chemicals on or near this DVD or any of its unsolder ES devices.
assemblies.
4. Use only an anti-static solder removal device. Some
3. Unless specified otherwise in this service data, clean solder removal devices not classified a "anti-static" can
electrical contacts by applying an appropriate contact generate electrical charges sufficient to damage ES
cleaning solution to the contacts with a pipe cleaner, devices.
cotton-tipped swab, or comparable soft applicator.
Unless specified otherwise in this service data,
lubrication of contacts is not required. 5. Do not use freon-propelled chemicals. These can
generate electrical charge sufficient to damage ES
devices.
4. Do not defeat any plug/socket B+ voltage interlocks with
witch instruments covered by this service manual might
be equipped. 6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
5. Do not apply AC power to this DVD and/or any of its packaged with leads electrically shorted together by
electrical assemblies unless all solid-state device heat conductive foam, aluminum foil, or comparable
sinks are correctly installed. conductive material.)
6. Always connect test instrument ground lead to the 7. Immediately before removing the protective material
appropriate ground before connection the test from the leads of a replacement ES device, touch the
instrument positive lead. Always remove the test protective material to the chassis or circuit assembly
instrument ground lead last. into which the device will be installed.
Insulation Checking Procedure Caution : Be sure no power is applied to the chassis or
Disconnect the attachment plug trom the AC outlet and turn circuit, and observe all other safety precautions.
the power on. Connect an insulation resistance meter(500V)
to the blades of the attachment plug. The insulation 8. Minimize bodily motions when handling unpackaged
resistance between each blade of the attachment plug and replacement ES devices. (Normally harmless motion
accessible conductive parts (Note 1) should be more than such as the brushing together of your clothes fabric or the
1M ohm. lifting of your foot from a carpeted floor can generate
Note 1 : Accessible Conductive Parts including Metal static electricity sufficient to damage an ES device.)
panels, input terminals, Earphone jacks, etc.
3
OVERALL BLACK DIAGRAM
XS100
CD/DVD
VR-DVD
(CD-LD)
LD-DVD
VR-CD
TO PICK UP
LD-CD
AVCC
GND
GND
VCC
XS103 MECHANISM
MD
NC
NC
VC
F+
T+
F-
T-
CHASSIS
D
C
B
A
E
F
SP-
SP+
LIM
GND
SLED+
SLED- 27MHz
XS102
SERVO VIDEO
& TRAY RF AMP HCUO4
GND
CLOSE ENCODER
DRIVER D1890 CHROMA
GND
OPEN
CS4955 RED/AGND
UNLOD BA5954 LUMA
BLUE/AGND
LOAD & BA6208 16M SDRAM*2 CVBS2
VGND
TO PICK UP
MECHANISM TC4W53 27MHz GREEN/CVBS1
CHASSIS VGND
12V
GND
SPDIF
5V
ZERO
ATAPI AGD
CEN
INTERFACE AGD
MPEG-2 AUDIO DATA AUDIO DAC R-S
SERVO & DVD PCM1723
AGND
DECODER WOOF
PROCESSOR &PCM1720 AGD
L-S
D1870 AGD
VS2811 L
AGD
R
XS109
TO OUTPUT ASSY
CONTROL
BUS
XS107
CPU EEPROM 4M ROM
RMC
FDATA D1850 4M DRAM 24C01 29F040
FCS
FCLK
GND
3.5V
3.5V
24V
Vcc
12V
POWER
NC THE BUS OF THE DATA
POWER
NC XS106
GND
GND
GND
3.3V
3.5V
3.5V
12V
12V
24V
Vcc
TO CONTROL ASSY
5V
8V
TO POWER
SUPPLY ASSY
CONTROL SIGNAL
IC INTRODUCTION
D1890 PIN ASSIGNMENTS
Pin Numbers PIN NAME Type Description
QFP100 and LQFP100
RF Flag Interface
13 DEFECT Digital Output Flag of bad data output status
RF SIO interface
14 SLCK Digital Input RF serial clock input
15 SDEN Digital Input RF serial data enable
16 SDATA Digital IO RF serial data IO
11 RST Digital input Reset (active high)
