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P7689

Level 3 Circuit Description 25 / 03 / 2000 V1.0

P7689 ­ Circuit Description

P7689 Level 3 Product Guide RF: Receive 1) The RF Signal from the base station is received through the Antenna A1 or from the Accessory Connector J600 and is fed to Pin 10 or Pin 3 respectively of the RF Switch U150, the switch acts as an isolation between TX and RX. The RF Switch control is provided by U151.This decides whether the Switch is opened for TX or RX and if the RF is passed to the Aux RF port or the Antenna. This is managed by the following signals: TX_EN H L H L RX_EN L H L H SW_RF (50 Load) Loaded Loaded Not Loaded Not Loaded Result TX through J600 RX through J600 TX through Antenna RX through Antenna

2) TX_EN and RX_EN are produced by Whitecap U800, Pins C1 and E3 respectively.U151 is supported by the voltages FILTERED ­5V(From ­5V (U903)) and RF_V1(Q201) 3) Once the received signal is present (using GSM 900 as the example) in the RF switch. Provided RX275_GSM_PCS (Q2101) is high, then the received signal will be passed to the band pass filter FL400, GSM900received frequency will be filtered through, *Note RX275_GSM_PCS also selects the PCS 1900 frequency passed through FL2400. The DCS 1800 frequency is selected by RX275_DCS (Q110) and passed through FL1400 4) For the PCS 1900 and DCS 1800 frequencies the signal is then fed onto the DCS/PCS Select switch U400. The signal RVCO_PCS and RVCO_DCS (Q1100) will then select the appropriate signal; with output tuning being provided by L1411 and C1411 for DCS and C2411 for PCS. 5) Once selected the signal will be fed into a Low noise Amplifier Circuit, this part of the circuit is critical in the achievement of a very low signal to noise ratio, therefore as can be seen around the actual amplifiers Q400 for GSM (supported by RX275_GSM (Q110)) and Q1400 for DCS / PCS (supported by RX275_DPCS (Q2102)), a large amount of external frequency matching and noise reduction circuitry is involved. 6) The appropriate signal is then fed onto FL1401 (For GSM 1800 / 1900) or FL401 (For GSM 900) where any existing harmonics or other unwanted frequencies are removed.

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P7689 ­ Circuit Description

7) The amplified signal is now injected to the base of the dual transistor mixer Q450. Both mixers are supported by RX275 (Q112).The tuned emitter biasing voltage is provided by RX275_GSM (Q110) and RX275_DPCS (Q2102) 8) The RX VCO U250 is now an integrated circuit and is controlled firstly from the Whitecap using the MQ SPI bus to program the MAGIC and then MAGIC drives the RX VCO IC using the CP_RX signal Pin A1. The power is supplied by RVCO_275 (SF_OUT + GPO4 through Q1102). 9) The generated RX VCO signal is then split, with a part going back to the MAGIC IC ­ U200. Pin A3 to serve as the feedback for the RX VCO Phase lock loop. The other part is firstly amplified through a Tuned Transistor Amplifier Q252, before being used to mix with the received frequencies through the emitters of the dual mixer transistor Q450. 10) The mixer will produce sum and difference signals i.e. RX'ed frequency + RX VCO frequency and RX'ed frequency - RX VCO frequency. It will be the difference signal that is now fed to the SAW Filter FL457 (Surface Acoustic Wave), this filter is the same as was used in previous 400MHz products. The purpose of the SAW filter is to provide comprehensive removal of harmonics created during the mixing process. 11) The IF signal fed to the SAW filter will be 400Mhz. The reason for the change to 400Mhz from 215Mhz is to limit the span of the RX VCO e.g. Description EGSM L Channel PCS H Channel EGSM L Channel PCS H Channel IF 400Mhz 400Mhz 215Mhz 215Mhz Channel 975 810 975 810 Received Frequency 925.2Mhz 1989.8Mhz 925.2Mhz 1989.8Mhz RX VCO Frequency 1325.2Mhz 1589.8Mhz 1140.5Mhz 1774.8Mhz Difference 264.6Mhz 634.6Mhz

