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Table Of Contents
1. INTRODUCTION...................................5
1.1 Purpose ................................................ 5 1.2 Regulatory Information .......................... 5 1.3 Abbreviations ......................................... 7
4. TROUBLE SHOOTING ................... 56
4.1 RF Components ................................. 56 4.2 Rx Trouble .......................................... 57 4.3 Tx Trouble .......................................... 65 4.4 Power On Trouble .............................. 77 4.5 Charging Trouble ............................... 79
2. PERFORMANCE ..................................9
2.1 H/W Features ..........................................9 2.2 Technical Specification .......................... 10
4.6 LCD Trouble ....................................... 81 4.7 Receiver Trouble ................................ 82 4.8 Speaker Trouble ................................. 84 4.9 Mic. Trouble ....................................... 87 4.10 Vibrator Trouble ............................... 90 4.11 Key Backlight LED Trouble .............. 92 4.12 SIM Detect Trouble .......................... 94 4.13 Earphone Trouble ............................ 96 4.14 HFK Trouble ...................................... 101
3. TECHNICAL BRIEF ............................15
3.1 Transceiver ......................................15 3.2 Power Amplifier Module .........................20 3.3 13MHz Clock ...................................21 3.4 Power Supplies for RF Circuits ............. 21 3.5 Testing Set-up and Checking Signals..... 22 3.6 Digital Main Processor ........................ 35 3.7 Analog Main Processor .......................... 40 3.8 Power Management .............................. 45 3.9 Memories ...........................................47 3.10 Display and Interface ........................... 47 . 3.11 Keypad Switches and Scanning ........ . 48 3.12 Microphone ........................................ . 49 3.13 Earpiece ............................................ 50 3.14 Hands free / Headset Interface ........... 50 3.15 Key Back-light Illumination ................... 52 3.16 LCD Back-light Illumination ...............53 3.17 Speaker & MIDI IC .............................. 54
5. DISASSEMBLY INSTRUCTION .... 105
5.1 Disassembly ....................................... 105
6. SOFTWARE DOWNLOAD ............. 108
6.1 Download Setup ................................. 108 6.2 Download Procedure ............................ 109
7. BLOCK DIAGRAM ........................... 114
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8. CIRCUIT DIAGRAM ......................... 115
8.1 Main Chipset and Memory ................... 115 8.2 Audio Part ........................................ 116 8.3 PMIC, LCD and I/O Connector ............. 117 8.4 RF Part ................................................ 118
13. EXPLODED VIEW & REPLACEMENT PART LIST ....... 137
13.1 Exploded View ................................. 137 13.2 Accessory ....................................... 139 13.3 Replacement Parts < Mechanic component > ................. 140 Replacement Parts
9. PCB LAYOUT .................................. 119
9.1 Rear Part ......................................... 119 9.2 Front Part ........................................ 120
< Main component > ...................... 142
10. ENGINEERING MODE .................. 121
10.1 BB Test [MENU 1] ........................... 121 10.2 RF Test [MENU 2] ........................... 123 10.3 MF Mode [MENU 3] ......................... 123 10.4 Trace option [MENU 4] .................... 124 10.5 Call Timer [MENU 5] ........................124 10.6 Fact. Reset [MENU 6] ......................124 10.7 S/W version [MENU 7] .....................124
11. STAND ALONE TEST ................... 125
11.1 What's the Standalone Test? ...........125 11.2 Standalone Test Equipment Setup... 126 11.3 H/W Test .........................................127 11.4 Tx Stand alone Test Setting .............. 128 11.5 Rx Stand alone Test Setting .............. 130
12. AUTO CALIBRATION ................... 132
12.1 Overview .......................................... 132 12.2 Equipment List ..................................132 12.3 Equipment Setup ............................... 133 12.4 AGC for RX .................................. 134 12.5 APC for TX ................................... 134 12.7 How to do calibration ....................... 135 -4-
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of G3100.
1.2 Regulatory Information
A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company's employees, agents, subcontractors, or person working on your company's behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that are resulted from such unauthorized use. B. Incidence of Harm If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done. C. Changes in Service A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service. D. Maintenance Limitations Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
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1. INTRODUCTION
E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F. Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G. Interference and Attenuation Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems. H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling: sign.
· Service personnel should ground themselves by using a wrist strap when exchange system boards. · When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. · Use a suitable, grounded soldering iron. · Keep sensitive parts in these protective packages until these are used. · When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC BB BER CC-CV DAC DCS dBm DSP ESD FPCB GMSK GPIB GSM IPUI IF LCD LDO LED OPLL
Automatic Power Control Baseband Bit Error Rate Constant Current Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing Electrostatic Discharge Flexible Printed Circuit Board Gaussian Minimum Shift Keying General Purpose Interface Bus Global System for Mobile Communications International Portable User Identity Intermediate Frequency Liquid Crystal Display Low Drop Output Light Emitting Diode Offset Phase Locked Loop
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1. INTRODUCTION
PAM PCB PGA PLL PSTN RF RLR RMS RTC SAW SIM SLR SRAM PSRAM STMR TA TDD TDMA UART VCO VCTCXO WAP
Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating Static Random Access Memory Pseudo SRAM Side Tone Masking Rating Travel Adapter Time Division Duplex Time Division Multiple Access Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol
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2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Features
Item
Standard Battery
Feature
Li-ion, 850 mAh Size: 42.08 × 66.65 × 9.3mm Weight: 29.32g Under the minimum current consumption environment (such as paging period 9), the level of standby current is below 4mA. Up to 3hours (GSM TX Level 7) Up to 200hours (Paging Period: 9, RSSI: -85 dBm) 3hours GSM, EGSM: -105dBm, DCS: -105dBm GSM, EGSM: 32dBm(Level 5), DCS: 29dBm(Level 0) Class 10 3V Small 128 × 96 pixel 65K Color Hard icons. Key Pad; 0 ~ 9, #, *, Up/Down Navigation Key Confirm Key, Clear Key, Back Key, Send Key, END/PWR Key Internal Yes Yes EFR/FR/HR Yes Yes Yes Yes Yes Yes Yes Hands-free kit, CLA, Data Kit -9-
Comment
Stand by Current Talk time Stand by time Charging time RX Sensitivity TX output power GPRS compatibility SIM card type Display
Status Indicator
ANT EAR Phone Jack PC Synchronization Speech coding Data and Fax Vibrator Loud Speaker Voice Recoding C-Mike Receiver Travel Adapter Options
2. PERFORMANCE
2.2 Technical Specification
Item Description Specification
GSM TX: 890 + n × 0.2 MHz RX: 935 + n × 0.2 MHz (n=1~124) EGSM TX: 890 + (n-1024) × 0.2 MHz RX: 935 + (n-1024) × 0.2 MHz (n=975~1024) DCS TX: 1710 + (n-512) × 0.2 MHz RX: 1805 + (n-512) × 0.2 MHz (n=512~885) RMS < 5 degrees Peak < 20 degrees < 0.1 ppm GSM, EGSM Level 5 6 7 8 9 10 11 4 Power Level 12 DCS Level 0 1 2 3 4 5 6 7 - 10 Power 30dBm 28dBm 26dBm 24dBm 22dBm 20dBm 18dBm 16dBm Toler. ±2dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB Level 8 9 10 11 12 13 14 15 Power 14dBm 12dBm 10dBm 8dBm 6dBm 4dBm 2dBm 0dBm Toler. ± 3dB ± 4dB ± 4dB ± 4dB ± 4dB ± 4dB ± 5dB ± 5dB Power 33dBm 31dBm 29dBm 27dBm 25dBm 23dBm 21dBm 19dBm Toler. ±2dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB ±3dB Level 13 14 15 16 17 18 19 Power 17dBm 15dBm 13dBm 11dBm 9dBm 7dBm 5dBm Toler. ± 3dB ± 3dB ± 3dB ± 5dB ± 5dB ± 5dB ± 5dB
1
Frequency Band
2 3
Phase Error Frequency Error
2. PERFORMANCE
Item
Description
GSM, EGSM
Specification
Offset from Carrier (kHz). 100 200 250 400 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 5 Output RF Spectrum (due to modulation) 6,000 DCS Offset from Carrier (kHz). 100 200 250 400 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000 GSM, EGSM Offset from Carrier (kHz). 6 Output RF Spectrum (due to switching transient) 400 600 1,200 1,800
Max. dBc +0.5 -30 -33 -60 -60 -60 -63 -65 -71
