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INTEGRATED CIRCUITS

DATA SHEET

TDA4566 Colour transient improvement circuit
Preliminary specification File under Integrated Circuits, IC02 March 1991

Philips Semiconductors

Preliminary specification

Colour transient improvement circuit
GENERAL DESCRIPTION

TDA4566

The TDA4566 is a monolithic integrated circuit for colour-transient improvement (CTI) and luminance delay line in gyrator technique in colour television receivers. Features Colour transient improvement for colour difference signals (R-Y) and (B-Y) with transient detecting-, storage- and switching stages resulting in high transients of colour difference output signals A luminance signal path (Y) which substitutes the conventional Y-delay coil with an integrated Y-delay line Switchable delay time from 550 ns to 820 ns in steps of 90 ns and additional fine adjustment of 37 ns Two Y output signals; one of 180 ns less delay QUICK REFERENCE DATA PARAMETER Supply voltage (pin 10) Supply current (pin 10) Y-signal delay at pin 12 S1 open; R14-18 = 1.2 k; note 1 t17-12 t17-12 t17-12 t17-12 0.5 MHz Y cd ttr 490 580 670 760 0 -1 - 550 640 730 820 1 0 100 610 700 790 880 2 +1 200 ns ns ns ns dB dB ns CONDITIONS VP IP SYMBOL - MIN. 10.8 TYP. 12 35 MAX. 13.2 50 UNIT V mA

V15-18 = 0 to 2.5 V V15-18 = 3.5 to 5.5 V V15-18 = 6.5 to 8.5 V V15-18 = 9.5 to12 V Y-signal amplification (R-Y) and (B-Y) signal attenuation output transient time Note

1. Delay time is proportional to resistor R14-18. R14-18 also influences the bandwidth; a value of 1.2 k results in a bandwidth of 5 MHz (typ.). PACKAGE OUTLINE 18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 27.

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Philips Semiconductors

Preliminary specification

Colour transient improvement circuit

TDA4566

March 1991

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Fig.1 Block diagram.

Philips Semiconductors

Preliminary specification

Colour transient improvement circuit

TDA4566

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Fig.2 Internal pin circuit diagram.

Philips Semiconductors

Preliminary specification

Colour transient improvement circuit
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage range (pin 10) Voltage ranges to pin 18 (ground) at pins 1, 2, 12 and 15 at pin 11 at pin 17 Voltage ranges at pin 7 to pin 6 at pin 8 to pin 9 Currents at pins 6, 9 at pins 7, 8, 11 and 12 Total power dissipation (Tj = 150 C; Tamb = 70 C Storage temperature range Operating ambient temperature range THERMAL RESISTANCE From junction to ambient (in free air) Note 1. Pins 3, 4, 5, 6, 9, 13 and 14 DC potential not published. Rth j-a Ptot Tstg Tamb - -25 0 1.1 + 150 + 70 I6, 9 I7, 8, 11, 12 -10 +10 V7-6 V8-9 0 0 5 5 Vn-18 V11-18 V17-18 0 0 0 VP (VP-3 V) 7 SYMBOL VP = V10-18 0 MIN. MAX. 13.2

TDA4566

UNIT V V V V V V mA

internally limited W C C

= 70

K/W

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Philips Semiconductors

Preliminary specification

Colour transient improvement circuit
CHARACTERISTICS VP = V10-18 = 12 V; Tamb = 25 C; measured in application circuit Fig.3; unless otherwise specified PARAMETER Supply (pin 10) Supply voltage Supply current Colour difference paths (R-Y) input voltage (75% colour bar signal) (peak-to-peak value) (B-Y) input voltage (75% colour bar signal) (peak-to-peak value) Input resistance (R-Y) (B-Y) Internal bias voltage (R-Y) (B-Y) Signal attenuation (R-Y) (B-Y) Output transient time Output resistance (B-Y) (R-Y) DC output voltage (B-Y) (R-Y) Output current source sink note 2 I7, 8 -I7, 8 0.4 1.0 - - - - V7-18 V8-18 3.8 3.8 4.3 4.3 4.8 4.8 R7-18 R8-18 - - 100 100 - - note 1 V8 / V1 V7 / V2 ttr -1 -1 - 0 0 100 +1 +1 200 V1-18 V1-18 3.8 3.8 4.3 4.3 4.8 4.8 R1-18 R2-18 8 8 12 12 16 16 V2(p-p) - 0.8 1.9 V1(p-p) - 0.63 1.5 VP IP 10.8 - 12 35 CONDITIONS SYMBOL MIN. TYP.

TDA4566

MAX.