12 XCK16M Digital input 16.9MHz for verification
RF
40 DVDA Analog input DVD RF signal input A
41 DVDB Analog Input DVD RF signal input B
42 DVDC Analog Input DVD RF signal input C
43 DVDD Analog Input DVD RF signal input D
38 DVDRFIN Analog Input DVD RF signal input RFIN
39 DVDRFIP Analog Input DVD RF signal input RFIP
53 CDA Analog Input CD RF signal input A
54 CDB Analog Input CD RF signal input B
55 CDC Analog Input CD RF signal input C
56 CDD Analog Input CD RF signal input D
61 OSP Analog Offset cancellation capacitor connecting
60 OSN Analog Offset cancellation capacitor connecting
86 RFOP Analog output RF positive output
85 RFON Analog output RF negative output
59 RFGC Analog RF VGA control
TRACKING ERROR
88 DPFN Analog DPD amplifier negative input
87 DPFO Analog DPD amplifier output
23 IR Analog DPD reference resister connecting
17 DPDMUTE Digital input DPD mute control input
83 TNI Analog Input 3 beam satellite PD signal input
82 TPI Analog Input 3 beam satellite PD signal input
97 TEO Analog Output Tracking error output
FOCUSING ERROR & RF LEVEL & CENTRAL SERVO SIGNAL
64 CDFNI Analog Input CD focusing error negative input
65 CDFPI Analog Input CD focusing error positive input
44 DVDFNI Analog input DVD focusing error negative input
45 DVDFPI Analog input DVD focusing error positive input
95 FEO Analog Output Focusing error output
96 FEONI Analog Input Focusing error amplifier negative input
93 FLVL Analog Output RF level output
5
Pin Numbers PIN NAME Type Description
94 FLVLNI Analog input RF level amplifier negative input
69 CDCSNI Analog input CD central servo signal negative input
70 CDCSPI Analog input CD central servo signal positive input
46 DVDCSNI Analog input DVD central servo signal negative input
47 DVDCSPI Analog input DVD central servo signal positive input
2 CSO Analog output Central servo signal output
3 CSONI Analog input Central servo amplifier negative input
ALPC
80 MDI1 Analog Input Laser power monitor input
81 LDO1 Analog Output Laser driver output
51 MDI2 Analog Input Laser power monitor input
52 LDO2 Analog Output Laser driver output
RF RIPPLE
8 CRTP Analog RF top envelop filter capacitor connecting
9 CRTPLP Analog Defect level filter capacitor connecting
7 HRFRP Analog output High frequency RF ripple output
6 LRFRP Analog output Low frequency RF ripple output
POWER
24,25,30,34,62,63 AVDD Power RF power
21,22,28,37,57,58 AGND GND GND
89,90 SVDD Power Servo analog power
98,99 SGND GND GND
4,5 VDD Power Digital power
18,19 GND GND GND
REFERENCE VOLTAGE
92 VREFO Analog output Reference voltage 2.0V
91 V2REFO Analog output Reference voltage 4.0V
ALPC TRIMMING
32 TM1 Analog input Trimming pin for ALPC1
33 TM2 Analog input Trimming pin for ALPC1
35 TM3 Analog input Trimming pin for ALPC2
36 TM4 Analog input Trimming pin for ALPC2
HIGH SPEED TRACK COUNTING
1 TRLP Analog Low-pass filter capacitor connecting
100 TRLPA Analog Low-pass filter capacitor connecting
10 HTRC Digital output High speed track counting digital output
FOR MONITOR ONLY
26 MON Analog output
27 MOP Analog output
31 VCON Analog output
20 HTRCMPH Digital output
84 HTE Analog output
6
D1890 BLOCK DIAGRAM
7
D1870 PIN ASSIGNMENTS
Pin Numbers Pin NAME Type Description
RG data PLL interface
11 PLLVDD Power Power for data PLL and related analog circuitry.
10 JITFN Analog Input The negative input terminal of operation amplifier for RF jitter meter.
9 JITFO Analog Output The output terminal of RF jitter meter.
Phase comparator output. Output the phase difference of EFM and Pck4m.