Max. dBc +0.5 -30 -33 -60 -60 -60 -65 -65 -73
Max. dBm -19 -21 -21 -24
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2. PERFORMANCE
Item
Description
GSM
Specification
Offset from Carrier (kHz). 6 Output RF Spectrum (due to switching transient) 400 600 1,200 1,800 7 Spurious Emissions Conduction, Radiation GSM, EGSM BER (Class II) < 2.439% @-102 dBm DCS BER (Class II) < 2.439% @-100 dBm ±3 dB 8±3 dB Frequency (Hz) 100 200 300 11 Sending Response 1,000 2,000 3,000 3,400 4,000 12 RLR 2±3 dB Max.(dB) -12 0 0 0 4 4 4 0
Max. dBm -22 -24 -24 -27
8
Bit Error Rate
9 10
RX Level Report Accuracy SLR
Min.(dB) -12 -6 -6 -6 -9 -
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2. PERFORMANCE
Item
Description
Frequency (Hz) 100 200 300 500
Specification
Max.(dB) -12 0 2 * 0 2 2 2 Min.(dB) -7 -5 -5 -5 -10
13
Receiving Response
1,000 3,000 3,400 4,000
* Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range. 14 15 STMR Stability Margin 13±5 dB > 6 dB dB to ARL (dB) -35 -30 -20 16 Distortion -10 0 7 10 17 18 19 Side Tone Distortion System frequency (13 MHz) tolerance 32.768KHz tolerance Three stage distortion < 10% 2.5 ppm 30 ppm At least 80 dB under below conditions: 1. Ringer set as ringer. 2. Test distance set as 50 cm Level Ratio (dB) 17.5 22.5 30.7 33.3 33.7 31.7 25.5
20
Ringer Volume
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2. PERFORMANCE
Item
21
Description
Charge Current
Specification
CC Charge : < 500 mA Trickle Charge : < 60 mA Antenna Bar Number 5 4 Power -85 dBm ~ -90 dBm ~ -86 dBm -95 dBm ~ -91 dBm -100 dBm ~ -96 dBm -105 dBm ~ -101 dBm ~ -105 dBm Voltage ~ 3.62 V 3.62 ~ 3.73 V 3.73 ~ 3.82 V 3.82 V ~
22
Antenna Display
3 2 1 0 Battery Bar Number 0
23
Battery Indicator
1 2 3 3.5 ± 0.03V (Standby)
24
Low Voltage Warning
3.62 ± 0.03V (Call)
25
Forced shut down Voltage
3.35 ± 0.03V
26
Battery Type
1 Li-ion Battery Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 850mAh
27
Travel Charger
Switching-mode charger Input: 100 ~ 240 V, 50/60 Hz Output: 5.2 V, 800 mA
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Transceiver (CX74017, U401)
The RF parts consists of a transmitter part,a receiver part,a synthesizer part,a voltage supply part,a VCTCXO part. And the main RF Chipset CX74017[U401]is a single-chip dual-band transceiver for the extended global system for mobile communication[E-GSM900MHz]/ Digital communication system[DCS1800MHz] voice and data transfer applications. This device integrated a direct conversion receiver architecture, which eliminates the need of Intermediate Frequency, a transmitter based on a modulation loop architecture and fractional-N synthesizer part with built in TXVCO and Local-VCO.
(1) Receiver Part
The Receiver part in CX74017 contains all active circuits completely, full receiver chain with the exception of discrete front-end RF SAW filters. The filtered and amplified signal is down converted in the RF-mixer to the baseband output. The receiver path is supported by internal channel filtering. The RF front-end circuit is shown Fig. 3-1.
PCS : 1805 ~ 1880MHz FAR-G6CS-1G8425-L257
0
CX74017
90
4/3
RXIP RXIN
DCS : 1805 ~ 1880MHz
Base Band Block
GSM : 925 ~ 960MHz
RXQP RXQN 0 90
2/3
f vco
GSMSEL DCSSEL
ANT S/W
LMSP54AA-097
Figure. 3-1 Receiver Block diagram
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3. TECHNICAL BRIEF
A. RF Front End
RF front end consists of Antenna Switch(FL401), dual band LNAs integrated in transceiver(U401). The Received RF signals (GSM 925MHz 960MHz, DCS 1805MHz 1880MHz) are fed into the antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile switch. The Antenna Switch (FL401) is used to control the Rx and TX paths. And, the input signals VC1 and VC2 of a FL401 are connected to DCSSEL(GPO_9) and GSMSEL(GPO_11) ports of U101 to switch either TX or RX path on. When the RX path is turned on, the received RF signal then feeds either Rx _900_RF or RX_1800_RF path controlled by GSM-RX and DCS-RX respectively. This Rx_900_RF path contains one SAW filter, followed after the Antenna Switch (FL401), to filter any unwanted signal apart from the DCS RX band. And, the RX_1800_RF path is the same case. The logic and current for Antenna Switch is given below Table 3-1. Table 3-1 The logic and current
VC1 GSM TX DCS TX GSM/DCS RX 0V 2.7 V 0V
VC2 2.7 V 0V 0V
Current 10.0 mA max 10.0 mA max <0.1 mA
These two paths are then connected to the LNAGSMIN (#11) and LNADCSIN (#13) of CX74017 (U401), respectively. A low-noise bipolar RF amplifier, contained within the U401, amplifies the RF signal. The RF signals from the front-end pass to the receiver mixers within the U401 device.
B. Demodulator and baseband processing
In direct conversion receiver there is only one mixer that is down-converting received RF signal to BB signal directly. The gain of the mixer is 40dB at high gain mode and 22dB at low gain mode. The Rx gain setting is done in the AGC algorithm. The nominal gain of the receiver is set as a function of the expected signal strength at the antenna input so that a desired level is reached at the Rx I/Q. 7 blocks in the receiver chain have variable gains, LNA, Mixer, LPF1, VGA1, gmC Filter, Auxiliary gain control and VGA2. The gain settings can be adjustable via 3-wire bus control lines. The baseband signals pass via integrated low-pass filters to the baseband A/D converters. The remainder of the channel filtering is performed by the baseband chipset. The demodulator contains switches to maintain the sense of the baseband I/Q outputs with respect to the incoming RF signal on both GSM900 and DCS1800.
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3. TECHNICAL BRIEF
C. DC offset compensation
Three correction loops ensure that DC offsets, generated in the CX74017, do not overload the baseband chain at any point. After compensation, the correction voltages are held on capacitors for the duration of the receive slot(s). A rising edge on the RXEN signal, selected via the serial interface, placed the DC compensation circuitry in the track mode.
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3. TECHNICAL BRIEF
(2) Transmitter Part
The Transmitter part contains CX74017 active parts, power amplifier module (PAM) and antenna switch. The CX74017 active part consists of a vector modulator and offset phase-locked loop block (OPLL) including down-converter, phase detector, loop filter and dual band transmit VCO which can operate at either final RF output frequency. The RF GMSK outputs from the transmit VCO are fed directly to the RF power amplifiers.
ANT S/W
LMSP54AA-097
GSMSEL DCSSEL
f vco
/3 X2
CX74017
DCS GSM
f LO
X2
f TX
f IF
PAM(RF3110)
/D1
Base Band Block
TXIP TXIN 0 90 TXQP TXQN
GSM : 880 ~ 925MHz
LF
PFD /D2
DCS : 1710 ~ 1785MHz
TXRAMP TXPA BANDSEL1
TXVCO
Fig.3-2 Transmitter Block diagram
A. IF Modulator The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted sideband rejection and produces a GMSK modulated signal. The baseband software is able to cancel out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A converters. The TX-Modulator implements a quadrature modulator. The IF-frequency input signal is split into two precise orthogonal carriers, which are multiplied by the baseband modulation signal IT/ITX and QT/QTX. It is used as reference signal for the OPLL.
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3. TECHNICAL BRIEF
B. OPLL
The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating signal. The IF signal goes via external passive bandpass filter to one port of the phase detector. The other side of the phase detector input is LO signal. The phase detector generates an error current proportional to the phase difference between the modulated signal from the offset mixer and the reference signal from the LO. The error current is filtered by a second order low-pass filter to generate an output voltage which depends on the GMSK modulation and the desired channel frequency. This voltage controls the transmit VCO such that the VCO output signal, centered on the correct RF channel, is frequency modulated with the original GMSK data. The OPLL acts as a tracking narrowband band pass filter tuned to the desired channel frequency. This reduces the wideband noise floor of the modulation and up-conversion process and provides significant filtering of spurious products.
(3) Synthesizer Part
The CX74017 includes a fully integrated UHF VCO with an on-chip LC tank. A single sigma-delta fractional-N synthesizer can phase lock the local oscillator used in both transmit and receive path to a precision frequency reference input. Fractional-N operation offers low phase noise and fast setting times, allowing for multiple slot applications such as GPRS. The generated frequency is given by the following equation.
f VCO
where :
FN N + 3.5 + 22 f ref 2 = R
f VCO = Generated VCO frequency
N = N-divider ratio integer part FN = Fractional setting R = R-divider ratio f VCO = Reference Frequency
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3. TECHNICAL BRIEF
The counter and mode settings of the synthesizer are also programmed via 3-wire interface.
