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SERVICE MANUAL FOR

8677

BY: Spark Pei

TESTING TECHNOLOGY DEPARTMENT // TSSC TESTING TECHNOLOGY DEPARTMENT TSSC
Dec . 2002

8677 N/B MAINTENANCE
Contents
1. Hardware Engineering Specification ---------------------------------------------------------------------------- 3 1.1 Introduction---------------------------------------------------------------------------------------------------------- 3 1.2 System Hardware Parts-------------------------------------------------------------------------------------------- 5 1.3 Other Functions ---------------------------------------------------------------------------------------------------- 29 1.4 Peripheral Components--------------------------------------------------------------------------------------------- 34 1.5 Power Management------------------------------------------------------------------------------------------------- 36 1.6 Appendix 1:SiS961 GPIO Definitions------------------------------------------------------------------------------- 39 1.7 Appendix 2:8677 product Spec ------------------------------------------------------------------------------------- 41 2. System View and Disassembly------------------------------------------------------------------------------------- 44 2.1 System View---------------------------------------------------------------------------------------------------------- 44 2.2 System Disassembly-------------------------------------------------------------------------------------------------- 47 3. Definition & Location of Connectors/Switches----------------------------------------------------------------- 67 3.1 Mother Board-A----------------------------------------------------------------------------------------------------- 67 3.2 Mother Board-B----------------------------------------------------------------------------------------------------- 68 3.3 Charge Board-------------------------------------------------------------------------------------------------------- 69 4. Definition & Location of Major Components ------------------------------------------------------------------ 70
4.1 Mother Board-A -----------------------------------------------------------------------------------------------------70 4.2 Mother Board-B ---------------------------------------------------------------------------------------------------- 71 4.3 Charge Board ------------------------------------------------------------------------------------------------------- 72

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5. Pin Description of Major Component --------------------------------------------------------------------------- 73
5.1 Mobil Intel Pentium 4 Processor-M-------------------------------------------------------------------------------- 73 5.2 SiS650 (IGUI HOST Memory Controller)------------------------------------------------------------------------- 79 5.3 SiS961 (MuTIOL ® Media I/O South Bridge)--------------------------------------------------------------------- 84
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Contents
6. System Block Diagram----------------------------------------------------------------------------------------------- 90 7. Maintenance Diagnostics-------------------------------------------------------------------------------------------- 91 7.1 Introduction---------------------------------------------------------------------------------------------------------- 91 7.2 Debug Tool----------------------------------------------------------------------------------------------------------- 92 7.3 Error Codes----------------------------------------------------------------------------------------------------------- 93 8. Trouble Shooting ----------------------------------------------------------------------------------------------------- 95 8.1 No Power ------------------------------------------------------------------------------------------------------------ 96 8.2 Battery Can not Be Charged --------------------------------------------------------------------------------------- 100 8.3 No Display ----------------------------------------------------------------------------------------------------------- 102 8.4 VGA Controller Failure LCD No Display-------------------------------------------------------------------------- 106 8.5 External Monitor No Display ------------------------------------------------------------------------------------------ 108 8.6 Memory Test Error ------------------------------------------------------------------------------------------------- 110 8.7 Keyboard (K/B) and Touch-Pad (T/P) Test Error----------------------------------------------------------------- 112 8.8 Hard Drive Test Error ---------------------------------------------------------------------------------------------- 114 8.9 CD-ROM Drive Test Error----------------------------------------------------------------------------------------- 116 8.10 USB Port Test Error ----------------------------------------------------------------------------------------------- 118 8.11 PC-Card Socket Fail ----------------------------------------------------------------------------------------------- 121 8.12 LAN Test Error ---------------------------------------------------------------------------------------------------- 123 8.13 Audio Driver Failure ---------------------------------------------------------------------------------------------- 125 9. Spare Parts List ------------------------------------------------------------------------------------------------------- 128 10. System Exploded Views-------------------------------------------------------------------------------------------- 140 11. Circuit Diagram----------------------------------------------------------------------------------------------------- 141 12. Reference Material ------------------------------------------------------------------------------------------------- 178
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1. Hardware Engineering Specification
1.1 Introduction
General Description
This document describes the engineering specification for 8677 portable notebook computer system.

System Overview

The 8677 model motherboard will accept Intel Mobile Pentium 4 with 400MHz FSB with Micro-FCPGA package. It can support Mobile Pentium 4 1.4GHz ~ 2GHz. This system is based on PCI architecture and is fully compatible with IBM PC/AT specification, which has standard hardware peripheral interface. The power management complies with Advanced Configuration and Power Interface (ACPI) 1.0b. It also provides easy configuration through CMOS setup, which is built in system BIOS software and can be pop-up by pressing F2 key at system start up or warm reset. System also provides icon LEDs to display system status, such as AC Power indicator, CD-ROM, HDD, NUM LOCK, CAP LOCK, SCROLL LOCK, SUSPEND MODE and battery present, capacity & charging status. It also equipped with LAN, 56KMODEM, 4 USB port, 3D stereo audio functions, TV out and audio line out, line in, external microphone in function. The memory subsystem supports 128MB on board DDR SDRAM, and with one expansion DDR 128MB/256MB module. The SiS650 IGUI Host Memory Controller integrates a high performance host interface for Intel Pentium 4 processor, a high performance 2D/3D Graphic Engine, a high performance memory controller, an AGP 4X interface, and SiS MuTIOL Technology connecting w/ SiS961 MuTIOL Media IO. The SiS961 MuTIOL Media I/O integrates two Universal Serial Bus 1.1 Host Controllers, the Audio Controller with AC 97 interface, the Ethernet MAC Controller w/ standard MII interface, the IDE Master/Slave controllers, and SiS MuTIOL technology.
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The ICS 1893 is a low-power, physical-layer device (PHY) that supports the 10Base-T and 100Base-TX Ethernet standards. This VLSI device is designed for easy implementation of 10/100 Mb/s Fast Ethernet LANs. It interfaces to a MAC through an MII interface ensuring interoperability between products from different vendors. The ENE CB1410 CARDBUS controller supports one PCMCIA or CARDBUS interface. The NS PC87393 Super I/O controller integrates the standard PC I/O functions: LPC bus interface, X-Bus Extension for read and write operations, floppy disk interface and one EPP/ECP capable parallel port. Like all LPC Super I/O devices, the PC87393 offers a single-chip solution to the most commonly used PC I/O peripherals to provide for the increasing number of multimedia applications, the AC97 CODEC ALC201 is integrated onto the motherboard which contain 3D audio output. SiS301LV, which is an accompany chip of SiS VGA chip, integrates: (1) A NTSC/PAL video encoder with Macrovision Ver.7.1.L1 option for TV display, (2) A LVDS transmitter with bi-linear scaling capability for TFT LCD panel display. SiS301LV receives digital video signals and control signals from the primary VGA chip then transforms them into composite, S or component video outputs for TV display, LVDS signals for LCD display. The H8/3437 is a high performance microcontroller with a fast H8/300 CPU core and a set of on-chip supporting functions optimized for embedded control. These include ROM, RAM, four types of timers, a serial communication interface, optional I²C bus interface, host interface, A/D converter, D/A converter, I/O ports, and other functions needed in control system configurations, so that compact, high performance systems can be implemented easily. A full set of software drivers and utilities are available to allow advanced operating systems such as Windows ME, Windows 2000 and Windows XP to take full advantage of the hardware capabilities. Features such as bus mastering IDE, Plug and Play, Advanced Power Management (APM) with application restart, software-controlled power shutdown. Following chapters will have more detail description for each individual sub-systems and functions.

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1.2 Hardware System
System parts
CPU: Using Intel Mobile Pentium 4 microprocessors in Micro-FCPGA package. Synthesizer: ICS952001. North Bridge: SiS650. South Bridge: SiS961.

TV-OUT and display controller: SiS301LV.

