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PSR-A300




MIXING CONSOLE


SERVICE MANUAL




A manufacture number should use this
manual with goods of 7 figures.


The example of a manufacture number.
CONTENTS
LK01001
SPECIFICATIONS ................................................ 3/5
7 figures
DIMENSIONS ............................................................ 7
PANEL LAYOUT ..................................... 8
The service manual of PA 011781 should CIRCUIT BOARD LAYOUT & WIRING
be used for the goods whose manufacture ............................................ 12
number is 9 or more figures. DISASSEMBLY PROCEDURE ............................ 13
PA 011781
LSI PIN DESCRIPTION ............................... 18
The example of a manufacture number. IC BLOCK DIAGRAM .................................. 20
CIRCUIT BOARDS ....................................... 21
JCLJ01001 INSPECTIONS ....................................................... 29/35
UCCLJ01001 PARTS LIST
CHNCLJ01001
BLOCK DIAGRAM & LEVEL DIAGRAM
9-11 figures
OVERALL CIRCUIT DIAGRAM




PA 011678 HAMAMATSU, JAPAN 1
200306-49800 Copyright (c) Yamaha Corporation. All rights reserved. PDF-K6101 '03.05
MG16/6FX




IMPOR TANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed
that basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and under-
stood by the users, and have therefore not been restated.

WARNING : Failure to follow appropriate service and safety procedures when servicing this product may result in per-
sonal injury, destruction of expensive components and failure of the product to perform as specified. For
these reasons, we advise all Yamaha product owners that all service required should be performed by an
authorized Yamaha Retailer or the appointed service representative.

IMPORTANT : This presentation or sale of this manual to any individual or firm does not constitute authorization certifi-
cation, recognition of any applicable technical capabilities, or establish a principal-agent relationship of
any form.

The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and
service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable
and changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to
exist, please contact the distributor's Service Division.

WARNING : Static discharges can destroy expensive components. Discharge any static electricity your body may have
accumulated by grounding yourself to the ground bus in the unit (heavy gauge black wires connect to
this bus.)

IMPORTANT : Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power
to the unit.



WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (Where
applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possibly
other entities) to cause cancer and/or birth defects or other reproductive harm.

DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHAT
SO EVER!

Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose
eyes to solder/flux vapor!

If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling
food.


IMPORTANT NOTICE FOR THE UNITED KINGDOM
Connecting the Plug and Cord

IMPORTANT. The wires in this mains lead are coloured in accordance with the following code:
BLUE : NEUTRAL
BROWN : LIVE
As the colours of the wires in the mains lead of this apparatus may not correspond with the coloured makings identifying the terminals in your
plug proceed as follows:
The wire which is coloured BLUE must be connected to the terminal which is marked with the letter N or coloured BLACK.
The wire which is coloured BROWN must be connected to the terminal which is marked with the letter L or coloured RED.
Making sure that neither core is connected to the earth terminal of the three pin plug.




WARNING
Components having special characteristics are marked and must be replaced with parts having specification equal to those
originally installed.