8 PDO Analog Output Sink or sour ce a constant c urrent to loop filt er over this pin w hen phase
difference occurs. Otherwise, this pin is high impedance.
Current reference input. It generates reference current for data PLL.
7 IREF Analog Input
Connect an external 15K resistor to this pin and PLLVSS.
6 LPFN Analog Input The negative input terminal of loop filter amplifier.
5 LPFO Analog Output The output of loop filter amplifier.
4 LPIN Analog Input The input of the low pass filter.
3 LPIO Analog Output The output of the low pass filter.
2 PLLVSS Ground Ground pin for data PLL and related analog circuitry.
1 VBDPLL Analog Output Reference voltage.
176 RFIN Analog Input The negative input terminal of RF differential signal.
175 RFIP Analog Input The positive input terminal of RF differential signal.
174 RFDSLV Analog Output RF data slicer level output.
173 SCO Analog Output Analog slicer current output.
Signal Amplifier Interface
172 ADCVDD Power Power pin for ADC circuitry.
171 HRFZC Analog Input High frequency RF ripple zero crossing input or photo interrupt pulse input.
170 RFRPSLV Analog Output RF ripple slice level output.
169 RFP Analog Input RF ripple detect input.
168 RFLEVEL Analog Input Sub beam add input or RF level input.
167 FEI Analog Input Focus error input.
166 TEI Analog Input Tracking error input.
165 TEZU Analog Input Tracking error zero crossing input.
164 TEZISLV Analog Input Tracking error zero crossing low pass input.
163 ADIN Analog Input General A/D input.
162 ADCVSS Ground Ground pin for ADC circuitry.
Motor and Actuator Drive Interface
161 PDMVSS Ground Ground for PDM Circuitry.
160 PWM2VREF Analog Input A refer ence voltage input for PWM circuitry. The typical value is 4.0V.
159 PWMVREF Analog Input A reference voltage input for PWM circuitry. The typical value is 2.0V.
158 PDMVDD Power Power for PDM circuitry.
12 FOO Analog Output Focus servo output. PDM output of focus servo compensator.
13 TRO Analog Output Tracking servo output. PDM output of tracking servo compensator.
1 st General multi-level PW M output. Th e number of output lev els is set
14 PWMOUT1 Analog Output
with DSP command. It is used to control step motor.
2 nd Gener al multi -level PW M output. Th e number of ou tput level is
15 PWMOUT2 Analog Output
selected DSP command.
17 DMO Analog Output Disk motor control output. PWM output.
Disk motor control. 3-level PWM output. It is used only f or DC motor, but it
is corporate with the pin PWMOUT1 to control step motor. If the internal
18 FMO Analog Output
DC_FMO is positive, the FMO output lags 90 than PWMOUT1, otherwise
the FMO output leads 90 than PWMOUT1.
Tray open control output.
FROPENPW
19 Analog Output It generates PWM output for TRWMEN 27hRW2=0 or digital out put for
M
TRWMEN 27hRW2 =0.
TTL Schmitt
20 FG Motor Hall sensor input.
Input 50K pull up
Tray close output.
22 TRCLOSE TTL Output
It provides a clock out to the micro controller.
23 ENDM TTL Output Enable/disable disk motor. A logical high enables disk motor.
Panel Interface
8
Pin Numbers Pin NAME Type Description
24 LED TTL Output LED control output.
TTL Input
25 PLY#/PAU# Play/pause key input, active low.
50K pull up
TTL Input
26 EJ/STOP# Eject, stop key input, active low.
50K pull up
TTL Input
27 LIMIT# Sledge inner limit input, active low.
50K pull up
TTL Input Tray_is_out input. A logical low indicates the tray is out. Feedback flag
28 TRAYOUT#
50K pull up from tray connector.