LPC to ISA and super I/O controller: NS PC87393

Keyboard System: Hitachi H8/3437 Universal Controller FAX/MODEM: Askey 56Kbps Fax Modem LAN PHY: ICS1893

PCMCIA: controller: ENE CB1410 + ENE CP2211 AC'97: Codec: Realtek ALC201 Thermal sensor: ADM1021A

System Flash Memory (BIOS) : Insyde 256KB Flash EPROM

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1.2.1 CPU module
Intel Mobile Pentium 4 Processors with 478 pins Micro-FCPGA package. The first Intel mobile processor with the Intel NetBurst micro-architecture which features include hyper-pipelined technology, a rapid execution engine, a 400MHz system, an execution trace cache, advanced dynamic execution, advanced transfer cache, enhanced floating point and multi-media unit, and Streaming SIMD Extensions 2 (SSE2). The Streaming SIMD Extensions 2 (SSE2) enable break-through levels of performance in multimedia applications including 3-D graphics, video decoding/encoding, and speech recognition. Use Source-Synchronous Transfer (SST) of address and data to improve performance by transferring data four times per bus clock. Support Enhanced n two performance modes.

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System frequency synthesizer:ICS952001 Programmable output frequency, divider ratios, output rise/fall time, output skew. Programmable spread percentage for EMI control. Watchdog timer technology to reset system if system malfunctions. Programmable watchdog safe frequency. Support I2C Index read/write and block read/write operations. For DDR SDRAM system use the ICS93705 or ICS93722 as the memory buffer. Use external 14.318MHz crystal.

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1.2.3 SiS650 IGUI HMAC 3D Graphic DDR/SDR Chipset
SiS650 IGUI Host Memory Controller integrates a high performance host interface for Intel Pentium 4 processor, a high performance 2D/3D Graphic Engine, a high performance memory controller, an AGP 4X interface, and SiS MuTIOL Technology connecting w/ SiS961 MuTIOL Media IO. SiS650 Host Interface features the AGTL & AGTL+ compliant bus driver technology with integrated on-die termination to support Intel Pentium 4 processors. SiS650 provides a 12-level In-Order-Queue to support maximum outstanding transactions up to 12. It integrated a high performance 2D/3D Graphic Engine, Video Accelerator and Advanced Hardware Acceleration MPEGI/MPEGII Video Decoder for the Intel Pentium 4 series based PC systems. It also integrates a high performance 2.1GB/s DDR266 Memory controller to sustain the bandwidth demand from the integrated GUI or external AGP master, host processor, as well as the multi I/O masters. In addition to integrated GUI, SiS650 also can support external AGP slot with AGP 1X/2X/4X capability and Fast Write Transactions. A high bandwidth and mature SiS MuTIOL technology is incorporated to connect SiS650 and SiS961 MuTIOL Media I/O together. SiS MuTIOL technology is developed into three layers, the Multi-threaded I/O Link Layer delivering 1.2GB bandwidth to connect embedded DMA Master devices and external PCI masters to interface to Multithreaded I/O Link layer, the Multi-threaded I/O Link Encoder/Decoder in SiS961 to transfer data w/ 533 MB/s bandwidth from/to Multi-threaded I/O Link layer to/from SiS650, and the Multi-threaded I/O Link Encoder/Decoder in SiS650 to transfer data w/ 533 MB/s from/to Multi-threaded I/O Link layer to/from SiS961. An Unified Memory Controller supporting PC133 or DDR266 DRAM is incorporated, delivering a high performance data transfer to/from memory subsystem from/to the Host processor, the integrated graphic engine or external AGP master, or the I/O bus masters. The memory controller also supports the Suspend to RAM function by retaining the CKE# pins asserted in ACPI S3 state in which only AUX source deliver power. The SiS650 adopts the Shared Memory Architecture, eliminating the need and thus the cost of the frame buffer memory by organizing the frame buffer in the system memory. The frame buffer size can be allocated from 8MB to 64MB.

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The Integrated GUI features a high performance 3D accelerator with 2 Pixel / 4 Texture, and a 128 bit 2D accelerator with 1T pipeline BITBLT engine. It also features a Video Accelerator and advanced hardware acceleration logic to deliver high quality DVD playback. A Dual 12 bit DDR digital video link interfaced to SiS 301B Video Bridge packaged in 100-pin PQFP is incorporated to expand the SiS 650 functionality to support the secondary display, in addition to the default primary CRT display. The SiS 301B Video Bridge integrates an NTSL/PAL video encoder with Macro Vision Ver. 7.1.L1 option for TV display, a TMDS transmitter with Bi-linear scaling capability for TFT LCD panel support, and an analog RGB port to support a secondary CRT. The primary CRT display and the extended secondary display (TV, TFT LCD Panel, 2'nd CRT) features the Dual View Capability in the sense that both can generate the display in independent resolutions, color depths, and frame rates. Two separate buses, Host-t-GUI in the width of 64 bits, and GUI-t-Memory Controller in the width of 128 bits are devised to ensure concurrency of Host-t-GUI streaming, and GUI-t-MC streaming. In PC133, or DDR266 memory subsystem, the 128 bits GUI-t-MC bus will attain the AGP4X or AGP 8X equivalent texture transfer rate, respectively. The Memory Controller mainly comprises the Memory Arbiter, the M-data/M-Command Queues, and the Memory Interface. The Memory Arbiter arbitrates a plenty of memory access requests from the GUI or AGP controller, Host Controller, and I/O bus masters based on a default optimized priority list with the capability of dynamically prioritizing the I/O bus master requests in a bid to offering privileged service to 1) the isochronous downstream transfer to guarantee the min. latency & timely delivery, or 2) the PCI master upstream transfer to curb the latency within the maximum tolerant period of 10us. Prior to the memory access requests pushed into the M-data queue, any command compliant to the paging mechanism is generated and pushed into the M-CMD queue. The Mdata/M-CMD Queues further orders and forwards these queuing requests to the Memory Interface in an effort to utilizing the memory bandwidth to its utmost by scheduling the command requests in the background when the data requests streamlines in the foreground.

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Features
High Performance Host Interface
Support Intel Pentium 4 series CPU with data transfer rate of 400MHz. Support 12 Outstanding Transactions Synchronous/Asynchronous Host-t-DRAM Timing Master deliver System Bus Interrupt support

Smart Prefetch mechanism to boost memory read performance Support 2M/4M/8M/16M TSEG SMRAM

Support Defer function to maximize bus utilization Support Dynamic Bus Inversion

AGTL+ & AGTL compliant bus driver auto compensation

64 Bit High Performance DDR266/PC133 Memory Controller
Supports DDR266/200 SDRAM or PC133/100 SDRAM

Support Up to 3 un-buffer Double-sided DIMM DDR266/200 Up to 1 GB per DIMM with max. memory size up to 3 GB

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Supports 16Mb, 64Mb, 128Mb, 256Mb, & 512Mb SDRAM technology with page size from 2KB up to 16 KB Sustains DDR SDRAM CAS Latency at options of 2, 2.5, & 3 clocks Programmable buffer strength optimizing performance and stability

8677 N/B MAINTENANCE
Dynamic Clock Enable (CKE) control placing the SDRAM into Suspend to DRAM state High performance unified memory controller optimizing the DRAM bus utilization Programmable frame buffer size from 8MB and up to 64MB 128KB SMRAM space re-mapping to A0000h, B0000h, or E0000h

Integrated A.G.P. Compliant Target/66Mhz Host-to-PCI Bridge
AGP v2.0 Compliant

Supports Graphic Window Size from 4MBytes to 256MBytes Supports Pipelined Process in CPU-to- A.G.P. Access

Supports 8 Way, 16 Entries Page Table Cache for GART to Enhance A.G.P. Controller Read/Write Performance

Supports PCI-to-PCI Bridge Function for Memory Write from 33Mhz PCI Bus to A.G.P. device Supports Additional AGP4X/2X interface and Fast Write Transaction

High Throughput SiS MuTIOL connect to SiS961 MuTIOL Media I/O
Bi-directional 16 bit data bus

