Text preview for : Samsung SGH-D807 service manual_2006.pdf part of SAMSUNG SGH-D807 Service Manual Slide Quad Phone - Part 1/3, pag. 89



Back to : 2006_quad_band_phone_©_.p | Home

GSM TELEPHONE
SGH-D807

GSM TELEPHONE

CONTENTS 1. Safety Precautions 2. General Introduction 3. Specification 4. Product Function 5. Circuit Description 6. Test Command & Test Procedure 7. Array course control 8. Exploded View and Parts List 9. Disassembly and Assembly instructions 10. MAIN Electrical Parts List 11. Flow Chart of Troubleshooting 12. PCB Diagrams 13. Block Diagrams 14. Reference data

This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.

Samsung Electronics Co.,Ltd.
Code No.: GH68-10831A 2006. 05. Rev.1.0

Contents
1. Safety Precautions 1-1. Repair Precaution ...........................................................................1-1 1-2. ESD(Electrostatically Sensitive Devices) Precaution ...........................1-2 2. General Introduction 3. Specification 3-1. GSM General Specification ..............................................................3-1 3-2. GSM TX power class ......................................................................3-2 3-3. EDGE TX Power Level ....................................................................3-3 4. Product Function 5. Circuit Description 6. Test Command & Test Procedure 6-1. Calibration Equipment ....................................................................6-1 6-2. Calibration Program .......................................................................6-1 6-3. Tx Power Tune up Procedure ..........................................................6-2 7. Array course control 7-1. Downloading Binary Files ................................................................7-1 7-2. Pre-requisition for Downloading .......................................................7-1 7-3. S/W Downloader Program ...............................................................7-2 7-4. How to Download ..........................................................................7-2 8. Exploded View and Parts List 8-1. Cellular phone Exploded View .........................................................8-1 8-2. Cellular phone Parts list .................................................................8-2 9. Disassembly and Assembly instructions 9-1. Disassembly ..................................................................................9-1 9-2. Assembly ......................................................................................9-7 9-3. KIT Assembly ..............................................................................9-10 9-4. Window Disassembly ....................................................................9-13

Contents
10. MAIN Electrical Parts List 11. Flow Chart of Troubleshooting 11-1. Baseband 11-1-1. Power ON ..............................................................................11-1 11-1-2. Initial ....................................................................................11-6 11-1-3. Sim Part ...............................................................................11-9 11-1-4. Microphone Part ...................................................................11-10 11-1-5. Speaker Part_1(MP3, SPEAKER PHONE) .................................11-12 11-1-6. Speaker Part_2(RECEIVER) ...................................................11-16 11-1-7. Charging Part ......................................................................11-18 11-2. RF 11-2-1. GSM850/EGSM RX ................................................................11-21 11-2-2. DCS RX ...............................................................................11-23 11-2-3. PCS RX ...............................................................................11-25 11-2-4. GSM850/EGSM TX ................................................................11-26 11-2-5. DCS/PCS TX ........................................................................11-28 12. PCB Diagrams 13. Block Diagrams 14. Reference data

1. Safety Precautions
1-1. Repair Precaution
Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because specipicty of cellular phone is sensitive for surrounding interference(RF noise). Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by the influence of manetic force. Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn away. Use a thicken twisted wire when you measure level. A thicken twisted wire has low resistance, therefore error of measurement is few. Repair after separate Test Pack and Set because for short danger (for example an overcurrent and furious flames of parts etc) when you repair board in condition of connecting Test Pack and tuning on. Take specially care of soldering, because Land of PCB is small and weak in heat. Surely tune on/off while using AC power plug, because a repair of battery charger is dangerous when tuning ON/OFF PBA and Connector after disassembing charger. Don't use as you pleases after change other material than replacement registered on SEC System. Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

1-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Safety Precautions

1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easilly by static electricity. Such parts are called by ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below. You can prevent from ESD damage by static electricity. Remove static electricity remained your body before you touch semiconductor or parts with semiconductor. There are ways that you touch an earthed place or wear static electricity prevention string on wrist. Use earthed soldering steel when you connect or disconnect ESD. Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by static electricity. Don't unpack until you set up ESD on product. Because most of ESD are packed by box and aluminum plate to have conductive power,they are prevented from static electricity. You must maintain electric contact between ESD and place due to be set up until ESD is connected completely to the proper place or a circuit board.

1-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

2. General Introduction
The SGH-D807 Quad Band phone functions as digital phone working in GSM (Global System for Mobile communications)850,EGSM900, DCS1800 and PCS(PersonalCommunication System)1900 modes.


Dimension LCD R/F band Vocoder Antenna SIM BLUETOOTH

: 99.9x52.0x15.4 mm (with Standard Battery) : QCIF(176×220) TFT, 2.12" : GSM850 / EGSM 900 / DCS1800 / PCS1900 : EFR + FR + HR + AMR : Intenna type : 3 Voltage operation : VER 1.2




MS Class GPRS Phase Multi-slot SMG Coding scheme Power class : : : : : :

Class B GSM Phase II+ GPRS/EGPRS Class 10 (2 Up-link, 4 Down-link, 5 Sum) SMG #31 CS1 - CS4(GPRS), MCS5 - MCS9(EGPRS) support GSM850 - Class 4 (2W) EGSM900 - Class 4 (2W) DCS1800 - Class 1 (1W) PCS1900 - Class 1 (1W)



WAP 2.0 Browser SIM AT(Application Toolkit) 40 Polyphonic Ringtone

< Basic Package >
Handset + Standard Battery + TA + User Guide

< Option Item >
Battery : Li-Ion, 880mA Travel Adapter Ear Microphone Bluetooth Headset Bluetooth Hands Free Kit Car Charger/Adapter

2-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

3. Specification
3-1. GSM General Specification
GSM850
F r e q . Ba n d [ M Hz ] Uplink/ Downlink A RFCN rang e T x /Rx s pacing GP RS 824~849 869~894 128~251 45 MHz 270.833 Kb ps 3. 692 us 812.5 K b ps 3. 692 us 576. 9 u s 4.615 ms 0.3 G M SK 8 PSK 33 d Bm~5 d Bm 27~5 dBm 5~19(class4) 8~19( class E 2) - 102 dBm 8 35 Km

EGSM900
880~915 925~960 0~124& 975~1023 45 MHz 270.833 Kb ps 3. 692 us 812.5 K b ps 3. 692 us 576. 9 u s 4.615 ms 0.3 G M SK 8 PSK 33 d Bm~5 d Bm 27~5 dBm 5~19(class4) 8~19( class E 2) - 102 dBm 8 35 Km

DCS1800
1710~1785 1805~1880 512~885 95 MHz 270.833 Kb ps 3. 692 us 812.5 K b ps 3. 692 us 576. 9 u s 4.615 ms 0.3 G M SK 8 PSK 30 d Bm~0 d Bm 26~0 dBm 0~15(class1) 2~15(class E2) - 100 dBm 8 2 Km

PCS1900
1850~1910 1930~1990 512~810 80 M Hz 270.833 Kbp s 3.692 us 812.5 K bp s 3.692 us 576.9 u s 4.615 ms 0.3 G MS K 8 PSK 30 dBm~0 d Bm 26~0 dBm 0~15(class1) 2~15(class E2) -102 d Bm 8 2 Km

Mod. Bit r ate/ Bit P eriod

EDGE

Time Slot Period/ Fr ame Period GP RS Modu lation EDGE GP RS M S P o wer ED G E GP RS P ower L evel ED G E Sens itivity T D MA Mux Cell Radius

3-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Specification

3-2. GSM TX power class
TX Power control level 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 TX Power control level 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 TX Power control level 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 TX Power control level 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

GSM850

EGSM900

DCS1800

PCS1900

33±2 dBm 31±2 dBm 29±2 dBm 27±2 dBm 25±2 dBm 23±2 dBm 21±2 dBm 19±2 dBm 17±2 dBm 15±2 dBm 13±2 dBm 11±2 dBm 9±2 dBm 7±2 dBm 5±2 dBm

