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Programmes After Market Services (P.A.M.S.) Technical Documentation NME­2A SeriesTransceivers

Chapter 6 External SIM Card Reader CAE­2

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Contents Page No
Introduction Summary Modes of Operation Card Out Mode Card In Mode Installation of the CAE­2 Block Description Overview Power Block MBUS Interface SIM Interface MCU Block Hardware Description Signals on Modular Connectors Signals on SIM Connector Power Block MBUS Interface SIM Interface MCU Block Circuit Diagram of GM8S Component Layout Diagram of GM8S Parts List of CAE­2 (EDMS: Issue 4.2) Exploded View of CAE­2 Mechanical Items 4 4 4 4 5 5 6 6 7 7 7 8 8 8 9 9 9 10 11 12 13 14 16 16 6 7 12 13 16

List of Figures
Figure 1: Interconnection Diagram Figure 2: Block Diagram Figure 3: Circuit Diagram of GM8S Module Figure 4: Component Layout Diagram of GM8S Figure 5: Exploded View of CAE­2

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Introduction
Summary
The CAE­2 external SIM card reader is designed for the Nokia 6081 GSM car telephone with type designation NME­2A and the handset with type designation HSE­6XA. The card reader is designed for a ID­1 SIM card (IC­card) in accordance with GSM recommendation 11.11 and ISO standard ISO­7816­1,2,3. All cards which do not comply to the GSM11.11 and ISO­7816 will be rejected by the CAE­2. Only one card at a time can be used in the external card reader. The card reader is connected to the telephone via the system cable and an extension cable, through one of its modular connectors. The handset is connected directly to the card reader through the second modular connector. The two modular connectors are connected in parallel, so the handset and the extension cable can be connected to any of the two connectors. The CAE­2 works in parallel with the internal card reader in the 6081. If a card is inserted in the internal card reader, and there is no card in the external, then the 6081 will function as normal. If a card is inserted in the external card reader, and there is no card in the internal, then the 6081 will work as if a card was inserted in the internal reader. The external reader has the highest priority, so if a SIM card is inserted in both the internal and the external card reader, then the external will handle all the GSM operations, and the internal SIM card interface will be disabled. If a conversation already was established when a card is inserted in the external card reader, that conversation is interrupted, the internal card reader is disabled, and the telephone will log onto the network using the SIM card in external reader.

Modes of Operation
The CAE­2 has two modes of operations which is, with or without a SIM card inserted in the card reader. Card Out Mode The card reader will be in this mode when no SIM card is inserted, and 12V DC is connected via the modular connector, and this is the case even if the MBUS connection is missing. The LED is iluminated when the reader is in the card out mode. Original 08/97

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The card reader first sends a MBUS registration message (as a slave unit) to the telephone (which is the master). The telephone responds by sending a registration acknowledge message to the card reader. When the acknowledge is received, the reader starts looking for a SIM card. If the MBUS connection is missing it will never start looking for a SIM card, because of the missing registration acknowledge, so the LED will stay on even if a card is inserted in the reader. Card In Mode When a SIM card is inserted in the reader, then the LED is turned off, and it enters the card in mode. The card reader will do read and write operations requested either from the telephone or SIM card itself. All SIM operations, which are available from the user interface in the telephone can can be done with a SIM card in the internal card reader, can now be executed using the SIM card in the external card reader. Phone calls can be initiated as soon as the telephone is in service. If the SIM card is drawn out from the card reader, the SIM interface will be disabled and the CAE­2 will enter the card out mode.

Installation of the CAE­2

The CAE­2 (10 is installed using a extension cable (11) which is plugged into one of the modular connectors on the card reader and into the connector on the system cable (5) normally used for the handset (2). The handset is then connected to the second modular connector on the card reader.

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Figure 1: Interconnection Diagram After power up the system is ready for insertion of a SIM card. The SIM card is inserted with the arrow on the SIM card facing the light guide for the LED on the CAE­2. If the card is inserted upside down it will be rejected by the card reader, and the message CARD REJECTED is written in the display of the handset. If this happens, draw out the SIM card and insert it in the right way.

