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(3,25 mm x 3,25 mm)

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

96% EFFICIENT SYNCHRONOUS BOOST CONVERTER WITH 1.5-A SWITCH
FEATURES
· 96% Efficient Synchronous Boost Converter ­ 200-mA Output Current From 0.9-V Input ­ 500-mA Output Current From 1.8-V Input Output Voltage Remains Regulated When Input Voltage Exceeds Nominal Output Voltage Device Quiescent Current: 25-µA (Typ) Input Voltage Range: 0.9-V to 6.5-V Fixed and Adjustable Output Voltage Options Up to 5.5-V Power Save Mode for Improved Efficiency at Low Output Power Low Battery Comparator Low EMI-Converter (Integrated Antiringing Switch) Load Disconnect During Shutdown Over-Temperature Protection Small 3 mm x 3 mm QFN-10 Package

DESCRIPTION
The TPS6102x devices provide a power supply solution for products powered by either a one-cell, two-cell, or three-cell alkaline, NiCd or NiMH, or one-cell Li-Ion or Li-polymer battery. Output currents can go as high as 200 mA while using a single-cell alkaline, and discharge it down to 0.9 V. It can also be used for generating 5 V at 500 mA from a 3.3-V rail or a Li-Ion battery. The boost converter is based on a fixed frequency, pulse-width-modulation (PWM) controller using a synchronous rectifier to obtain maximum efficiency. At low load currents the converter enters the Power Save mode to maintain a high efficiency over a wide load current range. The Power Save mode can be disabled, forcing the converter to operate at a fixed switching frequency. The maximum peak current in the boost switch is limited to a value of 1500 mA. The TPS6102x devices keep the output voltage regulated even when the input voltage exceeds the nominal output voltage. The output voltage can be programmed by an external resistor divider, or is fixed internally on the chip. The converter can be disabled to minimize battery drain. During shutdown, the load is completely disconnected from the battery. A low-EMI mode is implemented to reduce ringing and, in effect, lower radiated electromagnetic energy when the converter enters the discontinuous conduction mode. The device is packaged in a 10-pin QFN PowerPADTMpackage measuring 3 mm x 3 mm (DRC).

· · · · · · · · · · · · · · · ·

APPLICATIONS
All One-Cell, Two-Cell and Three-Cell Alkaline, NiCd or NiMH or Single-Cell Li Battery Powered Products Portable Audio Players PDAs Cellular Phones Personal Medical Products Camera White LED Flash Light
L1 6.8 µH C1 10 µF R1 SW VBAT 0.9-V To 6.5-V Input EN LBI R2 PS GND

VOUT R3 FB R4 R5 C2 2.2 µF C3 47 µF

VO 3.3 V Up To 200 mA

LBO PGND TPS61020

Low Battery Output

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright © 2003­2004, Texas Instruments Incorporated

TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

AVAILABLE OUTPUT VOLTAGE OPTIONS (1)
TA OUTPUT VOLTAGE DC/DC Adjustable 40°C to 85°C 3.0 V 3.3 V 5V (1) (2) PACKAGE MARKING BDR BDS BDT BDU 10-Pin QFN PACKAGE PART NUMBER (2) TPS61020DRC TPS61024DRC TPS61025DRC TPS61027DRC

Contact the factory to check availability of other fixed output voltage versions. The DRC package is available taped and reeled. Add R suffix to device type (e.g., TPS61020DRCR) to order quantities of 3000 devices per reel.

ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
TPS6102x Input voltage range on SW, VOUT, LBO, VBAT, PS, EN, FB, LBI Operating virtual junction temperature range, TJ Storage temperature range Tstg (1) -0.3 V to 7 V -40°C to 150°C -65°C to 150°C

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATINGS TABLE
PACKAGE DRC THERMAL RESISTANCE JA 48.7 °C/W POWER RATING TA 25°C 2054 mW DERATING FACTOR ABOVE TA = 25°C 21 mW/°C

RECOMMENDED OPERATING CONDITIONS
MIN Supply voltage at VBAT, VI Operating free air temperature range, TA Operating virtual junction temperature range, TJ 0.9 -40 -40 NOM MAX UNIT 6.5 85 125 V °C °C

