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Nokia Customer Care RH-37 Series Transceivers
7 - System Module
Issue 1 07/04
Š 2004 Nokia Corporation Company Confidential
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RH-37 System Module
Page No Glossary of Terms..................................................................................................................................... 7 Baseband................................................................................................................................................. 10 Block diagram ......................................................................................................................................11 Environmental Specifications............................................................................................................ 13 Absolute maximum ratings ..............................................................................................................13 Temperature conditions ....................................................................................................................13 Humidity and water resistance ......................................................................................................13 Frequencies in baseband ..................................................................................................................14 PWB ........................................................................................................................................................14 Characteristics of the PWB.......................................................................................................... 14 Key components.............................................................................................................................. 14 Technical Specifications ..................................................................................................................... 16 Baseband core .....................................................................................................................................16 UPP...................................................................................................................................................... 16 UEMEK ............................................................................................................................................... 16 External SRAM and Flash ............................................................................................................. 17 Energy management ..........................................................................................................................17 Modes of operation........................................................................................................................ 17 No Supply.......................................................................................................................................... 18 Backup ............................................................................................................................................... 18 Acting Dead...................................................................................................................................... 18 Active ................................................................................................................................................. 18 Sleep Mode ....................................................................................................................................... 19 Charging ............................................................................................................................................ 19 Power distribution ..............................................................................................................................19 DC characteristics ..............................................................................................................................20 Supply voltage ranges ................................................................................................................... 20 Baseband regulators ...................................................................................................................... 21 Function Groups.................................................................................................................................... 22 Battery ...................................................................................................................................................22 Audio ......................................................................................................................................................22 Internal microphone ...................................................................................................................... 22 Internal speaker............................................................................................................................... 23 IHF speaker ....................................................................................................................................... 23 External audio.................................................................................................................................. 24 External microphone connection ............................................................................................... 24 Headset connections...................................................................................................................... 24 Test possibilities .............................................................................................................................. 24 Camera ..................................................................................................................................................24 Key features...................................................................................................................................... 25 Specifications................................................................................................................................... 26 CCP bus.............................................................................................................................................. 26 CCI bus............................................................................................................................................... 26 UIF bus ............................................................................................................................................... 27 Clocks ................................................................................................................................................. 27 Test possibility ................................................................................................................................. 27 Vibra .......................................................................................................................................................27 ŠNokia Corporation Page 3
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Test possibility ................................................................................................................................. 27 FCI ...........................................................................................................................................................27 Function............................................................................................................................................. 28 Test possibility ................................................................................................................................. 29 LCD module ..........................................................................................................................................29 Characteristics................................................................................................................................. 30 LCD connector ................................................................................................................................. 31 Test possibility ................................................................................................................................. 32 Keypad ...................................................................................................................................................32 Test possibility ................................................................................................................................. 32 Illumination ..........................................................................................................................................33 Test possibility ................................................................................................................................. 34 XPress on grip LEDs ............................................................................................................................34 Test possibility ................................................................................................................................. 34 SIM .........................................................................................................................................................35 Test possibility ................................................................................................................................. 35 Interfaces ................................................................................................................................................ 36 BB-RF interface ...................................................................................................................................36 System connector interface .............................................................................................................36 System connector ........................................................................................................................... 36 ACI....................................................................................................................................................... 38 FBUS ................................................................................................................................................... 38 VOUT................................................................................................................................................... 39 DC plug .............................................................................................................................................. 39 Component Placement Hints............................................................................................................. 40 Power switch (S2419) .......................................................................................................................40 Helgo RF-chip (N7500) .....................................................................................................................41 Camera socket (X1470) .....................................................................................................................42 Hardware accelerator (D1470) .......................................................................................................42 UEM (D2800) .......................................................................................................................................43 Flash (D3000) .......................................................................................................................................43 SIM card reader (X2700) ..................................................................................................................43 System connector (X2002) ...............................................................................................................43 UEM (D2200) .......................................................................................................................................44 Battery connector (X2000) ..............................................................................................................45 X-press on grip LED's (V2402, V2403, V2404, V2405, V2406, V2407) ...............................45 Label placement ..................................................................................................................................46 RF Module Description........................................................................................................................ 47 General specifications of the transceiver ....................................................................................48 Frequency concept .............................................................................................................................48 RF power supply configuration .......................................................................................................49 RF block diagram ................................................................................................................................50 Antenna switch (TX/RX switch) ......................................................................................................51 Receiver ............................................................................................................................................. 52 Transmitter ....................................................................................................................................... 52 Frequency synthesizer ................................................................................................................... 52 Signal paths .........................................................................................................................................53 Receiver signal paths..................................................................................................................... 53
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Transmitter signal paths ............................................................................................................... 55 Frequency synthesizer signals..................................................................................................... 56 Printed Wired Board ............................................................................................................................ 57 RF key component placement .........................................................................................................58 Appendix 7A: Differentiation between RH-37 and RH-49 ............................................. 61 Differentiation between 900 MHz and 850 MHz (US) version (RH-37 vs. RH-49)........... 62 Antenna radiator (I039) and deco foil (I041) .............................................................................62 RF components ....................................................................................................................................62 MCU-SW ................................................................................................................................................. 65 Tuning ....................................................................................................................................................65 Flash exchange...................................................................................................................................... 66 Tuning and testing.......................................................................................................................... 67 Power Amplifier / Antenna Switch Exchange............................................................................... 69
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Glossary of Terms
ACI ADC AFC ASIC ASM BB BSI DCT4 DSP DUT EDGE EGPRS EMC ESD FC FR GMSK GPRS GSM GSM900 HSCSD HW IF IHF Accessory Control Interface Analogue to Digital Converter Automatic Frequency Control Application Specific Integrated Circuit Antenna switch module Baseband Battery Size Indicator Digital Core Technology, generation 4 Digital Signal Processor Device under test Enhanced Data Rates for Global Evolution Enhanced General Packed Radio Service Electro Magnetic Compatibility Electro Static Discharge Functional Cover Full Rate Gaussian Minimum Shift Keying General Packed Radio Service Global System for Mobile Communication GSM900 (channels 1 - 124)+extended GSM900 (channels 975 - 1023, 0) High Speed Circuit Switched Data Hardware Interface Integrated Hands Free ŠNokia Corporation
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RH-37 System Module IMEI I/O IR IrDA LCD LED LDO LNA LO MCU PA Phoenix PLL PWB RF RTC RX SA SIM SW TP TX UEMEK UI International Mobile Equipment Identity Input/Output Infrared Infrared Data Association Liquid Crystal Display Light Emitting Diode Low Drop Out Low Noise Amplifier Local Oscillator Micro Controller Unit Power Amplifier SW tool of DCT4 Phase Locked Loop Printed Wired Board Radio Frequency Real Time Clock Receiver Spectrum analyzer Subscriber Identification Module Software Test point Transmitter
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Universal Energy Management ASIC enhanced version User Interface
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Nokia Customer Care UPP USB VBU VCO VCTCXO V 8-PSK Universal Phone Processor Universal Serial Bus Back-up Battery Cut Off voltage (typical: 2.0 V) Voltage controlled oscillator Voltage controlled temperature compensated oscillator Master Reset Threshold (typical: 2.1 V)
RH-37 System Module
Phase Shift Keying with 8 states (Modulation scheme for EDGE/EGPRS)
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Baseband
The RH-37 product is a DCT4.5 Expression segment phone. There are two variants: An EGSM900/GSM1800/GSM1900 phone and a US variant, RH 49, with GSM850/1800/ 1900. The HW has the following features: ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ GPRS and HSCSD with EDGE in up to (2RX + 2TX) (MCS5), without EDGE also in (3RX + 1TX) (MCS6) DCT4 with AMR and 16 MIDI tones 128/16 Mbit Combo memory Amazon Active display with 64k colours Battery BL-5B Illuminated XPress on grips PopPortTM interface 5-way navigation key with select FCI rear side (C-cover) VGA Camera Vibra IHF
The RH-37 BB is based on the DCT4/4.5 engine and is compatible to the PopPortTM accessories. The DCT4/4.5 engine consists basically of two ASICs. The UEMEK (Universal Energy Management IC including voltage regulators, charge control and audio circuits, audio IFH amplifier from DCT4.5) and the UPP (Universal Phone Processor including MCU, DSP and RAM from DCT4).