Block Description

Overview The card reader consists of four different blocks. A Power block, MBUS interface, SIM interface and the MCU. The block diagram of the card reader can be seen in figure 2.

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Figure 2: Block Diagram Power Block The power block is responsible for converting the 12V DC from the transceiver (see item 1 in figure 1) to 5V DC used for all the electronics in the card reader except for the power to SIM card.

MBUS Interface This block converts messages to the card reader on the bi­directional one wire MBUS, to RX signals which can be read by the MCU. Messages from the card reader to the transceiver, are also converted from the MCU's TX line to the bi­directional MBUS. SIM Interface The SIM card is provided with the prober signals in accordance with the ISO 7816­3 standard through the SIM interface. It handles all control signals from the MCU and do level shifting, power switching and clock dividing for the SIM card. The +5V and VPP is controlled by the ~EN_PWR. RST can be set and reset by respectively ~SET_RST and

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~CLR_RST. DATA and DATA I/O is identical signals, and is the bi­directional halfduplex data line on the SIM card. The CLK signal is derived from the MCU oscillator Fosc. It can be stopped by the ~CLR_CLK signal. ­CARD_IN is a sense input for SIM card insertion, and it signals this event to the MCU trough the ~CARDOUT signal. MCU Block The MCU block consists mainly of the MCU which is controlling the card reader. The LEDs used for operation mode indication is also part of this block. The MCU has 2 UART's, one for the SIM interface and one for the MBUS interface. For explanation of the various signals to/from the MCU block, see the two former paragraphs.

Hardware Description

The diagram in the Schematic ­ detailed paragraph is used as the basis for this description of the hardware. Signals on Modular Connectors The modular connectors are wired in parallel and the various signals on these connectors (and the system cable and handset cable) is shown in the following table. All signals in bold are used in the card reader. PIN 1 2 3 4 5 6 7 8 NAME HS LSP ON/OFF KEY MBUS AGND DGND HS MIC 12V DC EARPHONE SIGNAL EXPLANATION Loudspeaker (not used) Power switch (not used) Bi­directional data line Audio ground (not used) Digital ground Microphone (not used) Vbat_sw from transceiver Earphone (not used)

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Signals on SIM Connector The SIM card is connected via the X3 flex foil connector. PIN 1 NAME ­CARD_IN SIGNAL EXPLANATION SIM insertion sense. Connected to hw switch in card reader mechanics. VCC for hw switch in card reader mechanics Bi­directional half­duplex SIM data line Clock signal for SIM card Programming voltage for SIM card Reset signal to SIM card Ground for SIM card. Connected to DGND Power for SIM card

2 3 4 5 6 7 8

+CARD_IN DATA CLK VPP RST GND +5V

Power Block
The power block consists of a low dropout voltage regulator LP2951ACM (N1), used for converting the incomming 12V DC (Vbat_sw) from the transceiver to the VCC (5V DC) used for all the electronics in the card reader, except the DC power connection for the SIM card. SIGNAL IN/OUT 12V VCC In Out VALUE 12V DC current 1.5A 5V DC 100mA MIN 10.8 V DC 4.93 V DC MAX 15.6 V DC 5.07 V DC

MBUS Interface
The MBUS is used for communications between all the units. It is a bi­directional halfduplex signal line, with a transmission speed of 9600 baud. The MBUS signal is converted to RX signal to the MCU and TX signal from the MCU via the sense resistor R19 and the open collector output made by transistor V4 and inverter V5. The pull­up resistor for the MBUS is placed in the transceiver. It also includes the EMC filter for the MBUS line.