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

ELECTRICAL CHARACTERISTICS
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25°C) (unless otherwise noted)
DC/DC STAGE PARAMETER VI VO VFB f ISW Minimum input voltage range for start-up Input voltage range, after start-up TPS61020 output voltage range TPS61020 feedback voltage Oscillator frequency Switch current limit Start-up current limit SWN switch on resistance SWP switch on resistance Total accuracy (including line and load regulation) Line regulation Load regulation Quiescent current Shutdown current CONTROL STAGE PARAMETER VUVLO VIL Under voltage lockout threshold LBI voltage threshold LBI input hysteresis LBI input current VOL Vlkg VIL VIH LBO output low voltage LBO output low current LBO output leakage current EN, PS input low voltage EN, PS input high voltage EN, PS input current Overtemperature protection Overtemperature hysteresis Clamped on GND or VBAT 0.8 × VBAT 0.01 140 20 0.1 VLBO = 7 V EN = VBAT or GND VO = 3.3 V, IOI = 100 µA TEST CONDITIONS VLBI voltage decreasing VLBI voltage decreasing 490 MIN TYP 0.8 500 10 0.01 0.04 100 0.01 0.1 0.2 × VBAT 0.1 0.4 510 MAX UNIT V mV mV µA V µA µA V V µA °C °C VBAT VOUT IO = 0 mA, VEN = VBAT = 1.2 V, VOUT = 3.3 V, TA = 25°C VEN = 0 V, VBAT = 1.2 V, TA = 25°C 1 25 0.1 VOUT= 3.3 V VOUT= 3.3 V -3% VOUT= 3.3 V TEST CONDITIONS RL = 120 0.9 1.8 490 480 1200 500 600 1500 0.4 x ISW 260 290 3% 0.6% 0.6% 3 45 1 µA µA µA MIN TYP 0.9 MAX 1.2 6.5 5.5 510 720 1800 V mV kHz mA mA m m UNIT V

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

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PIN ASSIGNMENTS
DRC PACKAGE (TOP VIEW)

EN VOUT FB LBO GND

PGND SW PS LBI VBAT

Terminal Functions
TERMINAL NAME EN FB GND LBI LBO PS SW PGND VBAT VOUT PowerPADTM NO. 1 3 5 7 4 8 9 10 6 2 I O I O I I I/O I I DESCRIPTION Enable input. (1/VBAT enabled, 0/GND disabled) Voltage feedback of adjustable versions Control / logic ground Low battery comparator input (comparator enabled with EN) Low battery comparator output (open drain) Enable/disable power save mode (1 / VBAT disabled, 0/ GND enabled) Boost and rectifying switch input Power ground Supply voltage Boost converter output Must be soldered to achieve appropriate power dissipation. Should be connected to PGND.

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

ELECTRICAL CHARACTERISTICS (continued)
FUNCTIONAL BLOCK DIAGRAM (TPS61020)
SW Backgate Control VOUT 10 k 20 pF PGND PGND Error Amplifier _ + Vref = 0.5 V Control Logic GND Oscillator Temperature Control + _ PGND FB

VBAT VOUT Vmax Control

AntiRinging

Gate Control

Regulator

EN PS

GND

LBI + _

Low Battery Comparator _ + Vref = 0.5 V GND

LDO

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

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PARAMETER MEASUREMENT INFORMATION
L1 6.8 µH Power Supply C1 10 µF R1 SW VBAT EN LBI R2 PS GND List of Components: U1 = TPS6102xDRC L1 = EPCOS B82462-G4682 C1, C2 = X7R/X5R Ceramic C3 = Low ESR Tantalum LBO PGND TPS6102x Control Output FB R4 R5 VOUT R3 C2 2.2 µF C3 47 µF VCC Boost Output

