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SERVICE MANUAL
Sec. 1: Main Section
I Specifications I Preparation for Servicing I Adjustment Procedures I Schematic Diagrams I CBA's I Exploded views I Parts List
Sec. 2: Deck Mechanism Section
I Standard Maintenance I Alignment for Mechanism I Disassembly/Assembly of Mechanism I Alignment Procedures of Mechanism I Deck Exploded Views I Deck Parts List
VIDEO CASSETTE RECORDER
HG231ED
HG430ED
PAL
MAIN SECTION
VIDEO CASSETTE RECORDER HG231ED/HG430ED
Sec. 1: Main Section
I Specifications I Preparation for Servicing I Adjustment Procedures I Schematic Diagrams I CBA's I Exploded Views I Parts List
TABLE OF CONTENTS
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1-1 Important Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2-1 Standard Notes for Servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3-1 Preparation for Servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4-1 Cabinet Disassembly Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5-1 Electrical Adjustment Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6-1 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7-1 Function Indicator Symbols. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7-7 Schematic Diagrams / CBA's and Test Points. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8-1 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9-1 Wiring Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10-1 IC Pin Function Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11-1 Lead Identifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12-1 Exploded Views. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13-1 Mechanical Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14-1 Electrical Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15-1
SPECIFICATIONS
Description 1. Video 1-1. Video Output (PB) 1-2. Video Output (R/P) 1-3. Video S/N Y (R/P) 1-4. Video Color S/N AM (R/P) 1-5. Video Color S/N PM (R/P) 1-6. Resolution (PB) 2. Servo 2-1. Jitter Low 2-2. Wow & Flutter 3. Normal Audio 3-1. Output (PB) 3-2. Output (R/P) 3-3. S/N (R/P) 3-4. Distortion (R/P) 3-5. Freq. resp (R/P) at 200Hz (-20dB ref. 1kHz) at 6kHz 4. Tuner 4-1. Video output 4-2. Video S/N 4-3. Audio output 4-4. Audio S/N 5. Hi-Fi Audio [ HG430ED ] 5-1. Output 5-2. Dynamic Range 5-3. Freq. resp (6dB B.W) dBV dB Hz -12 70 -8 85 20 ~ 20K -4 SP Mode SP Mode SP Mode Vp-p dB dB dB 0.8 39 -10 40 1.0 42 -6 46 -2 1.2 E-E Mode E-E Mode E-E Mode E-E Mode dBV dBV dB % dB dB -7 -10 -9 -9 36 -6 -6 41 1.0 -4 -4 4.0 -3 -1.5 SP Mode SP Mode SP Mode SP Mode SP Mode SP Mode µsec % 0.07 0.3 0.12 0.5 SP Mode SP Mode Vp-p Vp-p dB dB dB Line 0.8 0.8 40 37 30 230 1.0 1.0 45 41 36 245 1.2 1.2 SP Mode, W/O Burst SP Mode SP Mode SP Mode FL6A Unit Minimum Nominal Maximum Remark
Note: Nominal specs represent the design specs. All units should be able to approximate these some will exceed and some may drop slightly below these specs. Limit specs represent the absolute worst condition that still might be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1
HG231SP
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special safety-related characteristics which are often not evident from visual inspection, nor can the protection they give necessarily be obtained by replacing them with components rated for higher voltage, wattage, etc. Parts that have special safety characteristics are identified by a ! on schematics and in parts lists. Use of a substitute replacement that does not have the same safety characteristics as the recommended replacement part might create shock, fire, and/or other hazards. The Product's Safety is under review continuously and new instructions are issued whenever appropriate. Prior to shipment from the factory, our products are carefully inspected to confirm with the recognized product safety and electrical codes of the countries in which they are to be sold. However, in order to maintain such compliance, it is equally important to implement the following precautions when a set is being serviced. J. Be careful that foreign objects (screws, solder droplets, etc.) do not remain inside the set. K. Crimp type wire connector The power transformer uses crimp type connectors which connect the power cord and the primary side of the transformer. When replacing the transformer, follow these steps carefully and precisely to prevent shock hazards. Replacement procedure 1)Remove the old connector by cutting the wires at a point close to the connector. Important: Do not re-use a connector. (Discard it.) 2)Strip about 15 mm of the insulation from the ends of the wires. If the wires are stranded, twist the strands to avoid frayed conductors. 3)Align the lengths of the wires to be connected. Insert the wires fully into the connector. 4)Use a crimping tool to crimp the metal sleeve at its center. Be sure to crimp fully to the complete closure of the tool. L. When connecting or disconnecting the internal connectors, first, disconnect the AC plug from the AC outlet.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for safety. Replace only with part number specified. B. In addition to safety, other parts and assemblies are specified for conformance with regulations applying to spurious radiation. These must also be replaced only with specified replacements. Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc. C. Use specified internal wiring. Note especially: 1)Wires covered with PVC tubing 2)Double insulated wires 3)High voltage leads D. Use specified insulating materials for hazardous live parts. Note especially: 1)Insulation tape 2)PVC tubing 3)Spacers 4)Insulators for transistors E. When replacing AC primary side components (transformers, power cord, etc.), wrap ends of wires securely about the terminals before soldering. F. Observe that the wires do not contact heat producing parts (heatsinks, oxide metal film resistors, fusible resistors, etc.). G. Check that replaced wires do not contact sharp edges or pointed parts. H. When a power cord has been replaced, check that 5 - 6 kg of force in any direction will not loosen it. I. Also check areas surrounding repaired locations.
1-2-1
U29PSFP
Safety Check after Servicing
Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts, and wires have been returned to their original positions. Afterwards, do the following tests and confirm the specified values to verify compliance with safety standards.
Chassis or Secondary Conductor Primary Circuit Terminals d' d
1. Clearance Distance
When replacing primary circuit components, confirm specified clearance distance (d) and (d') between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1) Table 1 : Ratings for selected area AC Line Voltage 220 to 240 V Clearance Distance (d), (d')
Fig. 1
3mm(d) 6 mm(d')
Exposed Accessible Part
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
2. Leakage Current Test
Confirm the specified (or lower) leakage current between B (earth ground, power cord plug prongs) and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and output terminals, microphone jacks, earphone jacks, etc.) is lower than or equal to the specified value in the table below. Measuring Method (Power ON) : Insert load Z between B (earth ground, power cord plug prongs) and exposed accessible parts. Use an AC voltmeter to measure across the terminals of load Z. See Fig. 2 and the following table.
Z AC Voltmeter (High Impedance)
B
One side of Power Cord Plug Prongs
Fig. 2
Table 2: Leakage current ratings for selected areas AC Line Voltage Load Z 2k RES. Connected in parallel 50k RES. Connected in parallel Leakage Current (i) i0.7mA AC Peak i2mA DC i0.7mA AC Peak i2mA DC One side of power cord plug prongs (B) to: RF or Antenna terminals A/V Input, Output
220 to 240 V
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
1-2-2
U29PSFP
STANDARD NOTES FOR SERVICING
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indicated as shown.
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
Top View Out In Input
Bottom View
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:. (1) Prepare the hot-air flat pack-IC desoldering machine, then apply hot air to the Flat Pack-IC (about 5 to 6 seconds). (Fig. S-1-1)
b. For other ICs, pin 1 and every fifth pin are indicated as shown.
5 Pin 1
10
c. The 1st pin of every male connector is indicated as shown.
Pin 1
Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while applying the hot air. (3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible Foil Connector) cable, be sure to first disconnect the AC cord. 2. FFC (Flexible Foil Connector) cable should be inserted parallel into the connector, not at an angle.
Caution:
1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)
FFC Cable
Connector CBA
* Be careful to avoid a short circuit.
1-3-1
NOTE_1
3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.
(3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) With Iron Wire: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2) Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5.
CBA
Hot-air Flat Pack-IC Desoldering Machine
Masking Tape Tweezers
Flat Pack-IC
(3) While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5 (4) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.
Fig. S-1-2
With Soldering Iron: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
Hot Air Blower Soldering Iron Fig. S-1-3 or
(2) Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)
Iron Wire
Soldering Iron To Solid Mounting Point Fig. S-1-5
Sharp Pin Fine Tip Soldering Iron
Fig. S-1-4
1-3-2
NOTE_1
Instructions for Handling Semi-conductors
CBA Fine Tip Soldering Iron
Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1M) that is properly grounded to remove any static electricity that may be charged on the body.
Flat Pack-IC Tweezers Fig. S-1-6
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate with proper grounding (1M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing.
2. Installation
(1) Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily. (2) The " I " mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) (3) Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges.
CBA
Example :
Pin 1 of the Flat Pack-IC is indicated by a " " mark.
Grounding Band
Fig. S-1-7 1M
Presolder 1M
CBA
Conductive Sheet or Copper Plate
Flat Pack-IC CBA Fig. S-1-8
1-3-3
NOTE_1
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors Caution: An optical sensor system is used for the Tape Start and End Sensors on this equipment. Carefully read and follow the instructions below. Otherwise the unit may operate erratically. What to do for preparation Insert a tape into the Deck Mechanism Assembly and press the PLAY button. The tape will be loaded into the Deck Mechanism Assembly. Make sure the power is on, connect TP507 (S-INH) to GND. This will stop the function of Tape Start Sensor, Tape End Sensor and Reel Sensors. (If these TPs are connected before plugging in the unit, the function of the sensors will stay valid.) See Fig. 1. Note: Because the Tape End Sensors are inactive, do not run a tape all the way to the start or the end of the tape to avoid tape damage.