33±2 dBm 31±2 dBm 29±2 dBm 27±2 dBm 25±2 dBm 23±2 dBm 21±2 dBm 19±2 dBm 17±2 dBm 15±2 dBm 13±2 dBm 11±2 dBm 9±2 dBm 7±2 dBm 5±2 dBm

30±3 dBm 28±3 dBm 26±3 dBm 24±3 dBm 22±3 dBm 20±3 dBm 18±3 dBm 16±3 dBm 14±3 dBm 12±4 dBm 10±4 dBm 8±4 dBm 6±4 dBm 4±4 dBm 2±5 dBm 0±5 dBm

30±3 dBm 28±3 dBm 26±3 dBm 24±3 dBm 22±3 dBm 20±3 dBm 18±3 dBm 16±3 dBm 14±3 dBm 12±4 dBm 10±4 dBm 8±4 dBm 6±4 dBm 4±4 dBm 2±5 dBm 0±5 dBm

3-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Specification

3-3. EDGE TX Power Level

TX Power control level 8 9 10 11 12 13 14 15 16 17 18 19

GSM850

TX Power contro l level 8 9 10 11 12 13 14 15 16 17 18 19

EGSM900

TX Power control level 2 3 4 5 6 7 8 9 10 11 12 13 14 15

DCS1800

TX Power control level 2 3 4 5 6 7 8 9 10 11 12 13 14 15

PCS1900

27±3 dBm 25±3 dBm 23±3 dBm 21±3 dBm 19±3 dBm 17±3 dBm 15±3 dBm 13±3 dBm 11±5 dBm 9±5 dBm 7±5 dBm 5±5 dBm

27±3 dBm 25±3 dBm 23±3 dBm 21±3 dBm 19±3 dBm 17±3 dBm 15±3 dBm 13±3 dBm 11±5 dBm 9±5 dBm 7±5 dBm 5±5 dBm

26±3 dBm 24±3dBm 22±3dBm 20±3dBm 18±3dBm 16±3dBm 14±3dBm 12±4dBm 10±4dBm 8±4dBm 6±4dBm 4±4dBm 2±5dBm 0±5dBm

26±3 dBm 24±3 dBm 22±3 dBm 20±3 dBm 18±3 dBm 16±3 dBm 14±3 dBm 12±4 dBm 10±4 dBm 8±4 dBm 6±4 dBm 4±4 dBm 2±5 dBm 0±5 dBm

3-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

4. Product Function
Main Function
- 1.3 Mega Pixel Camera - Instant Messaging Capability - Multimedia Capability - Bluetooth Wireless Technology - Voice Command Feature - Speakerphone Capability - Personal Assistant feature provides alarms, calendar, calculator, timer, stopwatch, record audio, world time, and converter.

4-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

5. Circuit Description
< RF Circuit Description of SGH-D807 >
1. FEM (DUF400) ==> Switching Tx, Rx path for GSM850, EGSM900, DCS1800 and PCS1900 controlled by logic. Integration of GSM850, EGSM900, DCS1800 and PCS1900 RX SAW Filters. To convert Electromagnetic Field Wave to Acoustic Wave and the pass the specific frequency band. - for filtering the frequency band 824 ~ 849 / 869 ~ 894 MHz - for filtering the frequency band 880 ~ 915 / 925 ~ 960 MHz - for filtering the frequency band 1710 ~ 1785 / 1805 ~ 1880 MHz - for filtering the frequency band 1850 ~ 1910 / 1930 ~ 1990 MHz 2. FEM Control Logic ==> Truth Table VC1 GSM850 Rx Mode EGSM900 Rx Mode GSM850/EGSM900 Tx Mode DCS/PCS Rx Mode DCS/PCS Tx Mode 3. VC-TCXO(TCX400) ==> To generate the 26 MHz reference clock to drive the logic and RF. After additional process, the reference clock applies to the U401 VCXOB pin to modulate TXIQ and demodulate RXIQ. 4. HD155154NP (U405) ==> The HD155154NP is a RF tranceiver IC for GS850, EGSM900 DCS1800 and PCS1900 QUAD band cellular systems, and incorporates EDGE tranceiver capabillity, and integrates most of the low power silicon functions of a tranceiver. The HD155154NP incorporates triple RF LNAs, direct conversion mixers which are IQ demodulator, an auto offset calibrated programmable gain amplifier with baseband filter for both IQ chains, RF architecture for the transmitter. Moreover the HD155154NP includes power mode controller to optimize the power consumption. These functions can operate down to 2.7V and are housed in a 48-pin DPE QFN SMD package. L L L L H VC2 L L H L L VC3 H L L L L

5-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Circuit Description

- RX Function Differential Low Noise Amplifiers Direct Conversion mixer and IQ demodulator with 90 degree phase splitter. Auto offset calibrated programmable gain amplifier with baseband filter(PGA) - TX Function I/Q modulator with 90 degree phase splitter Offset PLL - Phase comparator included fast lock system (Digital phase detector)

Polar loop - Lineariser - Voltage gain amplifier - Inverse voltage gain amplifier - Down converter - AM detector PLL Synthesiser - RF Synthesiser for RX/TX RF local included fast lock system - 400kHz comparison frequency to achieve faster lock-up time 5. POWER AMP (PAM406) ==> The PF09025B is a high-power, high-efficiency power amplifier module with integrated power control Quad band Polar Loop Amplifier for GSM850 (824 to 849 MHz), GSM900(880 to 915 MHz), DCS1800(1710 to 1785 MHz) and PCS1900 (1850 to 1910 MHz). For 3.5 V normal operation Built in LDO Superb output linearity High gain 3-stage amplifier : +5dBm input typical GPRS / EGPRS Operation Compatible Small package : 8.0 X 8.0 mm

5-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Circuit Description

< Baseband

Circuit description of SGH-D807 >

1. CSP2750 (UCD101) ==> The CSP2750 has two major logical components power management and conversion signal processing. The PSC component is responsible for all power-related functionality, including the following; Power management for RF, BB and ancillary devices within the GSM/GPRS Battery-charge management Reset control SIM card voltage-level shifting The CSP component is responsible for the following ; Intraframe event scheduling Voice band processing, including voice band ADC and DAC Analog baseband processing, including baseband ADC and DAC Providing RF interface for Trident digital baseband device Transmitter Power control Automatic frequency control A5 ciphering Low-power sleep mode and wake-up control The CSP2750 has the following major physical components; Timing and control unit RF serial interface Low-power sleep mode controller Baseband Transmitter / Receiver Voice input and output

5-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Circuit Description

2. WM8955L(UCD503) ==> The WM8955L is a low power, high quality stereo DAC with intergrated headphone and loudspwaker amplifiers, designed to reduce external component requirements in portable digital audio application. The on-chip headsphone amplifiers can deliver 40mW into a 16 load. Advanced on-chip digital signal processing performs bass and treble tone comtrol. The WM8955L can operate as a master or a slave, and include an on-chip PLL. It can use most master clock frequencies commonly found in portable systems, including USB,GSM, CDMA or PDC clocks, or standard 256fs, clock rates. Different audio sample rates such as 48khz, 44.1khz, 8khz and many other are supported. The WM8955L operates on supply voltages from 1.8V up to 3.6V, although the digital core can operates on a separate supply down to 1.42V, saving power. Different section of the chip can also be powered down under software control.

3. HPE(UCP201) ==> The Trident-HPE digital baseband processor is a complete system IC designed for wireless terminals that includes two digital signal processor(DSP) cores optimized for low-power communications applications and a powerful, highperformance, industry-standard microcontroller core along with a rich set of peripherals. The Trident-HPE digital baseband processor achieves best-in-class signal processing performance while maintaining the efficient software code density, low power consumption, and small physical size required for GSM/GPRS terminals ARM946E-S microcontroller core; 101 MHz system bus, 16 kbyte instruction and 16kbyte data caches. 8 kbyte tightly coupled zero wait-state instruction and 4kbyte tightly coupled zero waitstate data memory direct memory access controller for transparent transfer between memory and peripherals. External Memory interface with asynchronous burst mode support Synchronous serial port supporting Programmable 48-bit general-purpose IO unit, keyboard interface, programmable interval timer and real-time clock.
5-4

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Circuit Description

SD/MMC controller that supports interfacing to secure digital/multimedia memory card. Two DSP16000 dual-MAC DSP cores; Up to 404 million MACs per second at 101 MHz. Memory complement; - DSP0 : 144K X 16-bit ROM, 40k X 16-bit RAM. - DSP1 : 96K X 16-bit ROM, 16k X 16-bit RAM. JTAG boundary scan and integrated H/W developement system Low power; Ultralow leakage process technology for best-in-class standby power Flexible power management modes to allow for maximum active power management Interprocessor communication hardware support between ARM, DSP0 and DSP1. Supported by Trident-HPE digital baseband processor software and hardware developement tools as well as industry standard ARM software and hardware developement tools Two on-chip, programmable, PLL clock synthesizers; - one for ARM and DSP, the other one for USB.