TYPICAL CHARACTERISTICS Table of Graphs
FIGURE Maximum output current vs Input voltage vs Output current (TPS61020) vs Output current (TPS61025) Efficiency vs Output current (TPS61027) vs Input voltage (TPS61025) vs Input voltage (TPS61027) Output voltage No load supply current into VBAT No load supply current into VOUT vs Output current (TPS61025) vs Output current (TPS61027) vs Input voltage vs Input voltage Output voltage in continuous mode (TPS61025) Output voltage in continuous mode (TPS61027) Output voltage in power save mode (TPS61025) Output voltage in power save mode (TPS61027) Waveforms Load transient response (TPS61025) Load transient response (TPS61027) Line transient response (TPS61025) Line transient response (TPS61027) Start-up after enable (TPS61025) Start-up after enable (TPS61027) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

TYPICAL CHARACTERISTICS
MAXIMUM OUTPUT CURRENT vs INPUT VOLTAGE
1400 1200 Maximum Output Current - mA VO = 3.3 V 1000 Efficiency - % 800 VO = 5 V 100 90 80 70 60 50 40 30 20 200 10 0 0.9 1.7 2.5 3.3 4.1 4.9 VI - Input Voltage - V 5.7 6.5 0 1 10 100 IO - Output Current - mA 1000 VBAT = 1.8 V VBAT = 0.9 V VO = 1.8 V

TPS61020 EFFICIENCY vs OUTPUT CURRENT

600 400 VO = 1.8 V

Figure 1. TPS61025 EFFICIENCY vs OUTPUT CURRENT
100 90 80 VBAT = 2.4 V 70 Efficiency - % 60 50 40 30 20 10 0 1 10 100 1000 IO - Output Current - mA VO = 3.3 V VBAT = 0.9 V VBAT = 1.8 V Efficiency - % 70 60 50 40 30 20 10 0 1 100 90 80 VBAT = 1.2 V

Figure 2. TPS61027 EFFICIENCY vs OUTPUT CURRENT

VBAT = 2.4 V VBAT = 3.6 V

VBAT = 1.8 V

VO = 5 V 10 100 IO - Output Current - mA 1000

Figure 3.

Figure 4.

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

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TYPICAL CHARACTERISTICS (continued)
TPS61025 EFFICIENCY vs INPUT VOLTAGE
100 95 90 85 Efficiency - % 80 75 IO = 250 mA 70 65 60 55 50 0.9 1.4 1.9 2.4 2.9 3.4 3.9 4.4 4.9 Efficiency - % IO = 10 mA IO = 100 mA VO = 3.3 V 95 90 85 80 75 70 65 60 55 50 0.9 1.4 1.9 2.4 2.9 3.4 3.9 4.4 4.9 5.4 5.9 6.4 VI - Input Voltage - V VO = 5 V IO = 250 mA IO = 10 mA 100 IO = 100 mA

TPS61027 EFFICIENCY vs INPUT VOLTAGE

VI - Input Voltage - V

Figure 5. TPS61025 OUTPUT VOLTAGE vs OUTPUT CURRENT
3.35 VO = 3.3 V 5.05 VO - Output Voltage - V VO - Output Voltage - V 5.10 VO = 5 V

Figure 6. TPS61027 OUTPUT VOLTAGE vs OUTPUT CURRENT

3.30 VBAT = 2.4 V

5 VBAT = 3.6 V 4.95

3.25

4.90

4.85

3.20 1 10 100 1000 IO - Output Current - mA

4.80 1 10 100 IO - Output Current - mA 1000

Figure 7.

Figure 8.

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

TYPICAL CHARACTERISTICS (continued)
NO LOAD SUPPLY CURRENT INTO VBAT vs INPUT VOLTAGE
1.6 No Load Supply Current Into VBAT - µ A 1.4 1.2 1 0.8 TA = 25°C 0.6 0.4 0.2 0 0.9 1.5 TA = -40°C No Load Supply Current Into VOUT - µ A TA = 85°C 34.8 TA = 85°C 29.8