Q505
Q504 TP507 S-INH
Fig. 1
1-4-1
HG240PFS
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain access to item(s) to be serviced. When reassembling, follow the steps in reverse order. Bend, route, and dress the cables as they were originally.
[1] Top Case [2] Front Assembly [3] VCR Chassis Unit [4] Jack CBA [5] Deck Assembly [6] Main CBA [7] Cylinder Shield [8] Jack Board [ HG430ED ]
(1): Identification (location) No. of parts in the figures (2): Name of the part (3): Figure Number for reference (4): Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered. P=Spring, L=Locking Tab, S=Screw, CN=Connector *=Unhook, Unlock, Release, Unplug, or Desolder e.g. 2(S-2) = two Screws (S-2), 2(L-2) = two Locking Tabs (L-2) (5): Refer to "Reference Notes."
Reference Notes
CAUTION: Locking Tabs (L-1) and (L-2) are fragile. Be careful not to break them. 1. Remove five Screws (S-2), two Screws (S-3): HG231ED, three Screws (S-3): HG430ED, and Screw (S-4). Then, slowly lift the VCR Chassis Unit (Deck Assembly, Jack CBA and Main CBA) up. 2. When reassembling, solder wire jumpers as shown in Fig. D5. 3. Before installing the Deck Assembly, be sure to place the pin of LD-SW on Main CBA as shown in Fig. D6. Then, install the Deck Assembly while aligning the hole of Cam Gear with the pin of LDSW, the shaft of Cam Gear with the hole of LD-SW as shown in Fig. D6.
2. Disassembly Method
REMOVAL ID/ LOC .No. [1] [2] PART REMOVE/*UNHOOK/ Fig. No. UNLOCK/RELEASE/ UNPLUG/DESOLDER D1 D2 7(S-1) *3(L-1),*4(L-2) Note -
Top Case Front Assembly
(S-1)
-
(S-1)
[3] [4] [5] [6] [7] [8]
5(S-2), (S-4), VCR Chassis D3-1 2(S-3) --- [ HG231ED ], Unit D3-2 3(S-3) --- [ HG430ED ] Jack CBA Deck Assembly Main CBA Cylinder Shield Jack Board [ HG430ED ] D4 D5 D6 D5 D5 D5 Desolder, (S-5) 2(S-6), Desolder *(L-3) --- [ HG430ED ] (S-7) ----------
1 2,3 -
[1] Top Case
(S-1)
-
(1)
(2)
(3)
(4)
(5)
Fig. D1
1-5-1
HG231DC
(L-2)
[ HG430ED ]
(L-2)
(S-2) (S-2) (S-3) (S-3) (S-2) (S-4)
[3]VCR Chassis Unit
(S-3) (S-2)
[2] Front Assembly
(L-1)
Fig. D2
[ HG231ED ]
(S-2) (S-2) (S-3) (S-2) (S-4)
[3] VCR Chassis Unit
(S-3) (S-2)
Fig. D3-2
[4] Jack CBA
(S-5) Desolder
Fig. D4 Fig. D3-1
1-5-2
HG231DC
[7] Cylinder Shield
Cylinder Assembly FE Head (S-7) ACE Head Assembly SW507 LD-SW Pin
[6] Main CBA [ HG430ED ] [8] Jack Board
(L-3) Shaft Hole Hole
[5] Deck Assembly
[5] Deck Assembly
Cam Gear
[6] Main CBA
(S-6)
LD-SW
Pin
[6] Main CBA Fig. D6
(S-6)
TOP VIEW From FE Head From Cylinder Assembly
From ACE Head Assembly Lead with blue stripe
From Capstan Motor Assembly
Lead with white stripe
Lead with blue stripe Desolder from bottom
Printing side
Lead connections of Deck Assembly and Main CBA
Fig. D5
1-5-3
HG231DC
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for "Circuit Board Assembly." NOTE: 1.Electrical adjustments are required after replacing circuit components and certain mechanical parts. It is important to do these adjustments only after all repairs and replacements have been completed. Also, do not attempt these adjustments unless the proper equipment is available. 2.To perform these alignment / confirmation procedures, make sure that the tracking control is set in the center position: Press either "L5? " or "K" button on the remote control unit first, then the "PLAY" button (Front Panel only).
Head Switching Position Adjustment
Purpose: To determine the Head Switching position during playback. Symptom of Misadjustment: May cause Head Switching noise or vertical jitter in the picture. Test point Adj.Point Mode PLAY (SP) Input -----
J23(V-OUT) VR501 TP502(RF-SW) (Switching Point) GND (MAIN CBA) Tape FL6A Measurement Equipment Oscilloscope
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe, V-Range: 0.001~50V/Div., F-Range: DC~AC-20MHz 2.Alignment Tape (FL6A)
Spec. 6.5H±1H (412.7µs±63.5µs)
Connections of Measurement Equipment
Oscilloscope Main CBA J23 GND TP502 CH1 CH2 Trig. (+)
Figure 1
EXT. Syncronize Trigger Point
CH1 1.0H CH2 Switching Pulse 0.5H V-Sync
6.5H+/-1H (412.7µs+/-63.5µs)
Reference Notes: Playback the Alignment tape and adjust VR501 so that the V-sync front edge of the CH1 video output waveform is at the 6.5H±1H(412.7µs±63.5µs) delayed position from the rising edge of the CH2 head switching pulse waveform.
1-6-1
HG240EA
Comparison Chart of Models & Marks
AL+5V SW507 LD-SW D502 S-LED 14 REMOCON-IN RS501 REMOTE SENSOR
MAIN CBA
TP507 SENS-INH KEY- 1 7 KEY- 2 8 KEY SWITCH
Model HG231ED HG430ED
AL+5V
Mark A B
KEY SWITCH
IC501 (SERVO/SYSTEM CONTROL)
Q504
ST-S
SENSOR CBA
Q503 Q501 TIMER+5V TP501
D561 STAND-BY
9 95 94 10 4 80 79
LD-SW CTL(+) CTL(-) ST-S END-S T-REEL S-REEL
TP506 END-S T-REEL +5V CTL
97 CTL AMP OUT D562 POWER
PS503 S-REEL RESET
34 RESET
Q505
END-S
SENSOR CBA
Q562
(DECK ASSEMBLY)
D564 TIMER
D563 CAS
Q563
Servo/System Control Block Diagram
BLOCK DIAGRAMS
1-7-1
Q564
D565 REC
CONTROL HEAD
CN504 2 CTL(+) 1 CTL(-) Q565 A AUDIO-SW-1 29 AUDIO-SW-2 30 AL+5V VR501 SW-POINT AL+5V
2 PG-DELAY 31 REC-SAF-SW A-MUTE-H 83
23 24 25 26
POWER-LED CAS-LED TIMER-LED REC-LED
3 12 5 11
TU701(TUNER UNIT) SDA SDA SCL SCL
IC503 (MEMORY)
5 SDA 6 SCL
AC HEAD ASSEMBLY
AUDIO-SW-1 AUDIO-SW-2 IIC-BUS SDA IIC-BUS SCL A-MUTE-H IIC-BUS SDA IIC-BUS SCL TO AUDIO BLOCK
CYLINDER ASSEMBLY
SW506 REC-SAFETY P-ON+15V AL+12V
CAPSTAN MOTOR
B Hi-Fi-H-SW 19 A-MODE 32 LINE-MUTE 28
PG SENSOR
Hi-Fi-H-SW A-MODE LINE-MUTE
FROM/TO Hi-Fi AUDIO BLOCK
DRUM MOTOR
M M
CAPSTAN MOTOR
90 D-PFG 77 D-CONT 81 LM-FWD/REV IIC-BUS SDA IIC-BUS SCL 76 C-CONT D-REC-H 78 C-F/R RF-SW C-ROTA 87 C-FG
IIC-BUS SDA IIC-BUS SCL D-REC-H RF-SW C-ROTA P-ON+5V AL+12V/+20.5V
72 71 33 18 15 D-V-SYNC 13
LOADING MOTOR
M
12 11 10 9 8 7 6 5 4 3 2 1