2
MG16/6FX


SPECIFICATIONS

General Specifications
Frequency Characteristics (ST OUT) 20 Hz­20 kHz +1 dB, ­3 dB @+4 dBu, 600 (with gain control at maximum level)
Total Harmonic Distortion (ST OUT) 0.1% (THD+N) @+14 dBu, 20 Hz­20 kHz, 600 (with gain control at maximum level)
­128 dBu Equivalent input noise (CHs 1 to 8)
­100 dBu Residual output noise (ST OUT)
­88 dBu (92 dB S/N) ST, GROUP Master fader at nominal level; all Ch assign switches off.
Hum and Noise 1 AUX, EFFECT master control at nominal level; all channel mix con-
­81 dBu (85 dB S/N)
trols at minimum level.
ST, GROUP Master fader and one Ch fader at nominal level.
­64 dBu (68 dB S/N)
(CHs 1 to 8)
60 dB CH MIC INPUT CH INSERT OUT
84 dB CH MIC INPUT GROUP OUT/ST OUT (CH to ST)
94 dB CH MIC INPUT ST OUT (GROUP to ST)
62.2 dB CH MIC INPUT REC OUT (CH to ST)
76 dB CH MIC INPUT AUX SEND (PRE)
86 dB CH MIC INPUT AUX SEND (POST)/EFFECT SEND
58 dB CH LINE INPUT GROUP OUT/ST OUT (CH to ST)
Maximum Voltage Gain 2 84 dB ST CH MIC INPUT GROUP OUT/ST OUT (CH to ST)
58 dB ST CH LINE INPUT GROUP OUT/ST OUT (ST to ST)
47 dB ST CH LINE INPUT AUX SEND (PRE)
57 dB ST CH LINE INPUT AUX SEND (POST)/EFFECT SEND
34 dB ST CH INPUT GROUP OUT/ST OUT (ST to ST)
16 dB AUX RETURN ST OUT
9 dB AUX RETURN AUX SEND
27.8 dB 2TR INPUT ST OUT
Monaural/Stereo Input Gain Control 44 dB variable
Monaural/Stereo High Pass Filter 80 Hz 12 dB/octave
­70 dB between input channels
Crosstalk (1 kHz)
­70 dB between input/output channels (CH INPUT)
±15 dB
Monaural Input Channel Equalization: HIGH 10 kHz shelving
Max. Variation (CHs 1 to 8) 3 MID 0.25­5 kHz peaking
LOW 100 Hz shelving
±15 dB
Stereo Input Channel Equalization: HIGH 10 kHz shelving
HI-MID 3 kHz peaking
Max. Variation (CHs 9/10 to 15/16) 3 LO-MID 800 Hz peaking
LOW 100 Hz shelving
7-band (125, 250, 500 1 k, 2 k, 4 k, 8 k)
Graphic Equalizer
Max. Variation ±12 dB
Internal Digital Effects 16 programs, parameter control
On each channel: red indicator lights if post-EQ signal (on ST channels, if either post-EQ sig-
Monaural/Stereo Input Peak Indicator
nal or post-mic-amp signal) comes within 3 dB of the clipping level.
Two 12-point LED meters [Stereo (L, R)]
Peak point: red indicator
Level Meters
+5, +3, +1, and 0 points: yellow indicators
­1, ­3, ­5, ­7, ­10, ­15, ­20: green indicators
Phantom +48 VDC Power (Balanced input) Supplied when Phantom +48 V switch is ON.
Included Accessory Power adaptor (PA-30)
USA and Canada: 120 V AC, 60 Hz
Europe: 230 V AC, 50 Hz
Power Supply
Australia: 240 V AC, 50 Hz
Korea: 220 V AC, 60 Hz
Power Consumption 51 W
Max. Dimensions (W × H × D) 423 × 108 × 416.6 mm
Weight 5.5 kg
Where 0 dBu = 0.775V and 0 dBV = 1 V
1 Rs = 150 ohms
Measured with 12.7 kHz, ­6 dB/oct. low pass filter (equivalent to 20 kHz, ­ filter).
(CH MIC INPUT to ST, GROUP OUT/AUX, EFFECT SEND)
2 Turning PAN/BAL to left or right.
3 Shelving turnover/rolloff frequency: 3 dB before maximum cut or boost.



3
MG16/6FX




Input Specifications

Input Connector Gain Input Appropriate Sensitivity* Rated Level Max. Before Connector
Impedance Impedance Clipping Specifications

­80 dBu ­60 dBu ­40 dBu
­60 (0.078 mV) (0.775 mV) (7.75 mV)
MIC INPUT 3 k 50­600 mic XLR-3-31 type (balanced)
(CHs 1 to 8)
­16 ­36 dBu ­16 dBu +4 dBu
(12.3 mV) (123 mV) (1.23 V)

­34 ­54 dBu ­34 dBu ­14 dBu
(1.55 mV) (15.5 mV) (155 mV) Phone jack (TRS)
LINE INPUT 10 k 600 line (balanced [T: hot; R: cold;
(CHs 1 to 8) S: ground])
­10 dBu +10 dBu +30 dBu
+10 (245 mV) (2.45 V) (24.5 V)

­60 ­80 dBu ­60 dBu ­40 dBu
(0.078 mV) (0.775 mV) (7.75 mV)
ST CH MIC INPUT 3 k 50­600 mic XLR-3-31 type (balanced)
(CH9/CH10,CH11/CH12)
­36 dBu ­16 dBu ­10 dBu
­16 (12.3 mV) (123 mV) (245 mV)

­54 dBu ­34 dBu ­14 dBu
­34 (1.55 mV) (15.5 mV) (155 mV)
ST CH LINE INPUT
(CH9(L)/CH10(R), 10 k 600 line Phone jack (unbalanced)
CH11(L)/CH12(R)) ­10 dBu +10 dBu +30 dBu
+10 (245 mV) (2.45 V) (24.5 V)

ST CH INPUT
­30 dBu ­10 dBu +10 dBu Phone jack (unbalanced);
(CH13(L)/CH14(R), 10 k 600 line (24.5 mV) (245 mV) (2.45 V) RCA pin jack
CH15(L)/CH16(R))