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Perform 533MB/s bandwidth in 66MHz x 4 mode Distributed arbitration strategy with enhanced mode of contiguous DMA data streaming Packet based, pipelining, and split transaction scheme
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Dedicated Isochroous Response Queue
Serves Isochroous downstream transfers responsive to the memory read requests originated from USB or audio/modem controllers Offers privilege service to guarantee minimum latency & timely delivery

High Performance & High Quality 3D Accelerator
Built-in a high performance 256-bit 3D engine Built-in a high quality 3D engine

High Performance 2D Accelerator

Built-in 128 double-words hardware command queue Built-in Direct Draw Accelerator Built-in GDI+ Accelerator

Complete TV-OUT/Digital Flat Panel Solution

Built-in secondary CRT controller for independent secondary CRT, LCD or TV digital output Cooperates with "SiS301B Video Bridge" to support

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Supports Dual 12-bit DDR digital interface to TV encoder and LCD transmitter

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MPEG-2/1 Video Decoder
MPEG-2 ISO/IEC 13818-2 MP@HL and MPEG-1 ISO/IEC 11172-2 standards compliant Built-in advanced hardware DVD acceleration logic Support AGP bus master/LFB-mode code fetching Half pixel resolution in motion compensation

Support VCD, DVD and HDTV (all ATSC modes) decoding Direct DVD to TV playback

Video Accelerator

Supports single frame buffer architecture

Supports single video windows with overlay function Supports YUV-to-RGB color space conversion

Supports bi-linear video interpolation with integer increments of 1/2048 Supports graphics and video overlay function Supports tearing free double buffer flipping

Supports RGB555, RGB565, YUV422, and YUV420 video playback format Supports filtered horizontal up and down scaling playback Supports DVD sub-picture playback overlay Supports DVD playback auto-flipping

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Built-in two 120x128 video playback line buffers to support 1920x1080 video playback Built-in independent Gamma correction RAM Supports DCI Drivers Supports Direct Draw Drivers

High Integration

Built-in 64x128 CRT FIFOs to support ultra high resolution graphics modes and reduce CPU wait-state Built-in programmable 24-bit true-color RAMDAC up to 333 MHz pixel clock Built-in two clock generators

Built-in two 120x128 video line buffers for MPEG II video playback Built-in TV Encoder Interface

Resolution, Color & Frame Rate
Supports 333 MHz pixel clock

Supports VESA standard super high resolution graphics modes Supports virtual screen up to 4096x4096

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Power Management
Supports VESA Display Power Management Signaling (DPMS) compliant VGA monitor for power management Supports direct I/O command to force graphics controller into standby/suspend/off state Power down internal Gamma/Palette SRAM in direct color mode

Supports PCI power management configuration registers for supporting ACPI power down controller Power down all internal macro cells such as SRAM, DAC, clock generator when power saving mode Supports clock stopping for video accelerator, VP, 2D, 3D and MPEG decoder when disabled Supports auto clock throttling for 2D engine, 3D engine

Multimedia Application

Supports auto clock throttling for 2D engine, 3D engine Supports RAMDAC snoop for multimedia applications

NAND Tree for Ball Connectivity Testing. 702-Balls BGA Package.

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1.8V Core with Mixed 1.2V 1.5V 1.8V, 2.5V and 3.3V I/O CMOS Technology

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1.2.4 SiS961 MuTIOL Media I/O
The SiS961 MuTIOL Media I/O integrates two Universal Serial Bus 1.1 Host Controllers, the Audio Controller with AC 97 Interface, the Ethernet MAC Controller w/ standard MII interface, the IDE Master/Slave controllers, and SiS MuTIOL technology. The PCI to LPC Bridge, I/O Advanced Programmable Interrupt Controller, legacy system I/O and legacy power management functionalities are integrated as well. The integrated Universal Serial Bus Host Controllers features Dual Independent OHCI Compliant Host controllers with six USB ports delivering 2 x 12 Mb/s bandwidth and rich connectivity. Besides, each port can be optionally configured as the wake-up source. Legacy USB devices as well as over current detection are also implemented. The Integrated AC97 v2.2 compliance Audio Controller that features a 6-channels of audio speaker out and HSP v.90 modem support. Additionally, the AC97 interface supports 4 separate SDATAIN pins that is capable of supporting multiple audio codecs with one separate modem codec. The integrated Fast Ethernet MAC Controller features an IEEE 802.3 and IEEE 802.3x compliant MAC with external LAN physical layer chip supporting full duplex 10 Base-T, 100 Base-T Ethernet, or with external Home networking physical layer chip supporting 1Mb/s & 10Mb/s Home networking. Additionally, 5 wake-up Frames, Magic Packet and link status changed wake-up function in G1/G2 states are supported. For storing Mac address, two schemes are provided: 1. Store in internal APC register or 2. Store in external EEPROM. The integrated IDE Master/Slave controllers features Dual Independent IDE channels supporting PIO mode 0,1,2,3,4, and Ultra DMA 33/66/100. It provides two separate data paths for the dual IDE channels that sustain the high data transfer rate in the multitasking environment. SiS961 supports 6 PCI masters and complies with PCI 2.2 specification. It also incorporates the legacy system I/O like: two 8237A compatible DMA controllers, three 8254 compatible programmable 16-bit counters, hardwired keyboard controller and PS2 mouse interface, Real Time clock with 512B CMOS SRAM and two 8259A compatible Interrupt controllers. Besides, the I/O APIC managing up to 24 interrupts with both Serial and FSB interrupt delivery modes is supported.
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The integrated power management module incorporates the ACPI 1.0b compliance functions, the APM 1.2 compliance functions, and the PCI bus power management interface spec. v1.1. Numerous power-up events and power down events are also supported. 21 general purposed I/O pins are provided to give an easy to use logic for specific application. In addition, the SiS961 supports Deeper Sleep power state for Intel Mobile processor. For AMD processor, the SiS961 use the CPUSTP# signal to reduce processor voltage during C3 and S1 state. A high bandwidth and mature SiS MuTIOL technology is incorporated to connect SiS645DX and SiS961 MuTIOL Media I/O together. SiS MuTIOL technology is developed into three layers, the Multi-threaded I/O Channels Layer delivering 1.2GB bandwidth to connect embedded DMA Master devices and external PCI masters to interface to Multi-threaded I/O Channels layer, the Multi-threaded I/O Packet Layer in SiS961 to transfer data w/ 533 MB/s bandwidth from/to Multi-threaded I/O Channels layer to/from SiS645DX, and the Multi-threaded I/O Packet Layer in SiS645DX to transfer data w/ 533 MB/s from/to memory sub-system to/from the Multi-threaded I/O Packet Layer in SiS961.

Features

Meet PC2001 Requirements chips

High performance SiS MuTIOL Technology Interconnecting SiS North Bridge and South Bridge
Bi-directional 16-bit data bus

533MB/s performance in 4x66 MHz mode Distributed Arbitration Scheme

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Supports Back to Back Transaction

Integrated Multi-threaded I/O link ensures concurrency of upstream/down stream data transfer with 1.2GB/s bandwidth
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Multiple DMA Bus Architecture
Concurrent Servicing of all DMA Devices: Dual IDE Controllers, Two USB 1.1 HC, MAC Controller, Audio/Modem DMA Controller Separate 32 Bit Input and Output Data Bus Scheme for each DMA Device Advanced Performance Merits of Split & Pipelined Transaction and Concurrent Execution among Multi-I/O Devices

Integrated MuTIOL to PCI Bridge
PCI 2.2 Specification Compliance Supports up to 6 PCI Masters

Two Prefetch cache Buffers support 2 delayed transactions

Fairness Rotating PCI Arbiter Scheme with Option to Place PCI Master 0 as the Highest Priority

Dual IDE Master/Slave Controller

Integrated Multithreaded I/O Link Mastering with Read Pipelined Streaming Dual Independent IDE Channels Each with 16 DW FIFO Native and Compatibility Mode

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PIO Mode 0, 1, 2, 3, 4 and Multiword DMA Mode 0, 1, 2 Ultra DMA 33/66/100