5-5

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

6. Test Command & Test Procedure
6-1. Calibration Equipment
HP 8960 DC Power Supply Test Jig Configuration
HP8960

RF

DC POWER SUPPLY GPIB +

+

-TEST JIG Serial GPIB Serial

PC

6-2. Calibration Program
- Samsung internal software

6-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Test Command & Test Procedure

6-3. Tx Power Tune up Procedure
- GMSK 1) Procedure: a. Calibraion equipment HP8960 and the cell phone are connected through RF cable. b. Target power ( required power level according to the specification which should be set by calibration program) is set to equipment as power level (ex: GSM 5 level is 32.5 dBm). c. Activate phone in Tx_Mode_Only. d. HP8960 equipment measures transmitted power through rf test cable from the phone and reports measured level to calibration program. e. The program compares measured power with the target power. f. The calibration program decides power code which is defined in advance in the program and writes the codes to the flash memory in the phone. 2) Target value is defined according to the value of GSM specification. See the TX power level definition table below. 3) Target values of the peak level of the phone are set normally in conducted mode - GSM850 5 level : 32.5 dBm - EGSM900 5 level : 32.5 dBm - DCS 0 level : 29.5 dBm - PCS 0 level : 30.2 dBm (Tolerance : -2 dB ~ +1 dB ) 4) Accuracy All the TX level from the phone after tuned-up satisfy the GSM specification 5) TX ramp mask specification applied to the calibration program :

6-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Test Command & Test Procedure

- 8PSK

1) Procedure: a. Calibraion equipment HP8960 and the cell phone are connected through RF cable. b. Target power ( required power level according to the specification which should be set by calibration program) is set to equipment as power level (ex: GSM 8 level is 27 dBm). c. Activate phone in Cont_8psk_Tx_Mode_Only. d. HP8960 equipment measures transmitted power through rf test cable from the phone and reports measured level to calibration program. e. The program compares measured power with the target power. f. The calibration program decides power code which is defined in advance in the program and writes the codes to the flash memory in the phone.

6-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Test Command & Test Procedure

2) Target value is defined according to the value of EGPRS specification. See the TX power level definition table below. 3) Target values of the peak level of the phone are set normally in conducted mode - GSM850 8 level : 27 dBm - EGSM900 8 level : 27 dBm - DCS 2 level : 26 dBm - PCS 2 level : 26 dBm (Tolerance : -2 dB ~ +1 dB ) 4) Accuracy All the TX level from the phone after tuned-up satisfy the EGPRS specification 5) TX ramp mask specification applied to the calibration program :

6-4

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

7. Array course control
· D807 DATA Cable and JTAG

Software Downloading 7-1. Downloading Binary Files · A binary file for downloading D807. - gsmstack.s3

7-2. Pre-requisition for Downloading · Downloader Program(Optiflash.exe) - Optiflash version 4.16 T1 S01 · D807 Mobile Phone · Data Cable · Binary file

7-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Array course control

7-3. S/W Downloader Program · Optiflash application · Path: version(D807ucfb6)\utils\SIBLEY_OPTIFLASH\optiflash.exe

7-4. How to Download Connect the data cable and press '*(star)' key on the keypad simultaneously. Run Optiflash application (Optiflash.exe)

7-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Array course control

File open

· Select an existing load file ( usually, gsmstack.s3 )

7-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Array course control

Option

· Click 'Settings' , Display as below.

* Generic · Specify Hardware Platform: Select a model and platform (USB) · Misc.Settings : Check the 'Debug Mode' and 'Erase All Unused Regions'

7-4

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Array course control

* COM Port

· Select com port - if you don't know the usb port, please see the control pannel. (Device Manager ­ Hardware ­ Port)

7-5

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Array course control

* Flash and Verify

· Click 'Browse' button - file to load and verify · Check the reserved memory regions All procedures are done, Click 'Flash' Button.

7-6

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Array course control

Pop up the window as below. Type the "yes" and Click 'OK'

Start Download.

· Display status of downloading progress.

7-7

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Array course control

Display "All is well" and the D807 will reboot automatically.

After download.. · You do "Full service reset" by pressing key button "*2767*3855#". · You can see S/W version by pressing key button "*#9998*1234#".

7-8

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

8. Exploded View and Parts List
8-1. Cellular phone Exploded View

QFR06 QFU01 QKP01 QME01 QME06

QMI03 QFR01 QLC01 QPC01 QCR32 QCA01

QKP02

QME02

QCR32

QMP01 QCA05

QFL01

QCR17

QCR05 QAN05 QSC01

QAN02 QCH05 QRE01

QRF03 QVO01 QBA01 QRF01 QBA00

QCR06

8-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Exploded View and Parts List

8-2. Cellular phone Parts list
QAN02 QAN05 QBA00 QBA01 QCA01 QCA05 QCH05 QCR04 QCR05 QCR17 QCR32 QCR32 QFL01 QFR01 QFR06 QFU01 QKP01 QKP02 QLC01 QME01 QME02 QME06 QMI03 QMP01 QPC01 QRE01 QRF01 QRF03 QSC01 QVO01 INTENNA-SGHD807 ASSY MEC-RUBBER INTENNA CONTAC PMO-BATT COVER V1 INNER BATTERY PACK-800MAH,BLK, UNIT-CAMERA ASSY MEC-CAMERA DECO PMO-MICRO SD COVER SCREW-MACHINE SCREW-MACHINE SCREW-MACHINE SCREW-MACHINE SCREW-MACHINE ASSY MEC-SLIDE LOWER HINGE ASSY MEC-CASE FRONT PMO-CASE FRONT U BUSH ASSY CASE-SLIDE UPPER ASSY MEC-KEYPAD(CIN/ZK) ASSY MEC-KEYPAD SUB MEA-LCD MODULE KIT UNIT-3X4 KEY FPCB ASSY UNIT-NAVY KEY FPCB UNIT-MODULE SPEAKER ASSY MEC-MIC HOLDER PBA MAIN-SGHD807 MEA-SLIDE FPCB KIT ASSY MEC-CASE REAR PMO-RF COVER 2 PMO-EARJACK COVER RMO-LOWER SCREW CAP PMO-VOLUM KEY GH42-00749A GH75-09496A GH72-28679A GH43-02389A GH59-02729A GH75-07777A GH72-27731A 6001-001479 6001-001478 6001-001460 6001-001700 6001-001700 GH75-08808A GH75-08730A GH72-27384A GH98-01668A GH75-08727A GH75-07758A GH97-05871A GH59-02878A GH59-02866A GH59-03051A GH75-09497A GH92-02519A GH97-05904A GH75-08731A GH72-25716A GH72-24043A GH73-05237A GH72-24041A

8-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Exploded View and Parts List

