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INTEGRATED CIRCUITS
DATA SHEET
TDA4665 Baseband delay line
Product specification Supersedes data of 1995 Oct 30 File under Integrated Circuits, IC02 1996 Dec 17
Philips Semiconductors
Product specification
Baseband delay line
FEATURES · Two comb filters, using the switched-capacitor technique, for one line delay time (64 µs) · Adjustment-free application · No crosstalk between SECAM colour carriers (diaphoty) · Handles negative or positive colour-difference input signals · Clamping of AC-coupled input signals (±(R-Y) and ±(B-Y)) · VCO without external components · 3 MHz internal clock signal derived from a 6 MHz CCO, line-locked by the sandcastle pulse (64 µs line) · Sample-and-hold circuits and low-pass filters to suppress the 3 MHz clock signal · Addition of delayed and non-delayed output signals · Output buffer amplifiers · Comb filtering functions for NTSC colour-difference signals to suppress cross-colour. QUICK REFERENCE DATA SYMBOL VP1 VP2 IP(tot) Vi(p-p) PARAMETER analog supply voltage (pin 9) digital supply voltage (pin 1) total supply current ±(R-Y) input signal PAL/NTSC (peak-to-peak value; pin 16) ±(B-Y) input signal PAL/NTSC (peak-to-peak value; pin 14) ±(R-Y) input signal SECAM (peak-to-peak value; pin 16) ±(B-Y) input signal SECAM (peak-to-peak value; pin 14) Gv gain Vo / Vi of colour-difference output signals V11 / V16 for PAL and NTSC V12 / V14 for PAL and NTSC V11 / V16 for SECAM V12 / V14 for SECAM ORDERING INFORMATION TYPE NUMBER TDA4665 TDA4665T PACKAGE NAME DIP16 SO16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 3.9 mm 5.3 5.3 -0.6 -0.6 5.8 5.8 -0.1 -0.1 MIN. 4.5 4.5 - - - - - 5 5 5.5 525 665 1.05 1.33 TYP. 6 6 GENERAL DESCRIPTION
TDA4665
The TDA4665 is an integrated baseband delay line circuit with one line delay. It is suitable for decoders with colour-difference signal outputs ±(R-Y) and ±(B-Y).
MAX.
UNIT V V mA mV mV V V dB dB dB dB
7.0 - - - - 6.3 6.3 +0.4 +0.4
VERSION SOT38-4 SOT109-1
1996 Dec 17
2
1996 Dec 17
BLOCK DIAGRAM
Philips Semiconductors
Baseband delay line
handbook, full pagewidth
±(R-Y) 11 LP addition output stages buffers ±(R-Y) LINE MEMORY pre-amplifiers SAMPLEAND-HOLD
16
SIGNAL CLAMPING
colour-difference input signals
colour-difference output signals
±(B-Y) LINE MEMORY SAMPLEAND-HOLD LP
14
SIGNAL CLAMPING
12
3
3 MHz shifting clock DIVIDER BY 192
±(B-Y)
VP1 FREQUENCY PHASE DETECTOR LP digital supply 1 VP2 6 MHz CCO
9
analog supply
TDA4665
sandcastle pulse input
5
SANDCASTLE DETECTOR
2 6 13 15
n.c. n.c. n.c. n.c. DIVIDER BY 2 3 GND2
MED848
7 4, 8
i.c.