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Block diagram
Figure 1: Baseband block diagram
UEMEK supplies both baseband and RF with power via built in voltage regulators, which are connected to the battery. The RF parts use mainly 2.78 V and the baseband parts 1.8V I/O voltage. The UPP core is supplied with programmable core voltage of 1.0V, 1.3V or 1.5V. UEMEK includes 7 linear LDO (Low Drop-Out) regulators for baseband and 7 regulators for RF. It also includes 4 current sources for biasing purposes and internal usage. The UEMEK is furthermore supplying the SIM interface with a programmable voltage of 1.8V or 3V.
Note: 5V SIM cards are no longer supported by DCT-4 generation Baseband.
UPP operates from a 26 MHz clock coming from the RF ASIC Helgo. The clock signal is divided by two down to the nominal system clock frequency of 13 MHz. The DSP and MCU contain PLLs, which can multiply the system clock to a higher frequency. A real time clock function is integrated into the UEMEK, which utilizes the same 32kHz clock supply as the sleep clock. The communication between UEMEK and UPP is implemented using two bi-directional serial busses, CBUS and DBUS. The CBUS is controlled by the MCU and operates at a
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speed of 1 MHz. The DBUS is controlled by the MCU and operates at a speed of 13 MHz. Both processors are located in the UPP. The UEMEK ASIC handles the analog interface between the Baseband and the RF section. UEMEK provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the user interface. The UEMEK supplies the analog TXC and AFC signals to the RF section according to UPP signal control. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP ASIC. UEMEK is a dual voltage circuit, the digital parts are running from the baseband supply 1.8V and the analog parts are running from the analog supply 2.78V. Also VBAT is directly used (Vibra, LED-driver, Camera Regulator, FCI). The Baseband supports both internal and external microphone inputs and speaker outputs. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP and transmitted to the UEMEK for decoding. An external vibra alert control signals are generated by the UEMEK with separate PWM outputs. EMC shielding is implemented using a soldered shielding, RF cans and PWB grounding.
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Environmental Specifications
Absolute maximum ratings
Table 1: Absolute maximum ratings Signal Battery Voltage (Idle) Battery Voltage (Call) Charger Input Voltage Note -0.3...5.5V Max 4.8V -0.3V ...16V
Temperature conditions
Table 2: Temperature conditions Condition Normal operating temperature Reduced functionality Storage Min -10°C -25°C -40°C Max +55°C +75°C +85°C
Humidity and water resistance
Table 3: Humidity conditions Condition Relative Humidity Min 5% C Max 95%
The module is not protected against water.
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Frequencies in baseband
Table 4: Frequencies in baseband Frequency 100 kHz 32 kHz 1 MHz Up to 1 MHz 6,5 MHz 3,25 MHz 13 MHz 26 MHz 52 MHz Context FCI SleepClk CBUS RFConvClk Display IF SIMIF DBUS, RFBUClik RF Clk Memory Clock X X X X X X X X X X Min UPP X UEMEK X X X X Estimation Flash SIM Comment
PWB
Characteristics of the PWB ˇ Single PWB ˇ ˇ 8 layer board Double side assembled
Key components
Figure 2: Key components
D1470 HW Accelerator
D2800 UPP
D2200 UEMEK
D3000 Combo
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Table 5: Key components Position D1470 D2800 D2200 D3000 Component Name HW Accelerator UPP8M v 3.5 UEMEKv2.0 Combo Memory (128M NOR + 16M UTRAM) Code 4377033 4371105 4376371 4347043
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Technical Specifications
Baseband core
UPP Main characteristics of the used UPP are: ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ DSP, LEAD3 16 bit DSP core 32 bit IF max. 200 MHz MCU based on ARM7 RISC MCU core max 50 MHz Internal 8 Mbit SRAM (PDRAM) General purpose UARTS SIM card interface Accessory interface (ACI) Interface control for Keypad, LCD, Audio and UEM control Handling of BB-RF Interface
UEMEK Main characteristics of the used UEMEK are: ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ACI support Audio codec 11 Channel A/D converter Auxiliary A/D converter 32 KHz crystal oscillator SIM interface and drivers Security logic Storage of IMEI code Buzzer and vibra motor drivers PWM 2 LED drivers, keyboard and display backlight drivers
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Nokia Customer Care ˇ ˇ ˇ ˇ ˇ Voltage reference for analogue blocks Charging function Baseband regulators RF regulators RF interface converters
RH-37 System Module
External SRAM and Flash The Combo-Memory is a multi chip package memory which combines 128 Mbit (8Mx16) muxed burst multibank flash and 16 Mbit muxed CMOS PSRAM (Pseudo SRAM: DRAM with SRAM interface). The combo is supplied by single 1,8 V for read, write and erase operations. For accelerated flash programming, Vpp = 9.0 V has to be applied to VPP input of the combo device. The combo memory is housed in a 44-ball FBGA.