CBF INTERFACE-SGHE900,DLC,B_TY ADAPTOR-SGHE900,BLK,PHIL,B_TYP S/W CD-SGH-D807 PC STUDIO 3.0 UNIT-EARPHONE,SGHE900,BLK,D-TY LABEL(P)-INTENNA WARNING LABEL MPR-BOHO VINYL MAIN WIN MPR-TAPE MAIN CONN COVER MPR-TAPE MAIN FPCB SHIELD MPR-TAPE LCD CONN BASE MPR-TAPE INS COVER MAIN MPR-TAPE TEST POINT LABEL(R)-WATER SOAK AS-WINDOWS SVC AS-SPK GASKET(T.0.5) LABEL(R)-WATER SOAK T_MOBILE MPR-BOHO VINYL FUNCTION MPR-TAPE LCD CONN COVER MPR-TAPE KEY FPCB CONN MPR-TAPE FRONT SCREW MPR-VINYL BOHO UPPER B MPR-VINYL BOHO FRONT BUS MPR-TAPE CONN COVER MPR-TAPE SPRING ANCHOR MPR-TAPE MAIN FPCB SHIELD MPR-GASK TAPE ASSY MEC-RUBBER KEY FPCB MPR-TAPE UPPER LCD MANUAL USERS-ROGERS ENGLISH MANUAL USERS-ROGERS FRENCH MANUAL USERS-ROGERS QRC BAG PE LABEL(R)-MAIN(RWC) CUSHION-CASE(CIN) BOX(P)-UNIT MAIN(CKD-CHINA)

GH39-00654A GH44-01343A GH46-00274A GH59-03537A GH68-09868A GH74-15426A GH74-19552A GH74-22333A GH74-19553A GH74-20753A GH74-20754A GH68-09361A GH81-03625A GH81-03355A GH68-05914A GH74-18027A GH74-19561A GH74-19564A GH74-20758A GH74-20768A GH74-21091A GH74-21709A GH74-21711A GH74-22333A GH74-22658A GH75-09498A GH74-27527A GH68-11340A GH68-11341A GH68-11342A 6902-000634 GH68-09538B GH69-03758A GH69-03760A

8-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

9. Disassembly and Assembly instructions
9-1. Disassembly

1

2

Unscrew 4 places of the Rear

Open the Ear Cover.

3

4

Open the lower part of Rear's right side using stick for disassembly.

Pull stick for disassembly and opens Rear's right side Hook

5

6

Open the Rear's left side Hook.

Push the Rear and unlock top portion Hook 2 places, disassemble the Rear.
9-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

7

8

Unscrew

2 places of PBA.

Down Slide.

9

10

Remove the PBA carafully.

Remove the Key Connector.

11

12

Control the Slide and makes the FPCB longest.

Remove a electric conduction Tape and a insulation Tape on the FPCB Connector using tweezers.
9-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

13

14

Open the cover of the Connector using wide surface of a tweezers.

Pull out the Slide FPCB carefully in the Connector.

15

16

Remove a insulation Tape and a electric conduction Tape that is covering Screw.

Unscrew 6 places of Front.

17

18

disassemble the Front.

Remove the Screw Cap that is covering the Slide Lower.
9-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

19

20

Unscrew on the Slide Lower

Push stick for disassembly with the picture in the Slide's corner.

21

22

Pull out the Hook of the Lower's top portion and disassemble Slide Lower.

Remove the FPCB's fixing Tape.

23

24

Remove the Connector's fixing Tape.

Open the Connector cover.

9-4

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

25

26

Pull out the Slide FPCB.

Remove the Connector insulation Tape.

27

28

Remove the ESD electric conduction Tape.

disassemble the SPK Module.

29

30

disassemble the Camera Module.

disassemble the Sub Key PBA.

9-5

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

31

disassemble the LCD Module.

9-6

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

9-2. Assembly

1

2

3

Assemble the LCD and Sub Assemble the Sub Key PBA, After the ESD electric Camera, SPK gradually. conduction Tape sticking, Keypad to Front. attach a insulation tape on Connector.

4

5

6

Attach a insulation Tape according to Main FPCB's white surface. Attach a Assemble the LCD's FPCB. electric conduction Tape according to gilding end line.

Attach as do not pass over the FPCB's gilding part.

9-7

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

7

8

9

Inserts

two places of

Attach Screw Cap in 2 places of the top portion after screw on the Slide Lower's 6 places.

screw on the Front's places .

6

Hook's lower part and assembles Slide Lower.

10

11

12

Attach a insulation Tape and a electric conduction Tape on a screw.

Combine the FPCB with the Sets in white surface of PBA. FPCB on Connector, and set a insulation Tape in gilding surface. Then, a insulation Tape attaches electric conduction Tape .

9-8

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

13

14

Connect the 3*4 Key Connector.

Combine

fix Screw 2 places of the PBA.

15

16

Assemble the Rear Hook's top portion.

Assemble the Set's right side Hook.

17

18

Assemble the Set's left side Hook.

9-9

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

9-3. KIT Assembly

Attach LCD on Upper's inside.

State that LCD sticks on inside

Take care so that ESD electric conduction Tape may not reach with surrounding Chip.

Connect Sub Key PBA, Camera, Spk to sequential connector.

After attach ESD electric conduction Tapes, attach insulation tapes according to base line that is written to LCD. (All connectors should be covered.)

9-10

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

13

14

Attach a insulation Tape according to the Main FPCB's white surface.Then, attach a Assemble the SLIDE FPCB with the Connector. electric conduction Tape depending on end line which do gilding.

15

16

Must not pass over the FPCB's gilding part.

The Lower assembly and the Screw combine. Combine a Screw after assemble the Front.

17

18

Attach a insulation Tape and a electric conduction Tape on the base line .

Combine the FPCB with the PBA.
9-11

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

19

Place a insulation Tape according to the FPCB's white surface on the Connector correctly. Attach electric conduction Tape on gilding surface.

9-12

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

9-4. Window Disassembly

1

2

Infix tweezers in middle groove of the LCD top portion.

Put end of tweezers at groove until the WINDOW goes up little bit.

3

4

Lift the window, at the same time put tweezers into the window's right side

Lift the window, at the same time puts tweezers into the window's left side.

5

6

Lift the WINDOW between the gab using a finger.

Lift WINDOW with two hands slightly.

9-13

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Disassembly and Assembly instructions

7

Check that the WINDOW's end segment has in the LCD top portion.

the step.

There is no step at the opposite, and assembles the Window with the step locating

8

The Wide surface among steps sticks directly with the LCD, and assembles the WINDOW to under portion direction after set end of the LCD top portion with the WINDOW.

9

After assemble finally the LCD's under portion, confirm whether the GAB does not happen between the WINDOW and the LCD
9-14

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

10. MAIN Electrical Parts List
SEC CODE 0403-001411 0403-001427 0403-001511 0403-001547 0406-001150 0406-001150 0406-001150 0406-001150 0406-001190 0406-001190 0406-001190 0406-001210 0406-001210 0406-001210 0406-001210 0504-000168 0801-002958 0801-002975 0801-002993 0801-002995 0801-003022 1001-001306 1001-001400 1002-001441 1003-001716 1009-001018 1108-000046 1201-002240 1201-002267 1203-003340 1203-003432 1203-003432 1203-003523 1203-003523 1203-003754 1203-003789 1203-004119 1203-004151 1203-004253 1205-002272 1205-002568 1205-002652 Design LOC AN400 ANT401 ANT402 BAT100 BTC502 C100 C101 C102 C103 C104 C105 C106 C107 C108 C109 C110 C111 C112 C113 C114 C115 C116 C117 C118 C119 C120 C121 C122 C123 C124 C125 C126 C127 C128 C129 C130 C133 C135 C136 C137 C138 C139 Discription DIODE-ZENER DIODE-ZENER DIODE-ZENER DIODE-ZENER DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS DIODE-TVS TR-DIGITAL IC-CMOS LOGIC IC-CMOS LOGIC IC-CMOS LOGIC IC-CMOS LOGIC IC-CMOS LOGIC IC-ANALOG MULTIPLEX IC-ANALOG SWITCH IC-D/A CONVERTER IC-EL DRIVER IC-HALL EFFECT S/W IC-MCP IC-AUDIO AMP IC-POWER AMP IC-POSI.FIXED REG. IC-POSI.FIXED REG. IC-POSI.FIXED REG. IC-POSI.FIXED REG. IC-POSI.FIXED REG. IC-POSI.FIXED REG. IC-POWER SUPERVISOR IC-POWER SUPERVISOR IC-BATTERY IC-DC/DC CONVERTER IC-TRANSCEIVER IC-SWITCH IC-TRANSCEIVER STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA

10-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

SEC CODE 1404-001165 1405-001082 1405-001082 1405-001082 1405-001082 1405-001082 1405-001082 2007-000137 2007-000138 2007-000138 2007-000138 2007-000138 2007-000139 2007-000139 2007-000143 2007-000148 2007-000148 2007-000161 2007-000170 2007-000170 2007-000170 2007-000171 2007-000171 2007-000171 2007-000171 2007-000171 2007-000171 2007-000171 2007-000173 2007-000173 2007-000242 2007-000690 2007-000775 2007-000982 2007-001217 2007-001292 2007-001292 2007-002797 2007-002965 2007-002965 2007-007107 2007-007107

Design LOC C200 C201 C202 C203 C204 C205 C206 C207 C208 C209 C210 C211 C212 C213 C214 C215 C216 C217 C218 C219 C220 C221 C222 C223 C224 C225 C226 C227 C228 C229 C230 C300 C301 C302 C303 C304 C305 C306 C307 C308 C309 C310

Discription THERMISTOR-NTC VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP

STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA

10-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

SEC CODE 2007-007107 2007-007107 2007-007134 2007-007134 2007-007142 2007-007142 2007-007142 2007-007142 2007-007316 2007-007318 2007-007528 2007-007528 2007-007528 2007-007528 2007-007586 2007-007588 2007-008051 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008055 2007-008057 2007-008117 2007-008210 2007-008210 2007-008419 2007-008419 2007-008419 2007-008419 2007-008419 2007-008420 2007-008478 2007-008478 2007-008483 2007-008483 2007-008483

Design LOC C311 C312 C313 C315 C318 C319 C320 C321 C322 C323 C324 C325 C329 C330 C331 C333 C334 C335 C336 C337 C338 C339 C340 C341 C342 C344 C345 C346 C347 C348 C400 C401 C404 C405 C406 C407 C408 C409 C410 C411 C412 C414

Discription R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP

STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA

10-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

SEC CODE 2007-008483 2007-008483 2007-008483 2007-008483 2007-008483 2007-008483 2007-008483 2007-008483 2007-008483 2007-008486 2007-008516 2007-008516 2007-008516 2007-008516 2007-008516 2007-008516 2007-008516 2007-008531 2007-008531 2007-008531 2007-008531 2007-008531 2007-008531 2007-008542 2007-008542 2007-008542 2007-008542 2007-008542 2007-008582 2007-008582 2007-008582 2007-008582 2007-008587 2007-008587 2007-008588 2007-008806 2007-008806 2007-008816 2007-008816 2007-009158 2007-009208 2007-009208

Design LOC C415 C416 C417 C418 C419 C420 C421 C422 C423 C424 C425 C426 C427 C428 C429 C430 C431 C432 C433 C434 C435 C436 C438 C439 C440 C441 C442 C443 C444 C445 C446 C447 C448 C449 C450 C451 C452 C453 C454 C455 C456 C457

Discription R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP

STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA

10-4

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

SEC CODE 2007-009208 2007-009223 2203-000233 2203-000254 2203-000254 2203-000254 2203-000254 2203-000254 2203-000254 2203-000254 2203-000254 2203-000254 2203-000278 2203-000359 2203-000438 2203-000438 2203-000438 2203-000438 2203-000489 2203-000550 2203-000550 2203-000627 2203-000627 2203-000627 2203-000654 2203-000654 2203-000812 2203-000812 2203-000812 2203-000812 2203-000812 2203-000836 2203-000995 2203-000995 2203-001153 2203-001412 2203-001412 2203-001412 2203-002982 2203-005056 2203-005056 2203-005138

Design LOC C458 C459 C500 C501 C502 C504 C505 C506 C508 C509 C510 C512 C513 C514 C515 C517 C518 C519 C520 C522 C523 C524 C525 C527 C529 C530 C531 C532 C533 C534 C535 C536 C537 C538 C539 C540 C541 C542 C545 C547 C548 C549

Discription R-CHIP R-CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP

STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SNA SNA SNA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SNA SA SA SA

10-5

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

SEC CODE 2203-005138 2203-005344 2203-005344 2203-005344 2203-005395 2203-005395 2203-005446 2203-005446 2203-005514 2203-005514 2203-005514 2203-005514 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682 2203-005682

Design LOC C550 C551 CD200 CN300 D504 DUF400 F301 F302 F303 F304 HDC301 IFC501 L100 L101 L102 L200 L401 L403 L404 L405 L406 L407 L408 L409 L410 L412 L500 L501 L502 L503 L504 OSC200 OSC301 PAM406 Q100 Q101 R100 R101 R102 R103 R104 R105

Discription C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP

STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA

10-6

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

SEC CODE 2203-005682 2203-005683 2203-005725 2203-005725 2203-005736 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006048 2203-006121 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006194 2203-006257 2203-006257 2203-006257 2203-006257 2203-006260 2203-006260

Design LOC R106 R107 R108 R109 R110 R111 R112 R113 R116 R117 R118 R120 R122 R123 R200 R201 R202 R203 R204 R205 R206 R207 R209 R210 R211 R212 R213 R214 R215 R216 R218 R219 R220 R301 R302 R303 R304 R305 R306 R307 R308 R309

Discription C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP

STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA

10-7

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

SEC CODE 2203-006324 2203-006348 2203-006348 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006423 2203-006556 2203-006556 2203-006556 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562

Design LOC R310 R400 R401 R402 R403 R404 R405 R406 R407 R408 R409 R410 R411 R412 R413 R417 R418 R419 R420 R421 R422 R423 R424 R425 R426 R427 R428 R429 R430 R431 R432 R433 R434 R437 R500 R501 R502 R503 R504 R505 R508 R511

Discription C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP

STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA

10-8

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

SEC CODE 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006562 2203-006585 2203-006638 2203-006648 2203-006712 2203-006824 2203-006824 2203-006824 2203-006824 2203-006824 2203-006824 2203-006824 2203-006824 2203-006825 2203-006825 2404-001225 2404-001225 2404-001336 2404-001336 2404-001339 2404-001352 2404-001352 2404-001381 2404-001381 2404-001381 2404-001381 2404-001381 2404-001381 2404-001396 2404-001406 2404-001406 2703-001178

Design LOC R512 R513 R514 R515 R516 R517 R518 R519 R520 R521 R522 R523 R524 R525 R527 R529 R530 R531 R532 R533 R536 R537 R538 R539 R540 R541 R542 R543 R544 R546 R547 RFS400 SIM100 SW301 SW302 TCX400 U100 U102 U103 U107 U108 U202

Discription C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP INDUCTOR-SMD

STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA

10-9

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

SEC CODE 2703-001178 2703-001180 2703-001737 2703-002203 2703-002205 2703-002206 2703-002268 2703-002368 2703-002734 2703-002734 2703-002966 2801-004285 2801-004373 2809-001293 2901-001389 2901-001389 2901-001389 2901-001389 2911-000017 3301-001158 3301-001158 3301-001729 3301-001729 3301-001729 3301-001729 3301-001729 3404-001152 3404-001152 3705-001358 3708-002194 3709-001344 3709-001421 3710-002306 3711-005976 3711-006220 4202-001116 4302-001158 4709-001372 GH09-00044A GH13-00032A GH71-05646A GH71-05646A

Design LOC U203 U204 U205 U206 U300 U301 U303 U304 U400 U401 U402 U403 U404 U405 U500 U501 U502 U504 UCD101 UCD503 UCP201 UME200 V500 V501 V502 V503 V504 V505 ZD101 ZD201 ZD202 ZD203 ZD204 ZD301 ZD302 ZD303 ZD304 ZD305 ZD500 ZD501 ZD502 ZD504