TTL Input Tray_is_in input. A logical low indicates the tray is in. Feedback flag from
29 TRAYIN#
50K pull up tray connector.
Micro controller Interface
Power-on reset output for external devices, active high.
If the flash mode is used, the micro controller must be the kind of
30 URST TTL Output
multiplexed address/data mode and its output pins must be at tri-state.
Otherwise, the flash mode cannot be used.
TTL Schmitt
31 UWR# Micro controller write strobe, active low.
Input 50K pull up
TTL Schmitt
32 URD# Micro controller read strobe, active low.
Input 50K pull up
For non flash mode cycle: register bank select control 1, input from micro
TTL I/O
33 UCS1 controller.
50K pull up
For flash mode cycle: flash ROM address FLASH_ADR14.
For non flash mode cycle: register bank select control 2, input from micro
TTL I/O
34 UCS2 controller.
50K pull up
For flash mode cycle: flash ROM address FLASH_ADR15.
TTL I/O For non fl ash mode c ycle: addr ess latch en able, hi gh active in put from
with Schmitt micro controller.
36 UALE
Input For flash mode cycle: address latch enable, high active output to control
50K pull up external 373.
For non flash mode cycle: micro control address/data Bus.
TTL I/O For flash mode cycle: flash ROM address/data bus.
37-43,46 UAD
50K pull up FLASH_ADR[7:0]/FLASH_D[7:0]. The FLASH_ADR[7:0] is latched in the
external 373.
TTL Output
47 UINT# Micro controller Interrupt, low active.
Open drain
Crystal Interface & DRAM clock Interface
44 DMVSS Ground Ground pin for DRAM clock circuitry.
45 DMVDD Power Power pin for DRAM clock circuitry.
48 XTALI Input Crystal input. The working frequency in 33.8688MHz.
49 XTALO Output Crystal output.
Memory Interface
For non flash mode: SDRAM output Mask.
50 DQM TTL Output
For flash mode: flash ROM address FLASH_ADR13.
For non flash mode: SDRAM bank address 1
51 BA1 TTL Output
For flash mode: flash ROM address FLASH_ADR12.
For non flash mode: SDRAM bank address 0
52 BA0 TTL Output
For flash mode: flash ROM address FLASH_ADR11.
For non flash mode: SDRAM clock enable.
53 CKE TTL Output
For flash mode: flash ROM address FLASH_ADR10.
54 CLK TTL Output SDRAM clock
For non flash mode: DRAM address bus RA[11:10]
55-56 RA[11:10] TTL Output
For flash mode: flash ROM address FLASH_ADR[9:8]
58-64,66-6
RA[9:0] TTL Output RAM address bus
7,69
70 RAS# TTL Output RAM row address strobe, low active
RAM output enable, low active.
71 ROE# TTL Output
It must be pulled with 20K resister if flash mode is used.
9
Pin Numbers Pin NAME Type Description
RAM write enable, low active. When two write enable pins are used, it only
72 RWE# TTL Output
for low byte.
High column address strobe: Write enable High Byte
Multi-function pin: low active
CASH#/RWE
73 TTL Output RAM column address strobe for high byte, when two column address
H#
strobe pins are used.
Write enable for high byte, when two write enable pins are used.
World RAM column address strobe: Low column address strobe
Multi-function pin: low active
74 CAS# TTL Output RAM column address strobe for a word, when two column address strobe
pins are not used.
It is used only for low byte, when two column address strobe pins are used.