Figure 3: Combo memory
2nd
e 1st
Chip PI
Energy management
The energy management of RH-37 is based on BB 4.0 architecture. A so-called semi fixed battery (BL-5B) supplies power primarily to UEMEK ASIC and the RF PA. The UEMEK includes several regulators to supply RF and Baseband. It provides energy management including power up/down procedure. Modes of operation The baseband engine has six different functional modes: Since the UEMEK controls the regulated power distribution; each of these states affects the general functionality of the phone. 1 No supply
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RH-37 System Module 2 3 4 5 6 Backup Acting Dead Active Sleep Charging
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No Supply In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to the disconnection of the main battery and backup battery or low battery voltage level in both of the batteries. The phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected. The battery voltage can rise either by connecting a new battery with VBAT > VMSTR+ or by connecting charger and charging the battery above VMSTR+. Backup In BACKUP mode the backup battery has sufficient charge but the main battery can be disconnected or empty (VBAT < VMSTR and VBACK > VBUCOFF). The VRTC regulator is disabled in BACKUP mode. VRTC output is supplied without regulation from the backup battery (VBACK). All the other regulators are disabled. BACKUP mode is not used in RH-37 since the product has no backup battery. Acting Dead If the phone is off when the charger is connected, the phone is powered on but enters a state called "Acting Dead". To the user, the phone acts as if it was switched off. A battery-charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the battery is being charged. Active In the Active mode the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. There are several sub-states in the active mode depending on if the phone is in burst reception, burst transmission, if DSP is working etc. In Active mode the RF regulators are controlled by SW writing into UEMEK´s registers wanted settings: VR1A can be enabled or disabled. VR2 can be enabled or disabled and its output voltage can be programmed to be 2.78V or 3.3V. VR4-VR7 can be enabled, disabled, or forced into the low quiescent current mode. VR3 is always enabled in Active mode.
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Sleep Mode Sleep mode is entered when both MCU and DSP are in standby mode. Both processors control the sleep mode. When SLEEPX signal (low) is detected UEMEK enters SLEEP mode. VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All the RF regulators are off in SLEEP. When SLEEPX=1 detected UEMEK enters ACTIVE mode and all functions are activated. The sleep mode is exited either by the expiration of a sleep clock counter in the UEMEK or by some external interrupt, generated by a charger connection, key press, headset connection etc. In the sleep mode, VCTCXO is shut down and 32 kHz sleep clock oscillator is used as reference clock for the Baseband. Charging In RH-37, the battery type/size is indicated by a BSI-resistor. The resistor value corresponds to a specific battery capacity. Also BTEMP, NTC resistor, is located on an engine board. The battery voltage, temperature, size and current are measured by the UEMEK controlled by the charging software running in the UPP. The charging control circuitry (CHACON) inside the UEMEK controls the charging current delivered from the charger to the battery. The battery voltage rise is limited by turning the UEMEK switch off when the battery voltage has reached 4.2 V. Charging current is monitored by measuring the voltage drop across a 220 m resistor.
Power distribution
Under normal conditions, the battery powers the baseband module. Individual regulators located within the UEMEK regulate the battery voltage VBAT. These regulators supply the different parts of the phone. 7 regulators are dedicated to the RF module and 7 to the baseband module. The VSIM regulator is able to deliver both 1,8V and 3,0 V DC and thus supporting two different SIM technologies. The regulator VCORE is likewise adjustable by the MCU. VCORE supplies the core logic of the UPP. The system connector provides a voltage to supply accessories. The white LEDs need a higher voltage supply than the battery can supply and are fed by a separate external voltage regulator. VBAT is directly distributed to the RF power amplifier, FCI and external baseband regulators.
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RH-37 System Module
Figure 4: Power Distribution Diagram
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Baseband
CAMERA
UEME
RF Regulators
To RF Parts VR1A VR1B VR2-7 6 SIM VFLASH1 VAUX3 VSIM VCORE VANA Baseband Regulators Combo Memory UPP
LCD
LEDs
VLED+
White LED Driver
RTC VAUX2
VIO VFLASH1
Battery VBAT
CHACON
VBAT Vout PA Supply System Connector
FCI
DC characteristics
Supply voltage ranges
Table 6: Battery voltage ranges Signal VBAT Min 3.1V Nom 3.7V Max 4.2V Note 3.2V SW cut off 2.95V HW power off
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Table 7: Regulator specification Regulator VCORE VIO VSIM1 VANA VFLASH1 VAUX2 VAUX3 VR2 VR3 VR4 VR5 VR6 VR7 VR1A VR1B Load current (mA) 200 150 25 80 70 70 10 100 20 50 50 50 45 5* 5* Limit (V) Min/Max (Typ) 1.476 / 1.65 (1.57) 1.72 / 1.88 (1.8) 1.745 / 1.855 (1.8) 2.70 / 2.86 (2.78) 2.70 / 2.86 (2.78) 2.70 / 2.86 (2.78) 2.70 / 2.86 (2.78) 2.70 / 2.86 (2.78) 2.70 / 2.86 (2.78) 2.70 / 2.86 (2.78) 2.70 / 2.86 (2.78) 2.70 / 2.86 (2.78) 2.70 / 2.86 (2.78) 4.6 / 4.9 (4.75) 4.6 / 4.9 (4.75)
RH-37 System Module
* When both enabled. Load current is 10 mA if other is disabled.
Note: This list shows the band regulators only. Please see other descriptions in the Glossary of Terms and in the dedicated sections.
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Function Groups
Battery
A battery of the type BL-5B is used. It is a Li Ion based standard cell. The battery capacity is 760mAh. The battery has a three-pin connector (BTEMP is not used). The battery does not support temperature measurement inside the battery pack. In order to get temperature information of the battery, the NTC mounted on the PWB within the BB area is used. Ni based batteries are not supported. The BSI resistor has a nominal value of 75 kOhm.
Figure 5: Battery BL-5B
Audio
Internal microphone The internal microphone capsule is mounted to in the PopPortTM system connector. The microphone is omni directional and it's connected to the UEMEK microphone input MIC1P/N. The microphone input is symmetric and the UEMEK (MICB1) provides bias voltage. The microphone input on the UEMEK is ESD protected. Spring contacts are used to connect the microphone to the PWB.
