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TDA2040
20W Hi-Fi AUDIO POWER AMPLIFIER
DESCRIPTION The TDA2040 is a monolithic integrated circuit in Pentawatt ® package,intended for use as an audio class AB amplifier. Typically it provides 22W output power (d = 0.5%) at Vs = 32V/4 . The TDA2040 provides high output current and has very low harmonic and cross-over distortion. Further the device incorporates a patented short circuit protection system comprising an arrangement for automatically limiting the dissipated power so as to keep the working point of the output transistors within their safe operating area. A thermal shut-down system is also included. TEST CIRCUIT

PENTAWATT ORDERING NUMBER : TDA2040V

December 1995

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SCHEMATIC DIAGRAM

PIN CONNECTION

THERMAL DATA
Symbol Rth j-case Parameter Thermal Resistance Junction-case Max. Value 3 Unit °C/W

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ABSOLUTE MAXIMUM RATINGS
Symbol Vs Vi Vi Io Ptot Tstg, Tj Supply Voltage Input Voltage Differential Input Voltage Output Peak Current (internally limited) Power Dissipation at T case = 75 °C Storage and Junction Temperature Parameter Value ± 20 Vs ± 15 4 25 ­ 40 to + 150 V A W °C Unit V

ELECTRICAL CHARACTERISTICS (refer to the test circuit, VS = ± 16V, Tamb = 25oC unless otherwise specified)
Symbol Vs Id Ib Vos Ios Po Supply Voltage Quiescent Drain Current Input Bias Current Input Offset Voltage Input Offset Current Output Power d = 0.5%, Tcase = 60°C f = 1kHz RL = 4 RL = 8 f = 15kHz RL = 4 Po = 1W, RL = 4 f = 1kHz f = 1kHz Po = 0.1 to 10W, R L = 4 f = 40 to 15000Hz f = 1kHz B = Curve A B = 22Hz to 22kHz B = Curve A B = 22Hz to 22kHz 0.5 R L = 4, R g = 22k, Gv = 30dB f = 100Hz, Vripple = 0.5VRMS f = 1kHz Po = 12W Po = 22W RL = 8 RL = 4 40 29.5 20 15 22 12 18 100 80 30 0.08 0.03 2 3 50 80 5 50 10 200 M dB % 66 63 145 °C µV µV pA 30.5 kHz dB dB % Vs = ± 4.5V Vs = ± 20V Vs = ± 20V Vs = ± 20V Parameter Test Conditions Min. ± 2.5 45 0.3 ±2 Typ. Max. ± 20 30 100 1 ± 20 ± 200 Unit V mA mA µA mV nA W

BW Gv Gv d

Power Bandwidth Open Loop Voltage Gain Closed Loop Voltage Gain Total Harmonic Distortion

eN iN Ri SVR

Input Noise Voltage Input Noise Current Input Resistance (pin 1) Supply Voltage Rejection Efficiency

Tj

Thermal Shut-down Junction Temperature

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Figure 1 : Output Power versus Supply Voltage Figure 2 : Output Power versus Supply Voltage

Figure 3 :

Output Power versus Supply Voltage

Figure 4 :

Distortion versus Frequency

Figure 5 :

Supply Voltage Rejection versus Frequency

Figure 6 :

Supply Voltage Rejection versus Voltage Gain

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Figure 7 : Quiescent Drain Current versus Supply Voltage Figure 8 : Open Loop Gain versus Frequency

Figure 9 :

Power Dissipation versus Output Power

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Figure 10 : Amplifier with Split Power Supply

Figure 11 : P.C. Board and Components Layout for the Circuit of Figure 10 (1:1 scale)

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Figure 12 : Amplifier with Split Power Supply (see Note)

Note : In this case of highly inductive loads protection diodes may be necessary.

Figure 13 : P.C. Board and Components Layout for the Circuit of Figure 12 (1:1 scale)

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Figure 14 : 30W Bridge Amplifier with Split Power Supply

Figure 15 : P.C. Board and Components Layout for the Circuit of Figure 14 (1:1 scale)

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Figure 16 : Two Way Hi-Fi System with Active Crossover

Figure 17 : P.C. Board and Components Layout for the Circuit of Figure 16 (1:1 scale)

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Figure 18 : Frequency Response Figure 19 : Power Distribution versus Frequency