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Universal Serial Bus Host Controller
Integrated Multithreaded IO Link Mastering Two Independent OHCI USB 1.1 Host Controllers, support up to six ports Supports wake-up from S1-S3 Legacy Keyboard/Mouse support

Integrated Fast Ethernet MAC Controller

Multithread I/O link Mastering with Read/Write Concurrent transaction IEEE 802.3 and 802.3x Standard Compatible

Supports Enhanced Software and Automatic Polling schemes to access PHY registers Supports full duplex 10base-T, 100base-Tx, 1 Mb/s & 10 Mb/s Home Networking Support ACPI v1.0b and PCI Power Management v1.1 Standard

Support 5 Wake-up Frame, Magic Packet, and Link Status changed wake-up function at G1/G2 state Integrated 128-bit multicast hash table

Support 2K bytes transmit and receive Data FIFO

MAC address store scheme from external 4-pin EEPROM or Internal APC register

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Integrated Audio Controller with AC97 Interface.
AC97 v2.2 compliance 6 Channels of AC97 speaker outputs and V.90 HSP-Modem
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Supports two Consumer Audio Digital interface: traditional Consumer Digital Audio Out and AC97 V2.2 Compliance Consumer Audio Digital Interface Supports VRA Mode for both AC97 Audio Link and Consumer Audio Digital Interface

Advanced Power Management
Meets ACPI 1.0b Requirements Meets APM 1.2 Requirements

ACPI Sleep States Include S1, S3, S4, S5

CPU Power States Include C0, C1, C2 C3, C4

Supports Intel Deeper Sleep Power State for Intel mobile processor. Reduce AMD processor voltage during S1/C3 state

Power Button with Override only wake up by Power Button RTC Day-of-Month, Month-of-Year Alarm 24-bit Power Management Timer

LED Blinking in S0, S1 and S3 States ACPI System Wake-up Events Software Watchdog Timer

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PCI Bus Power Management Interface Spec. 1.1 Support PCI CLKRUN and STP_PCI function (for Mobile only) Support RTC32KHz output from GPIO18 (for Mobile only).

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Integrated 32-bit Random Number Generator Support one GTL-level input signal used to Instantly Power off system Support one GTL-level input signal used to assert SMI#/SCI#

Integrated DMA Controller
Two 8237A Compatible DMA Controllers 8/16- bit DMA Data Transfer Distributed DMA Support

Integrated Interrupt Controller

Two 8259A Compatible Interrupt Controllers for up to 15 interrupts Programmable Level or Edge Triggered Interrupts Support Serial Interrupt

Support 8 PCI interrupts for internal device Support Message Interrupt Delivery Mode

Integrated I/O APIC in Serial Mode or FSB Interrupt Delivery Model for up to 24 Interrupts

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Three 8254 Compatible Programmable 16-bit Counters
System Timer Interrupt Generate Refresh Request Speaker Tone Output
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Integrated Keyboard Controller
Hardwired Logic Provides Instant Response Supports PS/2 Mouse Interface Password Security and Password Power-Up System Sleep and Power-Up by Hot-Key

KBC and PS2 Mouse Can Be Individually Disabled

Integrated Multimedia Timers

Support three timers operating at 32- or 64-bit mode

Integrated PCI to LPC Bridge
LPC 1.0 Compliance

Support Two Master/DMA devices

NAND Tree for Ball Connectivity Testing 371-Balls BGA Package

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1.8V Core with Mixed 1.5V, 1.8V, 2.65V and 3.3V I/O CMOS Technology

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1.2.5 SiS301LV
SiS301LV, which is an accompany chip of SiS VGA chip, integrates A NTSC/PAL video encoder with Macrovision Ver.7.1.L1 option for TV display. A LVDS transmitter with bi-linear scaling capability for TFT LCD panel display.

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All the above functions can support dual-display features. It means that the second display device driven by SiS301LV can display independent resolutions, color depths and frame rates different from the traditional CRT monitor driven by primary VGA chip. SiS301LV receives digital video signals and control signals from the primary VGA chip then transforms them into composite, S or component video output for TV display, LVDS signals for LCD display. The output display combination can be one of the three : (1) Primary CRT+SiS301LV TV, (2) Primary CRT+SiS301LV LCD,(3) SiS301LV TV + SiS301LV LCD.

National Semiconductor's PC8739x family of LPC Super I/O devices is targeted for a wide range of portable applications. PC99 and ACPI compliant, the PC8739x family features an X-Bus Extension for read and write operations over the X-Bus, a full IEEE 1284 Parallel Port with a Parallel Port Multiplexer (PPM) for external Floppy Disk Drive (FDD) support, a Musical Instrument Digital Interface (MIDI) port, and a Game port. Like all National LPC Super I/O devices, the PC8739x offers a single-chip solution to the most commonly used PC I/O peripherals. The PC8739x family also incorporates: a Floppy Disk Controller (FDC), two enhanced Serial Ports (UARTs), one with Fast Infrared (FIR, IrDA 1.1 compliant), General-Purpose Input/Output (GPIO) support for a total of 32 ports, Interrupt Serializer for Parallel IRQs and an enhanced WATCH DOG timer.
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1.2.7 Keyboard controller Hitachi H8/3437
The H8/3437 Series is a series of high-performance microcontrollers with a fast H8/300 CPU core and a set of onchip supporting functions optimized for embedded control. These include ROM, RAM, four types of timers, a serial communication interface, optional I2C bus interface, host interface, A/D converter, D/A converter, I/O ports, and other functions needed in control system configurations, so that compact, high-performance systems can be implemented easily. The series includes the H8/3437 with 60-kbyte ROM and 2-kbyte RAM, the H8/3436 with 48kbyte ROM and 2-kbyte RAM, and the H8/3434 with 32-kbyte ROM and 1-kbyte RAM. The H8/3437, H8/3436, and H8/3434 are available in mask-ROM versions. The H8/3437 and H8/3434 are also available in ZTATTM*1 (zero turn-around time) versions, providing a quick and flexible response to conditions from ramp-up through full-scale volume production, even for applications with frequently-changing specifications. In addition, the H8/3434 and H8/3437 have F-ZTATTM*2 (flexible-ZTAT) versions with on-board programmability. Notes: 1. ZTATTM is a trademark of Hitachi, Ltd.

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2. F-ZTATTM is a trademark of Hitachi, Ltd. Made by Billonton Computer corporation Integrated PCI v2.2 Interface Host-based ITU V.70 DSVD. Operation support: Windows 95/NT/ME/2000 K56flex for internet connection rates approaching 56kbits/s. Data Modes capabilities

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ITU-T V.90/K56flex, V.34, V.32bis, V.22bis, V.23, V.22A/B, V.21 Bell 212A and 103 Data Compression V.42bis, MNP Class 5 Error Correction V.42 LAPM and MNP2.4 FAX mode capabilities:

ITU-T V.17, V.29, V.27ter, and V.21 CH 2 TIA/EIA 578 Class 1 FAX

V.80 Host Controlled Communication Protocol Standards H.324 Interface Support On Chip PnP Logic

ACPI support "On Now" Support "Call ID"

PC 97 Compliant Unimodem/V Compliant Low Power Consumption Operation Voltage 3.3V

t ent re m ec u S c ac l Do iT ia M t en fid on C
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1.2.9 LAN PHY_ICS1893
The ICS1893 is a low-power, physical-layer device (PHY) that supports the ISO/IEC 10Base-T and 100Base-TX Carrier-Sense Multiple Access/Collision Detection (CSMA/CD) Ethernet standards. The ICS1893 architecture is based on the ICS1892. The ICS1893 supports managed or unmanaged node, repeater, and switch applications. The ICS1893 incorporates digital signal processing (DSP) in its Physical Medium Dependent (PMD) sublayer. As a result, it can transmit and receive data on unshielded twisted-pair (UTP) category 5 cables with attenuation in excess of 24 dB at 100 MHz. With this ICS-patented technology, the ICS1893 can virtually eliminate errors from killer packets. The ICS1893 provides a Serial Management Interface for exchanging command and status information with a Station Management (STA) entity. The ICS1893 Media Dependent Interface (MDI) can be configured to provide either half- or full-duplex operation at data rates of 10 MHz or 100 MHz. The MDI configuration can be established manually (with input pins or control register settings) or automatically (using the Auto-Negotiation features). When the ICS1893 Auto-Negotiation sublayer is enabled, it exchanges technology capability data with its remote link partner and automatically selects the highest-performance operating mode they have in common.