NO LOAD SUPPLY CURRENT INTO VOUT vs INPUT VOLTAGE

24.8 19.8 14.8 9.8 4.8 -0.2

TA = -40°C TA = 25°C

2

2.5 3 3.5 4 4.5 5 VI - Input Voltage - V

5.5

6

6.5

0.9 1.5

2

2.5 3 3.5 4 4.5 5 VI - Input Voltage - V

5.5

6

6.5

Figure 9. TPS61025 OUTPUT VOLTAGE IN CONTINUOUS MODE
Output Voltage 20 mV/div VI = 1.2 V, RL = 33 , VO = 3.3 V

Figure 10. TPS61027 OUTPUT VOLTAGE IN CONTINUOUS MODE

Output Voltage 20 mV/div

Inductor Current 200 mA/div

Inductor Current 200 mA/div

VI = 3.6 V, RL = 25 , VO = 5 V t - Time - 1 µs/div

t - Time - 1 µs/div

Figure 11.

Figure 12.

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

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TYPICAL CHARACTERISTICS (continued)
TPS61025 OUTPUT VOLTAGE IN POWER SAVE MODE
VI = 1.2 V, RL = 330 , VO = 3.3 V

TPS61027 OUTPUT VOLTAGE IN POWER SAVE MODE
VI = 3.6 V, RL = 250 , VO = 5 V

Output Voltage 20 mV/div, AC

Inductor Current 100 mA/div, DC

t - Time - 50 µs/div

Inductor Current 200 mA/div, DC

Output Voltage 50 mV/div, AC

t - Time - 50 µs/div

Figure 13. TPS61025 LOAD TRANSIENT RESPONSE

Figure 14. TPS61027 LOAD TRANSIENT RESPONSE

Output Current 100 mA/div, DC

Output Current 100 mA/div, DC Output Voltage 20 mV/div, AC

VI = 1.2 V, IL = 100 mA to 200 mA, VO = 3.3 V

VI = 3.6 V, IL = 100 mA to 200 mA, VO = 5 V

Output Voltage 20 mV/div, AC

t - Time - 2 ms/div

t - Time - 2 ms/div

Figure 15.

Figure 16.

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

TYPICAL CHARACTERISTICS (continued)
TPS61025 LINE TRANSIENT RESPONSE
VI = 1.8 V to 2.4 V, RL = 33 , VO = 3.3 V

TPS61027 LINE TRANSIENT RESPONSE
VI = 3 V to 3.6 V, RL = 25 , VO = 5 V

Input Voltage 500 mV/div, AC

Output Voltage 20 mV/div, AC

t - Time - 2 ms/div

Output Voltage 20 mV/div, AC

Input Voltage 500 mV/div, AC

t - Time - 2 ms/div

Figure 17. TPS61025 START-UP AFTER ENABLE
Enable 5 V/div, DC Enable 5 V/div, DC

Figure 18. TPS61027 START-UP AFTER ENABLE

Output Voltage 1 V/div, DC

Output Voltage 2 V/div, DC

VI = 2.4V, RL = 33 , VO = 3.3 V Inductor Current 200 mA/div, DC

VI = 3.6 V, RL = 50 , VO = 5 V Inductor Current 500 mA/div, DC t - Time - 500 µs/div

t - Time - 1 ms/div

Figure 19.

Voltage At SW 2 V/div, DC

Figure 20.