CN502 P-ON+15V AL+12V(2) GND D-PFG D-CONT LM-FWD/REV GND C-CONT C-F/R C-FG P-ON+5V AL+12V/+20.5V
D-V-SYNC B H-A-SW 16 H-A-COMP 17 C-POW-SW P-ON-H P-DOWN-L H-A-SW H-A-COMP V-ENV V-ENV 6 C-SYNC 58 C-SYNC
66 C-POW-SW 67 P-ON-H 86 P-DOWN-L
FROM/TO VIDEO BLOCK
FROM/TO POWER SUPPLY BLOCK
HG231BLS
REC-VIDEO SIGNAL
PB-VIDEO SIGNAL
MODE: SP/REC
Comparison Chart of Models & Marks
Model HG231ED HG430ED Mark A B
MAIN CBA
FROM SERVO/SYSTEM CONTROL BLOCK IIC-BUS SDA IIC-BUS SCL
50
IC501 (OSD)
52
OSD CHARACTER MIX
Video Block Diagram
Q351 BUFFER
65 43 46 68 69 78 79
IC301 (Y/C SIGNAL PROCESS)
(DECK ASSEMBLY)
Y. DELAY SERIAL DECORDER
CYLINDER ASSEMBLY
R SP EP P
VIDEO (R)-1 HEAD VIDEO (L)-1 HEAD VIDEO (L)-2 HEAD
TU701(TUNER UNIT)
TUNER IN1 IN2 FRT IN2 FRT PB/EE BYPASS AGC
LUMINANCE SIGNAL PROCESS SP HEAD AMP
VIDEO IN 6 VIDEO OUT 24
96 95 93 94
CN253 V(R)-1 V-COM V(L)-2 V(L)-2 V-COM V(R)-2 1 2 3 4 5 6
FRONT
JK756 V-IN
48 50 52 54 56
1-7-2
CHARA. INS. CCD 1H DELAY
+
Y MUTE TUNER IN1 PB/EE MUTE R PR P
B
1/2
C
REC FM AGC
EP HEAD AMP
90 89 88 87
VIDEO (R)-2 HEAD B
WF1 TP502 RF-SW
CHROMINANCE SIGNAL PROCESS
D-REC-H 80 C-ROTA/RF-SW 70 D-V-SYNC 62
B H-A-SW 71 H-A-COMP 83
D-REC-H RF-SW C-ROTA D-V-SYNC FROM/TO SERVO/SYSTEM CONTROL BLOCK
H-A-SW H-A-COMP
JACK CBA
Y/C MIX
P
WF3 J23 V-OUT
R
FBC
CN151 AGC VXO
JK101 Q101 CN101 1 BUFFER V-OUT1 19 3 20 V-IN1
V-OUT1 V-IN1
1 3
61 63
V-ENV 84 C-SYNC 67
V-ENV C-SYNC
V-OUT2 19 20 V-IN2
JK102 Q102 CN102 1 BUFFER 3
58 28 29 59
CN152
25
21
V-OUT2 V-IN2
1 3
X301 4.433619MHz
TP301 C-PB WF2
HG231BLV
Comparison Chart of Models & Marks
Model HG231ED HG430ED
PB-AUDIO SIGNAL
Mode : SP/REC
Mark A B
REC-AUDIO SIGNAL
JACK CBA
AUDIO 2 TU-AUDIO 21
TU701(TUNER UNIT)
MAIN CBA
JK101
A-IN1 A-IN1 A-OUT1 A-OUT1
2 6 1 3
CN101 7 5
CN151 7 A-IN1(L) A-OUT1(R) 5
JK102
Q151
BUFFER
Audio Block Diagram ( A )
A-IN2 A-IN2 A-OUT2 A-OUT2
1 5 2 4
2 6 1 3
CN102 8 6
CN152 8 A-IN2(L) A-OUT2(R) 6
IC151 (SWITCHING) PB/EE PB/EE PB/EE 3 IN2
Q152
BUFFER
13
TUNER PB/EE IN1 IN1 12 14 15 11 10 9
SW CTL
AUDIO-SW-1 AUDIO-SW-2
TO SERVO/SYSTEM CONTROL BLOCK
1-7-3
13 15 17 PB-ON 5 6 EQ AMP 8 9 SP/LP-ON +5V 7 ATT P INV R Q401 Q402 BIAS OSC 1 2 AUTO BIAS 3 Q406 100 REC AMP Q403 (SWITCHING) +5V Q405 (PB=ON)
IC301 (AUDIO SIGNAL PROCESS) TUNER IN1 IN2
ALC DET ALC LINE AMP MUTE
12
11
(DECK ASSEMBLY)
ACE HEAD ASSEMBLY
REC-ON
AUDIO HEAD
AUDIO ERASE HEAD
CN287 A-PB/REC A-COM AE-H AE-H/FE-H
3 4 6 5
3 4 6 5
CN504 A-PB/REC A-COM AE-H AE-H/FE-H
SERIAL DECODER
FE HEAD
AUDIO HD-SW CONTROL 16
68 69
71
FULL ERASE HEAD
CN501 2 FE-H 1 FE-H-GND
A-MUTE-H IIC-BUS SDA IIC-BUS SCL
TO SERVO/SYSTEM CONTROL BLOCK
HG231BLA
Comparison Chart of Models & Marks
Model HG231ED HG430ED
PB-AUDIO SIGNAL
Mode : SP/REC
Mark A B
REC-AUDIO SIGNAL
MAIN CBA
Audio Block Diagram ( B )
TO Hi-Fi AUDIO BLOCK
N-A-PB N-A-REC
IC301 (AUDIO SIGNAL PROCESS) 13 IN1 TUNER IN2 15 17
1-7-4
PB-ON R 8 ATT P 9 5 6 EQ AMP SP/LP-ON +5V 7 INV Q401 Q402 BIAS OSC 1 2 AUTO BIAS 3 Q406 100 REC AMP Q403 +5V Q405 (PB=ON)
ALC DET ALC LINE AMP MUTE
12
11
(DECK ASSEMBLY)
ACE HEAD ASSEMBLY
REC-ON
AUDIO HEAD
AUDIO ERASE HEAD
3 4 6 5
CN504 A-PB/REC A-COM AE-H AE-H/FE-H
SERIAL DECODER
FE HEAD
AUDIO HD-SW CONTROL 16
68 69
71
FULL ERASE HEAD
CN501 2 FE-H 1 FE-H-GND
A-MUTE-H IIC-BUS SDA IIC-BUS SCL
HG430BLA
TO SERVO/SYSTEM CONTROL BLOCK
Comparison Chart of Models & Marks
PB-AUDIO SIGNAL REC-AUDIO SIGNAL Mode : SP/REC
Model HG231ED HG430ED
JK751 A-OUT (L)
Mark A B
MAIN CBA
2 1
CN509 A-OUT1(L) A-OUT1(R)
JACK CBA
A-OUT (R)
JK101
CN151
A-IN1(R) A-IN1(L) A-OUT1(R) A-OUT1(L)
2 6 1 3
CN101 9 7 5 11
A-IN1(R) A-IN1(L) A-OUT1(R) A-OUT1(L)
9 7 5 11
SUB JACK CBA
JK102
CN152
AFV CBA
CN701 CN1 CN1 2 SIF 4 TU-AUDIO(R) 4 IF SIGNAL PROCESS 5 TU-AUDIO(L) 5 CN701 2
TU701 (TUNER UNIT)
22 SIF OUT
A-IN2(R) A-IN2(L) A-OUT2(R) A-OUT2(L)
2 6 1 3
CN102 9 8 6 11
A-IN2(R) A-IN2(L) A-OUT2(R) A-OUT2(L)
9 8 6 11
Hi-Fi Audio Block Diagram ( B )
IC451 (Hi-Fi AUDIO SIGNAL PROCESS)
67 65
MUTE-ON
73 74
SW VCO SW ALC ALC
62 70
OUTPUT SELECT
MUTE
72
2 AUDIO IN
1-7-5
ALC SW NOISE COMP R-CH BPF NOISE DET LIM DEV VCO HOLD PULSE LPF MIX L-CH INSEL
14 15 61 71
76 77 MUTE-ON 75
LOGIC ENV DET
37 38 Q451
IIC-BUS SDA IIC-BUS SCL A-MODE LINE-MUTE
21 MUTE 53
R-CH PNR P R
47
FROM/TO SERVO/SYSTEM CONTROL BLOCK
JK758 A-IN(R)
R-CH INSEL
48
52 56 54 50 60
39
Hi-Fi-H-SW
FRONT
JK757 A-IN(L)
V/I LPF
2 6 10 8 4
(DECK ASSEMBLY)
LIM DEV R P DO DET R SW NOISE COMP L-CH BPF LIM L VCO
L-CH PNR
+ 78 80
CYLINDER ASSEMBLY
Hi-Fi AUDIO (R) HEAD
24 26 27 7 8 9
ALC
TO AUDIO BLOCK
N-A-REC N-A-PB
CN253 Hi-Fi-A(R) Hi-Fi-COM Hi-Fi-A(L)
HG430BLH
34 33
Hi-Fi AUDIO (L) HEAD
Comparison Chart of Models & Marks
CAUTION FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE. CAUTION ! Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit. If Main Fuse (F001) is blown, check to see that all components in the power supply circuit are not defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the power supply circuit to fail.
Model HG231ED HG430ED
Mark A B
NOTE : The voltage for parts in hot circuit is measured using hot GND as a common terminal.
MAIN CBA
HOT CIRCUIT. BE CAREFUL. B A D001 - D004 Q051
2 12
F001 T1.6A L 250V BRIDGE RECTIFIER Q052 Q053
13
L003
T001
AC001
LINE FILTER
Power Supply Block Diagram
Q057
4 14
Q058 Q055 Q001
15
P-ON+15V P-ON+44V P-ON-H AL+12V/+20.5V AL+9V AL+12V C-POW-SW AL+5V TIMER+5V P-ON+5V P-DOWN-L AL-5V Q054
1-7-6
16
Q059
Q002 A
11
7
17
Q056
6
18
IC001 ERROR VOLTAGE DET
4 1
Q004 SHUNT REGULATOR
Q003
HOT
3
2
COLD
HG231BLP
FUNCTION INDICATOR SYMBOLS
Note: The following symbols will appear on the indicator panel to indicate the current mode or operation of the VCR. On-screen modes will also be momentarily displayed on the tv screen when you press the operation buttons.