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SIM Interface
The SIM interface is responsible for generating all the necessary signal for the SIM card. It is controlled by the MCU block. It consists of three parts. A power switch made by V2, a divide by 2 for the SIM clock made by toggle D­FF D1 and a D­FF used as a set/reset handler for the SIM reset signal. The HC74 D­FF is also necessary for converting the output levels of the MCU to the signal levels needed by the SIM card. The SIM interface also includes the EMC filters for the SIM connections. The D1a D­FF divide the MCU oscillator frequency of 7.3728 Mhz to 3.6864 Mhz which is used as SIM clock. The SIM clock can be disabled by the MCU signal ~CLR_CLK and it will always stop on a low value ('0'). The clock should have a duty cycle of 45% to 55% and a rise and fall time of not more than 24 ns. When the power to the SIM is removed, the reset input of the CLK FF is kept at a low signal via another switch. The D1b D­FF controls the reset signal (RST) for the SIM card. The RST can be set by the MCU signal ~CLR_RST and set by ~SET_RST. It will also be in reset state when power is removed from the SIM card. The _CARD_IN signal is low when there is no SIM card inserted. The ~CARD_IN will raise to a high ('1') if a SIM card is inserted. The inserted SIM card will shunt a mechanical switch, which is connected at the flex foil connector X3's pin 1 and 2. The ­CARD_IN signal is used as a output signal from the SIM interface to the MCU where it is called ~CARDOUT. The transistor V2 is used as a power switch for the SIM card. It is controlled by the MCU signal ~EN_PWR. The output +5V is supplying both the VPP and the VCC pin on the SIM card. The regulation on the +5V is supplying both the VPP and the VCC pin on the SIM card. The regulation on the +5V must not fall below 4.5 V DC. The ~EN_PWR signal also controls 3 HC4066 switches. Two of them are used to reset the RST and CLK FF's, when no power is applied to the SIM card. The third is grounding the SIM DATA line when the power is removed, in conjunction with R10. R10 serves as a pull up resistor when power is applied to the SIM card, and a pull down when power is removed. When power is applied to the SIM card the HC4066 switch in the SIM DATA line is activated, and the MCU's RX and TX is connected to the SIM card. For all the different signal levels on the SIM interface, see the ISO 7816­3 standard.

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MCU Block
The MCU is a DS87C520 from Dallas Semiconducters. It controls the SIM and MBUS interface, and all communications with the two interfaces is done with respectively UART 1 and UART 0. The MCU handles the power up reset automatically, and it also monitors the VCC in order to disable the SIM interface in case of a low voltage on VCC (<4.25 VDC). Without any SIM card inserted in card reader the LED's V6 and V7 will be turned on by the MCU. Approx 9 mA is used for the LED's. If a SIM card is inserted the MCU will turn off the LED's and enable the SIM interface in accordance with the ISO 7816­3 standard. In the following table an explanation of the signals in the MCU block is given.

SIGNAL ~TEST ~SET_RST ~CLR_RST ~CLR_CLK ~EN_PWR ~CARDOUT

IN/OUT In Out Out Out Out In

EXPLANATION Only for test purposes When low, the RST on SIM is high When low, the RST on SIM is low When low, the clock for SIM card is stopped at a low value Enables the +5V DC for the SIM card A low on this will interrupt the MCU, and indicate that the SIM card is removed SIM data is received via this pin MCU transmit data to the SIM card via this pin Used for software purposes Used for software purposes MBUS messages are received via this pin MCU transmit to MBUS via this pin Used for software purposes LED controlling pin

RX1 TX1 INTO P1.4 RX0 TX0 T2EX P1.6

In Out In In In Out In Out

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Circuit Diagram of GM8S

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Layout Diagram

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Parts List of CAE­2 (EDMS: Issue 4.2)