Voltage At SW 2 V/div, DC

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

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DETAILED DESCRIPTION CONTROLLER CIRCUIT
The controller circuit of the device is based on a fixed frequency multiple feedforward controller topology. Input voltage, output voltage, and voltage drop on the NMOS switch are monitored and forwarded to the regulator. So changes in the operating conditions of the converter directly affect the duty cycle and must not take the indirect and slow way through the control loop and the error amplifier. The control loop, determined by the error amplifier, only has to handle small signal errors. The input for it is the feedback voltage on the FB pin or, at fixed output voltage versions, the voltage on the internal resistor divider. It is compared with the internal reference voltage to generate an accurate and stable output voltage. The peak current of the NMOS switch is also sensed to limit the maximum current flowing through the switch and the inductor. The typical peak current limit is set to 1500 mA. An internal temperature sensor prevents the device from getting overheated in case of excessive power dissipation. Synchronous Rectifier The device integrates an N-channel and a P-channel MOSFET transistor to realize a synchronous rectifier. Because the commonly used discrete Schottky rectifier is replaced with a low RDS(ON) PMOS switch, the power conversion efficiency reaches 96%. To avoid ground shift due to the high currents in the NMOS switch, two separate ground pins are used. The reference for all control functions is the GND pin. The source of the NMOS switch is connected to PGND. Both grounds must be connected on the PCB at only one point close to the GND pin. A special circuit is applied to disconnect the load from the input during shutdown of the converter. In conventional synchronous rectifier circuits, the backgate diode of the high-side PMOS is forward biased in shutdown and allows current flowing from the battery to the output. This device however uses a special circuit which takes the cathode of the backgate diode of the high-side PMOS and disconnects it from the source when the regulator is not enabled (EN = low). The benefit of this feature for the system design engineer is that the battery is not depleted during shutdown of the converter. No additional components have to be added to the design to make sure that the battery is disconnected from the output of the converter. Down Regulation In general, a boost converter only regulates output voltages which are higher than the input voltage. This device operates differently. For example, it is able to regulate 3.0 V at the output with two fresh alkaline cells at the input having a total cell voltage of 3.2 V. Another example is powering white LEDs with a forward voltage of 3.6 V from a fully charged Li-Ion cell with an output voltage of 4.2 V. To control these applications properly, a down conversion mode is implemented. If the input voltage reaches or exceeds the output voltage, the converter changes to a down conversion mode. In this mode, the control circuit changes the behavior of the rectifying PMOS. It sets the voltage drop across the PMOS as high as needed to regulate the output voltage. This means the power losses in the converter increase. This has to be taken into account for thermal consideration. Device Enable The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In shutdown mode, the regulator stops switching, all internal control circuitry including the low-battery comparator is switched off, and the load is isolated from the input (as described in the Synchronous Rectifier Section). This also means that the output voltage can drop below the input voltage during shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high peak currents drawn from the battery. Undervoltage Lockout An undervoltage lockout function prevents device start-up if the supply voltage on VBAT is lower than approximately 0.8 V. When in operation and the battery is being discharged, the device automatically enters the shutdown mode if the voltage on VBAT drops below approximately 0.8 V. This undervoltage lockout function is implemented in order to prevent the malfunctioning of the converter.

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DETAILED DESCRIPTION (continued)
Softstart When the device enables, the internal startup cycle starts with the first step, the precharge phase. During precharge, the rectifying switch is turned on until the output capacitor is charged to a value close to the input voltage. The rectifying switch is current limited during that phase. This also limits the output current under short circuit conditions at the output. After charging the output capacitor to the input voltage, the device starts switching. If the input voltage is below 1.4 V the device works with a fixed duty cycle of 50% until the output voltage reaches 1.4V. After that the duty cycle is set depending on the input output voltage ratio. Until the output voltage reaches its nominal value, the boost switch current limit is set to 40% of its nominal value to avoid high peak currents at the battery during startup. As soon as the output voltage is reached, the regulator takes control and the switch current limit is set back to 100%. Power Save Mode The PS pin can be used to select different operation modes. To enable power save, PS must be set low. Power save mode is used to improve efficiency at light load. In power save mode the converter only operates when the output voltage trips below a set threshold voltage. It ramps up the output voltage with one or several pulses and goes again into power save mode once the output voltage exceeds the set threshold voltage. This power save mode can be disabled by setting the PS to VBAT. In down conversion mode, power save mode is always active and the device cannot be forced into fixed frequency operation at light loads. Low Battery Detector Circuit--LBI/LBO The low-battery detector circuit is typically used to supervise the battery voltage and to generate an error flag when the battery voltage drops below a user-set threshold voltage. The function is active only when the device is enabled. When the device is disabled, the LBO pin is high-impedance. The switching threshold is 500 mV at LBI. During normal operation, LBO stays at high impedance when the voltage, applied at LBI, is above the threshold. It is active low when the voltage at LBI goes below 500 mV. The battery voltage, at which the detection circuit switches, can be programmed with a resistive divider connected to the LBI pin. The resistive divider scales down the battery voltage to a voltage level of 500 mV, which is then compared to the LBI threshold voltage. The LBI pin has a built-in hysteresis of 10 mV. See the application section for more details about the programming of the LBI threshold. If the low-battery detection circuit is not used, the LBI pin should be connected to GND (or to VBAT) and the LBO pin can be left unconnected. Do not let the LBI pin float. Low-EMI Switch The device integrates a circuit that removes the ringing that typically appears on the SW node when the converter enters discontinuous current mode. In this case, the current through the inductor ramps to zero and the rectifying PMOS switch is turned off to prevent a reverse current flowing from the output capacitors back to the battery. Due to the remaining energy that is stored in parasitic components of the semiconductor and the inductor, a ringing on the SW pin is induced. The integrated antiringing switch clamps this voltage to VBAT and therefore dampens ringing.

