Text preview for : Samsung SGH-i550 service manual.pdf part of Samsung SGH-i550 service manual Samsung GSM Samsung SGH-i550 service manual.pdf
Back to : Samsung SGH-i550 service | Home
GSM TELEPHONE
SGH-i550
GSM TELEPHONE CONTENTS
1. Safety Precautions
2. Specification
3. Product Function
4. Array course control
5. Exploded View and Parts List
6. Main Electrical Parts List
7. Block Diagrams
8. PCB Diagrams
9. Flow Chart of Troubleshooting
10. Reference data
11. Disassembly and Assembly
Instructions
GSPN (Global Service Partner Network)
Country Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast & Africa mea.samsungportal.com
This Service Manual is a property of Samsung Electronics Co.,Ltd. Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law. 2007. 10. Rev.1.0
1. Safety Precautions
1-1. Repair Precaution
Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test, because the specification of cellular phone is sensitive for
surrounding interference(RF noise).
Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by the
influence of magnetic force.
Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn
away.
Use a thicken twisted wire when you measure level.
A thicken twisted wire has low resistance, therefore error of measurement is few.
Repair after separate Test Pack and Set because for short danger (for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
Take specially care of soldering, because Land of PCB is small and weak in heat.
Surely tune on/off while using AC power plug, because a repair of battery charger is
dangerous when tuning ON/OFF PBA and Connector after disassembling charger.
Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
1-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Safety Precautions
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
Use earthed soldering steel when you connect or disconnect ESD.
Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by
static electricity.
Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum
plate to have conductive power,they are prevented from static electricity.
You must maintain electric contact between ESD and place due to be set up until ESD is connected
completely to the proper place or a circuit board.
1-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
2. Specification
2-1. GSM General Specification
EGSM 900 DCS 18 00 PCS 190 0 WCDMA 2100
Fre q. Band[MHz] 880~91 5 1 710~17 85 1 850~19 10 1 920~19 80
Uplink/Downlink 925~96 0 1 805~18 80 1 930~19 90 2 110~21 70
0~124 & UL:9 612~98 88
ARFCN r ange 512~88 5 512~81 0
9 75~102 3 DL:10 562~10 838
Tx/Rx spa cing 10MHz 20MHz 20MHz 130MHz
Mod. Bit rat e/ 27 0.833 kbps 27 0.833 kbps 27 0.833 kbps 3. 84Mcps
Bit Period 3.692 us 3.692 us 3.692 us (chip ra te)
T ime Slot Per iod/ 576.9 us 576.9 us 576.9 us F rame l ength : 10ms
Fra me Per iod 4. 615ms 4. 615ms 4. 615ms Slot lengt h : 0. 667ms
QPSK
Modulation 0.3G M SK 0.3G MSK 0.3G M SK
HPSK
MS Powe r 33 dBm~5d Bm 30 dBm~0d Bm 30 dBm~0d Bm 2 4dBm~- 50dBm
4 1 1 3
Power Class
(max +33dBm) (max +30dBm) (max +30dBm) (max +24dBm)
Sensit ivit y -1 02dBm -1 00dBm -1 00dBm - 106.7 dBm
T DM A Mu x 8 8 8
Cell Radius 35Km 2Km 2Km 2Km
2-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Specification
2-2. GSM TX power class
TX Power GSM850 TX Power TX Power
DCS1800 PCS1900
control level GSM900 control level control level
5 33