As can be seen if the IF was kept at 215Mhz, the frequency span would have to be an extra 370Mhz. This is turn assists in reducing the part count. 12) The 400Mhz IF signal is then passed to the Isolation Amplifier Q480 The purpose of an Isolation Amp is to couple an analogue signal to adjoining parts of a circuit with 2 different grounds. Also to protect the base band signals from any stray RF. The Isolation Amp is supported by SW_VCC (MAGIC U200 Pin C7)
Isolation Amp

MAGIC IC U200

Base-band Signal

101001010100

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P7689 ­ Circuit Description

13) The signal is then passed to the MAGIC IC U200 PRE IN Pin A7 14) The signal is then demodulated internally using an external 800 MHz Varactor diode CR249, RX Local Oscillator set up, which is driven by PLL CP Pin A9 of MAGIC U200. 15) Where in earlier products, we used to have RX RXQ, and I these signals are now only used in digital form within the MAGIC and can only be measured using a specific set up. The demodulated signal is now converted internally to a base band digital form to be passed along an RX SPI bus to the Whitecap. 16) The RX SPI signal is made up of BDR (Base band Data Receive), BFSR (Base band Frame Synch Receive) and BCLKR (Base band Clock Receive, fed from MAGIC Pins G8, G9 and F7 respectively. 17) The Whitecap U800 receives these signals on Pins A3, D4 and B4, within the Whitecap the signal is digitally processed. Baud rate reduced, Error correction bits removed, etc... 18) The digital signal is now being fed down the DIG_AUD_SPI bus to the GCAP II U900, internally to the GCAP, the digital signal is converted to analogue and distributed to the correct outputs: 19) For Earpiece speaker, from GCAP II Pins H6 and H7 to speaker pads J502 and J503 20) The Alert is generated within the Whitecap, given the appropriate data from the incoming signal, SMS, call etc... and is fed to the alert pads J003 and J5004. This signal is supported by the signal ALRT_VCC, which is generated from B+ through Q903. 21) For the headset only the SPKR- signal is used from GCAP II Pin H6.The output is then fed out to the Headset Jack socket J504. Pin 3. RF: Transmit 1) There are 2 Mic inputs, firstly from the Xcvr Mic J900, where the analogue input is fed to the GCAP II U900 Pin J2. 2) Secondly the analogue voice can be fed from the Aux Mic attached to the headset and will be routed from connection 1 of the Headset Jack J504, through to GCAP II, Pin H3. 3) Within the GCAP II the analogue audio will be converted to digital and clocked out onto the DIG_AUD SPI bus to the Whitecap U800.

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P7689 ­ Circuit Description 4) It is within the Whitecap that all information about the transmission burst is formulated i.e. The timing of the burst / The channel to transmit on / The error correction protocol / In which frame the information will be carried to the base station, etc, etc... 5) All this information is then added to the digitised audio and is transferred to the MAGIC U200 along a TX SPI bus. The bus is made up of BCLKX (Base band Clock Transmit) Pin B3 and BDX (Base band Data Transmit) Pin B6. The timing for this data is already decided for the transmission burst, and therefore a frame synch is not required.

6) The SPI comes into the MAGIC at Pin G7 (BCLKX) and Pin J2 (BDX) 7) The operation of the MAGIC is very complex and with respect to the transmit path, integrates the functions of the Modem and its function of performing GMSK (Gaussian Minimum Shift Keying) and also the functions of the TIC (Translational Integrated Circuit). 8) A very basic block view of how the transmit path works within the MAGIC is demonstrated in: Fig 8.1 Internal MAGIC Operation Fig 8.1

BDX Look Up ROM CLK
Digital representation of RX VCO

AFC



Channel Info
Digital representation of TX VCO F/B

TX_CP CLK 9) The data is transmitted from Whitecap to MAGIC on TX SPI bus BDX, within the MAGIC each bit of data is clocked into a register. The clocked bit and the 3 preceding bits on the register are then clocked into the look up ROM, which looks at the digital word and from that information downloads the appropriate GSMK digital representation. Channel information and AFC information from MAGIC SPI is then Motorola Internal Use 5