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Figure 6: Internal microphone connection
RH-37 System Module
Internal speaker The internal earpiece is a dynamic earpiece with an impedance of 32 ohms. The earpiece is low impedance one since the sound pressure is to be generated using current and not voltage as the supply voltage is restricted to 2.7V. The earpiece is driven directly by the UEMEK and the earpiece driver (EARP & EARN outputs) is a fully differential bridge amplifier with 6 dB gain.
Figure 7: Speaker connection
IHF speaker UEMEK has an integrated Audio power amplifier to generate output for the IHF speaker.
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RH-37 System Module Block diagram of IHF.
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For RH-37, the Integrated Hands Free Speaker is used to generate hands free speech, and also polyphonic ringing tones. The speaker capsule is mounted into the A Cover, and spring contacts are used to connect the IHF Speaker contacts to the PWB. The IHF is furthermore used to generate alerting and warning tones. External audio RH-37 is designed to support a fully differential external audio accessory connection. A headset can be directly connected to the PopPortTM system connector. Stereo audio is not supported by RH-37. A stereo headset can be connected to RH-37, since left and right paths are connected in parallel at the PopPortTM connector. External microphone connection The external microphone input is fully differential and lines are connected to the UEMEK microphone input MIC2P/N. The UEMEK (MICB2) provides bias voltage. Microphone input lines are ESD protected. Headset connections Headset implementation uses separate microphone and earpiece signals. The accessory is detected by the ACI signal when the plug is inserted. Test possibilities Phoenix audio test For troubleshooting see Audio faults in Baseband Troubleshooting Instructions.
Camera
RH-37 incudes a VGA camera module. The camera supports a video preview mode, with integrated colour processing, and high quality still image mode, which utilizes the existing memory and the processing resources of the phone. ŠNokia Corporation
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Figure 8: Camera module
RH-37 System Module
Key features ˇ VGA resolution sensor ˇ ˇ On-chip viewfinder Video data interface CCP
ˇ Command interface CCI ˇ 2,8/1,8 V operation ˇ ˇ ˇ ˇ ˇ ˇ On board 11 bit ADC Automatic exposure control (AEC) Automatic white balance (AWB) Small physical size Ultra low power standby mode On board PLL
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RH-37 System Module Specifications
Table 8: Camera specification Feature Resolution Size Sensor technology Pixel size Signal to noise Minimum illumination Lens Power supply Description 480 x 640 pixels 10,6 x 8,7 x 5,8 mm 0,35 ľm HCMOS6i 5,6 x 5,6 ľm 35 dB @ 100 lux < 10 lux f# 2.8 Fixed focus 1,7 1,9 V Digital 2,7 2,9 V Analogue
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To relax the processing requirements of the UPP ASIC, a separate Hardware Accelerator device is incorporated in the phone system, to run the algorithms in hardware. The HWA performs all tasks to deliver both stills and viewfinder to the Baseband with no further processing required.
Figure 9: Camera module with HW accelerator
CAMERA
HWA CCP UIF CCI Phone Baseband
1V8, 2V8, CLK & CE
CCP bus CCP, also known as subLVDS, is a differential current mode bus. A CCP connection consists of 2 pairs of differential signals, data and clock, which are routed as 100 Ohm transmission lines and terminated in 100 Ohm at the receiver end. The CCP is unidirectional and outputs image data only. The data rate is about 117MHz whatever the image size or format. CCI bus CCI is an I2C-type bus used as the command interface in CCP/CCI systems. It uses a 16bit sub-address and does not support 'fast' mode, being limited to less than 100kHz. The HWA has a CCI bus master for communicating with the sensor. Page 26 ŠNokia Corporation Issue 1 07/04
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RH-37 System Module
UIF bus UIF is a slow (6,5 MHz) bus which may be shared with other UI functions (e.g. LCD). This version has unidirectional TX and Rx data lines and consists of a chip enable, chip select, Tx data, Rx data, data clock and system clock. Clocks The cameras and HWA can use 19.44MHz, 19.2MHz, 16.8MHz and 13MHz clocks in CCP/ CCI mode. The cameras can also use the half-frequencies. The HWA can use 16.8MHz, 13MHz, 9.72MHz, 9.6 MHz and 8.4MHz clocks for UIF mode. The clock input for any of the devices can be DC or AC coupled. The camera and HWA is supplied from the same clock input. Test possibility Phoenix camera test For troubleshooting see Camera faults in Baseband Troubleshooting Instructions.
Vibra
A vibra alerting device is used to generate a vibration signal for an incoming call. The vibra is located in the bottom end of the phone and connection is done with SMD. The vibra is controlled by a PWM signal from the UEMEK. The Frequency can be set to 64, 129, 258 or 520 Hz and duty cycle can vary between 3% and 97%. Test possibility Phoenix Vibra Test
FCI
FCI is a multipurpose bi-directional digital interface for connecting external module with terminal Baseband. The main operation of FCI is relying on well-known I2C bus. For powering the external module, a power supply connection is available from the terminal to the module. Main feature of FCI is the capability to download application code from external module to terminal and let the application to use both terminal and module resources for consumer application purposes. The main features of FCI are ˇ ˇ Application downloading from external module to the terminal Operating system independent logical interface
ˇ Communication API between terminal and external module ˇ Controlled power supply capability, hot swap support ˇ Ability to use several covers simultaneously (A/B covers for example)
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RH-37 System Module
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Function FCI operation is based on a few main principles. The external module is attached to the terminal, application (typically Java application) is downloaded to the terminal memory and it is automatically started (the first time module is attached to the terminal). Consumer starts the application from UI menu; application establishes a communication channel between external module and terminal SW execution environment (typically Java Virtual Machine) allowing application code to directly interact with the resources located in the module. FCI is implemented by emulating I2C with general I/O pins.
Figure 10: FCI interface
Terminal
FCI
VOUT
EM
GND
SDA
UPP
GenIO
I2C (sw) Interrupt
SCL FCINT
Device detection Device is detected when it is being attached to the terminal. The power out supply is activated. Identification Each time a external module is attached to the terminal it is identified via I2C bus. Authentication ensures that the attached module is verified to be fully operational with Nokia terminal. If authentication fails the power supply is turned off. Application downloading is automatically initiated right after the external module has been attached to the terminal and the terminal has power on. Cover checks whether the application is already installed before file transfer is initiated. A communication channel is available between the external module and the application that has been earlier installed to the terminal. Hot swap enables changing external module on-the-fly without re-booting the terminal. The FCI concept has a limit of simultaneous connection of 4 covers having 256 applications (HW resources) in each cover at maximum. Each cover (module) has 10-bit address.