4/3 DCS
2/3 GSM
CX74017
2V7_VTCXO 13MHz
f vco = (N+3.5+FN/2^22)f ref/R f vco
LF Fractional-N PLL
f ref
/R
13MHz
AFC
REFCLK
Base Band Block
/3 X2 DCS GSM
f LO
Figure 3-3. Synthesizer Block diagram.
3.2 Power Amplifier Module
The RF3110[U402] is a dual band amplifier module for E-GSM(880 to 915MHz) and DCS1800(1710 to 1785MHz). The efficiency of the module is 50% at nominal output power for E-GSM and 45% for DCS1800. This module should be operated under the GSM burst pulse. To avoid permanent degradation, CW operation should not be applied. To avoid the oscillation at no input power, before the input is cut off, the control voltage Vapc should be control to less than 0.5V. In order to improve thermal resistance, the through holes should be layouted as many as possible on PCB under the module. And to get good stability, all the GND terminals should be soldered to ground plane of PCB.
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3. TECHNICAL BRIEF
3.3 13 MHz Clock
A VCTCXO (Voltage Controlled Temperature Compensated Crystal Oscillator, X401) is used as a clock and oscillates at a frequency of 13MHz. The output of the clock is fed to the CX74017 RF Main Chip, analog baseband chipset (AD6521, U102), and digital baseband chipset (AD6522, U101)
Figure 3-4. VCTCXO Circuit.
3.4 Power Supplies for RF Circuits
Two regulators are used for RF circuits. One is ADP3330 (U404), the other is one port of ADP3408 (U301). ADP3330 (U404) supplies power to all the RF circuits except the VCTCXO(X401) that is supplied power from ADP3408. Regulator Regulator 1(U301,2V7_VTCXO) Regulator 2 (U404,RF2V8) Voltage 2.7V± 0.5V 2.85V± 0.5V Powers VCTCXO RF circuitry VSYNTHEN Enable Signal
Figure 3-5. Regulator Circuit..
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3. TECHNICAL BRIEF
3.5 Testing Set-up and Checking Signals
A. Received RF Power Level and Checks This section shows the typical RF power levels expected throughout the receiver path. A block diagram shows the locations of the RF measurement points and levels as shown in Fig. 3-11. Receiver Testing Set-up To check the receiver the test equipment should be set as the following conditions: On a signal generator or a GSM/DCS test box, output amplitude of CW sugnal = -60 dBm at either: 947.4 MHz (CH62) when testing the GSM RX path or 1842.6 MHz (CH699) when testing the DCS RX path. Set the DC power supply to 4.0 V. Note: All RF values shown are only intended as a guide figure and may differ from readings taken with other test equipment and leads. Lead and connector losses should always be taken into account when performing such RF measurements. Testing Receiver Measure the RF power levels of the points which is shown in Fig. 3-9. If there are any major difference between your measurement results and the values shown in the figure, then further investigation about the particular point will be required. It will also be necessary to ensure that all the following power supplies and signals which control this part of the receiver circuit are present : 1. The Control Signal of FEM (see Fig. 3-15, 16, 17) 2. RF2V8 (see Fig. 3-12) 3. 2V7_VTCXO (see Fig. 3-13) 4. 13MHz (see Fig. 3-14) 5. PLL_CLK, PLL_DATA, PLL_LE (see Fig. 3-18) 8. RX IP, IN, QP, QN (see Fig. 3-21)
B. Transmitted RF Power Level and Checks This section shows the typical RF power levels expected throughout the transmitter path. A block diagram shows the locations of the RF measurement points and levels as shown in Fig. 3-8. Transmitter Testing Set-up To check the transmitter the test equipment should be set as the following conditions: 1. Set the DC Power supply to 4.0 V. 2. Power up the GSM/DCS test set and then establishing a call with an attached mobile on active mode. 3. Select Channel, TX Level and Input Level according to which parameter is required. Note: All RF values shown are only intended as a guide figure and may differ from readings taken with other test equipment and leads. Lead and connector losses should be always taken into account during the measurement.
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3. TECHNICAL BRIEF
Testing Transmitter
Measure the RF power level of the points which are shown in Fig 3-9. If there are any major difference between your measurement results and the values shown in the figure then further investigation of that particular point will be required. It will also be necessary to ensure that all the following power supplies and signals which control this part of the transmitter circuit are present:
1. The Control Signal of FEM (see Fig. 3-15, 16, 17) 2. RF2V8 (see Fig. 3-12) 3. 2V7_VTCXO (see Fig. 3-13) 4. 13 MHz (see Fig. 3-14) 5. TXEN, TXRAMP, TXPA (see Fig. 3-19) 6. TX IP, IN, QP, QN (see Fig. 3-20)
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3. TECHNICAL BRIEF
RF components (Component Side)
CN401 Mobile S/W FL402 Dual Saw Filter
FL401 Ant. S/W
U401 RF Main Chipset
U402 Power Amp Module
U404 LDO X401 VCTCXO
U403 Inverter IC
Figure 3-6. RF components (Component Side).
Reference U401 CN401 FL401 U402
Description RF Main Chipset Mobile S/W Ant. S/W PAM
Reference FL402 X401 U404 U403
Description Dual SAW Filter VCTCXO LDO Inverter IC
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3. TECHNICAL BRIEF
Test point of Rx Power Levels
Figure 3-7. Test point of Rx Power Levels. (Refer to Figure 3-9)
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3. TECHNICAL BRIEF
Test point of Rx Power Levels
Figure 3-8. Test point of Rx Power Levels. (Refer to Figure 3-9)
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CX74017
3
0 90
-61 dBm
4/3 RXIP RXIN
-64.5 dBm
1
Dual Saw Filter L257
2 4
0 90
RXQP RXQN 2/3 2V7_VTCXO
DCS 1805~1880MHz -64 dBm f vco = (N+3.5+FN/2^22) f ref/R f vco
/R LF Fractional-N PLL
-61 dBm GSM 925 ~ 960MHz f ref
13MHz
13MHz
AFC REFCLK
-60 dBm
Figure 3-9. Transmitter & Receiver RF Levels
Serial I/O
/3 X2 Serial I/O DCS PLL_DATA PLL_CLK PLL_LE
- 27 f LO
X2 GSM
ANT S/W
GSMSEL DCSSEL TXPA
LMSP54AA-097
PLL_PD RXEN TXEN FEENA
Base Band Block
8 dBm PAM(RF3110) 7
Attanuator LF PFD
10 dBm f TX
f IF
BANDSEL1 BANDSEL2
32 dBm 5
34 dBm
/D1 TXIP TXIN /D2
0 90
10
9
GSM : 880~925MHz 8 6
TXVCO TXEN TXRAMP Attanuator
DCS : 1710 ~ 1785MHz
TXQP TXQN
RF2.85V RF2.85V
6 dBm 8 dBm
ADP3330_2V85
OUT Vin
VBAT TEMPSENSE
/SD
3. TECHNICAL BRIEF
VSYNTHEN
3. TECHNICAL BRIEF
Control signal test points (1)
VC2
VC1
TX_RAMP RF2.85V TX_PA
13MHz Clock VCTCXO2.7V
TXIQ
RXIQ
PLL_LE
Figure 3-10. Control signal test points (1). (Refer to Figure 3-12~21)
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3. TECHNICAL BRIEF
Control signal test points (2)
PLL_CLK
PLL_DATA
TX_EN
RX_EN
Figure 3-11. Control signal test points (2). (Refer to Figure 3-18)
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3. TECHNICAL BRIEF
2.85V 2.85V
Figure 3-12. Regulator Output (RF2V85)
Figure 3-13. VCTCXO Power Supply (2V7_VTCXO).
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3. TECHNICAL BRIEF
Figure 3-14. 13MHz Clock.
VC1=0V
VC2=0V
Figure 3-15. Control Signal (VC1,VC2) in Rx mode (GSM, DCS both).
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3. TECHNICAL BRIEF
VC1
VC2
Figure 3-16. Control Signal (VC1,VC2) in DCS TX mode.
VC1
VC2
Figure 3-17. Control Signal (VC1,VC2) in GSM TX mode.
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3. TECHNICAL BRIEF
PLL_LE
PLL_CLK
PLL_DATA
Figure 3-18. PLL_LE, PLL_CLK, PLL_DATA.
TX_EN
TX_RAMP
TX_PA
Figure 3-19. TX_EN, TX_RAMP, TX_PA.
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3. TECHNICAL BRIEF
Figure 3-20. TX IQ Signal.
Figure 3-21. RX IQ Signal.
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3. TECHNICAL BRIEF
3.6 Digital Main Processor
The AD6522 is an digital processor made by ADI.