Phone jack (TRS)
CH INSERT IN ­20 dBu 0 dBu +20 dBu
(CHs 1 to 8) 10 k 600 line (77.5 mV) (0.775 V) (7.75 V)
(unbalanced [T: out; R: in;
S: ground])

­12 dBu +4 dBu +24 dBu Phone jack (TRS) (unbalanced
AUX RETURN (L, R) 10 k 600 line (195 mV) (1.23 V) (12.3 V) [T: hot; S: ground])

­26 dBV ­10 dBV +10 dBV
2TR IN (L, R) 10 k 600 line (50.1 mV) (316 mV) (3.16 V) RCA pin jack

Where 0 dBu = 0.775 V and 0 dBV= 1 V
* Input sensitivity: the lowest level that will produce the nominal output level when the unit is set to maximum gain.

Output Specifications

Output Appropriate Max. Before
Output Connectors Rated Level Connector Specifications
Impedance Impedance Clipping

XLR-3-32 type (balanced)
ST OUT (L, R) 150 600 line +4 dBu (1.23 V) +24 dBu (12.3 V) Phone jack (TRS)
(balanced [T: hot; R: cold; S: ground])

GROUP OUT (1-4) Phone jack (TRS)
AUX SEND (1-2) 150 10 k line +4 dBu (1.23 V) +20 dBu (7.75 V) (impedance balanced [T: hot; R: cold; S:
EFFECT SEND ground])

CH INSERT OUT 150 10 k line 0 dBu (0.775 V) +20 dBu (7.75 V) Phone jack (TRS) R: in; S: ground])
(CHs 1 to 8) (unbalanced [T: out;

REC OUT (L, R) 600 10 k line ­10 dBV (316 mV) +10 dBV (3.16 V) RCA pin jack

Phone jack (TRS)
C-R OUT (L, R) 150 10 k line +4 dBu (1.23 V) +20 dBu (7.75 V) (impedance balanced [T: hot; R: cold; S:
ground])

PHONES 100 40 phone 3 mW 75 mW Stereo phone jack

Where 0 dBu = 0.775 V and 0 dBV= 1 V




4
MG16/6FX




ST OUT 20 Hz 20 kHz +1 dB, ­3 dB @+4 dBu , 600 GAIN
ST OUT 0.1 % THD+N @+14 dBu, 20 Hz 20 kHz, 600 GAIN
­128 dBu CH1 8
­100 dBu (ST OUT)
ST OUT GROUP OUT
­88 dBu 92 dB S/N
OFF
& *1
AUX EFFECT
­81 dBu 85 dB S/N

ST OUT GROUP OUT
­64 dBu 68 dB S/N 1
CH1 8
60 dB CH MIC INPUT CH INSERT OUT
84 dB CH MIC INPUT GROUP OUT/ST OUT CH to ST
94 dB CH MIC INPUT ST OUT GROUP to ST
62.2 dB CH MIC INPUT REC OUT CH to ST
76 dB CH MIC INPUT AUX SEND PRE
86 dB CH MIC INPUT AUX SEND POST /EFFECT SEND
58 dB CH LINE INPUT GROUP OUT/ST OUT CH to ST
*2 84 dB ST CH MIC INPUT GROUP OUT/ST OUT CH to ST
58 dB ST CH LINE INPUT GROUP OUT/ST OUT ST to ST
47 dB ST CH LINE INPUT AUX SEND PRE
57 dB ST CH LINE INPUT AUX SEND POST /EFFECT SEND
34 dB ST CH INPUT GROUP OUT/ST OUT ST to ST
16 dB AUX RETURN ST OUT
9 dB AUX RETURN AUX SEND
27.8 dB 2TR INPUT ST OUT
44 dB
80 Hz 12 dB/octave
­70 dB
(1 kHz)
­70 dB CH INPUT
±15 dB
HIGH 10 kHz
CH1 8 *3 MID 0.25 5 kHz
LOW 100 Hz
±15 dB
HIGH 10 kHz
HI-MID 3 kHz
CH9/10 15/16 *3 LO-MID 800 Hz
LOW 100 Hz
7 125 250 500 1k 2k 4k 8k
±12 dB
16
MIC ST CH
3 dB
12 LED 2 L R

+5 +3 +1 0
­1 ­3 ­5 ­7 ­10 ­15 ­20
+48 VDC PHANTOM +48 V ON
(PA-30)
100 V AC 50/60 Hz
51 W
W H D W423 H108 D416.6 mm
5.5 kg
0 dBu=0.775 V 0 dBV=1 V
*1 Rs=150 ohms
@12.7 kHz ­6 dB/oct. @20 kHz ­ dB/oct.
CH MIC INPUT to ST GROUP OUT/AUX EFFECT SEND
*2 PAN/BAL
*3 / 3 dB