P7689 ­ Circuit Description added to this new digital word, this word is then representative of the TX IF frequency of GIFSYN products. As in the case of the TIC, the TX frequency feedback and the RX VCO frequency are mixed to give a difference signal, this is digitally phase compared with the `modulation' from the look up ROM. The difference creates a DC error voltage TX_CP that forms part of the TX Phase locked loop. 10) The error correction voltage TX_CP is then fed from Pin B1 of MAGIC to Pin 4 of the TX VCO IC U350, adjoining this line is the loop filter (See Loop Filter document). 11) The Loop filter comprises mainly of U360 / Q360 / Q361 and C367 and it's main function is to `smooth' out any overshoots when the channel is changed, see Fig 11.1. If this overshoot were fed to the TX VCO the resulting burst would not meet the world standards for GSM with respect to bandwidth, see Fig 11.2.
Overshoot Channel 56 Channel 24

Fig 11.2 Fig 11.1
Acceptable 3dB Bandwidth Unacceptable 3dB Bandwidth

12) The Loop filter basically acts then as a huge capacitor and resistor to give a long CR time for smoothing. It uses a small capacitor and the very high input impedance buffer Op-Amp. During the TX_EN (Whitecap) period when the transmitter is preparing to operate the capacitor charges, then on receipt of DM_CS (Whitecap) when the Transmitter actually fires; the capacitor discharges through the Op-Amp giving a smooth tuning voltage, carrying modulation to the TX VCO. The support voltage for the Loop filter is V1_FILT (V2 from GCAP II through Q913, then creates V1_SW which creates V1_FILT). 13) The TX VCO IC now creates our required output frequency with the support signals TX_DCS (TX275 + *DCS_SEL through (U1101). TX275_GSM (*GSM_SEL + RX275) (Q110) TX275_DPCS (*GSM_SEL + RX275) (Q2102) These signals configure the VCO for correct mode of operation i.e. GSM 900 / 1800 / 1900. Support Voltage being SF_OUT (MAGIC Pin C1 14) The signal is then fed out through a buffer amplifier Q330, which is supported by TX275. The signal is also split with a sample of the output frequency being directed back to the MAGIC IC Pin A3, for use within the TIC part of the MAGIC as part of the TX Phase Locked Loop.

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P7689 ­ Circuit Description 15) To prevent the output frequency from the TX VCO before stabilisation has occurred, being amplified and transmitted, there is an Isolation Diode CR320 placed. This is biased `on' by the exciter voltage from the PAC IC U350 (Power Amplifier Control IC) Pin 7; this allows the TX output frequency through to the Exciter Amplifier Q331 and at same time gives more or less drive to the exciter stage. 16) The signal is then fed to a wide bandwidth PA U300, this is driven by the exciter voltage from the PAC IC, and supported by a ­ve biasing voltage created and timed by TX275 (RF_V2 + TX_EN through Q120), Filtered ­5V (-5V) and DM_CS (Whitecap U800 Pin E2). Also supported by the voltage PA B+ (DM_CS + B+ through Q390) 17) PA matching is provided using the signals TX_GSM (TX275 + *GSM_SEL through Q1101) and TX_DCS (TX275 + *DCS_SEL through Q1101) to switch on or off the diodes CR300 through CR306 to match the PA between GSM and DCS / PCS using the inductive strips on the PCB. 18) The amplified signal is then fed back to the RF switch U150, as discussed in Receive, then either transmitted through the antenna A1 or the Accessory Socket RF Port J600 Pin 2 RF: Power Control Operation