Discription INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD CRYSTAL-SMD CRYSTAL-SMD OSCILLATOR-VCTCXO FILTER-EMI/ESD FILTER-EMI/ESD FILTER-EMI/ESD FILTER-EMI/ESD DUPLEXER-FEM BEAD-SMD BEAD-SMD BEAD-SMD BEAD-SMD BEAD-SMD BEAD-SMD BEAD-SMD SWITCH-TACT SWITCH-TACT CONNECTOR-COAXIAL CONNECTOR-FPC/FFC/PIC CONNECTOR-CARD EDGE CONNECTOR-CARD EDGE SOCKET-INTERFACE HEADER-BOARD TO BOARD HEADER-BATTERY ANTENNA-CHIP BATTERY-LI(2ND) BLUETOOTH MODULE IC MICOM IC ASIC NPR-ANTENNA CONTACT NPR-ANTENNA CONTACT

STATUS SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA

10-10

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

11. Flow Chart of Troubleshooting
11-1.Baseband
11-1-1. Power ON
'Power On' does not work

Check the current consumption Yes Current consumption >= 100mA Yes Check the Vbat Voltage No

Download again

Voltage >=3.3V

No

Charge the Battery

Yes Check the pin of U101


Pin#J12 >= 2.8V Yes No Check U101 and C115


Pin#A13 and pin#A14>=2.8V No pin#C12 = 1.8V No Check U101, U103

Yes

Yes


Check the clock signal at C414


Freq = 26MHz Vrms >=300mV Vpp 900mV No Check the clock generation circuit (related to 3pin of TCX400, C407, R404)

Yes Check the initial operation

END

11-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

VCCD_2_9 VCCD_1_8 VCCD_2_9

VCCA_2_8

VBAT C101 C100

C102
R100

C103

TTY_DETECT

3 2 1

3 2 1

10 9 8 7 G G G G 4 4 5 5 6 6 SIM100

DSP_DB(0:15)
2 1 K 10 J 10 J9 J8 J7 H9 H8 H7 H6 G10 G9 G8 G7 F10 F9 F8 F7 D13 B4 C4 P13 L 11 F6 A6 M10 N11 P6 R2 K4 G5 J4 N5 N6 M3 J3 F11 K 15 B 15 E8 B 13 C10 VDD34 C11 VDD12 J13

NC6 NC5 GNDS17 GNDS16 GNDS15 GNDS14 GNDS13 GNDS12 GNDS11 GNDS10 GNDS9 GNDS8 GNDS7 GNDS6 GNDS5 GNDS4 GNDS3 GNDS2 GNDS1 A UX_A DC3

C104 SIMCLK SIMRST SIMDATA C105 C106 C107 C108

GND_OCTL VDD_OCTL GNDV VDDV GNDB VDDB GNDD VDDD VSS4 VSS3 VSS2 VSS1 VDD_IO2 VDD_IO1 VDD3 VDD2 VDD1 GND_HCUR GND_PSC2 GND_PSC1 GNDQ VDD67 VDD5

UP_CLK UP_RST UP_IO SIM_IO SIM_RST SIM_CLK

N9 R10 P10 J11 K11 K14

DSP_AB(0:8) KEYBL2 V1_8_EN

VCCA_2_8 VSYN_2_9 VPAC_2_9 VRF_2_9 VCCD_2_9

VRTC_1_5

R101

U101

DCS_TX_EN GSM_TX_EN POS
C109

RA REF2 RA REF1 RXTXIP RXTXIN RXTXQP RXTXQN

A OUTA P A OUTA N A OUTB P A OUTB N MICINP MICINN MICOUTP MICOUTN A UXINP A UXINN A UXOUTP A UXOUTN VXVCM VREGP VREGN DA ICK DA IRN DA IDI DA IDO

RTC_CL K XOENA Q MC A DC_A UX4 DINTR

PWR_SW2 PWR_SW1N PSW1_B UF RESET_O MODE PWR_K EEP INTRQ VIB _RNG_EN

D9 A FC E7 TXP

B5 B6 D7 D6 C7 C6

N4 D1 R6 P5 P3

P11 N12 R12 P12 N14 M14 N15 P15 M15 L 14 K 13 L 13 R13 M13 R14 R4 P4 L6 M6

C14 C15 L7 K9 N10 M9 L 10 L9

A OUTA P A OUTA N A OUTB P A OUTB N MICINP MICINN MICOUTP MICOUTN A UXINP A UXINN A UXOUTP A UXOUTN

A FC VA PC

DSP_INT

Flow Chart of Troubleshooting

TRXIP TRXIN TRXQP TRXQN

CL K 32K XOENA Q CL K 13M_MC

J IG_ON PWR_ON PSW1_B UF

This Document can not be used without Samsung's authorization
VSIM VRTC LED2_DRV LED1_DRV RING_DRV VIB_DRV VLDO_7 VLDO_6 VL5S_B VL5S_A VLDO_5 VL4S_B VL4S_A VLDO_4 VLDO_3 VLDO_2 VLDO_1 VACC K12 H11 G12 G13 F13 F15 C12 A14 C9 D10 B10 B11 A12 B12 A13 J12 G11 F14 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 AB8 AB7 AB6 AB5 AB4 AB3 AB2 AB1 AB0 I|O RWN RESETN_CSP

SAMSUNG Proprietary-Contents may change without notice
VBAT
CSN_PSC SCLK_PSC SDO_PSC SDI_PSC K8 L8 N7 M7

R108

C121

11-2
UP_CS UP_SCLK UP_SDO UP_SDI
OCTL0 OCTL1 OCTL2 OCTL3 OCTL4 OCTL5 OCTL6 OCTL7 VEXT E14 VBAT E13 CH_BDRV E11 CH_ISEN F12 CH_RES D14 SERLE1 SERLE2 SERDA SERCK ADC_AUX2 ADC_AUX1 VREF CREF RTC_ALMN D15 E10 A10 E9 H10

DSP_DB(15) DSP_DB(14) DSP_DB(13) DSP_DB(12) DSP_DB(11) DSP_DB(10) DSP_DB(9) DSP_DB(8) DSP_DB(7) DSP_DB(6) DSP_DB(5) DSP_DB(4) DSP_DB(3) DSP_DB(2) DSP_DB(1) DSP_DB(0) DSP_AB(8) DSP_AB(7) DSP_AB(6) DSP_AB(5) DSP_AB(4) DSP_AB(3) DSP_AB(2) DSP_AB(1) DSP_AB(0) C110

1 M100 NEG C111 C112 C113 C114 C115 C116

DSP_IO DSP_RWN FLASH_RESET

D2 D3 E3 E2 F3 F2 F1 F4 G4 G3 H5 J6 J5 K3 K2 K1 K5 K7 M1 M2 N2 N1 L5 P1 K6 L3 L2 R3

2

C117 ICHRG
U102

XOENA TX_BAND_SEL RX_SEL ANT_BAND_SEL

E6 C5 F5 E5 A4 G6 B3 A3

VCLOCK

B1 A2 C1 C2

R105

RTCALARM

C118

R106

C119

SERLE SERDAT SERCLK

R107 C120

INTRQ PWR_KEEP RST VBAT
R111

C125

R112

Flow Chart of Troubleshooting

VRF_2_9

R401

13MHZ_BB

R400 R402 R434

C400 C401

CLK13M_TR CLK13M_MC CLK13M_WM

TCX400

1 2 GND VCON

OUT VCC

4

C407
3

R404

CLK26M_RF

AFC C408

C409

VCCD_1_6

VCCD_1_8

VBAT

V1_8_EN

U103

1
L101

VIN2 SW2 PGND2

FB2 EN2 EN1

16 15 14
R122 R123 R120

2 3

C136

C138

L100

4 VDD NPOR2 13 5 12 SGND NPOR1 11 6 SCL PGND1 7 10 SW1 SDA 8 9 VIN1 FB1

C133

C139

C135

11-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

VCLOCK

L401 C412
U403

C414

1 NC 2A
3 GND

VCC

6

26M_REF_CLK

NC 5 Y4

C415

R407 C416

8 U404 VCC 1 7 _PR CK 2 6 _CLR D 3 5 Q _Q GND 4

13MHZ_BB

11-4

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting









11-5

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

11-1-2. Initial
Initial Failure Yes

The pin #C12 of U101 = 1.8V and the pin #J12 of U101 = 2.8V ?


No Check the U101 (if it has some problem, it is to be replaced.)

Yes


Is the pin #K9 of U101 "Low High" ? Yes No Check the U101 (if it has some problem, it is to be replaced.)