5
MG16/6FX




*1


MIC INPUT 3k 50 600 ­80 dBu ­60 dBu ­40 dBu
­60
(CH1 8 0.078 mV 0.775 mV 7.75 mV XLR-3-31
­36 dBu ­16 dBu +4 dBu
­16
12.3 mV 123 mV 1.23 V
LINE INPUT 10 k 600 ­54 dBu ­34 dBu ­14 dBu
­34
(CH1 8) 1.55 mV 15.5 mV 155 mV TRS
­10 dBu +10 dBu +30 dBu T
+10 245 mV 2.45 V 24.5 V R:
S
ST CH MIC INPUT 3k 50 600 ­80 dBu ­60 dBu ­40 dBu
­60
(CH9/CH10 CH11/CH12) 0.078 mV 0.775 mV 7.75 mV XLR-3-31
­36 dBu ­16 dBu ­10 dBu
­16
12.3 mV 123 mV 245 mV
ST CH LINE INPUT 10 k 600 ­54 dBu ­34 dBu ­14 dBu
­34
(CH9(L)/CH10(R) 1.55 mV 15.5 mV 155 mV
CH11(L)/CH12(R)) ­10 dBu +10 dBu +30 dBu
+10
245 mV 2.45 V 24.5 V
ST CH INPUT 10 k 600 ­30 dBu ­10 dBu +10 dBu
(CH13(L)/CH14(R) 24.5 mV 245 mV 2.45 V
CH15(L)/CH16(R)) RCA
CH INSERT IN 10 k 600 ­20 dBu 0 dBu +20 dBu
(CH1 8) 77.5 mV 0.775 V 7.75 V TRS

T R
S
AUX RETURN (L R) 10 k 600 ­12 dBu +4 dBu +24 dBu
195 mV 1.23 V 12.3 V TRS
T:
S:
2TR IN (L R) 10 k 600 ­26 dBV ­10 dBV +10 dBV
RCA
50.1 mV 316 mV 3.16 V
0 dBu=0.775V 0 dBV=1V
*1




ST OUT (L R) 150 600 +4 dBu 1.23 V +24 dBu 12.3 V XLR-3-32
TRS
T:
R: S

GROUP OUT (1-4) 150 10 k +4 dBu 1.23 V +20 dBu 7.75 V TRS
AUX SEND (1-2)
EFFECT SEND T R:
S:

CH INSERT OUT 150 10 k 0 dBu 0.775 V +20 dBu 7.75 V TRS
CH1 8 T:
R S:

REC OUT (L R) 600 10 k ­10 10

150 10 4 20




100 40 3 mW 75 mW

0 dBu=0.775V 0 dBV=1 V
6
MG16/6FX


DIMENSIONS


393




H 108
101.3 3




D 416.6
309.6
W 423
31.5

Units: mm




7
MG16/6FX


PANEL LAYOUT

Channel Control Section


Channels Channels
1 to 8 9/10 to 15/16
(Monaural) (Stereo)

1 [GAIN] Control
2 [PEAK] Indicator
3 [ 80 ] Switch (High Pass Filter)
4 Equalizer ([HIGH], [MID], [LOW])
5 [AUX1] and [AUX2] Controls
6 [PRE] Switch
7 [EFFECT] Control
8 [PAN] Control (CHs 1 to 8)
[PAN/BAL] Control (9/10 and 11/12)
[BAL] Control (13/14 and 15/16)
9 [ ] ST Switch
10 [PFL] (Pre-Fader Listen) Switch
11 [GROUP] Switches ( )
12 Channel Fader



1
2
3
4
5
6
7
8



9
10
11
12




8
MG16/6FX




Master Control Section




1 [ST] Master Fader
2 [GROUP] Faders (1-2, 3-4)
3 [TO ST] Switch
4 Master SEND ([AUX1], [AUX2], and [EFFECT] controls)
5 RETURN ([AUX1], [AUX2], and [ST] Controls)
6 [2TR IN] Control
7 [PHANTOM +48 V] Switch
8 Level-Meter Signal Switches
9 [C-R/PHONES] Control
10 Level Meter
11 [POWER] Indicator
12 [ST GRAPHIC EQUALIZER]
13 [PHONES] Jack
14 [DIGITAL EFFECT]




1
2
3
4

5

6
7
8
9
10
11
12
13
14




9
MG16/6FX




Rear Input/Output Section




1 Channel Input Jacks 1
2 [INSERT I/O] Jacks 2
3 Channel Input Jacks 3
4 [GROUP OUT] (1 to 4) Jacks 4
5 [ST OUT] (L, R) Jacks 5
6 [C-R OUT] Jacks 6
7 [SEND] Jacks 7
8 [RETURN] L (MONO), R Jacks 8
9 [REC OUT] (L, R) Jacks 9
10 [2TR IN] Jacks 10
11 POWER Switch 11
12 [AC ADAPTOR IN] Connector 12