Display panel
STANDBY
FUNCTION
TAPE IN
TIMER
REC
" H "= LED Light on, " L "= LED Light off MODE STANDBY FUNCTION TAPE IN TIMER Power on = " H " Power off = " L " VCR mode = " H " TV mode = " L " Cassette in = " H " Cassette out = " L " Timer stand by = " H " One touch recording = " H " Timer recording = " H " General mode = " L " REC mode = " H " REC pause General mode = " L " Blinks at 0.8Hz interval INDICATOR ACTIVE
REC
When reel and capstan mechanism is not functioning correctly When tape loading mechanism is not functioning correctly When cassette loading mechanism is not functioning correctly When the drum is not working properly P-ON Power safety detection
"A R" is displayed on a TV screen. (Refer to Fig. 1.) "A T" is displayed on a TV screen. (Refer to Fig. 2.) "A C" is displayed on a TV screen. (Refer to Fig. 3.) "A D" is displayed on a TV screen. (Refer to Fig. 4.) "A P" is displayed on a TV screen. (Refer to Fig. 5.)
1-7-7
HG231FIS
TV screen
Note: OSD for mechanical error will be displayed for 5 sec. after the mechanical error occurs. When reel and capstan mechanism is not functioning correctly When the drum is not working properly
A R
A D
Fig. 1
Fig. 4
When tape loading mechanism is not functioning correctly
P-ON Power safety detection
A T
A P
Fig. 2
Fig. 5
When cassette loading mechanism is not functioning correctly
A C
Fig. 3
1-7-8
HG231FIS
SCHEMATIC DIAGRAMS / CBA'S AND TEST POINTS
Standard Notes WARNING
Many electrical and mechanical parts in this chassis have special characteristics. These characteristics often pass unnoticed and the protection afforded by them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage, etc. Replacement parts that have these special safety characteristics are identified in this manual and its supplements; electrical components having such features are identified by the mark " ! " in the schematic diagram and the parts list. Before replacing any of these components, read the parts list in this manual carefully. The use of substitute replacement parts that do not have the same safety characteristics as specified in the parts list may create shock, fire, or other hazards.
Notes:
1. Do not use the part number shown on these drawings for ordering. The correct part number is shown in the parts list, and may be slightly different or amended since these drawings were prepared. 2. All resistance values are indicated in ohms (K=103, M=106). 3. Resistor wattages are 1/4W or 1/6W unless otherwise specified. 4. All capacitance values are indicated in µF (P=10-6 µF). 5. All voltages are DC voltages unless otherwise specified. 6. Electrical parts such as capacitors, connectors, diodes, IC's, transistors, resistors, switches, and fuses are identified by four digits. The first two digits are not shown for each component. In each block of the diagram, there is a note such as shown below to indicate these abbreviated two digits.
Capacitor Temperature Markings
Mark (B) (F) (SR) (Z) Capacity change rate Standard temperature 20°C 20°C 20°C 20°C Temperature range -25~+85°C -25~+85°C -25~+85°C -10~+70°C
±10%
+30 - 80%
±15%
+30 - 80%
Capacitors and transistors are represented by the following symbols.
CBA Symbols
(Top View) (Bottom View) + Electrolytic Capacitor
Schematic Diagram Symbols
Digital Transistor
(Bottom View)
Transistor or Digital Transistor
E C B (Top View)
(Top View)
NPN Transistor
ECB ECB
PNP Transistor
(Top View)
(Top View)
NPN Digital Transistor
ECB ECB
PNP Digital Transistor
1-8-1
SCPA1
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING PAGES: 1. CAUTION: FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE. 2. CAUTION: Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit. If Main Fuse (F001) is blown, first check to see that all components in the power supply circuit are not defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the power supply circuit to fail. 3. Note: (1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts list, and may be slightly different or amended since the drawings were prepared. (2) To maintain original function and reliability of repaired units, use only original replacement parts which are listed with their part numbers in the parts list section of the service manual. 4. Mode: SP/REC 5. Voltage indications for PLAY and REC modes on the schematics are as shown below:
Unit: Volts
1 5.0
2
3 5.0 (2.5)
PLAY mode REC mode
The same voltage for both PLAY & REC modes
Indicates that the voltage is not consistent here.
6. How to read converged lines
1-D3 Distinction Area Line Number (1 to 3 digits) Examples: 1. "1-D3" means that line number "1" goes to area "D3". 2. "1-B1" means that line number "1" goes to area "B1".
3 AREA D3 2 1 A
1-B1
AREA B1 1-D3 B C D
7. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB. : Used to indicate a test point with a component lead on foil side. : Used to indicate a test point with no test pin. : Used to indicate a test point with a test pin.
1-8-2
SCRK05
Main 1/6 Schematic Diagram
Comparison Chart of Models and Marks
MODEL HG231ED HG430ED MARK A B
1-8-3
1-8-4
HG231SCM1
Main 2/6 & Sensor Schematic Diagrams
Comparison Chart of Models and Marks
MODEL HG231ED HG430ED MARK A B
1-8-5
1-8-6
HG231SCM2
Main 3/6 Schematic Diagram
Comparison Chart of Models and Marks
MODEL HG231ED HG430ED MARK A B
1-8-7
1-8-8
HG231SCM3
Main 4/6 & Jack Schematic Diagrams
Comparison Chart of Models and Marks
MODEL HG231ED HG430ED MARK A B
1-8-9
1-8-10
HG231SCM4
Main 5/6 Schematic Diagram
CAUTION ! For continued protection against fire hazard, replace only with the same type fuse. NOTE : The voltage for parts in hot circuit is measured using hot GND as a common terminal. CAUTION ! Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit. If Main Fuse (F001) is blown, check to see that all components in the power supply circuit are not defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the power supply circuit to fail.
Comparison Chart of Models and Marks
MODEL HG231ED HG430ED MARK A B
1-8-11
1-8-12
HG231SCM5
Main 6/6 Schematic Diagram ( B )
Comparison Chart of Models and Marks
MODEL HG231ED HG430ED MARK A B
1-8-13
1-8-14
HG430SCM6
AFV Schematic Diagram ( B )
Comparison Chart of Models and Marks
MODEL HG231ED HG430ED MARK A B
1-8-15
1-8-16
HG430SCAFV
Main CBA Top View
CAUTION ! For continued protection against fire hazard, replace only with the same type fuse. NOTE : The voltage for parts in hot circuit is measured using hot GND as a common terminal. CAUTION ! Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit. If Main Fuse (F001) is blown, check to see that all components in the power supply circuit are not defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the power supply circuit to fail. BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED. ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
Sensor CBA Top View
BHF300F01011A
BHF300F01011B
WF3 J23 V-OUT
TP507 WF1 TP502 RF-SW S-INH TP501 CTL WF2 TP301 C-PB
VR501 SW-P
1-8-17
1-8-18
BHG470F01014A
Main CBA Bottom View
CAUTION ! For continued protection against fire hazard, replace only with the same type fuse. NOTE : The voltage for parts in hot circuit is measured using hot GND as a common terminal. BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED. ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
CAUTION ! Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit. If Main Fuse (F001) is blown, check to see that all components in the power supply circuit are not defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the power supply circuit to fail.
