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PAMS Technical Documentation NSM­2 Series Transceivers

UI Module

Issue 1 12/1999

E Nokia Mobile Phones Ltd.

NSM­2 UI Module

PAMS Technical Documentation

CONTENTS
UI Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LCD Module Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bottom Connector signals . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audio control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Display Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Key . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Backlighting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Buzzer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Speaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Microphone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Vibra Alerting Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IR Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 4 6 7 7 10 11 12 12 13 14 15 16 17

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NSM­2 UI Module

UI Module
Introduction
UI module is implemented on same PCB board with BB­module and RF­ module. UI HW part are LCD, backlighting, audio parts, IR, keyboard, power key and vibra.

Buzzer

Keys

1

8

5 2 2 BASEBAND 3 IR LCD

1

1

LED

Vibra

BB Interface
Signal IRONX FBUS_RX Parameter IR­module on/off IR receive pulse IR receive no pulse FBUS_TX IR transmit pulse IR transmit no pulse VIBRA From VB Min 0 0.7 x VBB 0 0.7 x VBB 0.7 x VBB 0 0.9 0 0.7 x VBB 0 0.7 x VBB 3.0 1.0 115 ROW (0:4) Rows Typ Max 0.3 x VBB VBB 0.3 x VBB VBB VBB 03 x VBB 1.1 140 0.3 x VBB VBB 0.3 x VBB VBB 4.8 V mA V Keyboard matrix row Keyboard matrix column Battery voltage (for lights) Iout@2mA Unit V Notes IR on state Iout@2mA

COL (0:4) VB

COL0 Battery voltage

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Signal PWRONX ROW5/ LCDCD Parameter Power on signal LCD command / data Min 0 0.7 x VBB 0 0.7 x VBB Typ

PAMS Technical Documentation
Max 0.3 x VBB VBB 0.3 x VBB VBB Unit V Notes Power on key Keyboard matrix row 5 LCD driver code/ data selection LCD driver serial clock LCD driver serial data LCD driver chip select LCD driver reset Ground PWM low level PWM high level Hz % V Buzzer PWM frequency PWM duty cycle Logic supply voltage Illumination control mV Connected to COBBA EARN output. Connected to COBBA EARP output. Stops charging

SCL SDA LCDEN

Serial clock for LCD Serial data for LCD LCD enable

0 0.7 x VBB 0 0.7 x VBB 0 0.7 x VBB 0 0.7 x VBB 0 0 0.7 x VBB 440 0

0.3 x VBB VBB 0.3 x VBB VBB 0.3 x VBB VBB 0.3 x VBB VBB 0 0.3 x VBB VBB 4700 50 2.8 2.9 0.3 x VBB VBB 17.6 788

LCDRSTX GND BUZZER

Reset

VBB LIGHT EARN

2.7 0 0.7 x VBB

EARP

17.6

788

mV

CCUT

Charging control

0 0.7 x VBB

0.3 x VBB VBB

LCD Module Interface
Pin Line Symbol VBB SCLK SDA Parameter Minimum 2.7 0 0 3 Serial data input 0 0.7xVBB Typical / Nominal 2.8 Maximum 2.9 300 2 Serial clock input 4.0 VBB 0.3xVBB VBB Unit Notes

1

Supply voltage

V uA MHz V VBB = 2.7V

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Pin Line Symbol LCDCDX Parameter Minimum 0 0.7xVBB 5 6 7 8 9 LCDCSX OSC GND VOUT LCDRSTX Chip select input External clock for LCD Ground DC/DC voltage converter output Reset 0 0.7xVBB 0 0.7xVBB 30.4 32.0 0 9 0.3xVBB VBB Typical / Nominal Maximum 0.3xVBB VBB 0.3xVBB VBB 33.6 kHz V Unit

NSM­2 UI Module
Notes

4

Control/display data flag input

Control Data Active Connected to VBB on PCB

Active

9

1

Display Driver Viewing trought LCD cell

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PAMS Technical Documentation