AD6522
DSP
Subsystem DSP BUS PBUS EBUS
AD6521 (VBC)
DMA and BUS ARBITRATION
SBUS
Peripheral
Subsystem
MCU
Subsystem (ARM7TDMI)
SRAM
FLASH
RF-Control MMI USC
Figure 3-22. Top level block diagram of the AD6522 internal architecture. BUS Arbitration Subsystem · It is to work as a cross point for data accesses between the three main buses. · EBUS is for external accesses, primarily from Flash memory for code and data. · RBUS is for internal RAM access. · PBUS is for access to internal peripheral modules such as UART, RTC or SIM. · In addition to the three main system buses, it has SBUS, IOBUS and DMABUS.
DSP subsystem · It consists of ADI DSP, Viterbi coprocessor, ciphering unit and a cache memory/controller system. · The DSP can run at a maximum clock frequency of 78MHz at 2.45V. · The Viterbi and ciphering accelerators enable a very efficient implementation of the channel equalization, encryption and decryption tasks.
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3. TECHNICAL BRIEF
MCU subsystem · It consists of an ARM7TDMI central processing unit, a boot ROM, a clock generation and access control module. · The maximum clock frequency for the ARM7TDMI is 39MHz at 2.45V. · The main clock is 13MHz and it is provided by VCTCXO. The Clock & BS(Bus Select) generator make internal clock by multiplying the main clock by 1X, 1.5X, 2X and 3X. · The boot ROM contains MCU code for basic communication between the ARM and one of the serial ports in the Universal System Connector subsystem.
Peripheral subsystem · It contains four major groups of elements. · The MMI group is a collection of all the functionality that are needed to implement a complete user interface including keyboard, display, backlight, RTC, general purpose I/O etc. · House Keeping group consists of three different sub-modules: The Watch Dog Timer, the Interrupt Controller, and the general timers. · GSM system group consists of the time base generation together with the synthesizer interface, which form the radio control. · Direct Memory Access is located between the three system buses (PBUS, RBUS and EBUS) and can move any data from any address location on one system bus to any address location on another system bus.
- 36 -
3. TECHNICAL BRIEF
AD6522 GSM-PROCESSOR KEYPAD Matrix Backlight Service light
KEYPADCOL[4:0] KEYPADROW[4:0] JTAGEN TCK.TMS TDI.TDO BACKLIGHT0 BACKLIGHT1 JTAGE.HSL.GPIO USCTX/RX/CLK U Generic Serial port A S C Generic Serial port B Generic Serial port D PWRON VDDRTC RESET OSCIN
JTAG
FLASH 16bit SRAM 8 or 16bit (optional)
ROMCS ADD[23:0] DATA[15:0] ROMCS RD WR HWR/UBS
Universal System Connector (USC)
Power Sub-system
DISPLAY (parallel or serial)
LWR/LBS DISPLAYCS LCDCTL Generic Serial Port C
OSCOUT VDDIO VDDCORE GNDIO GNDCORE
Accessory Devices e.g. Battery
GPCS0 GPCS1 Generic Serial Port D-A Generic Serial Port D-B GPIO[] / IR Q
ASDO ASFS ASDI
ASDI ASDFS ASDO
Control Serial Port
SIM
SIM Serial Interface
BSDO BSOFS BSDI BSIFS
BSDI BSIFS BSDO BSOFS
RX/TX I/Q Serial Port
VSDO VSDI VSFS
VSDI VSDO VSFS
VOICE DATA Serial Port
CLKIN CLKON MicroSMTM RF Interface
CLKOUT_GATE CLKOUT VBCRESET Generic Serial Port E
MCLK oe MCLK RESET
RAMP RF Timing I/Q Interince VOICE 1/f & Buzzer
DRV-OUT LAN-IN
AGC VOD
Synthesizer AFC MODE JTAG
PA Supply Enable
RADIO (AD6523/AD6524)
Figure 3-23. System interconnection of AD6522 external interfaces. - 37 -
3. TECHNICAL BRIEF
Interconnection with external devices
RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz. LCD module interface Mainly controlled by _LCD_MAIN_CS, LCD_RES, LCD_RS, _WR, DATA [00...15] signals. Table 3-3. Description _LCD_MAIN_CS LCD_RES LCD_RS (ADD1) __WR DATA [00...15] 3V0_VLCD LCD_BACKLIGHT _CTL LCD driver chip enable. LCD driver IC has own CS pin This pin resets LCD module. This pin determines whether the data to LCD module are display data or control data. ADD1 can select 16 bit parallel bus. ADD1 is also used to address flash memory. Write control. The phone do not read data from LCD chip. Parallel data lines. Color LCD driver chip uses the 16-bit data interface. Regulated 3V voltage is supplied to white colored LED driver for backlighting. Control signal of white LED driver IC.
RF interface The AD6522 control RF parts through TXEN, RXON1, RXON2, AGCEN, PLL_DATA, PLL_CLK, PLL_LE etc. Table 3-4. Signal Name TXEN RXON1 RXON2 AGCEN PLL_DATA PLL_CLK PLL_LE TX Enable/Disable LNA, Mixer 1 On/Off Mixer 2 On/Off AGC Enable/Disable Serial Data to PLL Clock to PLL PLL Enable/Disable Description
- 38 -
3. TECHNICAL BRIEF
SIM interface The AD6522 check status periodically in call mode if SIM card is inserted or not, but the AD6522 don't check in deep sleep mode. Interface by SIMDATAOP, SIMCLK, SIM_RST(GPIO_23) Table 3-5. Description SIMDATAOP SIMCLK SIM_RST(GPIO_23) This pin receives and sends data to SIM card. This model supports only 3.0 volt interface SIM card. Clock 3.25MHz frequency. Reset SIM block.
Figure 3-24. SIM Interface of AD6522. Key interface Include 5 column and 5 row. The AD6522 detect key press by interrupt.
ADP3408 interrupt There are two interrupts EOC and CHARGEDET EOC: End of Charge. AD6522 makes charging operation stop when high signal is inputted. CHARGEDET: This pin is activated when the charger is inserted.
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3. TECHNICAL BRIEF
3.7 Analog Main Processor AD6521
AD6521
TCK TMS TDO TDI MCLK MCLKEN RESET
for ICO
Dual-Mode Voiceband Baseband Codec
JTAG Interface
ITXP ITXN QTXP QTXN
FILTER FILTER
I TRANSMIT DAC Q TRANSMIT DAC 10 bit RAMP DAC
INTERP
BSDI
GMSK MOD 32 x 10 bit RAMP RAM BSAEBAND SERIAL PORT
BSIFS
RAMPDAC
FILTER
TXON ATSM RXON ARSM
BASEBAND TRANSMIT SECTION IRXP IRXN QRXP QRXN
I RECEIVE DAC Q RECEIVE DAC
FILTER FILTER
BASEBAND RECEIVE SECTION
BSDO
BSOFS
AFCDAC
13 bit AFC DAC 10 bit I DAC
ASDI AUXILIARY SECTION
IDACOUT IDACREF AUXADC1 AUXADC2 AUXADC3 AUXADC4
CONTROL REGISTOR
AUXILIARY SERIAL PORT
ASDO ASFS
10 bit AUX DAC
REFOUT REFCAP
VOLTAGE REFERENCE
VOUTNORP VOUTNORN VOUTAUXP VOUTAUXN BUZZER VOICEBAND SECTION VINNORP VINNORN VINAUXP VINAUXN
PGA
FILTER
ADC
SAMPLE RATE CONV
FILTER
VSDI
VOICEBAND SERIAL PORT FILTER
VSDO VSFS
MIC PGA DAC
SAMPLE RATE CONV
Figure 3-25. AD6521 function block diagram.
- 40 -
3. TECHNICAL BRIEF
BB Transmit section This section generates in-phase and quadrature BB modulated GMSK signals (BT = 0.3) in accordance with GSM 05.05 Phase 2 specifications. · The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter.
BB Receive section This section consists of two identical ADC channels that process baseband in-phase(I) and quadrature(Q) input signals. Each channel consists of a coarse switched capacitor input filter, followed by a high-order sigma-delta modulator and a lowpass digital filter.
Auxiliary section This section contains two auxiliary DACs(AFC DAC, IDAC) for system control. This section also contains AUX ADC and Voltage Reference AUX ADC : 6 channel 10 bits AFC DAC : 13 bits IDAC : 10 bits
Voiceband section Receive audio signal from MIC. The phones use differential configuration. Send audio signal to Receiver. The phones use differential configuration. It interconnects external devices such as main microphone, main receiver, ear-phone and Hands free kit through the VINNORP, VINNORN, VOUTNORP, VOUTNORN, VINAUXP, VINAUXN, VOUTAUXP, VOUTAUXN VINNORP, VINNORN: Main MIC positive/negative terminal. VOUTNORP, VOUTNORN: Main Receiver positive/negative terminal. VINAUXP, VINAUXN: Hands free kit microphone positive/negative terminal. VOUTAUXP, VOUTAUXON: Hands free kit speaker positive/negative terminal.