10
MG16/6FX




Connector Polarities

INPUT OUTPUT
Pin 1: Ground
MIC INPUT, ST OUT Pin 2: Hot (+)
Pin 3: Cold (­)


LINE INPUT (monaural channels), Tip: Hot (+)
GROUP OUT, ST OUT, C-R OUT, Ring: Cold (­)
AUX1, AUX2, EFFECT* Sleeve: Ground
Ring
Tip: Output
INSERT I/O Ring: Input
Sleeve: Ground
Sleeve Tip
Tip: L
PHONES Ring: R
Sleeve: Ground


RETURN, Tip: Hot
LINE INPUT (stereo channels) Sleeve: Ground
Sleeve Tip


* These jacks will also accept connection to monaural phone plugs. If you use monaural plugs, the connection will be unbalanced.




INPUT OUTPUT
1
MIC INPUT ST OUT 2 +
3 ­


LINE INPUT +
GROUP OUT ST OUT C-R OUT ­
AUX 1 AUX 2 EFFECT

Output
INSERT I/O Input


L
PHONES R




RETURN
LINE INPUT




11
MG16/6FX


CIRCUIT BOARD LAYOUT & WIRING




MAIN 2/3
MAIN 3/3




DSP



PS




MAIN 1/3




Power switch and AC connector wiring Wiring to PS circuit board

CN01 CN02 CN03
(PS circuit board) (PS circuit board) (PS circuit board)




PS circuit board
V9738100




(V975620) (V975600)
Shrink tube (Seven places) V9756100 (WA08700)




Final




12
MG16/6FX


DISASSEMBLY PROCEDURE


1. Rack Mount Angle (Time required: About 1 minute)
1-1 Remove the two (2) screws marked [570A]. The rack
mount angle R can then be removed. (Fig. 1)
1-2 Remove the two (2) screws marked [570B]. The rack
mount angle L can then be removed. (Fig. 1)

2. Bottom Cover (Time required: About 3 minutes)
2-1 Remove the ten (10) screws marked [550] and the
four (4) screws marked [560]. The bottom cover can
then be removed. (Fig. 1)




· Rear view

[490]




[460B] [460D]



[490] [490] [490]
· Right side view · Bottom view · Left side view


[570A] [550] [570B]




[550]

[560] [560]




[460A] [460C]
[570A] [550] [570B]




[460]: Bind Head Tapping Screw-S 3.0X6 MFZN2BL (EP630210)
[490]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)
[550]: Bind Head Tapping Screw-S 3.0X6 MFZN2BL (EP630210)
[560]: Bind Head Tapping Screw-B 3.0X8 MFZN2BL (EP600190)
[570]: Bind Head Screw 4.0X8 MFZN2BL (EG340360)


Fig .1




13
MG16/6FX



[A]




[A]: Bind Head Tapping Screw-B
3.0X8 MFZN2BL (EP600190)
Photo.2

[530]
[540]
[530]
PS


[530]: Bind Head Tapping Screw-B 3.0X8 MFZN2BL (EP600190)
[540]: Bind Head Tapping Screw-S 3.0X6 MFZN2BL (EP630210) [B] [B]
IC02 IC03 Q01
Photo.1 [B]: Bind Head Tapping Screw-B
3.0X8 MFZN2BL (EP600190)
Photo.3
3. PS Circuit Board (Time required: About 4 minutes)
3-1 Remove the bottom cover. (See procedure 2.)
3-2 Remove the two (2) screws marked [530] and the
screw marked [540]. The PS circuit board and Heat
sink can then be removed. (Photo. 1)
3-3 Remove the three (3) screws marked [A]. IC01, IC04,
and IC05 are stopped. (Photo. 2)
3-4 Remove the three (3) screws marked [B]. (Photo. 3)
3-5 Remove the solder IC02, IC03 and Q01. The heat
sink can then be removed from the PS circuit board.
(Photo. 3)

4. Side Cover (Time required: About 5 minutes each)
4-1 Remove the bottom cover. (See procedure 2.)
4-2 Side Cover L:
4-2-1 Remove the rack mount angle L. (See procedure 1.)
4-2-2 Remove the screw marked [460C], the three (3)
screws marked [460D], the three (3) screws marked
[470A] and the two (2) screw marked [480A]. The
side cover L can then be removed. (Fig. 1, Photo. 4)
4-3 Side Cover R:
4-3-1 Remove the rack mount angle R. (See procedure 1.)
4-3-2 Remove the PS circuit board. (See procedure 3.)
4-3-3 Remove the screw marked [460A], the three (3)
screws marked [460B], the three (3) screws marked
[470B] and the two (2) screw marked [480B]. The
side cover R can then be removed. (Fig. 1, Photo. 5)