1-8-19
1-8-20
BHG470F01014A
Jack CBA Top View
Jack CBA Bottom View
1-8-21
1-8-22
BHG470F01014C
AFV CBA Top View ( B )
AFV CBA Bottom View ( B )
Comparison Chart of Models and Marks
MODEL HG231ED HG430ED MARK A B
BHC400F01093
Sub Jack CBA Top View ( B )
Sub Jack CBA Bottom View ( B )
BHG470F01014B
1-8-23
1-8-24
WAVEFORMS
WF2 UPPER
(TP301 of Main CBA) of Main CBA)
WF1 LOWER (TP502
C-PB RF-SW
10mV x 10 0.5V x 10 5ms
WF3 UPPER
(J23 of Main CBA) of Main CBA)
WF1 LOWER (TP502
V-OUT RF-SW
0.1V x 10 0.5V x 10 50µs
WF3
(J23 of Main CBA)
V-OUT E-E 10µs 50mV x 10
1-9-1
U29WFPAL
Comparison Chart of Models & Marks
ANT-IN ANT-OUT B
AC CORD
Model HG231ED HG430ED
Mark A B
SENSOR CBA (BHF300F01011)
SENSOR CBA
AFV CBA (BHC400F01093)
(BHF300F01011)
(DECK ASSEMBLY)
AC HEAD ASSEMBLY
CONTROL HEAD
CN701 1 2 3 4 5 6 7 8 9 NU SIF GND TU-AUDIO(R) TU-AUDIO(L) P-ON+5V P-ON+5V IIC-BUS SCL IIC-BUS SDA
CN1 1 2 3 4 5 6 7 8 9
AUDIO HEAD
AUDIO ERASE HEAD
CN287 CTL(-) CTL(+) A-PB/REC A-COM AE-H/FE-H AE-H 1 2 3 4 5 6 CN504 CTL(-) CTL(+) A-PB/REC A-COM AE-H/FE-H AE-H
1 2 3 4 5 6
FE HEAD
CN501 2 FE-H 1 FE-H GND
JK101,102
1 2 3 4 5 6 7 8 9 10
FULL ERASE HEAD
CAPSTAN MOTOR MAIN CBA (BHG470F01014A)
LOADING MOTOR
M
WIRING DIAGRAM
1-10-1
B 1 2 3 4 5 6 7 8 9 CN253 V(R)-1 V-COM V(L)-1 V(L)-2 V-COM V(R)-2 Hi-Fi-A(R) Hi-Fi-COM Hi-Fi-A(L)
CYLINDER ASSEMBLY
M
CN151 1 2 3 4 5 6 7 8 9 10 11 JW001 V-OUT1 GND V-IN1 AL+12V(1) A-OUT1(R) JK1-8P-OUT A-IN1(L) NU A-IN1(R) GND A-OUT1(L)
CN101 1 2 3 4 5 6 7 8 9 10 11 B
JACK CBA (BHG470F01014C)
11 12 13 14 15 16 17 18 19 21 20
PG SENSOR
CAPSTAN MOTOR
DRUM MOTOR
M
1 2 3 4 5 6 7 8 9 10 11 12
CN502 AL+12V/+20.5V P-ON+5V C-FG C-F/R C-CONT GND LM-FWD/REV D-CONT D-PFG GND AL+12V(2) P-ON+15V CN152 1 2 3 4 5 6 7 8 9 10 11
VIDEO (R)1 HEAD
VIDEO (L)1 HEAD
JW002 V-OUT2 GND V-IN2 NU GND A-OUT2(R) SC2-IN A-IN2(L) A-IN2(R) GND A-OUT2(L)
CN102 1 2 3 4 5 6 7 8 9 10 11 B
VIDEO (L)2 HEAD
B
VIDEO (R)2 HEAD
Hi-Fi AUDIO (R) HEAD
JW003 A-OUT1(R) A-OUT1(L) GND
CN509 1 SUB JACK CBA 2 (BHG470F01014B) 3
AUDIO OUT(R) AUDIO OUT(L)
Hi-Fi AUDIO (L) HEAD
HG231WI
IC PIN FUNCTION DESCRIPTIONS
Comparison Chart of Models and Marks
Model HG231ED HG430ED Mark A B 17 Pin IN/ Mark No. OUT A B IN Signal Name N.U. H-ACOMP Function Not Used Head Amp Comparator Signal Video Head Switching Pulse Not Used Hi-Fi Audio Head Switching Pulse Not Used Not Used Not Used "POWER" LED Signal Output Active Level H/L H/L H/L H H H H H H/L H/L -
IC501( SERVO / SYSTEM CONTROL IC )
Pin IN/ Mark No. OUT 1 IN Signal Name SC2-IN "H" 4.5V, "L" 1.0V Active Function Level Input Signal from Pin 8 of SCART2 Video Head Switching Pulse Signal Adjusted Voltage A/D
18 A 19 B
OUT RF-SW N.U.
OUT Hi-Fi-HSW N.U. N.U. N.U.
20 21 22 23
2
IN
PGDELAY
A/D
3
IN
P-ON Power POW-SAF Detection Input Signal END-S Tape End Position Detect Signal Automatic Frequency Control Signal Video Envelope Comparator Signal Key Scan Input Signal 1 Key Scan Input Signal 2 Deck Mode Position Detector Signal Tape Start Position Detector Signal Not Used Not Used Dummy V-sync Output
OUT POWERLED
A/D 24 A/D 25 26 27 A/D 28 A/D A/D A/D 30 A/D H/Hi-z L 32 A B 31 29 A B A B A B
"CASSETTE" OUT CAS-LED LED Signal Output OUT TIMERLED "TIMER" LED Signal Output Recording LED Control Signal Not Used Not Used Audio Mute Control Signal Audio IN/OUT Control Signal Not Used Audio IN/OUT Control Signal Not Used Recording Safety SW Detect (With Record tab="L"/ With out Record tab="H") Not Used Hi-Fi Tape Detection Signal
4
IN
5
IN
AFC
A/D
OUT REC-LED N.U. N.U.
6 7 8 9
IN IN IN IN
V-ENV KEY-1 KEY-2 LD-SW
OUT LINEMUTE OUT AUDIOSW-1 N.U.
OUT AUDIOSW-2 N.U.
10 11 12 13 14
IN -
ST-S N.U. N.U.
IN
RECSAF-SW
H
OUT D-VSYNC IN
IN
N.U. A-MODE
L H L -
REMOCO Remote Control N-IN Sensor Color Phase Rotary Changeover SIgnal Not Used Video Head Amp Switching Pulse
15 A 16 B
OUT C-ROTA N.U.
H/L H/L
33 34 35 36 37
OUT D-REC-H Delayed Record Signal IN IN RESET Xcin Vcc System Reset Signal (Reset="L") Sub Clock Sub Clock Vcc
OUT H-A-SW
OUT Xcout
1-11-1
HG231PIN
Pin IN/ Mark No. OUT 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 IN
Signal Name Xin
Function Main Clock Input Main Clock Input Vss(GND) Not Used Not Used Clock Select (GND) Clock Input for letter size Clock Output for letter size Not Used LP
Active Level -
Pin IN/ Mark No. OUT 71 72 73 74 75 76 77
Signal Name
Function I2C BUS Control Clock I2C BUS Control Data Not Used Not Used Not Used Capstan Motor Control Signal Drum Motor Control Signal Capstan Motor FWD/REV Control Signal (FWD="L"/ REV="H")
Active Level H/L H/L PWM PWM
OUT IIC-BUS SCL IN/ IIC-BUS OUT SDA N.U. N.U. N.U.
OUT Xout IN IN Vss N.U. N.U. CLKSEL OSCin
OUT C-CONT OUT D-CONT
OUT OSCout IN IN N.U. LP
78
OUT C-F/R
H/L
FSC-IN 4.43MHz Clock [4.43MHz] Input OSDVss OSDVss OSD Video OSD-V-IN Signal Input N.U. Not Used OSD Video Signal Output OSDVcc LPF Connected Terminal (Slicer) Not Used Not Used Not Used Composite Synchronized Pulse SCART 1 8Pin Output Control Signal Not Used Not Used SD-H Not Used Not Used Not Used Capstan Power Switching Signal Power On Signal at High Not Used Not Used Not Used
79 80 81
IN IN
S-REEL T-REEL
Supply Reel PULSE Rotation Signal Take Up Reel PULSE Rotation Signal H/L/ Hi-z H L
PULSE 87 88 89 H/L 90 94 H/L 95 H 96 92 93 91 82 83 84 85 86
OUT LM-FWD/ Loading Motor REV Control Signal N.U. Not Used Audio Mute Control Signal Not Used Not Used
OUT OSD-VOUT IN OSDVcc HLF N.U. N.U. N.U. C-SYNC
OUT A-MUTE IN N.U. N.U.
Power Voltage P-DOWN- Down Detector L Signal C-FG N.U. N.U. D-PFG
IN IN -
Capstan Motor PULSE Rotation Detection Pulse Not Used Not Used Drum Motor Pulse Generator PULSE H/L
59 60 61 62 63 64 65 66 67 68 69 70
OUT 8POUT-1 N.U. N.U. N.U. N.U. N.U.
AMPVRE V-Ref for CTL F OUT AMP AMPVRE V-Ref for CTL F in AMP P80/C P80/C Terminal Playback/ Record Control Signal (-) Playback/ Record Control Signal (+) CTL AMP Connected Terminal
OUT SD-H
OUT C-POWSW IN P-ON-H N.U. N.U. N.U.
IN/ CTL (-) OUT IN/ CTL (+) OUT AMPC
H/L
-
1-11-2
HG231PIN
Pin IN/ Mark No. OUT 97 98 99 -
Signal Name CTLAMP out AMPVcc AVcc
Function To Monitor for CTL AMP Output AMPVcc A/D Converter Power Input/ Standard Voltage Input IF AGC Comparator Signal
Active Level PULSE -
100
IN
AGC
A/D
Notes: Abbreviation for Active Level: PWM -----Pulse Wide Modulation A/D--------Analog - Digital Converter
1-11-3
HG231PIN
LEAD IDENTIFICATIONS
2SC2785(F,H,J) BA1F4M-T BN1F4M-T BN1L4M-T KRA103M KRA104M KRC103M KTA1266(GR) KTA1281(Y) KTC3199(BL,GR,Y) 2SA1015-GR(TPE2) 2SA1020(Y) 2SC1815-BL(TPE2) 2SC1815-GR(TPE2) 2SC1815-Y(TPE2) 2SC2120-Y(TPE2) 2SC3266-Y(TPE2) KTA1267(GR,Y) KTC3203(Y) KTC3205(Y) BU4052BCF-E2 CD4052BCSJX TC4052BF(EL) 16 9
1 E C B E C B EL817A EL817B EL817C LTV-817B-F LTV-817C-F PS2561A-1(Q,W) A 1 4 K E
E
8 MID-32A22F PT204-6B-12
2SK3566
BR24L02F-WE2 CAT24WC02JI
8
5
C
C
RN1511(TE85R) FMG4A T148 C1 C2
FA1F4M-T1B KRC103S RTK KTA1504GR-RTK KTA1504Y-RTK KTC3875Y-RTK C
G D S
LA72648M-MPB-E QSZAB0RMB192 80 81 51 50
B1 E B2 B E
100 1 LA71750EM-MPB-E 30
31
60
41
MSP3407G-QG-B8 MSP3407G-QG-B8-V3 33 40 34 23 22 Note: A: Anode K: Cathode E: Emitter C: Collector B: Base R: Reference S: Source G: Gate D: Drain
61
80
21 1 20
44
12 1 11
1-12-1
HG231LE
EXPLODED VIEWS
Front Panel
A1X
1-13-1
HG231FEX
Cabinet
2L011 2L011 2L011 2B18
See Electrical Parts List for parts with this mark.