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SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

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APPLICATION INFORMATION DESIGN PROCEDURE
The TPS6102x dc/dc converters are intended for systems powered by a single up to triple cell Alkaline, NiCd, NiMH battery with a typical terminal voltage between 0.9 V and 6.5 V. They can also be used in systems powered by one-cell Li-Ion or Li-Polymer with a typical voltage between 2.5 V and 4.2 V. Additionally, any other voltage source with a typical output voltage between 0.9 V and 6.5 V can power systems where the TPS6102x is used.

Programming the Output Voltage
The output voltage of the TPS61020 dc/dc converter can be adjusted with an external resistor divider. The typical value of the voltage at the FB pin is 500 mV. The maximum recommended value for the output voltage is 5.5 V. The current through the resistive divider should be about 100 times greater than the current into the FB pin. The typical current into the FB pin is 0.01 µA, and the voltage across R4 is typically 500 mV. Based on those two values, the recommended value for R4 should be lower than 500 k, in order to set the divider current at 1 µA or higher. Because of internal compensation circuitry the value for this resistor should be in the range of 200 k. From that, the value of resistor R3, depending on the needed output voltage (VO), can be calculated using Equation 1:
R3 + R4 O *1 V FB V + 180 kW O *1 500 mV V

(1)

If as an example, an output voltage of 3.3 V is needed, a 1.0-M resistor should be chosen for R3. If for any reason the value for R4 is chosen significantly lower than 200k additional capacitance in parallel to R3 is recommended, in case the device shows instable regulation of the output voltage. The required capacitance value can be easily calculated using Equation 2: 200 kW * 1 C + 20 pF parR3 R4 (2)
L1 SW VBAT Power Supply C1 R1 EN LBI R2 PS GND LBO PGND TPS61020 Control Output FB R4 R5 VOUT C2 R3 C3 VCC Boost Output

Figure 21. Typical Application Circuit for Adjustable Output Voltage Option

Programming the LBI/LBO Threshold Voltage
The current through the resistive divider should be about 100 times greater than the current into the LBI pin. The typical current into the LBI pin is 0.01 µA, and the voltage across R2 is equal to the LBI voltage threshold that is generated on-chip, which has a value of 500 mV. The recommended value for R2 is therefore in the range of 500 k. From that, the value of resistor R1, depending on the desired minimum battery voltage VBAT, can be calculated using Equation 3.

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SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

V R1 + R2 V

BAT

LBI*threshold

*1

+ 390 kW

BAT * 1 500 mV

V

(3)

The output of the low battery supervisor is a simple open-drain output that goes active low if the dedicated battery voltage drops below the programmed threshold voltage on LBI. The output requires a pullup resistor with a recommended value of 1 M. If not used, the LBO pin can be left floating or tied to GND.