1) The PAC IC U350 (Power Amplifier Control Integrated Circuit) controls the power control of the transmitter. Below is a list of the main signals associated with the PAC IC and their purposes. 2) The RF detector (RF_IN Pin 2) provides a DC level proportional to the peak RF voltage out of the power amplifier, this is taken via an inductive strip from the output of the PA U300. 3) DET_SW Pin 11. This pin controls the variable gain stage connected between the RF detector and the integrator. The gain of the variable stage will be unity when DET_SW is low and will be 3 when DET_SW is high (floating). 4) TX_KEY Pin 10. This signal is used to `pre-charge' the Exciter and P.A. and occurs 20µS before the start of the transmit pulse. 5) EXC Pin 7.This output drives the power control port of the exciter. An increase of this voltage will cause the exciter to increase its output power. 6) SAT_DET Pin 12. If the feedback signal from the RF detector lags too far behind the AOC signal then this output will go low, indicating that the loop in at or near saturation. This signals the DSP to reduce the AOC_DRIVE signal until SAT_DET rises. See Fig 6.1

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P7689 ­ Circuit Description 7) AOC_DRIVE Pin 8. The voltage on this pin will determine the output power of the transmitter. Under normal conditions the control loop will adjust the voltage on EXC so that the power level presented to the RF detector results in equality of the voltage present at INT and AOC. The input level will be between 0 and 2.5V. 8) ACT Pin 9. This pin will hold a high voltage when no RF is present. Once the RF level increases enough to cause the detector to rise a few millivolts then this output will go low. In the GSM radio a resistor is routed between this point and the AOC input to cause the radio to ramp up the power until the detector goes active. Fig 6.1

DMCS goes high TX starts

TX_KEY goes high

SAT_DET goes low Linear ramp down begins

SAT_DET goes high Ramp down ceases

TX_KEY Goes low

DMCS goes low

Logic: Power Up sequence 1) Three power sources available, battery, External Power via Charger (Battery must be present to power up) 2) Battery Power Source: The P7689 uses the slim 3.6V Lithium Ion battery AANN4010A. The power from the batteries is taken from BATT + (Battery contacts J604) and is routed through the Battery FET Q901. Once B+ is available the unit carries out the following checks · The battery temperature is monitored to establish whether rapid charge is required, (J604 Pin 2 BATT_THERM_AD to GCAP II Pin B3) -40 deg C ­ 2.75V 25 deg C ­ 1.39V 40 deg C ­ 0.96V · Charger sensed (J600 Pin 5 MANTEST_AD to GCAP II Pin A1) This is achieved using different sense resistors within the accessory. For DHFA Charger - 2.75V For Fast Charger ­ 2.13V For Mid Rate Charger ­ 1.38V · Senses battery voltage (GCAP II Pin F7 ­ BATTERY) · Senses input B+ level GCAP II Pin E10 ­ B+)

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P7689 ­ Circuit Description 3) Charger Power Source: As with L7389, the P7689 uses the mid rate charger. When the charger is connected into the accessory plug J600, EXT B+ will be available at Pin 14. This will be sensed at GCAP II U900 Pin D10 MOBPORTB. Once sensed the power will then be passed through the protection diode CR903 and output to the EXT B+ FET Q905. The output will be controlled by the Mid-rate 1 signal and power will be made available at B+ NB. The charger supports the phone in conjunction with the batteries, therefore the batteries are charged as B+ is supplied. 4) The GCAP II is programmed to Boost mode (5.6V) by PGB0 Pin G7 and PGM1 Pin G8 both being tied to Ground. Once B+ is applied to GCAP II Pin K5, all the appropriate voltages to supply the circuit are provided. These are: · V1 ­ Programmed to 5.0V. V1 is at 2.775V at immediate power on, but is `boosted' to 5.0V through the switch mode power supply L901 / CR902 and C913. See Fig 6.1 for basic operation. V1 supplies the DSC bus drivers, negative voltage regulators and MAGIC. V1 is created from GCAP II Pin A6 and can be measured on C906. B+ FREAK