A2
Some Ref. Numbers are not in sequence.
2L011
2B9
JACK CBA
A5
2B9
2L012
2L022
2L011
2L042
2L021
A4 2L022 2L041
2L021 2L021
2L021
2B5
2L051
[ HG430ED ]
2L041
[ HG430ED ]
SUB JACK CBA
2L021
SENSOR CBA
2L031 2B7 2L041
AFV CBA
[ HG430ED ]
MAIN CBA
2B46 2B8
2L099 A10
1B1
A3
A7
1-13-2
HG231CEX
Packing
X1 X20 X3 X2
Some Ref. Numbers are not in sequence.
S2
X4
S3
S2
Unit
A14
S1
1-13-3
HG231PEX
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a ! have special characteristics important to safety. Before replacing any of these components, read carefully the product safety notice in this service manual. Don't degrade the safety of the product through improper servicing. NOTE: Parts that are not assigned part numbers (---------) are not available. Comparison Chart of Models and Marks
Model
HG231ED HG430ED Ref. No. Mark S3 X1 X2 X3 X4 X20! X20! A B Description UNIT, BAG V4010PA Part No. 0VM406453B NA690ED XB0M451T0001 XB0M571GLP01 WPZ0122LG001 WPZ0122LW001 0VM404632 0VMN04101 1VMN20013
ACCESSORIES
REMOTE CONTROL UNIT 364/CZF29UU DRY BATTERY R6P/2S or DRY BATTERY ES-GR6M-C RF CORD PAL 1.2M or RF CABLE CC1001020012010 ACCESSORY BAG K8092BA OWNER'S MANUAL(GERMAN) HG231ED OWNERS MANUAL HG430ED
Mark
A B
Ref. No. Mark A1X A1X A2 A3 A3 A4 A5 A7 A10! A10! A14 A14 A14 1B1 1B1 2B5 2B7 2B8 2B9 2B18 2B46 2L011 2L012 2L021 2L022 A B A B A B A B B A B
Description FRONT ASSEMBLY HE231ED FRONT ASSEMBLY HE432ED CASE, TOP(ANTHRACITE) HE240ED CHASSIS HE470ED CHASSIS(U27F-GMBH) HE240ED JACK BOARD(U27 FTZ) HE480ED (See Electrical Parts List) JACK BOARD(2-21P) HE470ED (See Electrical Parts List) PANEL, BOTTOM HE470ED LABEL, RATING HG231ED LABEL,RATING HG430ED LABEL, SERIAL NO. HE240ED LABEL, BAR CODE HG231ED LABEL,BAR CODE HG430ED DECK ASSEMBLY CZD013/VM23A0 DECK ASSEMBLY CZD013/VM23ED SHEILD, CYLINDER HG470ED SHIELD ASSEMBLY HG470ED (See Electrical Parts List) BUSH, LED(F) H3700UD (See Electrical Parts List) CUSHION HC460ED FIBER, TOP CASE HC460ED ROHM HOLDER H7770JD (See Electrical Parts List) SCREW, P-TIGHT 3X10 BIND HEAD+ SCREW, P-TIGHT 3X10 BIND HEAD+ SCREW, P-TIGHT M3X10 WASHER HEAD+ SCREW, P-TIGHT M3X10 WASHER HEAD+ (See Electrical Parts List) SCREW, S-TIGHT M3X6 BIND HEAD+ P-TIGHT SCREW 3X8 BIND + P-TIGHT SCREW 3X8 BIND + SCREW, S-TIGHT M3X5 BIND HEAD+ SCREW, P-TIGHT M3X8 BIND HEAD+
Part No. 0VM204402 0VM204455 0VM101267 0VM000174A 0VM000177
0VM203862 -------------------------------------------------------N23A0FL N23E0FL 0VM306638
0VM413251 0VM412906
GBCP3100 GBCP3100 GCMP3100
2L031 2L041 2L042 2L051 2L099 S1 S1 S2 A B
GBMS3060 GBMP3080 GBMP3080 GBMS3050 GBCP3080 0VM306884 1VM320025 0VM204516
PACKING
GIFT BOX CARTON HG231ED GIFT BOX,CARTON HG430ED STYROFOAM HG470ED
20040325
1-14-1
HG231CA
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a ! have special characteristics important to safety. Before replacing any of these components, read carefully the product safety notice in this service manual. Don't degrade the safety of the product through improper servicing. NOTES: 1. Parts that are not assigned part numbers (---------) are not available. 2. Tolerance of Capacitors and Resistors are noted with the following symbols. C.....±0.25% G.....±2% M.....±20% D.....±0.5% J......±5% N.....±30% F.....±1% K.....±10% Z.....+80/-20%
C057 Ref. No. Mark C017 C018 C020 C021 C022 C025 C026 C053 C056 A Description ELECTROLYTIC CAP 470µF/16V M or . ELECTROLYTIC CAP 470µF/16V M . ELECTROLYTIC CAP 100µF/16V M or . ELECTROLYTIC CAP 100µF/16V M . ELECTROLYTIC CAP 1000µF/16V M . ELECTROLYTIC CAP 470µF/10V M or . ELECTROLYTIC CAP 470µF/10V M . ELECTROLYTIC CAP 22µF/16V M H7 . ELECTROLYTIC CAP 47µF/16V M H7 . ELECTROLYTIC CAP 220µF/6.3V M H7 . CHIP CERAMIC CAP .(1608) B K 0.047µF/ 50V or CHIP CERAMIC CAP .(1608) B K 0.047µF/ 25V Part No. CE1CMASDL471 CE1CMASTL471 CE1CMASDL101 CE1CMASTL101 CE1CMZPTL102 CE1AMASDL471 CE1AMASTL471 CE1CMAVSL220 CE1CMAVSL470 CE0KMASSL221 CHD1JK30B473 CHD1EK30B473
CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
CHIP CERAMIC CAP .(1608) CH J 470pF/50V CHD1JJ3CH471 or CHIP CERAMIC CAP CG J 470pF/50V . CHD1JJ3CG471 CE1CMAVSL100 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CE1CMAVSL100 CE1CMAVSL100 CE1JMAVSL1R0 CHD1JK30B102 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CE1CMAVSL100 CHD1JK30B102 CE1JMAVSL1R0 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JK30B223 CHD1EK30B223 CE1JMAVSL1R0 CE1JMAVSL1R0 CHD1CZ30F224 CHD1EZ3FZ224 B B B B ELECTROLYTIC CAP 10µF/16V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . ELECTROLYTIC CAP 10µF/16V M H7 . ELECTROLYTIC CAP 10µF/16V M H7 . ELECTROLYTIC CAP 1µF/50V M H7 . CHIP CERAMIC CAP B K 1000pF/50V . A A A CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . ELECTROLYTIC CAP 10µF/16V M H7 . CHIP CERAMIC CAP B K 1000pF/50V . ELECTROLYTIC CAP 1µF/50V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
C060
Comparison Chart of Models and Marks
Model
HG231ED HG430ED
C061
Mark A B
C151
A A A
MCV CBA
Ref. No. Mark
A B
Description
MCV CBA MCV CBA Consists of the following MAIN CBA (MCV-A) SUB JACK CBA (MCV-B) JACK CBA (MCV-C) SENSOR CBA
Part No.