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Functional Cover(s)
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Figure 11: FCI interface schematic
RH-37 System Module
Terminal
FCI ASIP EN
Switch + Short Circuit protection ferrite
Functional Cover
FC_Vout
Cout
ferrite
VBAT VIO
GenIO_18
Reg.
Cin
GenIO_22
ferrite ferrite ferrite
FC_SDA FC_SCL FC_INT
ferrite ferrite ferrite
UPP
GenIO_2 GenIO_25
MCU
Test possibility Phoenix FCI Test For troubleshooting see FCI faults in Baseband Troubleshooting Instructions.
LCD module
RH-37 has a 130 x 130 16 bpp (bits per pixel) active matrix color display. The number of colours is 64k, i.e. 16 bits. The LCD Interface is using serial 9-bit data transfer. The LCD display is connected to transceiver PWB by board-to-board connector.
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RH-37 System Module Characteristics
Table 9: LCD Characteristics Active display area format UserInterface display area format Module size (width x height x thickness) Interface Illumination mode Number of LEDs Numbers of colors supported by interface Full mode 4096 colors out of 65Kcolors 256 colors out of 65Kcolors RAM bit data 130 columns x 130 rows 128 columns x 128 rows
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33,9 mm x 41.3 mm x 3.225 mm 9-bit serial Transflective, Normally white 3 white LED 65K 16-bit 4096 12-bit 256 8-bit 5xR, 6xG, 5xB 4xR, 4xG, 4xB 3xR, 3xG, 2xB
"11111 111111 11111"... White "00000 000000 00000"... Black
Pixel height to width ratio Viewing direction Refresh rate
1:1 6 o´clock 55 Hz +- 10%
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Table 10: LCD connector Pin No: 1 2 3 4 Description Power supply Power supply voltage Ground Bidirectional serial data Type OUT IN I/O Symbol VLEDVDDI GND SDA Input voltage high Input voltage low Output voltage high @ 1.0 mA Output voltage low @ 1.0 mA 5 Chip select IN CSX Input voltage high Input voltage low 6 7 Ground TE output to synchronise MCU to frame writing OUT GND TE Output voltage high @ 1.0 mA Output voltage low @ 1.0 mA 8 Reset IN RESX Input voltage high Input voltage low 9 Serial clock IN SCL Input voltage high Input voltage low 10 11 12 Ground Power supply voltage Power supply IN IN GND VDD VLED+ Operating voltage LED power supply current 2.6 0.8 x VDDI 0 0.7 x VDDI 0 0.7 x VDDI 0 0.7 x VDDI 0 0.8 x VDDI 0 0.7 x VDDI 0 Parameter LED power supply current Operating voltage 1.65 Min
RH-37 System Module
Typical 15 1.8
Max
Unit mA
1.95
V
VDDI 0.3 x VDDI VDDI 0.2 x VDDI VDDI 0.3 x VDDI
V
V
VDDI
V
0.2 x VDDI VDDI 0.3 x VDDI VDDI 0.3 x VDDI V V
2.75 15
2.9
V mA
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RH-37 System Module
Figure 12: LCD display
Nokia Customer Care
Connector type (Plug) Hirose DF23C-12DP-0.5V 6 7 1 12 1 12 6 7
Top view
Back view
Test possibility Phoenix Display Test For troubleshooting see Display faults in Baseband Troubleshooting Instructions.
Keypad
The RH-37 keys are connected to the UPP via the KEYB(10:0) bus. The keypad consists of a 5x4 matrix of 5 rows, ROW0 ROW4, and 4 columns, COL1 COL4. Additionally, there are 3 lines that are directly connected to the UPP IO and can be detected independently. COL5 is connected to GENIO0. Test possibility Phoenix Keyboard Test For troubleshooting, see Keypad faults in Baseband Troubleshooting Instructions.
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Figure 13: RH-37 keypad
RH-37 System Module
When there is no key pressed, all the inputs from the rows are high since UPP has internal pull-up resistors on all those lines. All the columns are low at this state. When a key is pressed, the specific row where the key is placed is pulled low. This generates an interrupt to the MCU and the MCU now starts its scanning procedure. The procedure first sets all the columns high (KEYB (1) to KEYB (4)) and then one by one low again. Only one of the columns is low at the time. While one of the columns is low, the row is (KEYB (5) to KEYB (9)) is read by MCU to find the active low signal. If the input is low, the MCU knows that a key is pressed. When the key has been detected all the keypad-register inside the UPP is reset and it's ready receiving new interrupt. The power on key is connected to the UEM PWRONX signal.
Illumination
In RH-37, white LED's are used for the LCD backlight and keypad lighting. Three LED's are used for the LCD lighting and two LED's for the keyboard. A step up DC-DC converter is used as a LED driver that is configured as a constant current source.
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RH-37 System Module
Figure 14: Illumination
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VBAT UEME
Keybord light
DC/DC-Converter
Vin VLED+ VLED-
DLIGHT
EN
LCD Backlight
GEN I/O 19
Test possibility Phoenix LED test For troubleshooting see Display faults in Baseband Troubleshooting Instructions.
XPress on grip LEDs
RH-37 uses 10 different controllable LEDs for light effects. For each LED one transistor serves as switch and current limiter. 33 resistors limit the current to an appropriate value. PWM modulation is realized by KLIGHT and KLIGHT2 output of UEMEK. 8 GENIOs are used to control the LEDs.
Figure 15: XPress on grip LED driver. There are 8 identical drivers.
VBAT
XPress on grip LED
UEME
GEN I/O
KLIGHT
Test possibility Phoenix LED test.
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RH-37 System Module
SIM
The whole SIM interface locates in UPP and UEMEK. The interface part in the UEMEK contains power up/down, port gating, card detect, data receiving, ATR-counter, registers and level shifting buffers logic. The SIM interface is the electrical interface between the Subscriber Identity Module Card (SIM Card) and mobile phone (via UEMEK device). Both 3V and 1.8V SIM cards are supported. A register in the UEMEK selects SIM supply voltage. It is only allowed to change the SIM supply voltage when the SIM IF is powered down. The SIM power up/down sequence is generated in the UEMEK. This means that the UEMEK generates the RST signal to the SIM. In addition, the SIMCardDet signal is connected to UEMEK. The card detection is taken from the BSI signal, which detects the removal of the battery. The data communication between the card and the phone is asynchronous half duplex. The clock supplied to the card is in GSM system 1.083 MHz or 3.25 MHz. The data baud rate is SIM card clock frequency divided by 372 (by default), 64, 32 or 16. The protocol type, that is supported, is T=0 (asynchronous half-duplex character transmission as defined in ISO 7816-3).