t ent re m ec u S c ac l Do iT ia M t 1.2.10 PCMCIA controller_ ENE CB1410 + ENE CP2211 en fid on C
CB1410
Ability to wake from D3HOT and D3COLD Mix-to-match 5V/3.3V 16 bit PC Cards and 3.3V CardBus Cards Single PC Card or CardBus slot with hot insertion and removal Burst transfers to maximize data throughput on the PCI bus and the CardBus bus

3.3V core logic with universal PCI interface compatible with 3.3V and 5V PCI signaling environment

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Parallel PCI interrupts, parallel ISA IRQ and Parallel PCI interrupts, Serial ISA IRQ with Parallel PCI interrupts, and Serial ISA IRQ and PCI interrupts Serial EEPROM interface for loading subsystem ID and subsystem vendor ID Pipelined architecture allows greater than 130 Mbps sustained throughput from-CardBus-to-PCI and from-PCIto- CardBus Interface to parallel single-slot PC Card power interface switches Up to five general-purpose I/Os

Programming output select for CLKRUN#

Five PCI memory windows and two I/O windows available to the 16-bit PC Card Socket Two I/O windows and two memory windows available to the CardBus Socket

Exchangeable Card Architecture ( ExCA ) compatible registers are mapped in memory I/O space Distributed DMA ( DDMA ) and PC/PCI DMA 16-Bit DMA on the PC Card Socket

Ring indicate, SUSPEND#, PCI CLKRUN#, and CardBus CCLKRUN# Socket activity LED pins

PCI Bus Lock ( LOCK# )

t ent re m ec u S c ac l Do iT ia M t en fid on C

Advanced Submicron, Low-Power CMOS Technology Internal Ring Qscillator

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CP2211 (Power Switch)
Fully integrated VCC and VPP switching Low rDS(ON): 90-m 5V and 3.3V VCC Switches Compatible with industry standard controllers 12V supply not required unless the PC Card uses 12V for flash programming or other applications 3.3V low voltage mode

t ent re m ec u S c ac l Do 1.2.11 AC'97 Codec _ Realtek T iALC201 M tia en fid on C
Short-circuit and thermal protection Compatible with 3.3V, 5V, and 12V PC Cards Break-before-make switching Conversion Two Analog Line-level Mono Inputs for Modem Sub-system and Internal PC Beeper Mono Microphone Input Switch able from Two External Sources High Quality Pseudo Differential CD Input Dual Stereo Line-level Outputs CrystalClear 3D Stereo Enhancement

20-bit Stereo Digital-to-Analog Converter and 18-bit Stereo Analog to Digital Converter with Sample Rate Four Analog Line-level Stereo Inputs for Connection from LINE IN, CD, VIDEO, and AUX

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1.2.12 Thermal sensor_ ADM1021A
On-Chip and Remote Temperature Sensing No Calibration Necessary 1_C Accuracy for On-Chip Sensor

t ent re m ec u S c ac l Do iT ia M t en fid n 1.2.13 System Flash o Memory (BIOS) C
3_C Accuracy for Remote Sensor Programmable Over/Under Temperature Limits Programmable Conversion Rate 2-Wire SMBus Serial Interface Supports System Management Bus (SMBus) Alert 200 _A Max Operating Current 1 _A Standby Current 3 V to 5.5 V Supply Small 16-Lead QSOP Package 2M bit Flash memory Flashed by 5V only User can upgrade the system BIOS in the future just running flash program. See Software BIOS Specification
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1.3 Other Functions
1.3.1 Hot Key Function
Keys Combination Fn + F1 Reserve Fn + F2 Reserve Feature Meaning

Fn + F3 Volume Down Fn + F4 Volume Up

Fn + F5 LCD/external CRT switching Fn + F6 Brightness down Fn + F7 Brightness up Fn + F9 Pause Fn + F10 Fn + F11 Fn + F12

Fn + F8 Brightness MAX Break

t ent re m ec u S c ac l Do iT ia M t en fid on C
simultaneously display. Increases the LCD brightness Toggle Max Brightness Toggle Panel Off/On Setup.

Rotate display mode in LCD only, CRT only and Decreases the LCD brightness

Panel Off/On Suspend to DRAM/HDD

Force the computer into either Suspend to HDD or Suspend to RAM mode depending on BIOS
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1.3.2 Power on/off/suspend/resume button
1.3.2.1 APM mode
At APM mode, Power button is on/off system power.

t ent re m ec u S c ac l Do iT ia 1.3.3 Cover Switch M t en fid on C
1.3.2.2 ACPI mode
management) to power button function. Continue pushing power button over 4 seconds will force system off at ACPI mode. 1. None 2. Standby 3. Off 4. Hibernate (must enable hibernate function in power management)

At ACPI mode. Power button behavior was set by windows power management control panel. You could set "standby" , "power off" or "hibernate"(must enable hibernate function in power

System automatically provides power saving by monitoring Cover Switch. It will save battery power and prolong the usage time when user closes the notebook cover. At ACPI mode there are four functions to be chosen at windows power management control panel.

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1.3.4 LED Indicators
System has eight status LED indicators to display system activity, which include three at front side and five above keyboard.

1.3.4.1 Three LED indicators at front side:

From left to right that indicate, AC POWER, BATTERY POWER and BATTERY STATUS AC POWER: This LED lights green when the notebook is being powered by AC, and flash (on 1 second, off 1 second) when Suspend to DRAM is active using AC power. The LED is off when the notebook is off or powered by batteries. BATTERY POWER: This LED lights green when the notebook is being powered by Battery , and flash (on 1 second, off 1 second) when Suspend to DRAM is active using Battery power. The LED is off when the notebook is off or powered by batteries, or when Suspend to Disk. BATTERY STATUS: During normal operation, this LED stays off as long as the battery is charged. When the battery charge drops to 10% of capacity, the LED lights red, flashes per 1 second and beeps per 2 second. When AC is connected, this indicator glows green if the battery pack is fully charged or orange (amber) if the battery is being charged.

1.3.4.2 Five LED indicators above keyboard:

From left to right that indicates LAN, CD-ROM/HARD DISK DRIVE, NUM LOCK, CAPS LOCK and SCROLL LOCK.

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1.3.5 Battery status
1.3.5.1 Battery Warning
System also provides Battery capacity monitoring and gives user a warning so that users have chance to save his data before battery dead. Also, this function protects system from mal-function while battery capacity is low.

t ent re m ec u S c ac l Do iT ia M t en fid 1.3.6 Fan power on/off management on C
System will Suspend to HDD after 2 Minutes to protect users data.

Battery Warning: Capacity below 10%, Battery Capacity LED flashes per second, system beeps per 2 seconds.

1.3.5.2 Battery Low State

After Battery Warning State, and battery capacity is below 4%, system will generate beep for twice per second.

1.3.5.3 Battery Dead State

When the battery voltage level reaches 7.6 volts, system will shut down automatically in order to extend the battery packs' life.

FAN is controlled by H8 embedded controller using AD2201 to sense CPU temperature and PWM control fan speed. Fan speed is depended on CPU temperature. Higher CPU temperature faster Fan Speed.

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1.3.7 CMOS Battery
CR2032 3V 220mAh lithium battery When AC in or system main battery inside, CMOS battery will consume no power. AC or main battery not exist, CMOS battery life at less (220mAh/5.8uA) 4 years. Battery was put in battery holder, can be replaced

1.3.8 I/O Port

One Power Supply Jack.

One External CRT Connector For CRT Display One S-Video TV Output Connector

Supports four USB port for all USB devices.

One MODEM RJ-11 phone jack for PSTN line One RJ-45 for LAN. Headphone Out Jack.