Bottom Connector signals
Name XMICP, XMICN Min Typ Max Unit k Notes Input AC impedance Maximum signal level Mute (output DC level) Unmute (output DC level) Bias current Maximum signal level Output AC impedance (ref. GND) Series output capacitance Load AC impedance to GND (Headset) Load AC impedance to GND (Accessory) Maximum output level (no load) Output signal level Load DC resistance to GND (Accessory) Load DC resistance to GND (Headset) DC voltage (100k pull­up to VBB) When accessory is not connected

2.2 1 1.47 2.5 100 60 1.55 2.9 600 350 47 10 16 6.8 1.0 22 10 16 2.8 1500 21 626 300

Vpp V V µA mV µF k Vpp mV k V uA

XEARP, XEARN

HEADDET

An external headset device is connected to the system connector XMIC and XEAR lines, from which the signals are routed to COBBA MIC3 microphone inputs and HF earphone outputs.

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Functional Description
Audio control
The audio control and processing is taken care by the COBBA­GJP, which contains the audio (and RF codecs, and the MAD2, which contains the MCU, ASIC and DSP blocks handling and processing the audio signals.
COBBA
Bias + EMC MICP/N Preamp Premult.

MAD DSP MCU

Multipl.

MIC2 MIC1 EMC + Acc. Interf. MIC3

Pre & LP

A D

XMICP/N

XEARP/N

HFCM Amp AuxOut EMC HF EARP/N
Multipl.

Buzzer Driver in UISWITCH

LP

A

D
Buzzer

The baseband supports three microphone inputs and two earphone outputs. The inputs can be taken from an internal microphone, a headset microphone or PPH­1 microphones. The microphone signals from different sources are connected to separate inputs at the COBBA­GJP ASIC. Inputs for the microphone signals are differential type. The MIC1 inputs are used for a headset microphone that can be connected directly to the HS/HF connector. The internal microphone is connected to MIC2 inputs. In COBBA there are also three audio signal outputs of which dual ended EAR lines are used for internal earpiece and HF line for accessory audio output. The third audio output AUXOUT is used for bias supply to the headset microphone. PData(2) is used for PPH­1 mute control. The output for the internal earphone is a dual ended type output capable of driving a dynamic type speaker. The output for the external accessory and the headset is dual ended (differential). Input and output signal source selection and gain control is performed inside the COBBA­GJP asic according to control messages from the MAD2. Keypad tones, DTMF, and other audio tones are generated and encoded by the MAD2 and transmitted to the COBBA­GJP for decoding. External audio connections The external audio connections are presented on the next page. A headset and PPH­1 can be connected directly to the system connector. The headset microphone bias is supplied from COBBA AUXOUT output and fed to microphone through XMICP line. E Nokia Mobile Phones Ltd.

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PAMS Technical Documentation

Baseband
100k

2.8 V

2.8 V

100k

MAD HeadDet
CCUT HookDet

100k

CCONT

EAD 100k

220k

33k

10k

AUXOUT 10k PData(2) 470R

10k 10k 100R

10m CTIM HF 10m HFCM 470R XEARN 33k 33n MIC1P MIC1N 33n 33n MIC3N MIC3P 33n 1k 2k2 100R XMICN 2k2 100R XMICP

CHAPS

XEARP

COBBA

Analog audio accessory detection In XEARP signal there is a 100 kW pullup and 33k pulldown in the transceiver for HeadDet. The HeadDet is pulled up when an accessory is connected, and pulled down when disconnected. To get HeadDet work properly the system connector must be assembled otherwise the transceiver

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will assume that some accessory is connected. In XMICN signal there is a 1.2 kW pulldown in transceiver and serial 1.2 kW from AUXOUT to XMICP. The XMICN is connected to transistor which is then connected to the HookDet line (in MAD). External accessory notices powered­up phone by detecting voltage in HeadDet line.
Accessory connected No accessory connected Headset with a button switch pressed Headset with a button switch released Handsfree (PPH­1) HookDet*) HeadDet**) High Low High Low Low High High High XEAR and XMIC loaded (dc) XEAR and XMIC loaded (dc) XMIC loaded (dc) Notes

*) HookDet is used only for detect button in headset **) HeadDet is used only for detect that some accessory is connected into system connector