Figure 16: UPP/UEMEK SIM Interface Connections )
SIM
SIMIO
UEME
SIMIO
SIMClk
UPP
SIMIO SIMClk SIMRst
SIMRst SIM ASIP
SIMClk SIMRst VSIM
SIMIF register UIF Block
From battery type contact
BSI
UEME digital logic
UEMEInt CBusDa CBusEnX CBusClk
Test possibility Phoenix SIM Test For troubleshooting, see SIM Card faults in Baseband Troubleshooting Instructions.
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RH-37 System Module
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Interfaces
BB-RF interface
The interface between the Baseband and RF can be divided into three categories: ˇ ˇ The digital interface from UPP to the RF ASIC (Helgo). The serial digital interface is used to control the operation of different blocks in the RF ASICs The analogue interface between Baseband and RF. The analogue interface consists of Tx and Rx converter signals. The power amplifier control signals TXC and AFC also come from the UEMEK.
ˇ Reference clock interface between Helgo and UPP which supplies the 26 MHz system clock for UPP.
System connector interface
System connector The system connector is a galvanic interface between phone and accessory. Four new functions are introduced with the PopPortTM IF; Accessory Control Interface (ACI), Power Out; Stereo audio output and Universal Serial Bus (USB). The USB functionality is not supported by RH-37. The RH-37 product supports "double mono" on the earpiece lines. The MBUS function, (included in previous accessory interfaces) is not supported by this interface. The connector is not backward compatible with DCT1, DCT2 and DCT3 accessory interfaces.
Figure 17: PopPortTM bottom connector (charger plug socket & PopPortTM system connector)
1 2 14
USB Vbus Vout ACI
XEARRN
XEARRP
Charge
Shielding GND
Charge GND
Data GND
XMICP
XEARP XEARN
Shielding GND
XMICN
Fbus_RX / USB D+
Fbus_Tx / USB D-
Figure 19. Pop-Port
Charge GND Charge
Bottom Connector (Charger plug socket & Pop-Port
System Connector)
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Table 11: System connector interface description Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 FBUS_RX FBUS_TX GND XMIC N XMIC P HSEAR N HSEAR P HSEAR RN HSEAR RP Signal VCHAR GND ACI Vout Charge ground Insertion & removal detection / Serial data bi-directional 1 kbit/s Power supply for external accessories Not used in RH-37 Serial data from accessory to phone / 115 kbit/s Serial data from phone to accessory / 115 kbit/s Data ground Negative audio in signal Positive audio in signal Negative audio out signal. Positive audio out signal. Negative audio out signal. Positive audio out signal. Notes
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RH-37 System Module
Table 12: System connector interface description Pin # 1 2 3 Signal VCHAR GND ACI Charge ground Insertion & removal detection / Serial data bi-directional 1 kbit/s Notes
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4
Vout
Power supply for external accessories
5 6 FBUS_RX
Not used in RH-37 Serial data from accessory to phone / 115 kbit/s
7
FBUS_TX
Serial data from phone to accessory / 115 kbit/s
8 9
GND XMIC N
Data ground Negative audio in signal
10
XMIC P
Positive audio in signal
11 12 13 14
HSEAR N HSEAR RN HSEAR P HSEAR RP
Negative audio out signal. Double mono in RH-37 Positive audio out signal. Double mono in RH-37
ACI ACI (Accessory Control Interface) is a point-to-point, Master-Slave, bi-directional serial bus. ACI has two main features: ˇ The identification of accessory type is provided ˇ The insertion and removal detection of an accessory device ˇ FBUS FBUS is an asynchronous data bus having separate TX and RX signals. Default bit rate of the bus is 115.2 Kbit/s. FBUS is mainly used for controlling the phone in the interface to Page 38 ŠNokia Corporation Issue 1 07/04 Acting as a data bus, intended mainly for control purposes.
Nokia Customer Care PC via DKU-5. VOUT
RH-37 System Module
The VOUT pin delivers the power supply for PopPortTM accessories, which are using the ACI or FBUS. The voltage level is 2.78V / 70mA. DC plug NMP standard 2- or 3-wire chargers are compatible with the charger IF. The IF does not support 3-wire charging control. Nevertheless, it is potential possible to use a 3-wire charger without PWM charging support. RH-37 uses a 3mm DC plug besides the PopPortTM IF.
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RH-37 System Module
Nokia Customer Care
Component Placement Hints
When exchanging components, all components must be placed properly. There is an extra challenge when: ˇ ˇ Components are manually placed Lead free process is applicable (which is the case for all RH-37 devices)
Therefore, the following placement support and check possibilities have been implemented:
Figure 18: PWB overview
Power Switch
Helgo (RF-chip)
Gel Grip LEDs Camera Socket Battery Connector Hardware Accelerator
UEM
UPP Flash
Pop-port
SIM card reader
Power switch (S2419)
The power switch placement has a direct influence to the phone usability and failure rates. Improper placement can cause difficulties to switch the phone on / off or increase the switch's sensitivity when dropping the phone (peeling of the switch or its pads). For proper placement, the corner marks need to fit properly even after soldering to get
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RH-37 System Module
Guiding Pins Corner Marks
Helgo RF-chip (N7500)
There are also corner marks introduced in order to help checking the placement after rework. The placement shall be done with proper equipment. The corner marks indicate proper placement after the soldering process. If the component is not placed properly the re-work process must be repeated until the component fits properly.
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RH-37 System Module
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Camera socket (X1470)
There are also corner marks introduced in order to support placement and checking placement after rework process.
Hardware accelerator (D1470)
There are also corner marks introduced in order to enable checking placement after rework process.
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RH-37 System Module
UEM (D2800)
There are also corner marks introduced in order to help checking placement after rework process.
Flash (D3000)
There are some corner marks introduced.
SIM card reader (X2700)
There are some corner marks introduced.
System connector (X2002)
There are also some marks introduced (bars) in order to help placing the system connector and checking placement after rework. The placement bars need to be visible (they can be partly hidden by the connector), but the connector must equally hide them in order to be parallel to the PWB. In addition, the connectors must meet their pads properly as well.
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RH-37 System Module
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UEM (D2200)
There are also corner marks introduced in order to help checking placement after rework.
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RH-37 System Module
Battery connector (X2000)
There are also some corner marks introduced in order to support placement of the connector and checking placement after rework.