Microphone Input Jack. Line in Jack Line out Jack

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One CardBus Sockets for one type II PC card extension

8677 N/B MAINTENANCE
1.3.9 Battery current limit and learning.
Implanted H/Wcurrent limit and battery learning circuit to enhance protection of battery.

1.4 Peripheral Components
1.4.1 LCD PANEL

t ent re m ec u S c ac l Do iT ia M t 1.4.2 Ext. Floppy Disk Drive en fid on C
1st Source QDI 14.1" TFT: QD141X1LH03-MP01 2nd Source: Chi-Mei 14.1 TFT : N141X6-L0 Please reference the spec. for detail. External USB 3.5" 1.44MB /1.2 MB/720KB FDD (Option) 1st Source :Mitsumi D353FUE 2nd Source :NEC UF0002

1.4.3 HDD
Fujitsu 20GB: MHR2020AT / 30GB: MHR2030AT/ 40GB : MHR2040AT Hitachi 20 GB: DK23DA-20F / 30GB DK23DA-30F/ 40GB DK23DA-40F
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1.4.4 DVD ROM Drive
1st source :TEAC DV-28E-B93 2nd source: QSI SDR-083

1.4.5 COMBO Drive

t ent re m ec u S c ac l Do 1.4.6 Keyboard iT ia M t en 1.4.7 Track Pad : Synapticsd fi TM41PUM311-2 on C
1st source : KME UJDA730-MT-A 2nd source : QSI SBW-161(16X Combo) 3rd source : NEC CB2100A JME 19mm pitch/3.0mm stroke Accurate positioning Low fatigue pointing action Low profile No moving part, high reliability Low power consumption
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Environmentally sealed Compact size. Software configurable Low weight

t ent re m ec u S c ac l Do iT ia M t 1.4.8 Fan en fid on 1.5 Power management C
Operating humidity : 5%-95% relative humidity, non condensing Storage temperature: -40 to +65 degree C Power supply voltage : 5.0Voltage ± 10% Power supply current : 4.0mA max operating. HY45J05-001

Operating temperature: 0 to 60 degree C

ESD: 15KV applied to front surface SEE ESD Testing specification PN 520-000270-01

The 8677 system has built in several power saving modes to prolong the battery usage for mobile purpose. User can enable and configure different degrees of power management modes via ROM CMOS setup (booting by pressing F2 key). Following are the descriptions of the power management modes supported.

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1.5.1 System Management Mode
1.5.1.1 Full on mode
In this mode, each devices is running with the maximal speed. CPU clock is up to its maximum.

1.5.1.2 Doze Mode

In this mode, CPU will be toggling between on & stop grant mode either. The technology is clock throttling. This can save battery power without loosing much computing capability. The CPU power consumption and temperature is lower in this mode.

1.5.1.3 Standby mode

For more power saving, it turns of the peripheral components. In this mode, the following is the status of each device: --CPU: Stop grant --LCD: backlight off --HDD: spin down

1.5.1.4 Suspend to DRAM

The most chipset of the system is entering power down mode for more power saving. In this mode, the following is the status of each device: Suspend to DRAM --CPU: off --NB: Partial off --VGA: Suspend
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--PCMCIA: Suspend --Audio: off --SDRAM: self Refresh Suspend to HDD

t ent re m ec u 1.5.2 Other power management functions S c ac l Do iT ia M t en fid on C
--System status is saved in HDD --All system status will be restored when powered on again

--all devices are stopped clock and power-down

1.5.2.1 HDD & Video access

System has the ability to monitor video and hard disk activity. User can enable monitoring function for video and/or hard disk individually. When there is no video and/or hard disk activity, system will enter next PMU state depending on the application. When the VGA activity monitoring is enabled, the performance of the system will have some impact.

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8677 N/B MAINTENANCE
1.6 Appendix 1: SiS961 GPIO Definitions
Pin name GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 MUX Function SPDIF LDRQ1# THERM# GPIO Function GPIO GPIO GPIO Power plane MAIN MAIN MAIN

t MAINnt EXTSMI# GPIO re me CLKRUN# GPIO c e u MAIN PREQ5# GPIO S c MAIN PGNT5# GPIO acGPIODo MAIN GPWAK# AUX iT ial RING M AUX nt GPIO AC_SDIN2 AUX e GPIO AC_SDIN3id GPIO AUX f STP_PCI#/CLK25 GPIO AUX on CM
CPUSTP# DPRSLPVR AGPSTOP# GPIO GPIO GPIO AUX AUX AUX

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8677 N/B MAINTENANCE
GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO22 GPIO23 GPIO24 APICD0 APICD1 APICCLK OC5 KBDAT/VGATEM KBCLK/LOHI# PMDAT/VGATEM PMCLK/RTC32KH Z Reserved for CLK GPIO GPO GPO GPO AUX AUX AUX AUX

t AUXnt e AUX e Reserved for Data GPIOcr e um EESK GPI S c AUX EEDI ac GPI Do AUX DDEO GPI AUX iT ial EECS M AUX t GPI THERM2# MAIN en (GTL LEVEL) fid GPIOFF# MAIN n o (GTL LEVEL) C
GPIO Reserved GPI MAIN AUX GPI
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8677 N/B MAINTENANCE
1.7 Appendix 2: 8677 product spec.
Model CPU 8677 Intel Pentium 4 Processor-M: 1.6GHz/1.7GHz/1.8GHz/1.9GHz/2.0GHz/2.2GHz/2.4GHz/2.6GHz

Core Logic L2 Cache System BIOS Memory VGA Controller Video Memory CD-ROM/DVD/Combo FDD HDD

t ent re m ec u S c ac l Do iT ia M t en fid on C
FSB 400MHz North Bridge: SiS650 South Bridge: SiS961 512KB on die 8/16/32MB UMA Internal 24X CD-ROM or DVD ROM, CD-RW, DVD Combo Drive -He ight: 12. 7mm IDE I /F External USB 3.5" 1.44MB/1.2MB/720KB FDD (Option) 2.5" 20 GB /30GB /40GB HDD (9.5mm height) Support ATA33/66/100

Intel Mobile Celeron Northwood: 1.4GHz/1.5GHz/1.7GHz/1.8GHz/2.0GHz/2.2GHz

Insyde 256KB Flash EPROM -Includes System BIOS, VGA BIOS, and Plug & Play capability, ACPI 128 MB DDR SDRAM on board with one expansion DDR 128MB/256MB module -Support PC-266 SiS650 integrated

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8677 N/B MAINTENANCE
8677 14.1" XGA TFT LCD Windows 98 keyboard, multi languages support US and Europe

Model Display Keyboard Pointing Device PCMCIA Audio

I/O ports

t ent re m ec u S c ac l Do iT ia M t en fid on C
1 Type II slot, Card Bus port support Two speaker(1W output) Build-in microphone Build-in AC-Link Audio controller Digital volume control -VGA out -USB 1.1 x 4 -DC input -Microphone jack x1 -Line in x1 -Line out x1 -TV out x1 -RJ-11 modem port x1 -RJ-45 LAN port x1
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Glide pad with 2 buttons and scroll button (4 directional scroll)

8677 N/B MAINTENANCE

Model Communication Battery AC adapter Dimensions Weight Software Indicater Color carton box Friendly User's Interface

8677 56K MDC Fax modem 10/100 based-T LAN 8-cell Li-ON (4S2P) Battery

t ent re m ec u S c ac l Do iT ia M t en fid on C
Input:100-240V, 50/60 Hz AC,CPO 310x277x29mm(front side)/33mm(back side) 3.0Kg Windows 2000/ME/XP/XP Pro TBD

3 LEDs for Power/Battery status (on Inverter module) 5 LEDs for CD-ROM, HDD, Num lock, Cap lock and Scroll lock (in Keyboard Cover) TBD