NOTE: Charging must stop when the detection sequences is done! CCUT signal at high stops charging. Headset detection The external headset device is connected to the headset connector, from which the signals are routed to COBBA headset microphone inputs and earphone outputs. In the XMICN line there is a 1.0 kW pulldown in the transceiver. The microphone is a low resistance pullup compared to the transceiver pulldown. When there is no call going, the AUXOUT is in high impedance state and the XMICN and XMICP is pulled down. When a headset is connected, the XMICP is pulled up. The switch inside the system connector is connected to the HeadDet line (in MAD), an interrupt is given due to both connection and disconnection. NOTE: If the headset is connected switch closed the transceiver can not detect if headset or PPH­1 in power off mode is connected. When switch is released to open transceiver can not any more detect the headset without polling by SW. Headset switch detection In the XMICN line there is a 1.0 kW pulldown in the transceiver. The microphone is a low resistance pullup compared to the transceiver pulldown. When a remote control switch is open, there is a capacitor in parallel with the microphone, so the XMICN is pulled up and HookDet pulled down by the phone, when AUXOUT is set to 2.1V. When the switch is closed, the XMICN is pulled down via the microphone and HookDet is pulled up. So both press and release of the button gives an interrupt when AUXOUT is set to 2.1V. PPH­1 detection The external Plug & Play PPH­1 device is connected to the system connector, from which the signals are routed to COBBA headset microphone E Nokia Mobile Phones Ltd.

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PAMS Technical Documentation inputs and earphone outputs. In the XMICN line there is a 1.0 kW pulldown in the transceiver. The PPH­1 has a low resistance pullup compared to the transceiver pulldown. When there is no call going, the AUXOUT is in high impedance state and the XMICN and XMICP is pulled down. When a powered PPH­1 is connected, the XMICP is pulled up. The switch inside the system connector is connected to the HeadDet line (in MAD), an interrupt is given due to both connection and disconnection. In PPH­1 device has two operating mode device with external microphone and without external microphone. When internal microphone is used the detection signal (EAD) is higher than when external microphone is used. NOTE I: If the PPH­1 is connected power off mode the transceiver can not detect if device is a headset or a PPH­1 connected. When PPH­1 is powered on it is possible to detect when case of PPH­1. NOTE II: If the external microphone is connected from or disconnected to PPH­1 it is not possible for transceiver to detect when that happens. Internal audio connections The speech coding functions are performed by the DSP in the MAD2 and the coded speech blocks are transferred to the COBBA for digital to analog conversion, down link direction. In the up link direction the PCM coded speech blocks are read from the COBBA by the DSP.

Display Circuit
The display circuit includes LCD module UX7 and two capacitors. The LCD module is COG (Chip on Glass) technology. The connection method for chip on the glass is ACF, Adhesive Conductive Film. The LCD module is connected to UI board with STAX elastomer. Capacitors are placed on PCB. The display driver includes hw­reset, voltage tripler or quadrupler which depends on temperature, temperature compensating circuit and low power control. Driver includes 84x48 RAM memory which is used when some elements are create on display. Elements can be created with software. Driver doesn't include CG­ROM. One bit in RAM is same as one pixel on display.

GENSIO(1:0) ROW5 LCDEN LCDRSTX

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Keyboard
Matrix size is 5 row and 5 columns. Scanning is used for keyboard reading. Rows and columns is connected to MAD interface.

Keyboard Matrix
ROW/COL 0 1 2 3 4 NC NC NC PWR switch 0 SLIDE SWT 1 Side Key Soft left 1 2 3 Send Up 4 5 6 2 Down 7 8 9 3 End/Mode 4 Side Key Soft Right * 0 #

NC = Not Connected E Nokia Mobile Phones Ltd.

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Power Key
Micro switch is used as a power key on UI module. Circuitry includes micro switch and two diodes which is needed for MAD interface. Power key is connected to CCONT. Power switch is active in LOW state. Power key is connected to ROW4.

Backlighting
Switching circuits for backlighting are placed on UI module. Display and keyboard lighting is connected together. When LIGHT­signal is HIGH the lights are on and when LIGHT­signal is LOW state lights are off.

Backlighting is made by LEDs, three LED on right and three on left side of display. LEDs are compatible with CL270­YG and those are side illuminating. Light is on when LIGHT­signal is in HIGH state. In keyboard backlighting is made by 6 LEDs. LEDs are compatible with CL190­YG. Backlighting is on when LIGHT­signal is on HIGH state.