X-press on grip LED's (V2402, V2403, V2404, V2405, V2406, V2407)
When X-press on grip LED's are exchanged, it must be checked that they are installed within the PWB outline in order to avoid mechanical shocks from the X-press on grip mechanics. Therefore, they must not trespass the `golden line'. In the picture below, tweezers are used to make the distance to the PWB outline visible.
Tweezers as tool to check LED glass may not reach the ,golden line`
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RH-37 System Module
Nokia Customer Care
Label placement
Different countries require different labels. This guide explains where it is possible to place these labels. In the figure below, there are numbered shaded areas (1 - 5) where labels can be placed. On the right hand side there are numbers and labels. The numbers refer to the place where the label is allowed to be placed. The Taiwan-specific label is metalized and it is very critical to place it properly, so that the phone performance is not affected. For this reason it is allowed to place it on the named areas 2, 3 and 4, but not within the areas 1 and 5. The Chinese label, which is not metalized, has designated area 1.
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RH-37 System Module
RF Module Description
The RF module performs the necessary high frequency operations of the triple-band engine. Both the transmitter and receiver have been implemented by using a direct conversion architecture, which means that the modulator and demodulator operate on the channel frequency. No intermediate frequencies are used for up- or down-conversion. The core of the RF is an application-specific integrated circuit (RF ASIC), Helgo85. The other RF key components are: ˇ An EDGE capable power amplifier module, which includes two amplifier chains, one for the low band (GSM900) and the other for both high bands (GSM1800 and GSM1900). An antenna switch module, which contains filters and switches to combine the two TX-PA outputs and three Rx chain inputs to the antenna port. 26 MHz reference oscillator (VCTCXO). 3296-3980 MHz VCO. Three SAW filters for Rx band filtering. One SAW filter for the low band (GSM900) Tx path.
ˇ ˇ ˇ ˇ ˇ
The control information for the RF is coming from the baseband section of the engine through a serial bus, referred later on as RFBus. This serial bus is used to pass the information on the frequency band, mode of operation, and synthesizer channel for the RF. In addition, exact timing information and receiver gain settings are transferred through the RFBus. Physically, the bus is located between the baseband ASIC called UPP and the RF ASIC. Using the information obtained from UPP, the RF ASIC controls itself to the required mode of operation and further sends control signals to the antenna switch and the power amplifier modules. In addition to the RFBus, there are still other interface signals for the power control loop and VCTCXO control and for the modulated waveforms (IQ signals). The RF circuitry is located in two shielding chambers on one side of the 8 layer PWB containing the following key components: The Small Signal Chamber contains RF ASIC, reference oscillator (VCTCXO), VCO, and Rx/Tx SAW-filters (GSM900/GSM1800). The Large Signal Chamber contains the RF Power Amplifier, the Antenna Switch Module, and the Rx SAW-filter and LNA (GSM1900).
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General specifications of the transceiver
Parameter Cellular System Modulation schemes RX Frequency Band
Unit GSM900, GSM1800, GSM1900 GMSK, 8-PSK GSM900: 925 ... 960 MHz GSM1800: 1805 ... 1880 MHz GSM1900: 1930 ... 1990 MHz GSM900: 880 ... 915 MHz GSM1800: 1710 ... 1785 MHz GSM1900: 1850 ... 1910 MHz GSM900: +5 ... +33 dBm (3.2 mW ... 2 W) GSM1800: +0 ... +30 dBm (1.0 mW ... 1 W) GSM1900: +0 ... +30 dBm (1.0 mW ... 1 W) GSM900: +5 ... 27 dBm (3.2 mW ... 0.5 W) GSM1800: +0 ... 26 dBm (1.0 mW ... 0.4 W) GSM1900: +0 ... 26 dBm (1.0 mW ... 0.4 W) GSM 900: 45 MHz GSM 1800: 95 MHz GSM 1900: 80 MHz GSM 900: 174 GSM 1800: 374 GSM1900: 299 200 kHz (each band) GSM 900: 15 GSM 1800: 16 GSM 1900: 16 GSM 900: 12 GSM 1800: 14 GSM 1900: 14 GSM 900: -102 dBm GSM 1800: -102 dBm GSM 1900: -102 dBm < 0.1 ppm < 5.0 ° < 20.0 °
TX Frequency Band
Output Power GMSK
Output Power 8-PSK
Duplex Spacing
Number of RF Channels
Channel Spacing Number of TX Power Levels GMSK Number of TX Power Levels 8-PSK Sensitivity, static channel (+25°C) Frequency Error, static channel RMS Phase Error Peak Phase Error
Frequency concept
The RF frequency plan is shown below. The VCO operates at the channel frequency multiplied by two or four depending on the frequency band of operation. This means that the modulated signals from baseband are directly converted up to the transmission frequency and the received RF signals directly down to the baseband frequency.
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Figure 19: RF frequency plan
Helgo GSM900: 925-960 MHz
RH-37 System Module
I-signal Q-signal RX
GSM1800: 1805-1880 MHz GSM1900: 1930-1990 MHz
f/4 f f
f/2 32963980 MHz
f f/4 f/2
f PLL
AFC GSM1800: 1710-1785 MHz GSM1900: 1850-1910 MHz Buffer 26 MHz VCTCXO VCTCXO 26 MHz I-signal Q-signal TX
GSM850: 824-849 MHz GSM900: 880-915 MHz
RF power supply configuration
All power supplies for the RF unit are generated in the UEM ASIC, which contains among other functions six pieces of 2.78 V linear regulators (VR2 ... VR7), a 4.8 V switching regulator (VR1) and two 1.35V voltage references (VrefRF01 and VrefRF02). The regulators are connected to the RF ASIC, except for VR7, which supplies the VCO. The 4.8V supply is required for the charge pump of the PLL to generate the tuning voltage for the VCO. The reference voltages are used as bias reference for the RF ASIC for the RX ADC (analog-to-digital converter) reference. All RF supplies can be checked either in Small Signal Chamber or in BB Chamber. The used power supply configuration is shown in the block diagram below. Values of voltages are given as nominal outputs of UEM. Currents are typical values.