There is 32.768kHz wave forms at the C216 and C217

No


Check the UCP201

Yes


Is the pin #14 & #15 of U103 "High"? Yes No Check the U103, R120


The voltage is "High" at the C110,C115,C116 No Check the U101

Yes No LCD display is O.K? Check the LCD part

Yes No Sound is O.K? Check the Audio part

Yes END

11-6

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

VCCD_1_6

VCCD_1_8

VRTC_1_5

C200

A(0:25)
NC2 2 NC1 1 F18 F17 R11 T11 M12 M11 M10 M9 M8 L8 L7 K8 J 12 H12 H11 H10 H9 H8 G9 G8 A 18 A2 V13 V7 N18 M2 H18 G2 B 13 B8 W18 W8 U12 U5 U1 T18 P1 L 16 L4 F1 D18 D9 C14 C1 B 16 B 12 B6 B4 G18 W12 G15 W14 R12

CLK13M_TR TR_RST
R203

D(0:15) D(0) D(1) D(2) D(3) D(4) D(5) D(6) D(7) D(8) D(9) D(10) D(11) D(12) D(13) D(14) D(15) CP_WEN CP_OEN CHG_DET FLASH_RESET ROM1_CS ROM2_CS RAM1_CS RAM2_CS MV_CS LOWER_BYTE UPPER_BYTE

A(0) A(1) A(2) A(3) A(4) A(5) A(6) A(7) A(8) A(9) A(10) A(11) A(12) A(13) A(14) A(15) A(16) A(17) A(18) A(19) A(20) A(21) A(22) A(23) A(24) A(25)

SIMCLK SIMDATA SIMRST USB_SUSP USB_DET CAM_IC_RESET USB_VPO USB_VMO USB_OEN USB_DATA UP_SCLK UP_SDO UP_SDI UP_CS CHG_EN BT_EN T_FLASH_ON DEBUG_RTS DEBUG_TXD DEBUG_RXD DEBUG_CTS MAIN_EL_EN MOT_EN EL_IC_EN SDS_TXD SDS_RXD KEY_COL(0:4)
MCI_DAT0_EN MCI_DAT_EN MCI_CMD_EN

P4 T2 P5 B 19 C19 C18 D17 E16 F16 E17 R3 R4 U2 T3 P3 P2 N4 N2 M3 M1 M6 N5 R16 R17 K7 L6 J7 J6 J5 J4 J8 H6 H4 H1 H3 G6 G4 H2 J 15 J 13 K 13 L 12 L 13 L 15 L 14 M14 N14 H19 F19 H17 G16 P15 P19 G5 V17 V19 U16 U19 W17 R13

SIMCL K SIMIO PIO14_SIMRST PIO07_USB _SUSP PIO09_USB _VPI PIO11_USB _VMI PIO12_USB _VPO PIO13_USB _VMO PIO36_USB _OEN PIO37_USB _DA TA SPCL K 0 SPRXD0 SPTXD0_I2SD SPFS0 RIO_PIO01 DSR0_PIO02 DTR0_PIO03 RTS0_PIO04 TX0 RX0_IRQ28 CTS0_PIO29 DCD0_PIO44 PIO41_IRDA TX PIO42_IRDA RX TX1 RX1_IRQ28 K EYBRD0 K EYBRD1 K EYBRD2 K EYBRD3 K EYBRD4 K EYBRD5 K EYBRD6 K EYBRD7 K EYBRD8 K EYBRD9 K EYBRD10 K EYBRD11_PSW1_B UF PIO38_MCI_CLK PIO08_MCI_CMD PIO21_MCI_DAT0 PIO22_MCI_DAT1 PIO23_MCI_DAT2 PIO24_MCI_DAT3 PIO39_MCI_CMD_EN PIO40_MCI_DAT_EN PIO43_MCI_DAT0_EN X1RTC X2RTC RTCAL A RMN OSC32OUT PIO19_PWRK EEP PIO20_SYSCLK REQ PWM1_PIO46 PIO10 PIO25 PIO26 PIO27 PIO28 PIO32

B7 C8 D8 A6 C6 C5 D7 E7 C4 C2 A3 B3 B1 D6 D5 D3 E8 F8 E6 D2 E4 E3 F5 F4 F3 F2 A8 E9 F9 G10 G11 F11 E11 G12 D11 E12 C12 A12 F12 D12 E13 D13 D14 B14 E14 H14 A14 C15 G14 J14 D15 C16 F15 B17 H16 A17

A_A0 A_A1 A_A2 A_A3 A_A4 A_A5 A_A6 A_A7 A_A8 A_A9 A_A10 A_A11 A_A12 A_A13 A_A14 A_A15 A_A16 A_A17 A_A18 A_A19 A_A20 A_A21 A_A22 A_A23 A_A24 PIO35_A_A25_BOOTSEL A_D0 A_D1 A_D2 A_D3 A_D4 A_D5 A_D6 A_D7 A_D8 A_D9 A_D10 A_D11 A_D12 A_D13 A_D14 A_D15 A_WEN A_OEN PIO30_WAITN FLASHRSTN A_CS0N A_CS1N A_CS2N A_CS3N A_CS4N A_CS5N A_CS6N A_CS7N A_BE0N A_BE1N

VSSA _U VDDA _U VSSA _D VDDA _D VSS18 VSS17 VSS16 VSS15 VSS14 VSS13 VSS12 VSS11 VSS10 VSS9 VSS8 VSS7 VSS6 VSS5 VSS4 VSS3 VSS2 VSS1 VDD_CORE8 VDD_CORE7 VDD_CORE6 VDD_CORE5 VDD_CORE4 VDD_CORE3 VDD_CORE2 VDD_CORE1 VDD_IO_1P8_18 VDD_IO_1P8_17 VDD_IO_1P8_16 VDD_IO_1P8_15 VDD_IO_1P8_14 VDD_IO_1P8_13 VDD_IO_1P8_12 VDD_IO_1P8_11 VDD_IO_1P8_10 VDD_IO_1P8_9 VDD_IO_1P8_8 VDD_IO_1P8_7 VDD_IO_1P8_6 VDD_IO_1P8_5 VDD_IO_1P8_4 VDD_IO_1P8_3 VDD_IO_1P8_2 VDD_IO_1P8_1 VRTC CK I RESTN TMS TRSTN

UCP201

TDO TDI TCK CKO_IACK IOBIT1_PIO06 IOBIT0_PIO05 SPFS1_PIO15 SPTXD1_I2SD_PIO16 SPRXD1_PIO17 SPCLK1_PIO18 INT0 IO RWN D_D15 D_D14 D_D13 D_D12 D_D11 D_D10 D_D9 D_D8 D_D7 D_D6 D_D5 D_D4 D_D3 D_D2 D_D1 D_D0 D_A8 D_A7 D_A6 D_A5 D_A4 D_A3 D_A2 D_A1 D_A0 TEST3 TEST2 TEST1 CPTSTSTOP_CKO ATDO_PWM2 ATDI_RTS1 ATCK_CTS1 ATMS_PIO45 PIO31_IRQ6 PIO00_IRQ5 IRQ4 IRQ3 IRQ2 IRQ1 PIO47 PIO34 PIO33

T12 V14 U14 N12 N11 V12 R220 N15 N16 M17 M18 T15 W6 V6 P11 N10 N9 N8 P9 P8 R9 T9 T8 U8 V8 R8 T7 R7 T6 U6 R6 N6 V4 T5 U4 V3 W3 W2 V1 V16 T14 U15 T17 T13 L5 M4 K12 P12 P16 P18 P17 M19 M16 J16 R14 U18

DSP_TMS DSP_TDO DSP_TDI DSP_TCK

PCM_SYNC PCM_TXD PCM_RXD PCM_CLK DSP_INT DSP_IO DSP_RWN

DSP_DB(0:15) DSP_DB(15) DSP_DB(14) DSP_DB(13) DSP_DB(12) DSP_DB(11) DSP_DB(10) DSP_DB(9) DSP_DB(8) DSP_DB(7) DSP_DB(6) DSP_DB(5) DSP_DB(4) DSP_DB(3) DSP_DB(2) DSP_DB(1) DSP_DB(0) DSP_AB(8) DSP_AB(7) DSP_AB(6) DSP_AB(5) DSP_AB(4) DSP_AB(3) DSP_AB(2) DSP_AB(1) DSP_AB(0)