- 41 -
3. TECHNICAL BRIEF
Figure 3-26-1. Voice band circuit diagram (Headset & Hands free kit part 1).
- 42 -
3. TECHNICAL BRIEF
Figure 3-26-2. Voice band circuit diagram (Handset & Hands free kit part 2)).
Figure 3-26-3. Voice band circuit diagram (Receiver part).
Figure 3-26-4. Voice band circuit diagram(MIC part).
- 43 -
3. TECHNICAL BRIEF
Figure 3-27. AD6521 circuit diagram.
- 44 -
3. TECHNICAL BRIEF
3.8 Power Management ADP3408
Figure 3-28. ADP3408 (U301) inner block diagram. Table 3-6. Description VSIM VCORE VRTC VAN VTCXO VMEM 2.86 V (is provided to SIM card) 2.45 V (is provided to the AD6522 & AD6521's digital core) 2.45 V (is provided to the RTC and Backup Battery) 2.45 V (is provided to the AD6521 I/O and used as microphone bias) 2.715 V (is provided to VCTCXO) 2.80 V (is provided to Flash)
- 45 -
3. TECHNICAL BRIEF
Power on sequence The ADP3408(U301) controls power on sequence. If a battery is inserted, the battery powers the 6 LDOs. Then if PWRONKEY is detected, the LDOs output turn on. REFOUT is also enabled, Reset signal is generated and send to the AD6522. LDO block There are 6 LDOs in the ADP3408. Battery charging block It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. The phones use Li-Ion battery only. Charger initialization, trickle charging, and constant current charging are implemented in hardware. Charging Process 1. Check charger is inserted or not. 2. If ADP3408 detects that Charger is inserted, the CC-CV charging starts. 3. Exception: When battery voltage is lower than 3.2V, the trickle charge (low current charge mode) starts firstly. After the battery voltage reaches to 3.2V, the CC-CV charging starts.
Pins used for charging CHGDET : Interrupt to AD6522 when charger is plugged. CHGEN : Control signal from AD6522 to charge Li+ battery. EOC : Interrupt to AD6522 when battery is fully charged. GATEIN : Control signal from AD6522 to charge NiMH battery. But, not used. MVBAT : Battery voltage divider. Divide ratio is 1:2.3 and it is sensed in AD6521 AUX_ADC4. TA (Travel Adaptor) Input voltage : AC 110V ~ 240V, 50~60Hz Output voltage : DC 5.2V(±0.2 V) Output current : Max 800mA Battery Li-ion battery : Max 4.2V, Nom 3.7V Standard battery : Capacity - 850mAh, Li-ion
- 46 -
3. TECHNICAL BRIEF
3.9 Memories
TH50VPF5683CDSB(U103) is a mixed multi-chip package containing a 32Mbit pseudo static RAM and a 64Mbit flash memory. · 64Mbit flash memory + 32Mbit PSRAM · 16 bit parallel data bus · ADD01 ~ ADD22. · 1 Chip enable input for Flash memory select. · 2 Chip enable input for Pseudo SRAM. · RF Calibration data, Audio parameters and battery calibration data etc are stored in Flash memory area.
3.10 Display and Interface
This model supports one 65000 color resolution LCD module. Control signals : _MAIN_LCD_CS (which is derived from AD6522, this acts as the chip select enable for the LCD), LCD_ID and LCD_RES. AD6522 uses DATA[00:15] pins to send data for displaying graphical text onto the LCD.
Table 3-7. LCD Display Format Back light 128 x 96 dots White LED Backlight
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3. TECHNICAL BRIEF
3.11 Keypad Switches and Scanning
The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 19 switches (KB101~KB119), connected in a matrix of 5 rows by 5 columns, as shown in Figure 3-29, except for the power switch (KB101), which is connected independently. Functions, the row and the column lines of the keypad are connected to ports of AD6522. The columns are outputs, while the rows are inputs and have pullup resistors built in. When a key is pressed, the corresponding row and column are connected together, causing the row input to go low and generate an interrupt. The columns/rows are then scanned by AD6522 to identify the pressed key.
Figure 3-29. Keypad Switches and Scanning.
- 48 -
3. TECHNICAL BRIEF
3.12 Microphone
The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to VINNORP (#J10) and VINNORN (#K10) pins of AD6521. The voltage of 2V45_VAN is output from ADP3408, and is a bias voltage for both the VINNORP (through R101) and VINAUX (through R112) lines. The VINNOR or VINAUX signal is then A/D converted by the Voiceband ADC part of AD6521. The digitized speech is then passed to the DSP section of AD6522 for processing (coding, interleaving etc.).
Figure 3-30. Microphone
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3. TECHNICAL BRIEF
3.13 Earpiece
The earpiece is driven directly from AD6521 VOUTNORP (#K8) and VOUTNORN (#K7) pins and the gain is controlled by the PGA in an AD6521. The earpiece is placed in the front cover and contacted to main PCB.
Figure 3-31. Earpiece.
3.14 Hands free / Headset Interface
A. Audio Output The output audio signals(VOUTAUXP & VOUTAUXN) from AD6521(U102) are used for both hands free and headset. Firstly, the output signals are fed to two analog siwtches (U203, U204). The two analog switches determine using HFK_EAR signal from AD6522(U101) to give the output audio signals to either hands free or headset speaker.
Figure 3-32. Headset and hands free kit (output)
- 50 -
3. TECHNICAL BRIEF
B. Audio Input Two input audio signals through the hands free kit and one input audio signal through the headset mic are fed to another analog switch (MAX4695EGC(U205)). The analog switch determines using HFK_EAR signal which signal is fed to analog baseband chipset AD6521(U102).
Figure 3-33. Headset and hands free kit (Input)
C. Headset Jack This phone chooses a 3-pole type ear-mic jack which has three electrodes such as Receiver +, Mic+, and GND. This type usually supports only single-ended configuration in the audio path. But most of phones use the common interface.
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3. TECHNICAL BRIEF
3.15 Key Back-light Illumination
In key back-light illumination, there are 6 yellow-green LEDs in Main Board, which are driven by KEY_BACKLIGHT line from AD6522. The LEDs are also used for precharge indication.
Figure 3-34. Key back-light and precharge indication illumination.
- 52 -
3. TECHNICAL BRIEF
3.16 LCD Back-light Illumination
For LCD Back-light illumination, there is a driver in FPCB of LCD module, which is driven by LCD_BACKLIGHT_CTL (GPO_22) through LCD connector (CN402) from AD6522.
Figure 3-35. LCD back-light illumination.
- 53 -
3. TECHNICAL BRIEF
3.17 Speaker & MIDI IC
The phones of this model use the loud speaker and Melody IC which makes the robust joyful melody sounds(40 ploy). · Melody IC control 5 GPIO is assigned to control melody IC. Melody data is transferred to melody IC and played by loud speaker. · External 3.3V LDO The maximum output current of analog amplifier in melody IC is 300mA. External LDO(U202) is included for max power of loud Speaker.
Figure 3-36. MIDI-IC, external LDO, and speaker.
- 54 -
3. TECHNICAL BRIEF
Basically, this phone have a melody IC of Yamaha Ltd.MA-2(nickname from Yamaha) is a synthesizer LSI for mobile phones that realize advanced game sounds. This LSI has a built-in speaker amplifier, and thus, is an ideal device for outputting sounds that are used by mobile phones in addition to game sounds and ringing melodies that are replayed by a synthesizer. The synthesizer section adopts "stereophonic hybrid synthesizer system" that are given advantages of both FM synthesizers and Waveform table synthesizers to allow simultaneous generation of up to thirty two FM tones and eight waveform table tones. Since FM synthesizer is able to present countless tones by specifying parameters with only several tens of bytes, memory capacity and communication band can be saved, and thus, the device exhibits the features in operating environment of mobile phones such as allowing distribution of arbitrary melodies with tones. On the other hand, since Waveform table synthesizer complies with downloading of tones from host CPU, arbitrary ADCM/PCM tones can be treated from sequencer in addition to the use of tones that are built-in the LSI.