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RH-37 System Module
Figure 20: RF power distribution diagram
UEM
4.75 V [ 4.6V ... 4.9V ]
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VR1
2.78 V [ 2.70V ... 2.86V ]
charge pump (VCP) Tx modulator (Vcc_ModOut)
TX buffer & EDGE ALCs (VRF_TX)
2.78 V [ 2.70V ... 2.86V ]
VR2
VR3
VCTCXO (+VCC) digital interface (VDIG)
2.78 V [ 2.70V ... 2.86V ]
VR4
Rx Front End (VRF_RX) Bias & Rx CH filters (VF_RX) RF controls (VPAB_VLNA)
2.78 V [ 2.70V ... 2.86V ]
VR5
PLL prescaler (VPRE) phasing dividers of Rx (VLO)
VR6 VR7 VrefRF01 V refRF02
2.78 V
[ 2.70V ... 2.86V ]
BB buffer (VDIG)
2.78 V [ 2.70V ... 2.86V ]
16 mA [max. 20 mA] 1.35 V [ 1.32V ... 1.38V ]
VCO (VCC_VCO)
100 uA 1.35 V [ 1.32V ... 1.38V ]
bias reference (VB_EXT) bias reference (RXIINN, RXQINN)
100 uA
VBAT
3.7 V
[ 2.95V ... 4.7V ]
Triple band PA
RF block diagram
RF block diagram consists of: ˇ ˇ ˇ ˇ Antenna switch module Power amplifier module RF ASIC VCTCXO module
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Figure 21: RF block diagram
RH-37 System Module
1900 Rx Balun
VLNA
VRF_RX RXIP
RF Front-end Module
SAW LNAB_P LNA_P
HB BP
1800 Rx RXQP
LC LB LP
SAW VF_RX INTEGRATED VBB
LC ESD 900 Rx
LOW-PASS FILTERS AND AGC FUNCTION BUILT-IN DC COMP. FILTER SAW EGSM VR6 VR5 1900 Tx 900 Tx VR4 LC LC VBB VLO VPRE VRF_RX VF_RX VPAB_VLNA CTRL inputs VR3 VR2 VR1 VDIG VRF_TX VCP VBB Divide 2.7V 10mA GPIO by 2/4 Balun 2 dB Att VCO Module RESET Bi-directional VRF_TX,VBB,VLO,VTX Pull-up VBAT Network Digital AGC VDIG TXIP Analog AGC 800/900 Det. internal matching 3dB att SAW EGSM Analog AGC 1800/1900 Det. internal matching 3dB att Balun VDIG VR3 900 Tx TXQP TXQM Digital AGC TXIM Serial Interface SLE SCLK SDATA VLO VR7 PLL VPRE,VDIG,VCP temp sensor RFTEMP VDIG
Edge capable PA Module
Digital AGC Vmode 1800/1900 Iref Iref 850/900 1800/1900 Vtxb Vtxb 850/900 Digital AGC VCTCXO Module
Vdetect 1800/1900 Vdetect 850/900 Vpctrl 1800/1900 Vpctrl 850/900
AFC D/A
Divide by two 1k2
REFCLK
s7 s3
TXA
2.7V 10/40mA GPIO VPAB,VBB
8-PSK Feed-back
TXP
s6
PCTRL enable
TXC
s1
detector feedback network GMSK Feed-back
s5 s2
VDIG VB_ext bias gen RB_ext R_ref
V_ref_RF01
Helgo
VBB, GND_BB
Helgo
PA Detect PA ID Iref 850/900 Iref 1800/1900 MODE
A detailed functional description is given in the following sections.
Antenna switch (TX/RX switch)
The antenna switch operates as a diplexer for the RX and TX signals. The antenna switch is controlled by the RF ASIC using the control signals VANT1, VANT2 and VANT3. The table below shows the possible different switching states.
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VANT_2 VC1 [Volt] 0 0 0 0 2.6
VANT_3 VC2 [Volt] 0 0 2.6 2.6 2.6
VANT_1 VC3 [Volt] 0 0 2.6 0 0
Rx1 GSM
900
Rx2 GSM
1800
Rx3 GSM
1900
Tx1 GSM
900
Tx2 GSM
1800/1900
Rx X
Rx
Rx
Tx
Tx
X X X X
To switch the TX-GSM 1800/1900 path both signals VANT2 and VANT3 have to be activated. Receiver Each receiver path is a direct conversion linear receiver. From the antenna, the received RF signal is fed to the antenna switch module where a diplexer first divides the signal to two separate paths for the low band and the two high bands. Then the paths are passing the Rx/Tx switches and the high band signal passes an additional GSM1800/1900 switch. As output of the module three separate Rx connections are available. These signals are fed to the SAW band filters, which let only the frequencies of the wanted band pass on to the low noise amplifiers. The GSM1900 LNA is an external component, the other two LNAs are integrated in the RF ASIC. The received signal is down converted in the demodulator mixers and amplified in the AGC gain stage to an appropriate baseband level and passed on as I and Q signal to the A/D converter in UEM for further digital signal processing. Transmitter The transmitter consists of two final frequency IQ-modulators and a power amplifier module with separate paths for the lower band and the upper bands, and a power control loop. The IQ-modulators are integrated in the RF ASIC, as well as the operational amplifiers of the power control loop. The power amplifier module contains power detectors. In GMSK mode, the power is controlled by adjusting the DC bias levels of the power amplifiers. In EDGE mode, the power is controlled by adjusting ALC in Helgo RFIC. Frequency synthesizer One PLL synthesizer generates all the required frequencies of the three bands for Rx and Tx operation. The VCO frequency is divided by 2 or by 4 in the RF ASIC depending on the active band. This allows the generation of all the frequencies in the GSM900, GSM1800 and GSM1900 bands, both RX and TX range. The frequency synthesizer is integrated in ŠNokia Corporation
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RH-37 System Module
The VCTCXO (Voltage Controlled Temperature Compensated Crystal Oscillator) generates the clock frequency of 26 MHz. This frequency is buffered in the RF ASIC and fed to the UPP. Additionally, it is used as the reference frequency for the RF PLL. The frequency of the VCTCXO is locked into the frequency of the base station with the help of an AFC voltage which is generated in the UEM by an 11 bit D/A converter. The PLL (phase locked loop) locks the VCO frequency into a stable frequency source, given by the VCTCXO. The PLL is located in the RF ASIC and is controlled through the RFBus. The loop filter generates a DC control voltage for the VCO from the charge pump pulses of the phase detector. The loop filter determines the step response of the PLL (settling time) and contributes to the stability of the loop.
Signal paths
Receiver signal paths
1900 Rx Balun SAW LNAB_P LNA_P
VLNA
VRF_RX RXIP
HB BP
1800 Rx RXQP
LC LB LP
SAW VF_RX INTEGRATED VBB
LC ESD 900 Rx
LOW-PASS FILTERS AND AGC FUNCTION BUILT-IN DC COMP. FILTER SAW Bi-directional VR6 VR5 1900 Tx 900 Tx VR4 LC LC VBB VLO