ITEM CODE DESCRIPTION VALUE TYPE ­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­­ R001 1430151 Chip resistor 10 5 % 0.063 W 0603 R002 1430087 Chip resistor 100 k 5 % 0.063 W 0603 R003 1430065 Chip resistor 10 k 5 % 0.063 W 0603 R006 1430087 Chip resistor 100 k 5 % 0.063 W 0603 R008 1430065 Chip resistor 10 k 5 % 0.063 W 0603 R009 1430065 Chip resistor 10 k 5 % 0.063 W 0603 R010 1430065 Chip resistor 10 k 5 % 0.063 W 0603 R011 1430298 Chip resistor 1.0 M 2 % 0.063 W 0603 R012 1430071 Chip resistor 22 k 5 % 0.063 W 0603 R016 1430071 Chip resistor 22 k 5 % 0.063 W 0603 R017 1430087 Chip resistor 100 k 5 % 0.063 W 0603 R018 1430087 Chip resistor 100 k 5 % 0.063 W 0603 R021 1430144 Chip jumper 0603 R022 1430144 Chip jumper 0603 R030 1430087 Chip resistor 100 k 5 % 0.063 W 0603 R031 1430065 Chip resistor 10 k 5 % 0.063 W 0603 C001 2604103 Tantalum cap. 4.7 u 20 % 35 V 7.3x4.4x2.8 C002 2310784 Ceramic cap. 100 n 10 % 25 V 0805 C003 2320059 Ceramic cap. 100 p 5 % 50 V 0603 C004 2320107 Ceramic cap. 10 n 5 % 50 V 0603 C005 2310784 Ceramic cap. 100 n 10 % 25 V 0805 C006 2310784 Ceramic cap. 100 n 10 % 25 V 0805 C007 2604431 Tantalum cap. 10 u 20 % 16 V 6.0x3.2x2.5 C008 2320045 Ceramic cap. 27 p 5 % 50 V 0603 C009 2320045 Ceramic cap. 27 p 5 % 50 V 0603 C010 2320045 Ceramic cap. 27 p 5 % 50 V 0603 C011 2320059 Ceramic cap. 100 p 5 % 50 V 0603 C012 2320059 Ceramic cap. 100 p 5 % 50 V 0603 C013 2320059 Ceramic cap. 100 p 5 % 50 V 0603 C014 2320059 Ceramic cap. 100 p 5 % 50 V 0603 C015 2320059 Ceramic cap. 100 p 5 % 50 V 0603 C016 2320045 Ceramic cap. 27 p 5 % 50 V 0603 C017 2310784 Ceramic cap. 100 n 10 % 25 V 0805 C018 2320059 Ceramic cap. 100 p 5 % 50 V 0603 B001 4510036 Crystal 7.3728 M +­50PPM 12x6x3mm V002 4200909 TransistorBC858B/BCW30 pnp 30 V 100 mA SOT23 V003 4200917 TransistorBC848B/BCW32 npn 30 V 100 mA SOT23 Original 08/97

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V004 V005 V006 V007 D001 D002 N001 N002

X001 X002 X003 P001

4200917 4200917 4102998 4102998 4309375 4309488 4301062 0240426 4370169 8400470 9380149 5416518 5416518 5431702 9854153 9854153

TransistorBC848B/BCW32 npn 30 V 100 mA SOT23 TransistorBC848B/BCW32 npn 30 V 100 mA SOT23 Led Green 2.2 V 1206 Led Green 2.2 V 1206 IC, 2 x D­flip­flop 74HC74 SO14S IC, 4 x bi.switch 74HC4066 SO14S IC, regulator LP2951AC SO8S MCU SW Module MCU DS87C520 ROM Code Sticker Brady LAT­2­747 9.5X9.5 Modular jack 8 pole smd Modular jack 8 pole smd Flexfoil connect 1x08 1mm smd PC board GM8S 80.8x58.2x1.6 d 4/pa PCB GM8S 80.8X58.2X1.6 D 4/PA

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Exploded View of CAE­2

Figure 5: Exploded View of CAE­2 Mechanical Items ITEM 1 2 3 4 5 6 7 8 S1 CODE 9450019 9450018 9450017 6292279 9380154 5408803 6291917 9380112 0201013 DESCRIPTION Front Cover Bottom Cover Light Guide PT­screw Label blank Chip card reader push PT­screw Cover sticker GM8S module VALUE CAE­2 CAE­2 CAE­2 TYPE 1D21141 3D21142 3D21143 KB30x10 WN1442 FEXN BLU 4D21745 KB25x5 WN1442 4D21434

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