- 55 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Components
CN401 Mobile S/W FL402 Dual Saw Filter
FL401 Ant. S/W
U401 RF Main Chipset
U402 Power Amp Module
U404 LDO X401 VCTCXO U403 Inverter IC
RF Components Reference U401 CN401 FL401 U402 Description RF Main Chipset Mobile S/W Ant. S/W PAM Reference FL402 X401 U404 U403 Description Dual SAW Filter VCTCXO LDO Inverter IC
- 56 -
4. TROUBLE SHOOTING
4.2 RX Trouble
START
HP8922 : Test mode (PCS band) 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) Spectrum analyzer setting
Oscilloscope setting
Check
Regulator Circuit
Check VCTCXO Circuit
Check Control Signal
Check Ant SW & Mobile SW
Check Saw Filter Circuit
Check RX IQ
Redownload S/W, CAL
Now See next Page to see How to check each parts
- 57 -
4. TROUBLE SHOOTING
4.2.1 Checking Regulator Circuit
U404.1
U404.6
Check Pin 6 No Check Pin 1. RF 2.85V OK? No Yes Regulator Circuit is OK See next page to check VCTCXO Yes Replace U404 Pin 6 High? Change the board
- 58 -
4. TROUBLE SHOOTING
4.2.2 Checking VCTCXO Circuit
X401.4
X401.3
Check Pin 3 Refer to Graph 4-1 13MHz OK? No Check Pin 4 Refer to Graph 4-2 No Check U301,PMIC 2.7V OK?
Yes
VCTCXO Circuit is OK See next page to check ANT SW & Mobile SW
Yes
Change X401
Graph 4-1. VCTCXO 13MHz - 59 -
Graph 4-2. VCTCXO 2.7V
4. TROUBLE SHOOTING
4.2.3 Checking PLL Control Signal
LE Data Clock
Graph 4-3. RF Control Signal
TP404(PLL_CLK)
TP406(PLL_DATA)
TP402(PLL_LE)
Check TP 403
Level is High?
No
Download the S/W
Check TP406, 404 402. Check if there is Any major Differencr Refer to Graph 4-3 major difference
Yes No
Similar?
Download the S/W
Yes Control Signal is OK See next page to check ANT SW & Mobile SW
- 60 -
4. TROUBLE SHOOTING
4.2.4 Checking Ant SW & Mobile SW
CN401.2
C448 FL401
CN401.1 C445
L410
L409
For these 2 test case, No Call connection is needed
Check CN401 Pin 1,2 with RF Cable connected.
Open Yes
No
Changing CN401
Check CN401 Pin 1,2 with No RF Cable Connected Check C445, C448 Check whether Ant SW Set as RX mode · Refer to Graph 4-4 · Refer to Table 4-1
Short Yes
No
Changing CN401
VC1 :Low VC2 :Low Yes
No
Changing the Board.
Check RF Level of FL401 L409(for GSM) & L410(for DCS)
Pin10 : ~ -62dBm Pin 1 : ~ -63dBm Yes
No
Changing FL401 Ant SW & Mobile SW is OK See next Page to check Rx IQ Signal
For this RF Level test case, RX Stand alone Mode is needed (Refer to chapter 11)
- 61 -
4. TROUBLE SHOOTING
VC1
Low
VC2
Low
Graph 4-4. ANT SW Control GSM, DCS RX Mode
VC1 High VC2 Low
Graph 4-5. ANT SW Control for DCS TX Mode
VC1 Low
ANT SW EGSM TX DCS TX EGSM, DCS RX VC1 0 1 0 VC2 1 0 0
VC2 High
Table 4-1. ANT SW Control Logic Graph 4-6. ANT SW Control for GSM TX Mode - 62 -
4. TROUBLE SHOOTING
4.2.5 Checking SAW Filter Circuit
FL402.3 FL402.5
FL402.1 FL402.7
Check RF Level of Saw Filter Input For GSM : FL402.1 For DCS : FL402.3 Check RF Level of Saw Filter Output For GSM : FL402.7 For DCS : FL402.5
Pin1: ~ -61dBm Pin3: ~ -61dBm Yes
No
Check the parts are well Soldered For GSM : L409 For DCS : L410
Changing L409 for GSM L410 for DCS
Pin7: ~ -64dBm Pin5: ~ -65dBm Yes
No
Soldering is OK?
No
Yes
Changing FL402
Check the parts are well Soldered For GSM : L408,C444 For DCS : L411, C450
Changing L408, C444 for GSM L411, C450 for DCS
Saw Filter is OK See next Page to check Rx IQ Signal
For these 2 test case, RX Stand alone Mode is needed
- 63 -
4. TROUBLE SHOOTING
4.2.6 Checking RX IQ
RXQN RXQP
RXIN RXIP
Graph 4-7. RX IQ Signal
Graph 4-8. RX I Signal (Extended)
Check C401, 405. Check if there is Any Major Difference Refer to Graph 4-4 Check C401 or C405. Check if there is Any Major Difference Refer to Graph 4-5
Similar? Yes
No
Replace U401
Similar? Yes
No
Replace U401
Redownload the Software And calibrate
- 64 -
4. TROUBLE SHOOTING
4.3 TX Trouble
START
HP8922 : Test mode (PCS band) 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting
Check
Regulator Circuit
Check VCTCXO Circuit
Check Control Signal
Check TX IQ
Check RF TX Level
Check Ant SW & Mobile SW
Redownload S/W, CAL
Now See next Page to see How to check each parts
- 65 -
4. TROUBLE SHOOTING
4-3-1 Checking Regulator Circuit
· If you already check this point while checking RX part, you can skip this test.
U404.1
U404.6
Check Pin 6. Check Pin 1.
RF 2.85V O.K? Yes No Pin 6. High ? Yes No
Changing the Board
Regulator Circuit is OK See next Page to check VCTCXO
Replace U404
- 66 -
4. TROUBLE SHOOTING
4-3-2 Checking VCTCXO Circuit
· If you already check this point while checking RX part, you can skip this test.
X401.4
X401.3
Check Pin 3. Refer to Graph 4-9
13 MHz O.K? No
Yes
VCTCXO Circuit is OK See next Page to check ANT SW & Mobile SW
Check Pin 4. Refer to Graph 4-10
Yes 2.7V OK? No
Changing X401
Check U101, PMIC
Graph 4-9. VCTCXO 13MHz - 67 -
Graph 4-10. VCTCXO 2.7V
4. TROUBLE SHOOTING
4-3-3 Checking Control Signal
TX_EN PLL_LE TX_RAMP
PLL_DATA PLL_CLK
TX_PA
Graph 4-11. RF Control Signal
Graph 4-12. RF Control Signal (TX_EN, TX_RAMP, TX_PA)
TP404(PLL_CLK)
TP406(PLL_DATA)
TP402(TX_EN)
TP402(PLL_LE)
- 68 -
4. TROUBLE SHOOTING
TX_RAMP (R0401)
TX_PA (R404)
Check TP402,404,406 . Check if there is Any Major Difference Refer to Graph 4-11
Similar? Yes
No
Download the S/W
Check TP 405, R401, R404. Check if there is Any Major Difference Refer to Graph 4-12
Similar? Yes
No
Download the S/W
Control Signal is OK See next Page to check ANT SW & Mobile SW
- 69 -
4. TROUBLE SHOOTING
4-3-4 Checking TX IQ TXQN, TXQP
TXIN,TXIP
Graph 4-13. TX IQ Signal
Check C449, 453. Check if there is Any Major Difference Refer to Graph 4-10
Similar? Yes
No
Download the S/W
TX IQ Signal is OK See next Page to check RF TX Level
- 70 -
4. TROUBLE SHOOTING
4-3-5 Checking RF TX Level
L401
L402 R406 R401
L405
R403 U402 R404
U401
Check L401(For GSM), L402(For DCS) To Check TXVCO Output Check R406(For GSM), R414(For DCS) To Check Attenuation Circuit
No
C427
R414
R405
GSM: ~10dBm DCS : ~8dBm Yes
Changing U401
GSM: ~8dBm DCS : ~6dBm Yes
No
Soldering check R406, R408, R409, (For GSM) R414, R415, R416 (For DCS)
Check L405(For GSM), C427(For DCS)To Check PAM Output Power
GSM: ~34dBm DCS : ~32dBm Yes
No
GSM: ~2V DCS : ~2V Yes
No
Change the board
Check R401 To Check TXRAMP
Check R403 to Check 2.85v
No
RF TX Level before ANT SW is OK See next Page to check ANT SW & Mobile SW
GSM: ~2.85V DCS : ~2.85V Yes
Change the board
Check R404 To Check TXPA
No
GSM: ~2.7V DCS : ~2.7V Yes
Change the board
For these RF TX Level test case, TX Stand alone Mode is needed
GSM: ~0V DCS : ~2.7V Yes
Check R405 To Check Band
No
Change the board
Changing U402
- 71 -
4. TROUBLE SHOOTING
4-3-6 Checking Ant SW & Mobile SW C425
CN401.2
C448 FL401
CN401.1
C445
Check C448, C445 Check whether Ant SW Set as TX mode Refer to Graph 4-10,11 Refer to Table 4-1
Check VC1, VC2 Yes
No
Changing board
For these 2 test case, TX Stand alone Mode is needed Check RF Level of FL401 Pin 5 (for GSM) & Pin 3(for DCS)
Pin5 : ~33.5dBm Pin 3 : ~31.5dBm Yes
Check C448, C445 Is Set for TX Mode Refer to Table 4-1
No
Go to Next Chapter to Check other RF Level
Check RF Level of U401 Pin 8(connect to C461)
GSM: ~32.5dBm DCS : ~29.5dBm Yes
Changing FL401 ANT SW EGSM TX VC1(C445) VC2(C448) 0 1 0 1 0 0
Check CN401 Pin 1 with RF Cable connected.