0VSA15006 0VSA15267 ---------------------------------0VSA14893
C152
A A A
B
C154
A A
MAIN CBA
Ref. No. Mark Description MAIN CBA (MCV-A) Consists of the following Part No. ----------C155 C156 C157 C158 C159
A A A
CAPACITORS
C002! ! C003! ! C003! C004 C005 C006 C007 C008 C010 C011 C012 C014 C015 A A B METALLIZED FILM CAP 0.068µF/275V K or CT2E683HJE06 . METALLIZED FILM CAP 0.068µF/250V K . SAFTY CAP 2200pF/250V or . SAFETY CAP 2200pF/250V . SAFTY CAP 2200pF/250V . ELECTROLYTIC CAP 33µF/400V M(L.Z) . CERAMIC CAP B K 0.01µF/500V . CERAMIC CAP SL K 56pF/1KV or . CERAMIC CAP SL J 56pF/1KV . CERAMIC CAP .(AX) B K 1000pF/50V CERAMIC CAP .(AX) X K 5600pF/16V FILM CAP 0.022µF/50V J or .(P) FILM CAP 0.022µF/50V J .(P) ELECTROLYTIC CAP 10µF/16V M H7 . ELECTROLYTIC CAP 10µF/50V M H7 . ELECTROLYTIC CAP 470µF/35V M or . ELECTROLYTIC CAP 470µF/35V M . ELECTROLYTIC CAP 47µF/25V M H7 . CT2E683DC011 CCN2EMA0E222 CA2E222MR049 CCN2EMA0E222 CA2H330NC010 CCD2JKP0B103 CCD3AKPSL560 CCD3AJPSL560 CCA1JKT0B102 CCA1CKT0X562 CMA1JJS00223 CA1J223MS029 CE1CMAVSL100 CE1JMAVSL100 CE1GMASDL471 CE1GMASTL471 CE1EMAVSL470
C251 C252 C253 C254
C302
CHIP CERAMIC CAP .(1608) B K 0.022µF/ 50V or CHIP CERAMIC CAP .(1608) B K 0.022µF/ 25V
C303 C304 C305
ELECTROLYTIC CAP 1µF/50V M H7 . ELECTROLYTIC CAP 1µF/50V M H7 . CHIP CERAMIC CAP F Z 0.22µF/16V or . CHIP CERAMIC CAP FZ Z 0.22µF/25V .
20040325
1-15-1
HG231EL
Ref. No. Mark C307
Description CHIP CERAMIC CAP .(1608) B K 0.047µF/ 50V or CHIP CERAMIC CAP .(1608) B K 0.047µF/ 25V
Part No. CHD1JK30B473 CHD1EK30B473
Ref. No. Mark
Description CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
Part No. CHD1EZ30F104 CHD1JZ3FZ104 CE1JMAVSLR47 CP1EMAVSB4R7 CE1CMAVSL100 CHD1JJ3CH102 CHD1EJ3CH102 CHD1JJ3CG102 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CE0KMAVSL101 CE1JMAVSL1R0 CHD1JJ3CH121 CHD1JJ3CG121 CHD1JJ3CH221 CHD1JJ3CG221 CE1JMAVSL1R0 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JJ3CH680 CHD1JJ3CG680 CHD1JJ3CH680 CHD1JJ3CG680 CHD1JD3CH100 CHD1JD3CG100 CE0KMAVSL221 CE1CMAVSL101 CE0KMAVSL470 CE0KMASSL221 CCD2AKS0B471 CMA2AJP00183 CMA1JJP00183 CHD1JK30B102 CHD1JK30B182 CE1CMAVSL100 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JK30B223 CHD1EK30B223
C333 CHD1JK30B223 CHD1EK30B223 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JK30B473 CHD1EK30B473 CHD1JK30B822 CHD1JZ30F104 CHD1EZ30F104 C341 CHD1JZ3FZ104 C342 C343 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 C345 C346 C347 C351 C352 C401 C402 CHD1EZ30F104 CHD1JZ3FZ104 CE1CMAVSL100 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JJ3CH680 CHD1JJ3CG680 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JJ3CH680 CHD1JJ3CG680 CE1JMAVSLR47 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JJ3CH680 CHD1JJ3CG680 CCA1JZTFZ104 CHD1JZ30F104 C424 A A C419 C421 C422 C423 A C418 C417 C411 C412 C414 C415 C416 C403 C404 CE0KMAVSL470 CE1JMAVSL1R0 CE1JMAVSL1R0 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JZ30F104 C338 C339 C340 C337 C334 C335 C336
ELECTROLYTIC CAP 0.47µF/50V M H7 . ELECTROLYTIC CAP 4.7µF/25V M NP H7 . ELECTROLYTIC CAP 10µF/16V M H7 . CHIP CERAMIC CAP .(1608) CH J 1000pF/ 50V or CHIP CERAMIC CAP CH J 1000pF/25V or . CHIP CERAMIC CAP CG J 1000pF/50V . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . ELECTROLYTIC CAP 100µF/6.3V H7 . ELECTROLYTIC CAP 1µF/50V M H7 . CHIP CERAMIC CAP CH J 120pF/50V or . CHIP CERAMIC CAP CG J 120pF/50V . CHIP CERAMIC CAP CH J 220pF/50V or . CHIP CERAMIC CAP CG J 220pF/50V . ELECTROLYTIC CAP 1µF/50V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP CH J 68pF/50V or . CHIP CERAMIC CAP CG J 68pF/50V . CHIP CERAMIC CAP CH J 68pF/50V or . CHIP CERAMIC CAP CG J 68pF/50V . CHIP CERAMIC CAP CH D 10pF/50V or . CHIP CERAMIC CAP CG D 10pF/50V . ELECTROLYTIC CAP 220µF/6.3V M H7 . ELECTROLYTIC CAP 100µF/16V M H7 . ELECTROLYTIC CAP 47µF/6.3V M H7 . ELECTROLYTIC CAP 220µF/6.3V M H7 . CERAMIC CAP B K 470pF/100V . FILM CAP 0.018µF/100V J or .(P) FILM CAP 0.018µF/50V J .(P) CHIP CERAMIC CAP B K 1000pF/50V . CHIP CERAMIC CAP B K 1800pF/50V . ELECTROLYTIC CAP 10µF/16V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP .(1608) B K 0.022µF/ 50V or CHIP CERAMIC CAP .(1608) B K 0.022µF/ 25V
C308
CHIP CERAMIC CAP .(1608) B K 0.022µF/ 50V or CHIP CERAMIC CAP .(1608) B K 0.022µF/ 25V
C309
CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
C310
CHIP CERAMIC CAP .(1608) B K 0.047µF/ 50V or CHIP CERAMIC CAP .(1608) B K 0.047µF/ 25V
C312 C313
CHIP CERAMIC CAP B K 8200pF/50V . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
C314 C315
CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103 CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
C316 C317 C318 C319 C320
CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103 ELECTROLYTIC CAP 47µF/6.3V M H7 . ELECTROLYTIC CAP 1µF/50V M H7 . ELECTROLYTIC CAP 1µF/50V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
C321
CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
C322 C323
ELECTROLYTIC CAP 10µF/16V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C324 C325
CHIP CERAMIC CAP CH J 68pF/50V or . CHIP CERAMIC CAP CG J 68pF/50V . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
C326 C327 C328 B B B C329 C330 C332 B B
CHIP CERAMIC CAP CH J 68pF/50V or . CHIP CERAMIC CAP CG J 68pF/50V . ELECTROLYTIC CAP 0.47µF/50V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP CH J 68pF/50V or . CHIP CERAMIC CAP CG J 68pF/50V . CERAMIC CAP .(AX) F Z 0.1µF/50V CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or
CHIP CERAMIC CAP .(1608) CH J 33pF/50V CHD1JJ3CH330 or CHIP CERAMIC CAP CG J 33pF/50V . ELECTROLYTIC CAP 33µF/6.3V M H7 . ELECTROLYTIC CAP 4.7µF/25V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . ELECTROLYTIC CAP 22µF/6.3V M H7 . CHD1JJ3CG330 CE0KMAVSL330 CE1EMAVSL4R7 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CE0KMAVSL220 CHIP CERAMIC CAP .(1608) B K 4700pF/50V CHD1JK30B472
20040325
1-15-2
HG231EL
Ref. No. Mark C425
Description CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
Part No. CHD1JZ30F104 CHD1EZ30F104
Ref. No. Mark C474 C475 B B B
Description ELECTROLYTIC CAP 22µF/6.3V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . ELECTROLYTIC CAP 10µF/16V M H7 . ELECTROLYTIC CAP 4.7µF/25V M H7 . ELECTROLYTIC CAP 4.7µF/25V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . ELECTROLYTIC CAP 4.7µF/25V M H7 . ELECTROLYTIC CAP 4.7µF/25V M H7 . ELECTROLYTIC CAP 4.7µF/25V M H7 . ELECTROLYTIC CAP 10µF/16V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP B K 2200pF/50V . ELECTROLYTIC CAP 220µF/6.3V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
Part No. CE0KMAVSL220 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CE1CMAVSL100 CE1EMAVSL4R7 CE1EMAVSL4R7 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CE1EMAVSL4R7 CE1EMAVSL4R7 CE1EMAVSL4R7 CE1CMAVSL100 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JK30B222 CE0KMAVSL221 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CCA1JKT0B101 CE1JMAVSL1R0 CE1AMAVSL220 CE0KMAVSL101 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104
CHD1JZ3FZ104 CHD1JZ30F104 C476 CHD1EZ30F104 B CHD1JZ3FZ104 CHD1JJ3CH221 CHD1JJ3CG221 CHD1JJ3CH680 CHD1JJ3CG680 CHD1JJ3CH221 CHD1JJ3CG221 CHD1JJ3CH680 CHD1JJ3CG680 CE0KMAVSL470 CE1CMAVSL470 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CE1CMAVSL100 CE1AMAVSL220 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CE1CMAVSL100 CE1EMAVSL4R7 C506 C508 C510 C511 C512 B C489 C501 C502 C486 B B B B B B C481 C482 C483 C484 C485 B B B B B B B C477 C478 C479 C480 B B B B B B B
C426
A A A
CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP CH J 220pF/50V or . CHIP CERAMIC CAP CG J 220pF/50V . CHIP CERAMIC CAP CH J 68pF/50V or . CHIP CERAMIC CAP CG J 68pF/50V . CHIP CERAMIC CAP CH J 220pF/50V or . CHIP CERAMIC CAP CG J 220pF/50V . CHIP CERAMIC CAP CH J 68pF/50V or . CHIP CERAMIC CAP CG J 68pF/50V . ELECTROLYTIC CAP 47µF/6.3V M H7 . ELECTROLYTIC CAP 47µF/16V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . ELECTROLYTIC CAP 10µF/16V M H7 . ELECTROLYTIC CAP 22µF/10V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . ELECTROLYTIC CAP 10µF/16V M H7 . ELECTROLYTIC CAP 4.7µF/25V M H7 .