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2. System Assembly & Disassembly
2.1 System View
2.1.1 Front View
n o p q Microphone Connector Audio Input Connector Audio Output Connector Top Cover Latch q

t ent re m ec u S c ac l Do iT ia 2.1.2 Left-Side View M t en fid on C
n p o n o p q r VGA Port S-Video Output Connector RJ-45 Connector RJ-11 Connector PC Card Slot

n op q r

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8677 N/B MAINTENANCE
2.1.3 Right-Side View
n o p q CD-ROM/DVD-ROM Drive USB Ports Power Connector Kensington Lock

2.1.4 Rear View
n o p q

Battery Charge Indicator Battery Power Indicator AC Power Indicator Battery Pack

t ent re m ec u S c ac l Do iT ia M t en fid on C
q

n

o p

q

o np

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8677 N/B MAINTENANCE
2.1.5 Bottom View
n o p q SO-DIMM cover CPU cover Hard Disk Drive cover Battery Pack n

t ent re m ec u S c 2.1.6 Top-Open View ac l Do iT ia M t en fid on C
n o p q r s t u v LCD Screen Stereo Speaker Keyboard Touch Pad Device LED Indicators Power Button Battery Charge Indicator Battery Power Indicator AC Power Indicator n o p q

o

p q

v u t s o r

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8677 N/B MAINTENANCE
2.2 System Disassembly
The section discusses at length each major component for disassembly/reassembly and show corresponding illustrations. Use the chart below to determine the disassembly sequence for removing components from the notebook. NOTE: Before you start to install/replace these modules, disconnect all peripheral devices and make sure the notebook is not turned on or connected to AC power.

NOTEBOOK

t ent re m ec u S c ac l Do iT ia M t en fid on C
2.2.1 Battery Pack 2.2.2 Keyboard 2.2.3 CPU Modular Components 2.2.4 HDD Module 2.2.6 SO-DIMM 2.2.7 LCD Assembly 2.2.8 LCD Panel LCD Assembly Components 2.2.9 Inverter Board 2.2.10 System Board Base Unit Components 2.2.11 Touch pad 2.2.12 Modem Card

2.2.5 CD/DVD-ROM Drive

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8677 N/B MAINTENANCE
2.2.1 Battery Pack Disassembly
1. Carefully put the notebook upside down. 2. Pull the battery pack out of the compartment (o) while sliding and holding the release lever outwards to the "unlock" ( ) position (n). (Figure 2-1)

Reassembly

1. Push the battery pack into the compartment. The battery pack should be correctly connected when you hear a clicking sound. 2. Slide the release lever to the "lock" ( ) position.

t ent re m ec u S c ac l Do iT ia M t en fid on C
n n o
Figure 2-1 Remove the battery pack

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2.2.2 Keyboard Disassembly
1. Remove the battery pack. (See section 2.2.1 disassembly) 2. Remove one screw fastening the LED cover on the bottom of the notebook. (Figure 2-2)

Figure 2-2 Remove one screw

3. Open the top cover. Slide and hold the LED panel to rightward. Feel the LED panel loose, then take it away. (Figure 2-3)

t ent re m ec u S c ac l Do iT ia M t en fid on C

Figure 2-3 Remove the LED panel

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8677 N/B MAINTENANCE
4. Slightly lift up the keyboard. Then disconnect the cable from system board to detach the keyboard. (Figure 2-4)

Reassembly

1. Reconnect the keyboard cable and fit the keyboard back into place. 2. Fit the LED panel and secure by one screw. 3. Replace the battery pack. (See section 2.2.1 reassembly)

t ent re m ec u S c ac l Do iT ia M t en fid on C
Figure 2-4 Disconnect the cable 50

8677 N/B MAINTENANCE
2.2.3 CPU Disassembly
1. Carefully put the notebook upside down. And remove the battery pack. (See section 2.2.1 disassembly) 2. Remove two screws fastening the CPU compartment cover. (Figure 2-5)

Figure 2-5 Remove the CPU compartment cover

3. Remove four screws fastening the heat sink and disconnect the fan's power cord to detach the heat sink from the CPU compartment. (Figure 2-6)

t ent re m ec u S c ac l Do iT ia M t en fid on C

Figure 2-6 Remove the heat sink

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8677 N/B MAINTENANCE
4. Push the lever to the right .Then lift up the lever to the vertical position .Finally remove the existing CPU.(Figure 2-7)

2

Reassembly

1. Align the arrowhead corner of the CPU with the beveled corner of the socket, and insert the CPU pins into the holes. Place the lever back to the horizontal position and push the lever to the left. 2. Reconnect the fan's power cord to the system board, fit the heat sink onto the top of the CPU and secure with four screws. 3. Replace the CPU compartment cover and secure with two screws. 4. Replace the battery pack. (See section 2.2.1 reassembly)
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t ent re m ec u S c ac l Do iT ia M t en fid on C
1 Figure 2-7 Remove the P4 CPU

8677 N/B MAINTENANCE
2.2.4 HDD Module Disassembly
1. Carefully put the notebook upside down. And remove the battery pack. (See section 2.2.1 disassembly) 2. Remove two screws fastening the HDD compartment cover, and lift the cover up. (Figure 2-8)

Figure 2-8 Remove the HDD cover

3. Slide the hard disk drive outwards to unplug the drive. (Figure 2-9)

t ent re m ec u S c ac l Do iT ia M t en fid on C

Figure 2-9 Remove the HDD drive

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4. Remove four screws to separate the hard disk drive from the bracket. (Figure 2-10)

Reassembly

1. To install the hard disk drive, place it in the bracket and secure with four screws. 2. Put the hard disk drive in the compartment and slide it inwards to plug. 3. Replace the HDD compartment cover and secure with two screws. 4. Replace the battery pack. (See section 2.2.1 reassembly)

t ent re m ec u S c ac l Do iT ia M t en fid on C
Figure 2-10 Free the HDD drive 54

8677 N/B MAINTENANCE
2.2.5 CD/DVD-ROM Drive
Disassembly
1. Carefully put the notebook upside down. And remove the battery pack. (See section 2.2.1 disassembly) 2. Remove one screw that secures the CD/DVD-ROM drive. (Figure 2-11)

Figure 2-11 Remove one screw

3. Put the notebook back to the upright position. Then insert a small rod, such as a straightened paper clip, into the drive's manual eject hole and push firmly to release the tray. Pull the tray out until fully extended, then carefully pull harder to remove the CD/DVD-ROM drive. (Figure 2-12)

t ent re m ec u S c ac l Do iT ia M t en fid on C

Figure 2-12 Remove CD/DVD-ROM

Reassembly
1. To replace the CD/DVD-ROM drive, slide and push it all the way into the compartment to plug. 2. Secure the CD/DVD-ROM drive with one screw. 3. Replace the battery pack. (See section 2.2.1 reassembly)
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2.2.6 SO-DIMM Disassembly
1. Carefully put the notebook upside down. And remove the battery pack. (See section 2.2.1 disassembly) 2. Remove one screw fastening the memory compartment cover to access the SO-DIMM socket. (Figure 2-13)

Figure 2-13 Remove the cover

3. Pull the retaining clips outwards ( ) and remove the SO-DIMM ( ). (Figure 2-14)

Reassembly

t ent re m ec u S c ac l Do iT ia M t en fid on C

Figure 2-14 Remove the SO-DIMM

1. To install the SO-DIMM, match the SO-DIMM's notched part with the socket's projected part and firmly insert the SO-DIMM into the socket at 20-degree angle. Then push down until the retaining clips lock the SO-DIMM into position. 2. Replace one screws to fasten the memory compartment cover. 3. Replace the battery pack. (See section 2.2.1 reassembly)

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2.2.7 LCD Assembly Disassembly
1. Carefully put the notebook upside down. And remove the battery pack. (See section 2.2.1 disassembly) 2. Remove the LED cover. (See the step 1--3 of section 2.2.2 disassembly) 3. Open the top cover. Then remove the two hinge covers. (See Figure 2-15.)