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Buzzer
Alerting tones and/or melodies as a signal of an incoming call are generated with a buzzer that is controlled with a PWM signal by the MAD via UISWITCH. Also keypress and user function response beeps are generated with the buzzer. The buzzer is a SMD device and is placed on the mother board. Target for SPL is 100dB (A) at 5cm.

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PAMS Technical Documentation

Speaker
Speaker circuit includes pads for speaker and 2 capacitors, 2 ferrites for EMC protection. Speaker is sealed to A­cover with gasket and UI PCB with supporting ring. With that the frequency response is more constant. Speaker does not need holes for PCB. This gives reliable sound quality for the phone and it can be estimated in several environments. Arrangement is not a leak tolerant speaker. The low impedance, dynamic type earphone is connected to a differential output in the COBBA audio codec. The electrical specifications for the earphone output are shown below. The voltage level at each output is given as reference to ground. Earphone levels are given to 32 ohm load.
Nominal COBBA output, differential, 6dB gain Earpiece sound pressure (sensitivity +28dBPa/V 1kHz) 17.6mV Maximum 788mV Notes ENGINE ­ UI Interface; Estimate, must be checked with final earpiece construction Measured as shielded (in brackets with leak ring)

­7dBPa

+26dBPa

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Microphone
The internal microphone is placed to slide. Microphone is OMNI directional. The microphone requires a bias current to operate. The bias current is generated from VCOBBA supply with a transistor. EMC protection parts are implemented partly in slide and partly on motherboard.
Pin X300/2 Name MICP Min Typ 0.55 Max 4.1 Unit mV Notes Connected to COBBA MIC2N input. The maximum value corresponds to1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB. typical value is maximum value ­ 16 dB. Connected to COBBA MIC2P input. The maximum value corresponds to1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB. typical value is maximum value ­ 16 dB.

X300/1

MICN

0.55

4.1

mV

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PAMS Technical Documentation

Vibra Alerting Device
A vibra alerting device is used for giving silent signal to the user of an incoming call. Vibra is located in the phone. The vibra is controlled with a PWM signal by the MAD via UISWITCH.
Signal M300 / 1 Ivibra Rated load current Rated load speed 7000 Parameter Min 1.0 Typ 1.1 115 8000 Max 2.0 140 12000 Unit V mA rpm Notes Measured against M300/2

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IR Module
An infrared transceiver module is designed to substitute an electrical cable between the phone and a PC. The infrared transceiver module is a stand alone component capable to perform infrared transmitting and receiving functions by transforming signals transmitted in infrared light from and to electrical data pulses running in two wire asynchronous databus. IR is located left bottom corner of the product.
Signal IRONX Parameter IR­module on/off Min 0.7 x VBB 0 FBUS_RX IR receive no pulse IR receive pulse FBUS_TX IR transmit pulse IR transmit no pulse 0.7 x VBB 0 0.7 x VBB 0 Typ Max VBB 0.3 x VBB VBB 0.3 x VBB VBB 0.3 x VBB Iout@2mA Unit V Notes Iout@2mA, IR is at off state IR, is at on state

The module is activated with an IRONX signal by the MAD, which supplies power to the module. The IR datalines are connected to the MAD accessory interface AccIf via FBUS. The AccIf in MAD performs pulse encoding and shaping for transmitted data and detection and decoding for received data pulses. The data is transferred over the IR link using serial data at speeds 9.6, 19.2, 38.4, 57.6 or 115.2 kbits/s, which leads to maximum throughput of 92.160 kbits/s. The used IR module is not complies with the IrDA 1.0 specification (Infra Red Data Association), which is based on the HP SIR (Hewlett­Packard`s Serial Infra Red) concept. Maximum transmission distance is set to 60cm. In IR transmission a light pulse corresponds to 0­bit and a "dark pulse" corresponds to 1­bit. constant pulse IR TX

UART TX startbit
1

0

1

0

0

1

1

0

stopbit

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PAMS Technical Documentation The FBUS cannot be used for external accessory communication, when the infrared mode is selected. Infrared communication reserves the FBUS completely.

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