Open Yes
No
Changing CN401
DCS TX EGSM, DCS RX
Check CN401 Pin 1&2 with No RF Cable Connected
Short Yes
No
Changing CN401
Table 4-2. ANT SW Control Logic
END
For these 2 test case, No Call connection is needed
- 72 -
4. TROUBLE SHOOTING
VC1 High VC2 Low
VC1 Low VC2 High
Graph 4-14. ANT SW Control DCS TX Mode
Graph 4-15. ANT SW Control GSM TX Mode
VC1
Low
VC2
Low
Graph 4-16. ANT SW Control GSM, DCS RX Mode
- 73 -
CX74017
0 90
-61 dBm
4/3 RXIP RXIN
-64.5 dBm
3
4. TROUBLE SHOOTING
1
Dual Saw Filter L257
2
RXQP RXQN
0 90
4
2/3 2V7_VTCXO
DCS 1805~1880MHz f vco = (N+3.5+FN/2^22) f ref/R f vco
/R
13MHz
-61 dBm GSM 925 ~ 960MHz
13MHz
-64 dBm f ref
LF Fractional-N PLL
AFC REFCLK
-60 dBm Serial I/O
/3 X2 Serial I/O DCS
4-3-7 Receiver and Transmitter RF Level
- 74 f LO
X2 GSM
ANT S/W
GSMSEL DCSSEL TXPA
PLL_DATA PLL_CLK PLL_LE
LMSP54AA-097
PLL_PD RXEN TXEN FEENA
Base Band Block
8 dBm
10 dBm f TX
f IF
BANDSEL1 BANDSEL2
32 dBm 7
Attanuator LF PFD /D2
34 dBm 5
/D1 TXIP TXIN
0 90
10
9
PAM(RF3110)
GSM : 880~925MHz 8 6
TXVCO TXEN Attanuator
DCS : 1710 ~ 1785MHz
TXQP TXQN
TXRAMP
RF2.85V RF2.85V
6 dBm 8 dBm
ADP3330_2V85
OUT Vin
VBAT TEMPSENSE
/SD
VSYNTHEN
4. TROUBLE SHOOTING
4-3-8 Receiver RF Level
Figure 4-1. Test Points of Rx Level.
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4. TROUBLE SHOOTING
4-3-9 Transmitter RF Level
Figure 4-2. Test Points of Tx Level.
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4. TROUBLE SHOOTING
4.4 Power On Trouble
SETTING : Connect PIF, and set remote switch off at PIF.
START
Check Battery Voltage > 3.35V ? Yes Push power-on key and check the level change of U301 Pin 2 Yes
No Charge or Change Battery
No
Check the contact of power-key or dome switch.
Check the voltage of the following pins at U301 Pin 21 = 2.8V ? Pin 22 = 2.45V ? Pin 25 = 2.7V ? Pin 6 = 2.45V ?
No
Replace U301
Yes Logic level at pin 1 of U301 = HIGH? Yes THE PHONE WILL POWER ON. No Redownload software
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4. TROUBLE SHOOTING
Test) U301 (ADP3408) Check!!
POWER-ON KEY signal input These powers should be necessary to power on.
This signal should go HIGH when the power-on procedure is completed.
Pin 25 (2V7_VTCXO)
Pin 22 (2V8_VMEM) Pin 21 (2V45_VCORE)
U301
Pin 6 (2V45_VRTC) Pin 2 (POWERKEY) Pin 1 (RPWRON)
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4. TROUBLE SHOOTING
4.5 Charging Trouble
SETTING : Connect the battery and the charging adaptor(TA) to the phone.
START
Charging Connector (CN302) well-soldered? Yes Voltage at Pin 10 of U301 = 5.2V? Yes R347, Q301, D302 wellsoldered? Yes Voltage across D302 < 0.3V Yes Voltage across R347 is about 20~150mV ? Yes Voltage across Q301 < 1.0V Yes
No
Resolder CN302.
No
The charging adaptor(TA) is out of order. Change the charging adaptor.
No
Resolder R347, Q301, D302 .
No
Replace D302.
No
Replace R347.
No
Replace Q301
Is the battery charged ? Yes CHARGING WILL OPERATE PROPERLY.
No
The battery may have the problem. Change the battery and try again.
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4. TROUBLE SHOOTING
Test) Q301 & D302 Check!!
The charging current will flow into this direction.
PWRONKEY SIMEN CHRIN ISENSE
GATEDR BATSNS RESCAP
D302 Q301 R347
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4. TROUBLE SHOOTING
4.6 LCD Trouble
START PIF Power On
Is the connection of LCD module with LCD connector on PCB OK? Yes Check the soldering of CN301 Yes Does LCD work properly? No No
No
Reassemble LCD module with LCD connector
Resolder CN301
Replace LCD module
Yes LCD working!
Test ) CN301 Check!!
CN301
A) Check the connection between LCD & Main board B) Check the soldering of LCD & Main board C) Replace LCD module
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4. TROUBLE SHOOTING
4.7 Receiver Trouble
SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode
START
Check the signal level of "VOUTNORP" at C206. Is it a few hundred mVAC? Yes
No
Replace the Main board. ABB is out of order.
Check the signal level at C207. Is it a few hundred mVAC?
No Check if the C203 is short. Yes
No
Yes
Replace the C203 No
Check the contact state of Receiver.
Replace Receiver.
Receiver will work properly.
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4. TROUBLE SHOOTING
· The Receiver part Circuit Diagram
C207 C206
C203
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4. TROUBLE SHOOTING
4.8 Speaker Trouble
SETTING : Connect PIF to the phone, and Power on. Enter The engineering mode, and set "Melody on" at Buzzer of BB test menu.
START
The power to the analog part of Melody IC No Replace U202 ( Melody IC LDO) The power to the analog part of Melody IC No Check the soldering condition of R212, and re-solder R212
Voltage across C222 = 3.3 V? Yes Voltage at R212 = 2.8 V ?
Yes Check the soldering of C201, C205, R203, R205 Yes
The component of Melody IC path No Re-soldering C201, C205, R203, R205 Speaker connector Check!! No Re-solder CN201 or Replace CN201
Check the signal level at 1,2 of CN201
Yes
Speaker connector Check!! No
Check the soldering between Speaker & wire Yes Re-solder Speaker Yes Speaker Working!!
Re-solder Speaker
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4. TROUBLE SHOOTING
· Test) Speaker Check!!
U202
C207
CN201
The Power for analog part of the melody IC Circuit diagram
The Power for analog part of the melody IC The voltage is 3.3V
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4. TROUBLE SHOOTING
The Melody IC & Speaker part Circuit Diagram
These 4 components make up the analog amplified stage of melody.
The Power for digital part of The melody IC. The voltage is 2.8V
- 86 -
4. TROUBLE SHOOTING
4.9 Mic. Trouble
SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode.
START
MIC Bias voltage
Check if the C204 voltage is almost 2.2V(DC)
No
Voltage at pin 24 of U301 is 2.45V(DC)? Yes
No
Replace the U301.
Yes Replace the R202 & R204. No
Is the voltage at Pin 3 of Q203 almost 0V (DC)? Yes
Replace Q203.
Check the signal level at each side of MIC201. Is it a few ten mV (AC)? Yes
No
Replace the Microphone, MIC201.
Check the soldering of R206, C208, C206, C211 Yes Replace Main Board.
No
Replace R206, R208, C206, C211
Mic will work properly.
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4. TROUBLE SHOOTING
C204
R202
The signal flow of the microphone to U103.
R206, R208, C208, C211
R204
MIC activating signal : Mic is activated when this signal goes to high.
The voltage at pin. 3 of Q203 goes to almost 0V when the mic is activated.
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4. TROUBLE SHOOTING
R202 Q203 R204 C204
C208
R206 R208
MIC201
C201
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4. TROUBLE SHOOTING
4.10 Vibrator Trouble
SETTING : After Initialize Agilent 8960, Test in EGSM, Connect PIF to the phone, and Power on. Enter The engineering mode, and set 'Vibrator on' at Vibration of BB test menu.
START Check the voltage through Q201 No No
Is the voltage at pin 3 of Q201 near 0 V?
Check the soldering of R218 Yes
Resolder R218
Yes Replace Q201 Check the soldering of R217 Yes Vibrator connector Check!! No No Resolder R217
Check the signal level of CN203 Yes
Resolder Vibrator
Replace Vibrator Yes Vibrator Working!!