LX Output Fig 6.1 The basic circuit operation for the Boost circuit is as follows the LX signal (GCAP II Pin B10) allows a path for B+ to charge the capacitor, when the switch is on, the capacitor then discharges through the inductor (switch off), setting up an electric field. The field then collapses setting up a back EMF to charge the capacitor, and so on and so on. The back EMF created by the inductor is greater than B+ with the +ve half of the cycle passing through the diode to charge a capacitor from where the V_BOOST voltage is taken. The frequency of the switching signal LX decides the duty cycle of the output wave and therefore the resultant voltage. V_BOOST is fed back into the GCAP. V2 ­ Programmed to 2.775V, available whenever the radio is on and supplies most of the logic side of the board. V2 is supplied out of GCAP II Pin J2 and can be measured on either C939 or C941. V3 ­ Programmed to 2.003V to support the Whitecap, but does support the normal 2.75V logic output from the Whitecap, it originates from GCAP II Pin B5 and can be measured on C909 or C910. VSIM1 ­ Used to support either 3V or 5V SIM cards. Will dynamically be set to 3V upon power up, but if the card cannot be read then the SIM card is powered down and an attempt to read the card at 5V is tried. VSIM1 can be measured on C905 and is distributed from GCAP II Pin C6 (For further information, see SIM Card Operation).

· · ·

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P7689 ­ Circuit Description VREF ­ Programmed as V2 i.e. 2.775 and provides a reference voltage for the MAGIC IC, distributed from GCAP II Pin G9 and can be measured on C919. · -5V ­ Used to drive display and ­10V ­ Used for RF GSM / DCS selection signals through Q160. Both voltages produced by V1 through U903 and U904. · SR_VCC ­ Power Cut Circuit - Used to buffer the SRAM U702 voltage with a built in soft reset within the unit's software. The reason for this is to protect the user from any accidental loss of power up to 0.5 seconds i.e. If the unit is knocked, causing a slight battery contact bounce, the SR_VCC will, to the user, keep the unit running normally, whilst internally the unit resets itself. During this loss of power the unit takes it's power from RTC BATTERY+ and is originated from GCAP II Pin E1 · V1_SW ­ See Deep Sleep Mode 5) Once the power source has been selected to power the phone on the PWR_SW must be toggled low. This can be done by pressing the Power Key S500 to create ON_2, which is supported by PWR_SW (GCAP II Pin C8). Alternatively by plugging in an external fast charger, if a battery is present, then again the ON_2 line will be pulled low. 6) The unit will then follow on as in the sequence below: ·

0

50

100

150

200

250

300

350

400

450

500

RESET

EPROM CE

SRAM VB&LB

SPI_CE

GCAP

R/W

SPI_CE MAGIC

CLK SELECT

VCLK BFSR 1.7 after RESET, BCKLR at 1.6s

DSC_EN

DOWNLINK

V1

UPLINK

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P7689 ­ Circuit Description

On initial power up, all the keypad backlights (DS504 ­ DS509 and DS513 and DS514) will be on, they are supported from the signal ALRT_VCC (B+ through Q903) and switched by BKLT_EN (Whitecap Pin K3) through Q907.Also the `blue' display backlights (DS500 ­ DS503) which are supported by V_BOOST1. 7) 13 MHz clock. On Power Up there are 2 different reference clocks produced. Initially, as soon as power is applied to the MAGIC IC the crystal, Y200, supported by the CRYSTAL_BASE (MAGIC Pin E1) will emit a 26MHz signal to the MAGIC IC, which will internally be divided by 2 to give our external 13MHz clock. This is then fed out of the MAGIC on Pin J6 (MAGIC_13MHz) and distributed to Whitecap Pin H10 (CLKIN), then from Whitecap Pin B7 to GCAP II Pin F5 as GCAP_CLK. At the same time the 13MHz Varactor Diode CR248 is producing an output. This output is controlled in the following way: The 26MHz from Y200 is divided down to 200 kHz and fed to a phase comparator within the MAGIC. The 13MHz from CR248 is also divided down and fed in to the phase comparator, the difference in phase produces an error voltage that is fed onto the cathode of the Varactor CR248. Which regulates the output to a stable 13MHz clock. Once the software is running and the logic side of the board has successfully powered up, the CLK_SELECT signal from Whitecap Pin A1 is fed to MAGIC Pin G6. This in turn then switches the Multiplexer from the output of Y200 to the CR248 output. Phase 1 Phase 2 PLL
200kHz