DSP_AB(0:8)

CP_TDO CP_TDI CP_TCK CP_TMS WM_SDIN WM_CS MV_INT FLIP_SNS JACK_INT INTRQ WM_SCLK USB_CON CF

AS4 EAR_SWITCH AS2 CODEC_PDN CARD_DETECT AMP_EN BL_CONT XOENAQ PWR_KEEP CLK32K RTCALARM

OSC200

1 C219

2 C220

KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4) KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) KEY_ROW(3) KEY_ROW(4) KEY_ROW(5)

PSW1_BUF KEY_ROW(0:5)

MCI_DAT0 MCI_CMD MCI_CLK

11-7

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting







11-8

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

11-1-3. Sim Part
"Insert SIM is displayed on the LCD Yes

Check the SIM connector's (SIM100) connection to SIM card

No


Resolder or change SIM100

Yes


Check the voltage at pin#1 of SIM100 >= 2.8V ? No Check the U101

Yes


Is there any signals pin#2,#3,#4 of ? No Check the UCP201

Yes

Check the SIM Card

END



11-9

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

11-1-4. Microphone Part
Microphone does not work Yes Is the assembled status of microphone O.K? Yes Check the reference voltage on mic path Yes No No Reassembled the microphone


Resolder or change R500,R501,R502,R505,R514,R517, C502,C505

C111 2.8V ? Yes


No Check U101

Is microphone ok? Yes END

11-10

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

R500

MICOUTP MICINP

R501

C502

C503 MICINN MICOUTN
R505

MAIN_MIC_P MAIN_MIC_N

R502

C505
R504

C508

C509

VCCA_2_8

R514

AUXOUTP AUXINP

R516

R518

C514

R517 R519

C516 R521 AUXINN
R524

C515
R520 C518

R523

C519 EAR_MIC_P EAR_MIC_N

AUXOUTN



11-11

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

11-1-5. Speaker Part_1(MP3, SPEAKER PHONE)
There is no sound from the Speaker

Is the terminal of Speaker O.K ?

No Replace the Speaker

Yes


Are there any signals at the L500, L501 No Check U501

Yes

MP3

What is the type of sound from the Speaker

SPEAKER PHONE

No

Is there any signals at the pin#12 and pin#13 of UCD503 ?

Is there any signals at C506, C512 ?

No

Yes

Yes


Check UCD503


The pin #5, #7 of U500 is "High" Yes No No The pin #5, #7 of U500 is "High" Check U101

Yes


Check UCP201

END

11-12

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

VBAT

C500

L500

17
GND

16
VDD

15
VDD

14
VDD

13
VDD

AMP_OUT_N
C504
12

18 NC 19 NC 1 VREF

VOM

AMP_IN_P AMP_IN_N

C506 C512

R503 R512

2 3 4

VSS 11 U501 VSS 10

VIM VIP

C510 L501

VOP 9
VDD VSS VSS VDD

EN 5

AMP_OUT_P

AMP_EN

6

7

8

R515
R546 R547

R513

C513

VBAT

C517

VBAT

L504

C501

U500

1 AOUTAP SPK_P AMP_OUT_N
R511

VCC

NO2 10 COM2 9 NC2 8 IN2 7 GND 6 GND 11
C550

R508

AOUTAN SPK_N AMP_OUT_P

2 NO1 3 COM1 4 NC1 5 IN1
C551

AS2

R522

11-13

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

VCCD_1_8
R525 C520 R527 C522

AOUTAN AOUTAP

WM_CS WM_SDIN WM_SCLK
35 36 37 38 34 33

32
SCL K

31
SDIN

30
CSB

29
MODE

28
L INEINL

27
L INEINR

26
MONOIN+

25
MONOIN-

GND

GND

GND NC5 NC4

GND

NC3

24 23 22 21 20 19 18

VDAC_3_1

CLK13M_WM

R543

1 MCLK 2 DCVDD

HPDETECT NC2

R544

3 DBVDD 4 DGND C533 C534 5 BCLK 6 DACDAT
MONOOUT P L L GN D

UCD503

VMID VREF AGND AVDD
H P GN D

C529

C532

C530

C531

R OU T 1

ROUT2

7 DACLRC

8 CLKOUT

OU T 3

PCM_CLK PCM_TXD PCM_SYNC
R532 R531

9

10

11

12

13

14

15

16

L OU T 2

L OU T 1

HPVDD

17

C536

C537

R533

AMP_IN_N AMP_IN_P MP3_L MP3_R

11-14

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting









11-15

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

11-1-6. Speaker Part_2(RECEIVER)
There is no sound from the Speaker

Is the terminal of Speaker O.K ?

No Replace the Speaker

Yes


Are there any signals at the PIN#3, #9 of U500 No Check U500

Yes


The pin #5, #7 of U500 is "Low" No Check UCP201

Yes


Are there any signals at the PIN#2, #10 of U500 No Check U101



Yes Check UCP201

END

11-16

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting



11-17

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

11-1-7. Charging Part
Abnormal charging part

The pin #1 of U108 is VEXT 5V?
Yes

No

Check IF501



The pin #6 of U108 is "LOW"?
Yes

No

Check UCP201



Charging Current is 350mA~650mA?
Yes

No

Check U108



Check The Battery

END

11-18

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting





11-19

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

VBAT VCCD_1_8

USB_5V

VEXT_5V

R536

R537
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

IFC501 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NC NC NC NC

EAR_MIC_P EAR_MIC_N EAR_R EAR_GND EAR_L EAR_SWITCH JACK_INT TTY_DETECT SDS_TXD SDS_RXD JIG_ON_IF USB_DPLS USB_DMNS

R538 R539

R541

ZD500

ZD504

V500

C541

V505
C547
ZD502

C540 C542
ZD501

NC NC NC NC

25 26 27 28

6

6

5

5

1

1

8 3

7

8

3

7

V501 V502 V503 V504

4

2

2

4

VEXT_5V

VBAT

U108

1 IN 2 VL 3 GND ICHRG
GND

BATT 8 ACOK 7 EN 6 CHG 5 CHG_EN

4 ISET

9 C122 C124
C137 C123 R110

R109

11-20

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

11-2. RF
11-2-1. GSM850/EGSM RX


NORMAL CONDITION catch the channel? No CHECK ANT401, R405 contact?

Yes No


C421, RFS400 resolder or change

DUF400 Check Pin1 -65dBm ?

Yes No


DUF400 resolder or change

DUF400 Check Pin10, 11 -65dBm ?

Yes

U405 Check Pin6, 7 -65dBm ?

No


C431, C436, L406 resolder or change

Yes No


U101 pin A13, B10, C112, C114 resolder or change

U405 Check Pin1, 31, 48 : 2.9V ?

Yes


U405 Check Pin35 : 26Mhz? Vp-p : 950mV? Yes U405 Check Pin25, 26, 27, 28 Vp-p : 120mV? Yes U101 CHECK!! No No TCX400 resolder or change


U405 resolder or change



11-21

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting













11-22

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

11-2-2. DCS RX

NORMAL CONDITION catch the channel?

No


CHECK ANT401, R405contact?

Yes No


C421, RFS400 resolder or change

DUF400 Check Pin1 -65dBm ?

Yes No


DUF400 resolder or change

DUF400 Check Pin12, 13 -65dBm ?

Yes

U405 Check Pin4, 5 -65dBm ?

No


C429, C430, L405 resolder or change

Yes No


U101 pin A13, B10, C113, C115 resolder or change

U405 Pin1, 31, 48 : 2.9V ?

Yes


U405 Check Pin35 : 26Mhz? Vp-p : 950mV? Yes U405 Check Pin25, 26, 27, 28 Vp-p : 120mV? Yes U101 CHECK!! No No TCX400 resolder or change


U405 resolder or change



11-23

SAMSUNG Proprietary-Contents may change without