5. Power Switch and AC Connector
(Time required: About 5 minutes each)
5-1 Remove the bottom cover. (See procedure 2.)
5-2 Remove the rack mount angle R. (See procedure 1.)
5-3 Remove the PS circuit board. (See procedure 3.)
5-4 Remove the side cover R. (See procedure 4.)
5-5 Remove the power switch by bending its claw.
(Photo. 6)
5-6 To remove the AC connector, remove the hexagonal
14 nut and flat washer. (Photo. 6)
MG16/6FX




[470A]
[480A] [480B] [470B]
[470A]
[480A] [480B] [470B]
[470A] [470B]

[470]: Bind Head Tapping Screw-S [470]: Bind Head Tapping Screw-S
3.0X6 MFZN2BL (EP630210) 3.0X6 MFZN2BL (EP630210)
[480]: Hexagonal Socket Set Screw [480]: Hexagonal Socket Set Screw
3.0X6 MFZN2BL (V9842300) 3.0X6 MFZN2BL (V9842300)

Photo.4 Photo.5




Photo.6

6. DSP Circuit Board
(Time required: About 4 minutes)
6-1 Remove the bottom cover. (See procedure 2.)
6-2 Remove the PS circuit board and Heat sink.
(See procedure 3.)
6-3 Remove the four (4) screws marked [510]. The DSP
circuit board can then be removed. (Photo. 7)




[500] [500]

[510] [510]


DSP

[510] [510]


[500]

[500]: Bind Head Tapping Screw-S 3.0X6 MFZN2BL (EP630210)
[510]: Bind Head Tapping Screw-S 3.0X6 MFZN2BL (EP630210)

Photo.7
15
MG16/6FX




7. MAIN (1/3, 2/3, 3/3) Circuit Boards
(Time required: About 22 minutes)
7-1 Remove the rack mount angle L and R.
(See procedure 1.)
7-2 Remove the bottom cover. (See procedure 2.)
7-3 Remove the PS circuit board and Heat sink.
(See procedure 3.)
7-4 Remove the side cover L and R. (See procedure 4.)
7-5 Remove the three (3) screws marked [500]. The
DSP shield can then be removed with the DSP circuit
board. (Fig. 2, Photo. 7)
7-6 Remove the select knob and the sixteen (16) fader
knobs. (Photo. 8)
7-7 Remove the two (2) screws marked [480C], the
twenty-six (26) screws marked [490] and the thirty-
seven (37) hexagonal nuts and flat washer marked
[A]. The MAIN (1/3, 2/3, 3/3) circuit boards can then
be removed. (Fig. 1, Photo. 9)
The knobs, buttons, meter cover, MIX1 supports
and MIX2 support on the MAIN circuit board are
not components of the circuit board. When
replacing the MAIN circuit board, be sure to
remove these parts according to the following
procedure.
7-8 Remove the hexagonal nut marked [B]. The MAIN
3/3 circuit board can then be removed from the MIX1
support (upper). (Fig. 2)
7-9 Pull out the one hundred seventeen (117) volume
knobs from the MAIN 1/3 circuit board. (Photo. 8)
7-10 Remove the thirteen (13) push ON buttons, thirteen
(13) sleeve ON buttons, fifteen (15) push PFL buttons
and fifty-three (53) push HPF buttons from the MAIN
1/3 circuit board. (Fig. 2)
7-11 Remove the five (5) screws marked [450]. The MIX2
support can then be removed from the MAIN 1/3
circuit board. (Fig. 2)

[480C]




[480C]

[480C]: Hexagonal Socket Set Screw 3.0X6 MFZN2BL (V9842300)
Photo.8
Photo.9


16
MG16/6FX




7-12 Remove the two (2) screws marked [430]. Twist the
eight (8) hooks of the MIX1 support (upper) to
become straight, and the support and two (2) spacer
can be removed from the MAIN 1/3 circuit board.
(Fig. 2, Photo. 10)
7-13 Remove the screw marked [440]. Twist the eight (8)
hooks of the MIX1 support (lower) to become
straight, and the support and spacer can be removed
from the MAIN 1/3 circuit board. (Fig. 2)
7-14 Remove the meter cover from the meter reflector.
(Fig. 2)




MAIN 3/3




MAIN 2/3




[450]
MAIN 1/3
[450]



[500]