C427 C428 C428 C429 C430 C451 C452
A A A A B B A A B B B B
C453 C454 C455
B B B B B
C456
B B B
C457 C458 C459 C460 C461 C462 C463 C464 C465
B B B B B B B B B B B
CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103 CHIP CERAMIC CAP .(1608) B K 4700pF/50V CHD1JK30B472 ELECTROLYTIC CAP 22µF/10V M H7 . CE1AMAVSL220 CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103 CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103 ELECTROLYTIC CAP 10µF/16V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . ELECTROLYTIC CAP 220µF/6.3V M H7 . ELECTROLYTIC CAP 22µF/10V M H7 . CE1CMAVSL100 CHD1JZ30F104 CHD1EZ30F104
CERAMIC CAP .(AX) B K 100pF/50V ELECTROLYTIC CAP 1µF/50V M H7 . ELECTROLYTIC CAP 22µF/10V M H7 . ELECTROLYTIC CAP 100µF/6.3V H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
C513 CHD1JZ3FZ104 CE0KMAVSL221 CE1AMAVSL220 C514
CHIP CERAMIC CAP .(1608) CH J 22pF/50V CHD1JJ3CH220 or CHIP CERAMIC CAP CG J 22pF/50V . CHD1JJ3CG220 CHIP CERAMIC CAP .(1608) CH J 22pF/50V CHD1JJ3CH220 or CHIP CERAMIC CAP CG J 22pF/50V . CHD1JJ3CG220 CHD1JJ3CH180 CHD1JJ3CG180 CHD1JJ3CH180 CHD1JJ3CG180 CHD1JK30B473 CHD1EK30B473 CHIP CERAMIC CAP CH J 18pF/50V or . CHIP CERAMIC CAP CG J 18pF/50V . CHIP CERAMIC CAP CH J 18pF/50V or . CHIP CERAMIC CAP CG J 18pF/50V .
C466 C467 C468 C469 C470 C471 C472
B B B B B B B B B
CHIP CERAMIC CAP .(1608) B K 4700pF/50V CHD1JK30B472 CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103 ELECTROLYTIC CAP 4.7µF/25V M H7 . ELECTROLYTIC CAP 10µF/16V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CE1EMAVSL4R7 CE1CMAVSL100 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 C519 C520 C515 C516 C517 C518
CHIP CERAMIC CAP .(1608) B K 4700pF/50V CHD1JK30B472 CHIP CERAMIC CAP .(1608) B K 0.047µF/ 50V or CHIP CERAMIC CAP .(1608) B K 0.047µF/ 25V
C473
B B B
CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103 CHIP CERAMIC CAP .(1608) CH J 100pF/50V CHD1JJ3CH101 or CHIP CERAMIC CAP CG J 100pF/50V . CHD1JJ3CG101
20040325
1-15-3
HG231EL
Ref. No. Mark C521 C522 C523 C524 C526 C527 C528 C530 C531 C532 C533
Description CHIP CERAMIC CAP CH J 560pF/50V or . CHIP CERAMIC CAP CG J 560pF/50V . ELECTROLYTIC CAP 22µF/6.3V M H7 . CHIP CERAMIC CAP B K 1000pF/50V . CHIP CERAMIC CAP CH J 330pF/50V or . CHIP CERAMIC CAP CG J 330pF/50V . ELECTROLYTIC CAP 22µF/6.3V M H7 . CERAMIC CAP .(AX) F Z 0.022µF/25V CERAMIC CAP .(AX) Y M 0.01µF/16V ELECTROLYTIC CAP 22µF/6.3V M H7 . CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V .
Part No. CHD1JJ3CH561 CHD1JJ3CG561 CE0KMASSL220 CHD1JK30B102 CHD1JJ3CH331 CHD1JJ3CG331
Ref. No. Mark C853 C854 C855
Description
Part No.
CHIP CERAMIC CAP .(1608) B K 4700pF/50V CHD1JK30B472 CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103 CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V or CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V or CHIP CERAMIC CAP FZ Z 0.1µF/50V . CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JJ3CH181 CHD1JJ3CG181 CE0KMAVSL470
CHIP CERAMIC CAP .(1608) B K 4700pF/50V CHD1JK30B472 CE0KMASSL220 CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103 CCA1EZTFZ223 CCA1CMT0Y103 CE0KMASSL220 CHD1JZ30F104 CHD1EZ30F104 CHD1JZ3FZ104 CHD1JK30B223 CHD1EK30B223 CHD1AZB0F105 CHD1AZ30F105
C856 C859 C862 CN701 D001 D002 D003 D004 D005 D006 D007 D008 D009 D011 B
CHIP CERAMIC CAP CH J 180pF/50V or . CHIP CERAMIC CAP CG J 180pF/50V . ELECTROLYTIC CAP 47µF/6.3V M H7 .
CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
CONNECTOR
AFV PCB ASSEMBLY CPU2900/G470 HG470AFV NDQZ001N4005 NDWZ001N4005 NDQZ001N4005 NDWZ001N4005 NDQZ001N4005 NDWZ001N4005 NDQZ001N4005 NDWZ001N4005 NDQZ000BA159 NDTZ01N4148M QDTZ001SS133 NDTZ01N4148M QDTZ001SS133 NDTZ01N4148M QDTZ001SS133 NDTZ01N4148M QDTZ001SS133 NDQZ000BA158 NDQZ000FR202 NDQZ000FR202 NDQZ000SB140 AERB81004*** NDQZ000SB340 NDTB00DZ18BS QDTB00MTZJ18 NDQZ000BA158 NDTZ01N4148M QDTZ001SS133 NDTB0DZ6R8BS QDTB0MTZJ6R8 NDTZ01N4148M QDTZ001SS133 NDTB0DZ5R1BS QDTB0MTZJ5R1 NDQZ001N4005 NDWZ001N4005 NDQZ001N4005 NDWZ001N4005 NDQZ001N4005 NDWZ001N4005 JW10.0T NDTC0DZ5R6BS QDTC0MTZJ5R6 RCX4JATZ0332 NDTB00DZ10BS QDTB00MTZJ10 NDTB00DZ18BS
DIODES
RECTIFIER DIODE 1N4005 or RECTIFIER DIODE 1N4005 RECTIFIER DIODE 1N4005 or RECTIFIER DIODE 1N4005 RECTIFIER DIODE 1N4005 or RECTIFIER DIODE 1N4005 RECTIFIER DIODE 1N4005 or RECTIFIER DIODE 1N4005 RECTIFIER DIODE BA159 SWITCHING DIODE 1N4148M or SWITCHING DIODE 1SS133(T-77) SWITCHING DIODE 1N4148M or SWITCHING DIODE 1SS133(T-77) SWITCHING DIODE 1N4148M or SWITCHING DIODE 1SS133(T-77) SWITCHING DIODE 1N4148M or SWITCHING DIODE 1SS133(T-77) RECTIFIER DIODE BA158 RECTIFIER DIODE FR202-B/P RECTIFIER DIODE FR202-B/P A A D014 D015 D016 D018 D019 D021 D023 D051 D052 D053 D055 D056 D057 D057 D058 A B B A A A B SCHOTTKY BARRIER DIODE SB140 or SCHOTTKY BARRIER DIODE ERB81-004 SCHOTTKY BARRIER DIODE SB340 ZENER DIODE DZ-18BSBT265 or ZENER DIODE MTZJT-7718B RECTIFIER DIODE BA158 SWITCHING DIODE 1N4148M or SWITCHING DIODE 1SS133(T-77) ZENER DIODE DZ-6.8BSBT265 or ZENER DIODE MTZJT-776.8B SWITCHING DIODE 1N4148M or SWITCHING DIODE 1SS133(T-77) ZENER DIODE DZ-5.1BSBT265 or ZENER DIODE MTZJT-775.1B RECTIFIER DIODE 1N4005 or RECTIFIER DIODE 1N4005 RECTIFIER DIODE 1N4005 or RECTIFIER DIODE 1N4005 RECTIFIER DIODE 1N4005 or RECTIFIER DIODE 1N4005 PCB JUMPER D0.6-P10.0 ZENER DIODE DZ-5.6BSCT265 or ZENER DIODE MTZJT-775.6C CARBON RES. 1/4W J 3.3k ZENER DIODE DZ-10BSBT265 or ZENER DIODE MTZJT-7710B ZENER DIODE DZ-18BSBT265 or D012 D013 D014
C535 C538
CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103 CHIP CERAMIC CAP .(1608) B K 0.022µF/ 50V or CHIP CERAMIC CAP .(1608) B K 0.022µF/