Error Voltage

Y200 26MHz F F 2

F F 130 Phase Detector

F F 65
13MHz

CR248

Multiplexer MAGIC IC U913

13MHz Output to Whitecap Logic: SIM Card Interface

1) Once powered up, the SIM card is interrogated. The SIM interface is part of the Whitecap U800 and it supports both `synchronous' (Prepay card) and asynchronous, serial data transmission. Although the T2288 is programmed only for asynchronous. VSIM1 (SIM_VCC) is originally programmed to 3V but if the card is 5V then the SIM card will be powered down and VSIM1 will be reprogrammed to 5V. The signal

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P7689 ­ Circuit Description levels for in and out of the SIM are now required to be level shifted within GCAP II U900 to 3V.these signals are: Reset (Whitecap Pin E9 ­ RST0) in to GCAP II Pin K7 ­ LS1_IN_TG1A. This signal is then level shifted to the required voltage and fed out to SIM Contacts J803 Pin 4 from Pin J7 - LS1_OUT_TG1A. Clock: This is a 3.25MHz signal from Whitecap Pin E9 ­ CLK0 Pin E7 to GCAP II Pin G6 ­ LS2_IN. This signal is then level shifted to the required voltage and fed out to SIM Contacts J803 Pin 6 from Pin F6 ­ LS2_OUT. SIM I/O ­ Data transmission to and from SIM card; for TX, from SIM card contact SIM I/O Pin 5 through to GCAP II Pin J8 SIM I/O. Through level shifter to desired voltage and out through Pin K10 (LS3_TX_PA_B+) to Whitecap Pin F3 DAT0_TX. For RX data from Whitecap Pin B5 DATA0_RX to GCAP II, Pin H8 ­ LS3_RX where the signal is level shifted to desired voltage and outputted on Pin J8 SIM I/O to SIM contacts Pin 5 SIM I/O. SIM_PD ­ This signal is provided by using the BATT_THERM contact of the battery. If there are no batteries present then the unit will not power up. If batteries are present, but colder than ­15 deg C and no card is inserted then the output of the comparator Q905 will stay high and the unit will display `Insert Card'. Once the battery temperature goes above that (BATT_THERM Voltage approximately 2.51V) but the SIM card is either not inserted or faulty `CHECK CARD ` will be displayed. The reason behind this is to prevent the extra cost of a mechanical SIM presence detect switch and to prevent the SIM card being removed whilst connected to Aux Power.

· · ·

·

Logic: Charger Circuit 1) As was mentioned earlier for P7389 we use either the mid-rate charger or the full rate charger. The operation of which is as follows: In standby, the phone requires approximately 50mA for support so Q905 is opened, and as the charger can support 400mA. The phone also opens Q900, controlled by CHRGC (GCAP II Pin E8). This allows a charge of 350mA to charge the battery. The current is monitored current sense resistor R913; the voltage drop over this resistor is looked at by GCAP II Pin D9 ­ I_SENSE, to monitor the charge being delivered. Mid-rate 1 = 0 Mid-rate 2 = 0
Q901

Q905

Q904

Q909

Q900

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P7689 ­ Circuit Description Whilst in a Transmit mode of operation, the unit requires up to 1.5A to be supplied during each burst.