[450]: Bind Head Tapping Screw-S 3.0X6 MFZN2BL (EP630210)
[500]: Bind Head Tapping Screw-S 3.0X6 MFZN2BL (EP630210)

Fig. 2

MIX1 support (upper): Hooks




MAIN 1/3




Photo.10
17
MG16/6FX


LSI PIN DESCRIPTION


ZFX-2 (XY297A00) CPU DSP: ICM01
PIN NAME I/O FUNCTION PIN NAME I/O FUNCTION
No. No.
1 ED2 I/O 53 AXLR2 I Audio Data Transmitt Unit 2/3 Left and
2 ED3 I/O Right Channel Frame Frequency Signal
3 ED4 I/O 54 AR1 I Audio Data Receive Unit 1 Data Input
External Memory and I/O Data Bus
4 ED5 I/O 55 AR2 I Audio Data Receive Unit 2 Data Input
5 ED6 I/O 56 HRBCK/SA0 I Host Interface Receive Clock / I2C Bus Address 0
6 ED7 I/O 57 HR/SA1 I Host Interface Data Input/ I2C Bus Address 1
7 VSS S Ground 58 HRS/SA2 I Host Interface Receive Data Frame
8 VDD S Power Supply Frequency Signal/ I2C Bus Address 2
9 CLKM0 I Clock Mode 59 VSS S Ground
10 CLKM1 I 60 VDD S Power Supply
1 3 6 PLL BYPASS 61 HXBCK/SCL I Host Interface Transmitt Clock/ I2C Bus Clock
CLKM0 0 1 0 1 62 HXS/SA3 I Host Interface Transmitt Data Frame
CLKM1 0 0 1 1 Frequency Signal/ I2C Bus Address 3
11 TMS I TAP(Test Access Port) Mode Select 63 /CS/SA4 I Host Interface Chip Select/ I2C Bus Address 4
12 TDI I TAP Data Input 64 HBCKS/SA5 I HRBCK/HXBCK Active Edge Select/ I2C Bus Address 5
13 TCK I TAP Clock 65 I2CSEL I Host Interface Mode Select
14 CLKIN I Master Clock 66 VSS S Ground
15 VSS S Ground 67 VDD S Power Supply
16 VDD S Power Supply 68 AXBC1 I Audio Data Transmitt Unit 1 bit Clock
17 CLKO O Machine Clock Output 69 AXBC2 I Audio Data Transmitt Unit 2/3 bit Click
18 EA12/ED8 I/O 70 AXLR1 I Audio Data Transmitt Unit 1 Left and Right
19 EA13/ED9 I/O External SRAM and ROM Address Bus/ Channel Frame Frequency Signal
20 EA14/ED10 I/O External DRAM and I/O Data Bus 71 DIVS O Machine Clock Output then 8 min.
21 EA15/ED11 I/O 72 /LAV O Ruch ALU Overflow Frag Output
22 VSS S Ground 73 /LMV O Ruch MAC Overflow Frag Output
23 VDD S Power Supply 74 /DRDY O/Z Host Interface Transmitt Data Ready Frag Output
24 EA16/ED12 I/O 75 EMU0 I/O/Z Emurator Interrupt 0
25 EA17/ED13 I/O External SRAM and ROM Address Bus/ 76 EMU1 I/O/Z Emurator Interrupt 1
26 EA18/ES14 I/O External DRAM and I/O Data Bus 77 TDO O/Z TAP(Test Access Port) Data Output
27 EA19/ED15 I/O 78 DIV512 O Machine Clock then512 min.
28 EA4/ED16 I/O 79 ARLR1 I Audio Data Receive Unit 1 Left and Right
29 EA5/ED17 I/O External Memory Address Bus/ External I/O Channel Frame Frequency Signal
30 EA6/ED18 I/O Data Bus 80 ARLR2 I Audio Data Receive Unit 2 Left and Right
31 EA7/ED19 I/O Channel Frame Frequency Signal
32 VSS S Ground 81 HDIR/SA6 I Host Interface Data Format Select/ I2C Bus Address 6
33 VDD S Power Supply 82 SEL5V3V I Input Level Control
34 EA8/ED20 I/O 83 /MUTE I Mute Control
35 EA9/ED21 I/O External Memory Address Bus/ External I/O 84 /TRST I TAP(Test Access Port) Reset
36 EA10/ED22 I/O Data Bus 85 /RS I Hardware Reset
37 EA11/ED23 I/O 86 VSS S Ground
38 TEST0 I 87 VDD S Power Supply
39 TEST1 I 88 /IOE O External I/O Enable
Test Mode Control
40 TEST2 I 89 /RAS/SRCS O External DRAM Low Address Strove/External
41 TEST3 I SRAM Chip Select
42 /BIO I Separate Control Input 90 /CAS/SROE O External DRAM Culumn Address Strove/External
43 /INT1 I Interrupt 1 SRAM Output Enable
44 ARBC1 I Audio Data Receive Unit 1 bit Clock 91 /ROME O External ROM Enable
45 ARBC2 I Audio Data Receive Unit 2 bit Clock 92 /WE O External Memory and I/O Wright Enable
46 AX1 O Audio Data Transmitt Unit 1 Data Output 93 EA0 O
47 AX2 O Audio Data Transmitt Unit 2 Data Output 94 EA1 O
External Memory and I/O Address Bus
48 AX3 O Audio Data Transmitt Unit 3 Data Output 95 EA2 O
49 VSS S Ground 96 EA3 O
50 VDD S Power Supply 97 VSS S Ground
51 HX/SDA I/O/Z Host Interface Data Output/I2C Bus Data 98 VDD S Power Supply
52 /EMPTY O/Z CMEM Update Buffer and HR Resistor Empty Flag Output 99 ED0 I/O
External Memory and I/O Data Bus
100 ED1 I/O