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4. TROUBLE SHOOTING
CN203
D201 Q201
When the vibrator works, the signal at this point goes to 2.8V
When the vibrator works, the current flow this direction.
When the vibrator works, the signal at this point goes to 0V
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4. TROUBLE SHOOTING
4.11 Key Backlight LED Trouble
SETTING : Connect PIF to the phone, and power on. Enter engineering mode, and set "Backlight on" in "at" "BB test-Backlight" menu
START PIF Power On
Is the voltage level at Pin1 at O202 about 1.2V? Yes
No
Check the soldering of R234,R236
Are all LEDs LD201~LD206 not working Yes
No
Check the soldering or Replace LEDs not working
Replace Q202, and try again Yes
Backlight LED Working!!
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4. TROUBLE SHOOTING
· Test) LD201~LD206 & Q201 Check!!
R234
LD202
LD201
R236 Q202
LD204
LD203 LD206
LD205
A) Check the diode LD201~LD206. B) Check the current through Q202. - 93 -
4. TROUBLE SHOOTING
4.12 SIM Detect Trouble
SETTING : Insert the SIM into J301. Connect PIF to the phone, and power on.
START
Does the SIM supports 3V? Yes Voltage at pin 1 of J301 = 2.9V ? Yes
No
Change the SIM. Our phone supports 3V SIM only.
No
Voltage at pin 19 of U301 = 2.9V ? Yes
No
Replace U301.
Check the soldering condition of J301. Yes Check the contact between J301 and SIM card. Yes
No
Re-solder J301.
No
Replace J301.
Change the SIM and try again. Does it work properly? Yes The SIM is malfunctioned. Change the SIM.
No
Does it work properly after re-downloading S/W ?
No
Change the main board.
Yes
SIM will be detected.
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4. TROUBLE SHOOTING
· Test) SIM Connector Check!!
J301
- 95 -
4. TROUBLE SHOOTING
4.13 Earphone Trouble
SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode.
START
Inset the earphone to the phone
Earphone detect problem
Does the audio profile of the phone change to the earphone mode?
No
Yes
Audio path problem
Set the audio part of the test equipment to echo mode.
Can you hear your voice from the earphone?
No
Change the earphone and try again.
Can you hear your voice from the earphone?
No
Set the audio part of the test equipment to PRBS or continuous wave mode.
Yes
Change Earphone. Can you hear your voice from the earphone?
Yes Earphone sending path problem
Yes
Earphone will work properly
Earphone receiving path problem
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4. TROUBLE SHOOTING
Earphone detect problem
Voltage at R241 = 0V ?
No
Check if between pin 3 and pin 4 of J201 is open ?
No Change the J201.
Yes If open, go to the next step
Earphone receiving path problem
Is the signal level at pin5, pin4 of U203 about 1.2V after call connection?
No
Is the both signal level at pin5,pin4 of U203 about 1.2V?
No
Is the signal level at only pin 5 of U203 about 1.2V?
Yes Yes Resolder R240, C234, J201. Yes Resolder or replace U203.
No
Change main board.
Does it work well? No
Download S/W
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4. TROUBLE SHOOTING
Earphone sending path problem
Voltage at pin9 of U205 1.5~1.9V? Yes Is the signal level across L201 about 1.5 to 1.9V? Yes
No
Is the signal level at pin9, pin11 of U205 about 1.5 to 1.9V? Yes
No
Is the both signal level at pin9, pin11 of U205 about 1.5 to 1.9V? No Resolder or replace U205. Yes
Resolder L201.
Does it work well?
No
Re-download software.
Does it work well? Yes
No Change the main board.
Yes
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4. TROUBLE SHOOTING
J201
R240 C234
L201 R241
U205
U203 U204
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4. TROUBLE SHOOTING
This part makes the mic bias of the ear-mic. The reference voltage for the hook-detect of ear-mic.
The direction of the audio Signal from the ear-mic.
U203
U204
Ear-mic detection part
- 100 -
4. TROUBLE SHOOTING
4.14 HFK Trouble
SETTING : After initializing GSM test equipment, Connect PIF to the phone, and power on.
START
Connect HFK to the phone. HFK detect problem. Does the audio profile of the phone change to the car-kit mode? Yes Set the audio part of the test equipment to echo mode. Yes Can you hear your voice from the HFK? No Change the HFK and try again. Yes Can you hear your voice from the HFK? Yes No
Voltage at R337 is 0V ? No Audio path problem. Yes No
Resolder R337 & CN302.
Redownload software.
Set the audio part of the test equipment to PRBS or continuous wave mode. Yes Can you hear your voice from the HFK? No
HFK receiving path problem.
Yes
HFK will be work properly.
Change HFK.
HFK sending path problem.
Is the signal level at pin 9 & 10 of CN302 a few tens or hundreds mV(AC)? Yes
HFK receiving path problem.
No
Is the signal level at pin 5 of U203 & U204 a few tens or hundreds mV(AC)? Yes
No Redownload software. Yes
Does it work well?
Check the HFK again.
Resolder or replace U203 & U204. No Yes
Change the main board.
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4. TROUBLE SHOOTING
HFK sending path problem.
Is the signal level at pin 11 of CN302 a few tens or hundreds mV(AC)? Yes Is the signal level at pin1, pin2 of U205 a few tens or hundreds mV(AC)? Yes
No Resolder CN302.
No Replace the U205.
Does it work well?
No Redownload software.
Yes No Does it work well? Change the main board.
Yes
U205
U203 U204
CN302
- 102 -
4. TROUBLE SHOOTING
CN302
U203
U204
- 103 -
4. TROUBLE SHOOTING
U205
- 104 -
5. DISASSEMBLY INSTRUCTION
5. DISASSEMBLY INSTRUCTION
5.1 Disassembly
1. Remove the Battery and Screws as shown below.
Figure 5-1. Removing the Battery.
2. Lift up and remove the Rear cover.
Figure 5-2. Removing the Rear cover.
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5. DISASSEMBLY INSTRUCTION
3. Detach the rest components as shown below.
Figure 5-3. Detaching the rest components.
- 106 -
5. DISASSEMBLY INSTRUCTION
4. First, lift up PCB and remove the Antenna holding the hooks of the both end sides. After that, detach the Receiver and Keypad.
Figure 5-4. Removing PCB, Antenna, Receiver and Keypad. 5. Use a tweezers to remove the Battery locker and Spring.
Figure 5-5. Removing the Battery locker.
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6. SOFTWARE DOWNLOAD
6. SOFTWARE DOWNLOAD
6.1 Download Setup
Figure 6-1 describes Download setup
UART
Figure 6-1. Download Setup
Condition Disconnect TA to the Datakit and phone have a battery Check the battery up to two blocks more.
- 108 -
6. SOFTWARE DOWNLOAD
6.2 Download Procedure
1. Access Flash loader program in PC and select Erase.
1. Select Erase
2. Check the Model. (G3100)
2. Check `G3100'
- 109 -
6. SOFTWARE DOWNLOAD
3. Press Start and Wait until Erase is completed.
1. Press `Start'
2. Confirm completion
- 110 -
6. SOFTWARE DOWNLOAD
4. Select Write and Select ... Key to Choose software (Mot. File). ...
1. Select `Write'
2. Select this key
5. Press Open after choosing software
3. Choose software file
4. Press `Open'
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6. SOFTWARE DOWNLOAD
6. Wait until converting from MOT to BIF is completed.
1. Wait until completion of converting
7. Press Start and Power on the phone using JIG remote Power on. (switch 1)
2. Press `Start'
3. Turn off and turn on the remote switch
Remote
H/F
PS
DC
- 112 -
6. SOFTWARE DOWNLOAD
8. Wait until Sending Block is complete.
First, you can see this message
Second, you can see this message
- 113 -
The G3100 is made up of one PCB. Blow you can see the block diagram of G3100.
Mic Receiver Speaker
TX[I:Q]
Analog Processor
RX[I:Q]
RF
Transceiver
Display
(4096 Color LCD)
Digital Processor
PAM
SIM
Charging Memory
IO
7. BLOCK DIAGRAM
7. BLOCK DIAGRAM
Battery
Signal / Control
Charging Current
Accessory
- 114 -
Power IC
8. Circuit Diagram
8.1 Main Chipset and Memory
1
2
3
4
5
6
7
8
9
10
2V8_VMEM
CLOSE TO AD6522
2V45_VCORE 2V8_VMEM
2V8_VMEM
2V45_VCORE 2V45_VRTC
2V45_VCORE CLOSE TO AD6522 C114 C110 47n C115 47n C111 47n
C101 2V8_VMEM 47n
C102 47n
C103 47n
C104 47n
C105 47n
C106 47n
C107 47n
C108 47n
C109 47n L2 N5 N9 N13 H1 P7 K14 C8 B14 B10 C6 D5 L9 C112 47n E3 A2 C113 100p
47n
VEXT1 VEXT2