76-83,
85-87 RD[15:0] TTL I/O RAM data bus
90-94
System Clock Interface
88 IPLLVDD Power Power pin for system varipitch circuitry.
89 IPLLVSS Ground Ground pin for system varipitch circuitry.
Host Interface
Drive active/Slave present
TTL I/O
101 DASP# This is the time-multipl exed sig nal that indi cates tha t a device is a ctive, or
50K pull up
that slave is present.
Host chip select 2(for 3FXH/37xh)
TTL Input
102 CS3FX# The CX3FX# and CS1FX# are chip select signals from the host used to
50K pull up
select the Command Block registers.
TTL Input
103 CS1FX# Host chip select 1 (for 1Fxh/17xh)
50K pull up
Host address bus
105,108,10 TTL Input
HA[2:0] This is the 3-bit binary coded address asserted by the host to access a
6 50K pull up
register or data port in the device.
TTL I/O
107 PDIAG# Passed diagnostics
50K pull up
TTL Output
110 IOCS16# I/O 16-bit chip select
Open drain
Host interrupt.
111 INTRQ TTL Output
The MT1368 uses this signal to interrupt the host system.
DMA acknowledge.
TTL Input
112 DMACK# This signal shall be used by the host in response to DMAREQ to initiate
50K pull up
DMA transfers.
I/O channel ready: Ultra DMA ready: Ultra DMA data strobe.
This is a multi-function pin.
For i/o channel Ready, this signal is negated to extend the host transfer
cycle of any register read or write when the device is not able t o compl ete
the transfer.
113 IORDY TTL Output
For Ultr a DMA Read y, this signal is asserted by the devi ce to indic ate to the
host that the device is r eady to recei ve Ultra D MA data out bu rsts from the
host.
For Ultra DMA data strobe, this is the data in strobe signal from dev ice for
Ultra DMA data in burst to host.
Device I/O read: Ultra DMA ready: Ultra DMA data strobe.
This is multi-function pin.
For Device I/O Read, this signal is the strobe signal asserted by the host to
TTL Input read device registers or the data port.
114 DIOR#
50K pull up For Ultra DMA read, this is asserted by the host to indicate to the device
that the host is ready to receive Ultra DMA data in burst to host
For Ultra DMA data strobe, this signal is the data out strobe signal from the
host for an Ultra DMA data out burst.
10
Pin Numbers Pin NAME Type Description
Device I/O write: Stop Ultra DMA burst
This is multi-function pin.
For Device I/O Write, this signal is the strobe signal asserted by the host to
TTL Schmitt
116 DIOW# write device registers or the data port.
Input 50K pull up
For Stop Ultra DMA, this signal shall be negated by host before data is
transferred in an Ultra DMA burst and is asserted by host during an Ultra
DMA burst to signal the termination of Ultra DMA burst.
DMA request.
This signal is used f or DMA dat a transfer s between host an d device a nd it
117 DMARQ TTL Output
shall be asserted by the MT1368 when it is ready to transfer data to or from
the host. The direction of data transfer is controlled by DIOR# and DIOW #.
118 -120,12 Host data bus.
2-126,-128- This is an 8- or 16- bit bi-directional data interface between the host and
HD[15:0] TTL I/O
131,134-13 device; the lower 8 bits are used for 8-bit register transfers. Data transfers
7 are 16-bit wide.
Host reset.
TTL Schmitt
138 HRST# This signal is referred to as hardware reset and it is used by host to reset
Input 50K pull up
the MT1368.
CLV/CAV Varipitch interface
140 VPVDD Power Power pin for varipitch VCO circuitry.
141 VCOCIN Analog Input Connect capacitor for compensator loop filter.
142 VPVSS Ground Ground pin for varipitch VCO circuitry.
Miscellaneous
TTL Schmitt
139 PRST# Power-on reset, low active
Input 50K pull up
TTL Input
143 TEST Test mode control pin, high active
50K Pull-Down
Lag and Programmable I/O Interface
145 FLAGD TTL I/O Servo DSP flag.
146 FLAGC TTL I/O Servo DSP flag.
147 FLAGB TTL I/O Servo DSP flag.
Servo DSP flag. The internal flags of servo DSP can be selected to output
148 FLAGA TTL I/O through FLAGA, FLAGB, FLAGC, and FLAGD pins. To program the
selection the micro controller must write FLGMOD register.