Inductor Selection
A boost converter normally requires two main passive components for storing energy during the conversion. A boost inductor and a storage capacitor at the output are required. To select the boost inductor, it is recommended to keep the possible peak inductor current below the current limit threshold of the power switch in the chosen configuration. For example, the current limit threshold of the TPS6102x's switch is 1800 mA at an output voltage of 5 V. The highest peak current through the inductor and the switch depends on the output load, the input (VBAT), and the output voltage (VOUT). Estimation of the maximum average inductor current can be done using Equation 4: V OUT I +I L OUT V 0.8 BAT (4) For example, for an output current of 200 mA at 3.3 V, at least 920 mA of average current flows through the inductor at a minimum input voltage of 0.9 V. The second parameter for choosing the inductor is the desired current ripple in the inductor. Normally, it is advisable to work with a ripple of less than 20% of the average inductor current. A smaller ripple reduces the magnetic hysteresis losses in the inductor, as well as output voltage ripple and EMI. But in the same way, regulation time at load changes rises. In addition, a larger inductor increases the total system costs. With those parameters, it is possible to calculate the value for the inductor by using Equation 5:
V L+ BAT DI V L ­V OUT BAT V OUT

(5)

Parameter f is the switching frequency and IL is the ripple current in the inductor, i.e., 20% × IL. In this example, the desired inductor has the value of 5.5 µH. With this calculated value and the calculated currents, it is possible to choose a suitable inductor. In typical applications a 6.8 µH inductance is recommended. The device has been optimized to operate with inductance values between 2.2 µH and 22 µH. Nevertheless operation with higher inductance values may be possible in some applications. Detailed stability analysis is then recommended. Care has to be taken that load transients and losses in the circuit can lead to higher currents as estimated in Equation 5. Also, the losses in the inductor caused by magnetic hysteresis losses and copper losses are a major parameter for total circuit efficiency. The following inductor series from different suppliers have been used with the TPS6102x converters: Table 1. List of Inductors
VENDOR Sumida Wurth Elektronik EPCOS Cooper Electronics Technologies INDUCTOR SERIES CDRH4D28 CDRH5D28 7447789 744042 B82462-G4 SD25 SD20

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Capacitor Selection
Input Capacitor At least a 10-µF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor or a tantalum capacitor with a 100-nF ceramic capacitor in parallel, placed close to the IC, is recommended. Output Capacitor The major parameter necessary to define the output capacitor is the maximum allowed output voltage ripple of the converter. This ripple is determined by two parameters of the capacitor, the capacitance and the ESR. It is possible to calculate the minimum capacitance needed for the defined ripple, supposing that the ESR is zero, by using Equation 6:
I C min + OUT *V OUT BAT DV V OUT V

(6)

Parameter f is the switching frequency and V is the maximum allowed ripple. With a chosen ripple voltage of 10 mV, a minimum capacitance of 24 µF is needed. The total ripple is larger due to the ESR of the output capacitor. This additional component of the ripple can be calculated using Equation 7: DV +I R ESR OUT ESR (7) An additional ripple of 16 mV is the result of using a tantalum capacitor with a low ESR of 80 m. The total ripple is the sum of the ripple caused by the capacitance and the ripple caused by the ESR of the capacitor. In this example, the total ripple is 26 mV. Additional ripple is caused by load transients. This means that the output capacitor has to completely supply the load during the charging phase of the inductor. A reasonable value of the output capacitance depends on the speed of the load transients and the load current during the load change. With the calculated minimum value of 24 µF and load transient considerations the recommended output capacitance value is in a 47 to 100 µF range. For economical reasons, this is usually a tantalum capacitor. Therefore, the control loop has been optimized for using output capacitors with an ESR of above 30 m. The minimum value for the output capacitor is 10 µF.

Small Signal Stability
When using output capacitors with lower ESR, like ceramics, the adjustable voltage version is recommended. The missing ESR can be compensated in the feedback divider. Typically a capacitor in the range of 4.7 pF in parallel to R3 helps to obtain small signal stability with lowest ESR output capacitors. For more detailed analysis, the small signal transfer function of the error amplifier and the regulator, which is given in Equation 8, can be used: 4 (R3 ) R4) A + d + REG V R4 (1 ) i w 0.9 ms) FB (8)

Layout Considerations
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC. The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the control ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current.