18
MG16/6FX




µ PD78082 (XZ312A00) MCU DSP: ICM03
PIN NAME I/O FUNCTION PIN NAME I/O FUNCTION
No. No.
1 P12/ANI2 I/O 23 NC Non-connection
2 P13/ANI3 I/O 24 P32 I/O
3 P14/ANI4 I/O 25 P33 I/O Port 3
Port 1 / A/D converter analog input
4 P15/ANI5 I/O 26 P34 I/O
5 P16/ANI6 I/O 27 P35/PCL I/O Port 3 / Clock output
6 P17/ANI7 I/O 28 P36/BUZ I/O Port 3 / Buzzer output
7 P72/ASCK//SCK2 I/O Port 7 / Asynchronous serial interface serial clock input / Serial interface serial clock input/output 29 P37 I/O Port 3
8 P71/TxD/SO2 I/O Port 7 / Asynchronous serial interface serial data output / Serial interface serial data output 30 P00 I Port 0
9 P70/RxD/SI2 I/O Port 7 / Asynchronous serial interface serial data input / Serial interface serial data input 31 P01/INTP1 I/O
10 P101/TI6/TO6 I/O Port 10 / 8-bit timer (TM6) external counter clock input / 8-bit timer output 32 P02/INTP2 I/O Port 0 / External interrupt input
11 P100/TI5/TO5 I/O Port 10 / 8-bit timer (TM5) external counter clock input / 8-bit timer output 33 P03/INTP3 I/O
12 P50 I/O 34 NC Non-connection
13 P51 I/O 35 /RESET I System reset input
14 P52 I/O Port 5 36 IC (VPP) Internally connected
15 P53 I/O 37 X2
Main system clock crystal oscillator connection
16 P54 I/O 38 X1 I
17 VSS Ground 39 VDD Power supply +5V
18 P55 I/O 40 AVDD A/D converter analog power supply +5V
19 P56 I/O Port 5 41 AVREF I A/D converter reference voltage input
20 P57 I/O 42 AVSS A/D converter analog ground
21 P30 I/O 43 P10/ANI0 I/O
Port 3 Port 1 / A/D converter analog input
22 P31 I/O 44 P11/ANI1 I/O




PCM3001E/2K (X0053A00) ADA DSP: ICM04
PIN NAME I/O FUNCTION PIN NAME I/O FUNCTION
No. No.
1 VINL I ADC Analog Input, Lch 15 VOUTL O DAC Analog Output, Lch
2 Vcc1 ADC Analog Power Supply 16 LRCIN I Sampling Clock Input (fs)
3 AGND1 ADC Analog GND 17 BCKIN I Bit Clock Input
4 VREFL ADC Reference decouple, Lch 18 DIN I Audio Data Input
5 VREFR ADC Reference Decouple, Rch 19 DOUT O Audio Data Output
6 VINR I ADC Analog Input, Rch 20 XTI I Crystal Oscillator Input, External System Clock Input
7 CINPR ADC Anti-areasing Filter Capacitor (+), Rch 21 XTO O Crystal Oscillator Output
8 CINNR ADC Anti-areasing Filter Capacitor (-), Rch 22 CLKIO I/O Crystal Oscillator Buffer Output, External System Clock Input
9 CINNL ADC Anti-areasing Filter Capacitior (-), Lch 23 VDD Digital Power Supply
10 CINPL ADC Anti-areasing Filter Capacitor (+), Rch 24 DGND Digital GND
11 VCOM DAC Center Voltage Decouple