MULTIWAY SPEAKER SYSTEMS AND ACTIVE BOXES Multiway loudspeaker systems provide the best possible acoustic performance since each loudspeaker is specially designed and optimized to handle a limited range of frequencies. Commonly, these loudspeaker systems divide the audio spectrum into two, three or four bands. To maintain a flat frequencyresponseover the Hi-Fi audio range the bands covered by each loudspeaker must overlap slightly. Imbalance between the loudspeakers produces unacceptable results therefore it is important to ensure that each unit generates the correct amount of acoustic energy for its segment of the audio spectrum. In this respect it is also important to know the energy distribution of the music spectrum determine the cutoff frequenciesof the crossover filters (see Figure 19). As an example, a 100W three-way system with crossover frequencies of 400Hz and 3kHz would require 50W for the woofer, 35W for the midrange unit and 15W for the tweeter. Both active and passive filters can be used for crossovers but today active filters cost significantly less than a good passive filter using air-cored inductors and non-electrolyticcapacitors. In addition, active filters do not suffer from the typical defects of passive filters : - power loss - increased impedance seen by the loudspeaker (lower damping) - difficulty of precise design due to variable loudspeaker impedance Obviously, active crossovers can only be used if a

power amplifier is provided for each drive unit. This makes it particularly interesting and economically sound to use monolithic power amplifiers. In some applications, complex filters are not really necessary and simple RC low-pass and high-pass networks (6dB/octave) can be recommended. The results obtained are excellent because this is the best type of audio filter and the only one free from phase and transient distortion. The rather poor out of band attenuation of single RC filters means that the loudspeaker must operate linearly well beyond the crossover frequency to avoid distortion. A more effective solution, named "Active Power Filter" by SGS is shown in Figure 20. Figure 20 : Active Power Filter

The proposed circuit can realize combined power amplifiers and 12dB/octave or 18dB/octave highpass or low-pass filters. In practice, at the input pins of the amplifier two equal and in-phase voltages are available, as required for the active filter operation.

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The impedance at the pin (-) is of the order of 100, while that of the pin (+) is very high, which is also what was wanted.
C1 = C2 = C3 22 nF R1 8.2 k R2 5.6 k R3 33 k

PRATICAL CONSIDERATION Printed Circuit Board The layout shown in Figure 11 should be adopted by the designers. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the gorund return of the output in which a high current flows. Assembly Suggestion No electrical isolation is needed between the package and the heatsink with single supply voltage configuration. Application Suggestions The recommended values of the components are those shown on application circuit of Fig. 10. Different values can be used. The following table can help the designer.

The component values calculated for fc = 900Hz using a Bessel 3rd order Sallen and Key structure are : In the block diagram of Figure 21 is represented an active loudspeaker system completely realized using power integrated circuit, rather than the traditional discrete transistors on hybrids, very high quality is obtained by driving the audio spectrum into three bands using active cro ssove rs (TDA2320A) and a separate amplifier and loudspeakers for each band. A modern subwoofer/midrange/tweetersolution is used.

Figure 21 : High Power Active Loudspeaker System using TDA2030A and TDA2040

Comp. R1 R2 R3 R4 C1 C2 C3, C4 C5, C6 C7

Recom. Value 22k 680 22k 4.7 1µF 22µF 0.1µF 220µF 0.1µF

Purpose Non inverting input biasing Closed loop gain setting Closed loop gain setting Frequency stability Input DC decoupling Inverting DC decoupling Supply voltage bypass Supply voltage bypass Frequency stability

Larger than Recommended Value Increase of input impedance Decrease of gain (*) Increase of gain Danger of oscillation at high frequencies with inductive loads

Smaller than Recommended Value Decrease of input impedance Increase of gain Decrease of gain (*)

Increase of low frequencies cut-off Increase of low frequencies cut-off Danger of oscillation Danger of oscillation Danger of oscillation

(*) The value of closed loop gain must be higher than 24dB

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PENTAWATT PACKAGE MECHANICAL DATA
DIM. A C D D1 E F F1 G G1 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia MIN. mm TYP. MAX. 4.8 1.37 2.8 1.35 0.55 1.05 1.4 MIN. inch TYP. MAX. 0.189 0.054 0.110 0.053 0.022 0.041 0.055 0.142 0.276 0.409 0.409

2.4 1.2 0.35 0.8 1 3.4 6.8 10.05 17.85 15.75 21.4 22.5 2.6 15.1 6 4.5 4 3.65

0.094 0.047 0.014 0.031 0.039 0.126 0.260 0.396

0.134 0.268

10.4 10.4

0.703 0.620 0.843 0.886 3 15.8 6.6 0.102 0.594 0.236 0.177 0.157 3.85 0.144 0.152 0.118 0.622 0.260

L E L1

A

C

D1

L2 L5 L3

D

Dia. F

L6

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H2

L7

F1

G

G1

H3

M

M1

TDA2040

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1996 SGS-THOMSON Microelectronics All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A.

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