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

APPLICATION EXAMPLES
L1 6.8 µH Battery Input C1 10 µF R1 SW VBAT EN LBI R2 PS GND LBO PGND TPS61027 LBO FB R5 VOUT C2 2.2 µF C3 100 µF VCC 5 V Boost Output

List of Components: U1 = TPS61027DRC L1 = EPCOS B82462-G4682 C1, C2 = X7R,X5R Ceramic C3 = Low ESR Tantalum

Figure 22. Power Supply Solution for Maximum Output Power Operating from a Single Alkaline Cell
L1 6.8 µH Battery Input C1 10 µF R1 SW VBAT EN LBI R2 PS GND LBO PGND TPS61027 LBO FB R5 VOUT C2 2.2 µF C3 47 µF

VCC 5 V Boost Output

List of Components: U1 = TPS61027DRC L1 = EPCOS B82462-G4682 C1, C2 = X7R,X5R Ceramic C3 = Low ESR Tantalum

Figure 23. Power Supply Solution for Maximum Output Power Operating from a Dual/Triple Alkaline Cell or Single Li-Ion Cell

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

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TPS61020 L1 4.7 µH Input 0.9 V to 6.5 V C1 10 µF SW VBAT EN LBI PS GND FB C3 LBO PGND 10 nF R1 VOUT C2 22 µF D1

List of Components: U1 = TPS61020DRC L1 = Sumida CDRH2D16-4R7 C1, C2, C3 = X7R, X5R Ceramic D1 = White LED

Figure 24. Power Supply Solution for Powering White LED´s in Lighting Applications
L1 4.7 µH Input 1.8 V to 6.5 V C1 10 µF TPS61020 SW VBAT EN LBI PS GND VOUT C2 22 µF FB C3 LBO PGND Flashlight Comtrol List of Components: U1 = TPS61020DRC L1 = TDK VLF3010AT 4R7MR70 C1, C2, C3 = X7R, X5R Ceramic D1 = OSRAM LWW57G Q1 = Vishay SI1012R 22 µF R2 200 k Q1 R1 1.5 M D1

Figure 25. Simple Power Supply Solution for Powering White LED Flashlights

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

C5 0.1 µF L1 6.8 µH Battery Input C1 10 µF R1 SW VBAT EN LBI R2 PS GND List of Components: U1 = TPS61027DRC1 L1 = EPCOS B82462-G4682 C3, C5, C6, = X7R,X5R Ceramic C3 = Low ESR Tantalum DS1 = BAT54S

DS1 C6 1 µF VOUT C2 2.2 µF FB C3 47 µF R5

VCC2 10 V Unregulated Auxiliary Output

VCC1 5 V Boost Main Output

LBO PGND TPS61027

LBO

Figure 26. Power Supply Solution With Auxiliary Positive Output Voltage
VCC2 -5 V Unregulated Auxiliary Output

C5 0.1 µF L1 6.8 µH Battery Input C1 10 µF R1 SW VBAT EN LBI R2 PS GND List of Components: U1 = TPS61027DRC L1 = EPCOS B82462-G4682 C1, C2, C5, C6 = X7R,X5R Ceramic C3 = Low ESR Tantalum DS1 = BAT54S

DS1

C6 1 µF

VOUT C2 2.2 µF FB C3 47 µF R5

VCC1 5 V Boost Main Output

LBO PGND TPS61027

LBO

Figure 27. Power Supply Solution With Auxiliary Negative Output Voltage

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TPS61020, TPS61024 TPS61025, TPS61027
SLVS451A ­ SEPTEMBER 2003 ­ REVISED APRIL 2004

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THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below. · Improving the power dissipation capability of the PCB design · Improving the thermal coupling of the component to the PCB · Introducing airflow in the system The maximum recommended junction temperature (TJ) of the TPS6102x devices is 125°C. The thermal resistance of the 10-pin QFN 3 x 3 package (DRC) is RJA = 48.7 °C/W, if the PowerPAD is soldered. Specified regulator operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power dissipation is about 820 mW. More power can be dissipated if the maximum ambient temperature of the application is lower. T *T J(MAX) A P + + 125°C * 85°C + 820 mW D(MAX) R 48.7 °C W qJA (9)

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