At non-flash mode: programm able I/O or internal non-servo flags output.
TTL I/O
150 IO3 At flas h mode c ycle: to m onitor DSVSEL t o devic e master or slav er. It is
50K pull high
recorded on DEVSEL102hRW6 .
TTL I/O At non-flash mode cyc le: progr ammable I/ O or int ernal non -servo fl ags outp ut.
151 IO2
50K pull high At flash mode cycle: flash ROM address FLASH_ADR16.
At non-flash mode cyc le: progr ammable I/ O or int ernal non -servo fl ags outp ut.
152 IO1 TTL I/O
At flas h mode cycle: flash ROM output enable FLASH_OE#.
TTL I/O At non-flash mode cyc le: progr ammable I/ O or int ernal non -servo fl ags outp ut.
153 IO0
50K pull high At flas h mode cyc le: flas h ROM write enab le FLAS H_W R#.
SIO interface & Defect
154 SDATA TTL I/O RF serial data input/output.
155 SDEN TTL output RF serial data latch enable
156 SLCK TTL output RF serial clock output
TTL Input
157 BDO Flag of defect data input status
50K pull down
Digital Power & Ground
57,75,104,1
DVDD3 Power +3.3V use for Internal digital circuitry and digital output pad
44
16,65,109,
DVDD Power +5V use for Internal digital circuitry and digital output pad
133,100
21,35,68,8
4,115,121,1
DVSS Ground Internal digital circuitry and digital output pad.
27,133,149
96
11
D1870 BLOCK DIAGRAM
IPLLVDD
IPLLVSS
RFDTSL
VBDPLL
PLLVDD
PLLVSS
DMVDD
DMVSS
URST#
XTALO
JITFO
JITFN
XTALI
LPFO
LPFN
RFIN
RFIP
IREF
LPIN
BDO
SCO
PDO
LPIP
RFRPSLV TEST
TEZI RFZC/ RF flag Data Data
TEZISLV TEZC Interface Slicer PLL
HRFZC Circuit CDROM Varipitch System DRAM Reset
CIRC/RSPC C3 PRST#
Sync Detection Clock Clock Logic
Error Corrector Decoder
ADCVDD Descrambler Generator Generator
FEI
TEI
Servo
RFRP Sync
RFLEVEL ADC System Clock
Protection RD[15:0]
ADIN
ADCVSS
RA[11:0]
Buffer RAS#
SLCK Serial RF Memory CAS#
SDEN Servo EFM/EFM+ Controller CASH#/RWEH#
SDATA
Controller
DSP Demodulator RWE#
Subcode/ID ROE#
FDO CLK
TRO
Demodulator
CKE
256 DOM
FMO SRAM BA(1:0)
PWMOUT1 PDM &
PWMOUT2 PWM CSS Host ATAPI
CLV/CAV
DAC Controller Data Packet
PDMVDD
FIFO FIFO EJ/STOP#
PWM2VREF Key/LED PLY#/PAU#
PWMVREF Interface
PDWVSS LED
FLAGA Varipitch Micro-controller
Flags & PWM Interface
FLAGB CLV Clock Host/MPEG Interface TRAYIN#
Program- DAC TRAYOUT#
FLAGC Generator
FLAGD mable Mega LIMIT#
I/O Interface TROPENPWM
IO[3:0]
TRCLOSE
VPVDD
VCOCIN
VPVSS
ENDM
FG
DMO
HD[15:0]
PDIAG#
DASP#
HRST#
DIOW#
DIOR#
DMACK#
HA[2:0]
CS1FX#
CX3FX#
DMARQ
IORDY
INTRQ
IOCS16#