UNIT

13.2 50

V mA

V

V k k V V dB dB ns V V mA mA

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Philips Semiconductors

Preliminary specification

Colour transient improvement circuit

TDA4566

PARAMETER Y-signal path Y-input voltage (composite signal) (peak-to-peak value) Internal bias voltage Input current during picture content during sync. pulse Y-signal delay at pin 12

CONDITIONS

SYMBOL

MIN.

TYP.

MAX.

UNIT

capacitive coupling during clamping V17(p-p) V17-18 I17 -I17 S1 open; R14 = 1.2 k; notes 3 and 4 t17-18 t17-18 t17-18 t17-18 S1 closed S1 open t17-12 t11-12 t 17 12 ----------------------------t 17 12 T j t 17 12 ----------------------------t 17 12 V P -I15 f = 0.5 MHz V11/V17 V12/V17 note 5 V 11 (3 MHz) -----------------------------------V 11 (0.5 MHz) V 12 (3 MHz) -----------------------------------V 12 (0.5 MHz) 0 - - 3.0 dB -1 0 0 +1 +1 +2 dB dB 490 580 670 760 - 160 - - - 550 640 730 820 37 180 0.001 610 700 790 880 - 200 - - ns ns ns ns ns ns K-1 V-1 - 2.1 - - 0.45 2.4 8 100 0.62 2.7 12 150 V V A A

at V15-18 = 0 to 2.5 V at V15-18 = 3.5 to 5.5 V at V15-18 = 6.5 to 8.5 V at V15-18 = 9.5 to12 V Fine adjustment of Y-signal delay for all 4 steps Signal delay between pin 11 and pin 12 Dependency of delay time on temperature

on supply voltage

-0.03

Input switching current Y-signal attenuation pin 11 from pin 17 pin 12 from pin 17 Frequency response at 3 MHz referred to 0.5 MHz pin 11

15

25

A

pin 12

0

3.0

dB

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Philips Semiconductors

Preliminary specification

Colour transient improvement circuit

TDA4566

PARAMETER Frequency response at 5 MHz referred to 0.5 MHz pin 11

CONDITIONS note 5

SYMBOL

MIN.

TYP.

MAX.

UNIT

V 11 (5 MHz) -----------------------------------V 11 (0.5 MHz) V 12 (5 MHz) -----------------------------------V 12 (0.5 MHz) V11-18 V12-18 note 2 I11, 12 -I11, 12

-3.0 -3.0

- -

2.0

dB

pin 12

2.0

dB

DC output voltage pin 11 pin 12 Output current source sink Notes 1. Output signal transient time measured with C6-18 = C9-18 = 220 pF without resistor (see Fig. 3). 2. Output current measured with emitter follower with constant current source of 0.6 mA. 3. R14-18 influences the bandwidth; a value of 1.2 k results in a bandwidth of 5 MHz (typ.). 4. Delay time is proportional to resistor R14-18. Devices with suffix "A" require the value of the resistor to be 1.15 k; a 27 k; resistor connected in parallel with R14-18 = 1.2 k.; 5. Frequency response measured with V15-18 = 9.5 V and switch S1 open. 1.8 9.8 - - 2.3 10.3 - - 2.6 10.8 0.4 1.0 V V mA mA

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Philips Semiconductors

Preliminary specification

Colour transient improvement circuit
APPLICATION INFORMATION

TDA4566

(1) Residual carrier reduced to 20 mV peak-to-peak (R = 1 k, C = 100 pF). (2) Switching sequence for delay times shown in Table 1. (3) R14-18 = 1.2 k for TDA4566. R14-18 = 1.15 k for TDA4566A (27 k resistor connected in parallel to 1.2 k).

Fig.3 Application diagram and test circuit.

Table 1

Switching sequence for delay times. CONNECTION (2) VOLTAGE AT PIN 15 DELAY TIME (ns) (1) 550 640 730 820

(a) 0 0 0 X Notes 0 0 X X

(b) 0 X X X

(c) 0 to 2.5 V 3.5 to 5.5 V 6.5 to 8.5 V 9.5 to 12 V

1. When switch (S1) is closed the delay time is increased by 37 ns. 2. Where: X = connection closed; 0 = connection open.

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Philips Semiconductors

Preliminary specification

Colour transient improvement circuit
PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil)

TDA4566

SOT102-1

D seating plane

ME

A2

A

L

A1

c Z e b1 b 18 10 b2 MH w M (e 1)

pin 1 index E

1

9

0

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.044 b1 0.53 0.38 0.021 0.015 b2 1.40 1.14 0.055 0.044 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION

ISSUE DATE 93-10-14 95-01-23

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Philips Semiconductors

Preliminary specification

Colour transient improvement circuit
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values

TDA4566
with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.

This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

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