Text preview for : datasheet.pdf part of HP L1530 MN82832



Back to : datasheet.pdf | Home

Publication date: June 2006

M ai nt en an
Package Code No.

ce /D
Part No.

is

co

nt in ue Pl pl d in ea an c se ed lud pl vi an m m es si tf ed ain ai fo ol t n l ht low disc dis ena ten low tp in o co n an in :// g nt n ce c g pa U in tin t e fo na RL ue ue ype typ ur so a d t d e Pr od ty ni bo yp p c. u e e uc ne t l d tl ife t/s ate cy c/ st en in cl e fo st rm ag at e. io n.

M Di ain sc te on na tin nc ue e/ d
MN82832

DATA SHEET

SDB00105BEM

LQFP176-P-2424B

1

MN82832

MN82832
3-Dimension Y/C Separation LSI
Overview
MN82832 is a system LSI which incorporates processing necessary for high-quality televisions in a one chipconfiguration. High-efficiency 3-dimensions Y/C separation and color demodulation corresponding to an NTSC/PAL system, plus various functions of the digital YUV output are built in. It is most suitable as a television use LSI providing high-quality processing and multi-processing.

Features
Input (A/D input Y: 10-bit, C/U/V: 8-bit) Composite video signal YC signal YUV signal Analog Output (D/A output Y: 10-bit , C/U/V: 8-bit) YC signal YUV signal Digital Output (Y: 10-bit, C/U/V: 8-bit) YC signal YUV signal (4 : 2 : 2 rate or 4 : 2 : 0 rate) Main functions 3 dimension Y/C separation with full 10-bit operation (16M-bit or 64M-bit SDRAM) (Non-standard: 3 frame average type YNR , 5 dB improvement of S/N ratio) Clamp control(Clamp current source included) Color demodulation (NTSC/PAL-BGHI, M, N) Sync separation ID -1 detection DD conversion (burst lock clock line lock clock) Horizontal/vertical aperture correction 10-bit A/D converter (1-ch.) 8-bit A/D converter (1-ch.) 10-bit D/A converter (1-ch.) 8-bit D/A converter (2-ch.) IIC bus control

Specifications
Clock frequency 4 fsc (first half processing part) 4 (8) fsc or 13.5 (27) MHz (latter half processing part) 16 fsc (SDRAM-I/F part) Supply voltage 3.3 V 0.165 V Package 176-pin LQFP ( 24mm, 0.5mm pitch)

Applications
CRT Televisions, LCD Televisions, PDP Televisions, TV Capture Cards, Monitors with Built-in TV Tuner

SDB00105BEM

2

MN82832
Block Diagram
MN82832
10-bit D/A 8-bit D/A 8-bit D/A
H,V Aperture Correction

Analog Output

Composite/ Y-input S-mode (C-input) YUV U-input YUV V-input

10-bit A/D

Sync Separation

Std/Non-std Detection

YOUT C/UOUT VOUT

Mix 8-bit A/D 2DYC Separation

Digital Output

16M-bit SDRAM

Memory Control

3DYC Separation YNR

DD Convert 3D processing of NTSC 2D processing of PAL

ID-1 Det.

Motion Detection

YOUT UVOUT HOUT VOUT CLKOUT UVID

X' Tal 27 MHz

Clock Gen.

Color Demodulation

IIC Bus I/F

SCL

SDA

Application System of MN82832 (Middle Class with PIP)
SP

16M-bit 16M-bit SDRAM SDRAM

Sound Sound AN5891 AN5891

AN5265 AN5265 AN5275 AN5275 Audio Out Audio Out

New Tuner New Tuner with with VIF & SIF VIF & SIF

AV AV Switch Switch

New 3D New 3D YC Sep. YC Sep. MN82832 MN82832

1chip Signal 1chip Signal Processor Processor for for Analog TV Analog TV Comb Filter Comb Filter VCJ VCJ Caption, OSD Caption, OSD Tuner Micro Tuner Micro MN101E11G

AN15931 AN15931 RGB AMP RGB AMP

2SC3941 2SC3941 2SC2258 2SC2258 Video Out Video Out VM Drive VM Drive 2SD1729 2SD1729 H-Out H-Out AN5522 AN5522 AN5523 AN5523 Ver. Drive Ver. Drive
CRT

PIP PIP

MN101E11G (NTSC) (NTSC) MN101E04G MN101E04G (Multi) (Multi) MN101E02H MN101E02H (Multi+teletext) (Multi+teletext)

PNA460X IRPNA460X Receiver IR Receiver
SDB00105BEM

Parabola out

3

Request for your special attention and precautions in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.