Figure 2-15 Remove two hinge covers

2. Disconnect the two LCD cables from the system board, and remove four screws of the hinges. Now you can separate the LCD assembly from the base unit. (Figure 2-16)

t ent re m ec u S c ac l Do iT ia M t en fid on C

Figure 2-16 Separate the LCD assembly

Reassembly
1. Attach the LCD assembly to the base unit and secure with four screws of the hinges. 2. Reconnect the LCD cables to the system board. And replace two hinge covers 3. Replace the LED panel and battery pack. (See section 2.2.1 and 2.2.2 reassembly)

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2.2.8 LCD Panel Disassembly
1. Carefully put the notebook upside down. And remove the battery pack. (See section 2.2.1 disassembly) 2. Upturn the notebook, remove the LCD assembly. (See section 2.2.7 Disassembly.) 3. Remove the four rubber pads and four screws on the corners of the panel. (Figure 2-17)

Figure 2-17 Remove LCD frame

4. Insert a flat screwdriver to the lower part of the frame and gently pry the frame out. Repeat the process until the frame is completely separated from the housing. 5. Remove the four screws on two sides of LCD panel, and disconnect the cable from the inverter board. (Figure 2-18)

t ent re m ec u S c ac l Do iT ia M t en fid on C

Figure 2-18 Remove LCD panel

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8677 N/B MAINTENANCE
6. Remove the four screws fastening the LCD bracket on side of the LCD panel. (Figure 2-19)

Reassembly

1. Attach the LCD bracket on the LCD panel and secure with four screws. 2. Fit the LCD panel back into place and secure with four screws, and reconnect the cable to the inverter board. 3. Fit the LCD frame back into the LCD housing and replace the four screws and four rubber pads. 4. Replace the LCD assembly and battery pack. (See section 2.2.1and 2.2.7 reassembly.)

t ent re m ec u S c ac l Do iT ia M t en fid on C
Figure 2-19 Remove the LCD bracket

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2.2.9 Inverter Board Disassembly
1. Remove the LCD assembly and detach the LCD frame (see instructions in previous two sections). 2. To remove the inverter board on the bottom of the LCD assembly, disconnect the cable and remove two screw. (Figure 2-20)

Reassembly

1. Fit the inverter board back into place and secure with two screw. 2. Reconnect the cable. 3. Replace the LCD frame. (See section 2.2.8 Reassembly.) 4. Replace the LCD assembly. (See section 2.2.7 Reassembly.)

t ent re m ec u S c ac l Do iT ia M t en fid on C
Figure 2-20 Remove the inverter board 60

8677 N/B MAINTENANCE
2.2.10 System Board Disassembly
1. Remove the battery pack, LED panel, heat sink, HDD module, CD/DVD-ROM drive and LCD assembly. (See the Disassembly parts in previous sections.) 2. Remove the keyboard (See section 2.2.2 disassembly) and disconnect the touch pad cable from system board. (Figure 2-21)

Figure 2-21 Remove the touch pad cable

t ent re m ec u S c ac l Do iT ia M t en fid on C

Figure 2-22 Remove the sixteen screws

4. Remove sixteen screws on the bottom of the notebook. (Figure 2-22)

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5. Remove seven screws on the battery pack compartment of the notebook. Then remove the bottom housing. (Figure 2-23)

Figure 2-23 Remove seven screws

6. Remove one screw fastening the charge board and disconnect the right speaker cable( connector from system board slot( ). (Figure 2-24)

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Figure 2-24 Loose the system board

) , then disconnect the

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7. Remove six screws and two nuts fastening the system board on the cover assembly .Then disconnect the left speaker cable from the system board. (Figure 2-25)

Figure 2-25 Remove the system board

8. Disconnect the LED board connector from system board slot. (Figure 2-26)

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Figure 2-26 detach the LED board

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Reassembly
1. Reconnect the LED board to system board. 2. Fit the system board back into cover assembly and secure with six screws and two nuts. Then reconnect the left speaker cable. 3. Replace the charge board and secure with one screw. Then reconnect the right speaker cable. 4. Fit the bottom housing and secure with twenty three screws. 5. Reconnect the touch pad and keyboard cable. 6. Replace the heat sink, HDD module, CD/DVD-ROM drive LCD assembly , keyboard and battery pack.

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2.2.11 Touch pad Disassembly
1. Remove the system board. (See section 2.2.10disassembly) 2. Remove the four screws to lift up the touchpad holder and touchpad panel. (Figure 2-27)

Figure 2-27 Remove the touch pad holder

3. To tack the touch pad out, remove the ten screws fastening the touch pad shield. (Figure 2-28)

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Figure 2-28 Remove the touch pad shield

Reassembly
1. Replace the touch pad and fit the touch pad shield on it. 2. Fasten the touch pad shield by ten screws. 3. Replace the touchpad holder and secure with four screws. 4. Assemble the notebook. (See section 2.2.10 Reassembly.)
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2.2.12 Modem Card Disassembly
1. Remove the battery pack, LED panel, heat sink, HDD module, CD/DVD-ROM drive and LCD assembly. (See the Disassembly parts in previous sections.) 2. Disassembly the notebook to access the system board . (See section 2.2.10disassembly) 3. Remove the two screws fastening the modem card, and then disconnect the cable from system board . (Figure 2-29)

Reassembly

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Figure 2-29 Remove the modem card

1. Reconnect the cable to modem card and secure the modem card with two screws. 2. Assemble the notebook. (See section 2.2.10disassembly)

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8677 N/B MAINTENANCE 3. Definition & Location of Connectors / Switches
3.1 Mother Board-A
J504 J506 J508 J510
J509

J502 : LED Board Connector J504 : VGA Connector J505 : Primary IDE Connector J506 : TV Out Connector J508 : LAN Connector(RJ45) J509 : DDR Socket J510 : RJ11 J511 : PCMCIA Socket J512 : Secondary IDE Connector J513 : Line In J514 : Line Out J515 : MIC In

J502

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J511 J509 J515 J514 J513 J505 J512

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8677 N/B MAINTENANCE 3. Definition & Location of Connectors / Switches
3.2 Mother Board-B
J1 : LCD Connector
J7

SW2 SW5 SW7 SW6 SW4 SW3

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J2 J1 J5 J4 J3

J2 : LCD Inverter Board Connector J3 : Charge Board Connector J4 : Internal KB Connector J5 : Touch Pad Connector J7 : Transform Board Connector(MDC)

SW2 : SW_LEFT SW3 : SCRL_UP SW4 : SW_RIGHT SW5 : SCRL_LEFT SW6 : SCRL_RIGHT SW7 : SCRL_DOWN

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8677 N/B MAINTENANCE 3. Definition & Location of Connectors / Switches
3.3 Charge Board
Side A

J1

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J501 : Battery Connector J503,J504 : USB Connector PJ50 : Power Jack
J504 J503 J501 PJ501
PJ501 J503

J1 : Charge Board to MB Connector

J504

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8677 N/B MAINTENANCE 4. Definition & Location of Major Components
4.1 Mother Board-A
J509

U503

U506

U50 5
U505

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U507 U509 U508 U510 U516

U503 : SiS301LV(LVDS Interface) U505 : SiS650(North Bridge) U506 : P4 478 CPU Socket(Mobile P4) U507 : ES824(DATA Buffer) U508 : ICS952001(Clock Generator) U509 : ICS1893(LAN PHY) U510 :ICS93722(DDR Clock Buffer) U511 : On Board DDR RAM U512 : On Board DDR RAM U513 : On Board DDR RAM U514 : On Board DDR RAM U516 : SiS961 ( South Bridge) U517 : System BIOS

U504

U514 U513 U512

U505 U506

U517

U507

U511

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8677 N/B MAINTENANCE 4. Definition & Location of Major Components
4.2 Mother Board-B
U11 : CP2211(Card Bus Power Controller)

U11

U13 U19

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U13 : F3437(H8) U19 : PC87393(Super I/O)

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8677 N/B MAINTENANCE 4. Definition & Location of Major Components
4.3 Charge Board
Side A

PU9 :TL594C Pulse-Width-Modulation Controller

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PU9
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5. Pin Descriptions of Major Components
5.1 Mobile Intel Pentium 4 Processor-M
The Coordinates of the Processor Pins as Viewed From the Top of the Package

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5. Pin Descriptions of Maj