Whilst in background mode the phone operates as in standby mode with 50mA supporting the phone and 350mA charging the battery, but this time the EXT B+ FET Q905 is switched off and therefore the charger current is directed through the charging FET Q900. In this state Mid-rate 1 = 0 Mid-rate 2 = 1 During a TX pulse the full 400mA from the charger supports B+ with addition to approximately 1.1A from the battery. For this state Mid-rate 1 = 1 Mid-rate 2 = 1

Logic: Deep Sleep Mode Deep sleep mode is there to provide a facility to save battery life by intermittently shutting off part of the PCB. This is achieved in the following way. The signal STBY_DL is generated from Whitecap Pin F1, through a standby delay circuit CR912 and U906. The logic gate U906 and diode CR912 are used to provide a short delay between the time of activation of the STBY_PC5 signal and to the STBY_DL signal. This is a hardware patch for timing issues related to the Whitecap's Deep Sleep Module (DSM). The resultant signal is then passed onto Q834 and Q912. This has the effect respectively of: 1) Grounding VREF which makes MAGIC inoperable 2) Grounding V2 This switches off MAGIC, Front END IC and inhibits the Transmit path through RF_V2 3) The shutdown is only for a fraction of a second and during that time the GCAP Clock supports the logic side of the unit. The GCAP clock is generated by Y900, which generates a 32.768MHz clock. This clock is output from Whitecap Pin C7 and fed directly to Whitecap Pin P4. The clock is always monitored by Whitecap and should it fail, the unit will no longer go into deep sleep mode.

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P7689 ­ Circuit Description

Logic: Keypad Operation 1) The keypad works as a matrix supported V2. The signals inform the Whitecap upon a key press by dropping the signal `low'. Below is the Key Matrix.
KBR0 KBR1 KBR2 KBR0 X 7 2 KBR1 7 X 1 KBR2 2 1 X KBR3 X X MENU SCROLL DOWN X KBR4 X X X KBC0 FAST ACCESS 0 6 KBC1 X * 5 KBC2 OK 9 4 KBC3 # 8 3 KBC4 X X X GND VA X X

KBR3

X

X

KBR4 KBC0 KBC1 KBC2

X FAST ACCESS X OK

X 0 * 9

MENU SCROLL DOWN X 6 5 4

X

X

X

X

X

X

X

X X X X

X X X X

X X VOL DOWN VOL UP

X VOL DOWN X MAIL

X VOL UP MAIL X

X MENU CLEAR MENU SCROLL UP X

X X X X

X X X X

KBC3

#

8

3

X

X

MENU

CLEAR

KBC4 GND

X VA

X X

X X

X X

X X

X X

X X

MENU SCROLL UP X X

X

X

X X

X X

X X

Logic: Display 1) The display is a 96 X 64 pixel graphics display and is connected to the PCB via a 16 Pin ZIF connector J902. It is made up of glass with polarizers, a display driver and transflector. It is connected to the PCB through an elastomeric contact. The LCD is controlled by: · CS1 Chip Select which originates from DP_EN_L, Whitecap Pin A11 to J902 Pin 1. · RES which originates from RESET, Whitecap Pin P2 to J902 Pin 2. · R/W which originates from R_W, Whitecap Pin P2 to J902 Pin 4. · 7 Data Lines from Whitecap DO ­ D7 · The display is supported by V2 and ­10V (originating from U904 and can be measured on C965) · Also the data / command signal AO from Whitecap Pin B12. Logic: IrDA 1) The IrDA port is used in conjunction with the Truesync Software to transfer data between various applications. This as yet cannot be used for flashing and flexing of the phone's software. The block diagram of the IrDA module U500 circuit can be seen in Fig 1.1 below

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P7689 ­ Circuit Description

2) The IrDA data takes the form of an SIP (Serial Infrared Pulse) with UTXD being an active high signal that turns the LED on. The received signal URXD is always a pulsed, active low 2.4µs pulse, and a low will light the LED. 3) The signal IrDA_EN (Whitecap Pin B2) turns off the transmitter and opens the receiver path. 4) Within the module the pulse stretcher is integrated to allow compatibility between the received signal and Whitecap. 5) The module is supported by V2 Logic: Vibrator 1) The vibrator contacts are now situated on the topside of the smart card PCB 2) The vibrator is controlled by the signal VIB_EN Whitecap Pin K1 and B+ through U501 3) U501 connects to the vibrator pads through Connector J5006 Pins 2 and 4 Vibrator pads

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