10
GND1
Product specification
TDA4665
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Baseband delay line
PINNING SYMBOL VP2 n.c. GND2 i.c. SAND n.c. i.c. i.c. VP1 GND1 Vo(R-Y) Vo(B-Y) n.c. Vi(B-Y) n.c. Vi(R-Y) PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION +5 V supply voltage for digital part not connected ground for digital part (0 V) internally connected sandcastle pulse input not connected internally connected internally connected +5 V supply voltage for analog part ground for analog part (0 V) ±(R-Y) output signal ±(B-Y) output signal not connected ±(B-Y) input signal not connected ±(R-Y) input signal Fig.2 Pin configuration.
i.c. 4
handbook, halfpage
TDA4665
VP2 1 n.c. 2 GND2 3
16 Vi(R-Y) 15 n.c. 14 Vi(B-Y) 13 n.c.
TDA4665
SAND 5 n.c. 6 i.c. 7 i.c. 8
MED849
12 Vo(B-Y) 11 Vo(R-Y) 10 GND1 9 VP1
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Ground pins 3 and 10 connected together. SYMBOL VP1 VP2 V5 Vn Tstg Tamb VESD Note 1. Equivalent to discharging a 200 pF capacitor through a 0 series resistor. THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT38-4 SOT109-1 PARAMETER thermal resistance from junction to ambient in free air 75 220 K/W K/W VALUE UNIT digital supply voltage (pin 1) voltage on pin 5 voltage on pins 11, 12, 14 and 16 storage temperature operating ambient temperature electrostatic handling for all pins; note 1 PARAMETER analog supply voltage (pin 9) MIN. -0.5 -0.5 -0.5 -0.5 -25 0 - MAX. +7 +7 VP + 1.0 VP +150 70 ±500 V V V V °C °C V UNIT
1996 Dec 17
4
Philips Semiconductors
Product specification
Baseband delay line
TDA4665
CHARACTERISTICS VP = 5.0 V; input signals as specified in characteristics with 75% colour bars; super-sandcastle frequency of 15.625 kHz; Tamb = 25 °C; measurements taken in Fig.3; unless otherwise specified. SYMBOL Supply VP1 VP2 IP1 IP2 Vi(p-p) analog supply voltage (pin 9) digital supply voltage (pin 1) analog supply current digital supply current 4.5 4.5 - - note 1 - - - - 525 665 1.05 1.33 - - - - mV mV V V 5 5 4.8 0.7 6 6 6.0 1.0 V V mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Colour-difference input signals input signal (peak-to-peak value) ±(R-Y) PAL and NTSC (pin 16) ±(B-Y) PAL and NTSC (pin 14) ±(R-Y) SECAM (pin 16) ±(B-Y) SECAM (pin 14) Vi(max)(p-p) maximum symmetrical input signal (peak-to-peak value) ±(R-Y) or ±(B-Y) for PAL and NTSC ±(R-Y) or ±(B-Y) for SECAM R14, 16 C14, 16 V14, 16 Vo(p-p) input resistance during clamping input capacitance input clamping voltage proportional to VP before clipping before clipping 1 2 - - 1.3 - - - - 1.5 - - 40 10 1.7 V V k pF V
Colour-difference output signals output signal (peak-to-peak value) ±(R-Y) on pin 11 ±(B-Y) on pin 12 V11/V12 V11, 12 R11, 12 Gv Vn/Vn+1 Vn(rms) ratio of output amplitudes at equal input signals DC output voltage output resistance gain for PAL and NTSC gain for SECAM ratio of delayed to non-delayed output signals (pins 11 and 12) noise voltage (RMS value; pins 11 and 12) ratio Vo/Vi ratio Vo/Vi Vi(14,16)(p-p) = 1.33 V; SECAM signals Vi(14,16) = 0 V; note 2 Vi(14,16) = 0 V; active video; RS = 300 - - Vo(p-p) = 1 V; note 2 - 63.94 - - 54 64 5 10 - 64.06 mV mV dB µs all standards all standards Vi(14,16)(p-p) = 1.33 V proportional to VP - - -0.4 2.5 - 5.3 -0.6 -0.1 - 1.05 1.33 0 2.9 330 5.8 -0.1 0 - - - +0.4 3.3 400 6.3 +0.4 +0.1 1.2 V V dB V dB dB dB mV
V(11,12)(p-p) unwanted signals (line-locked) (peak-to-peak value) meander spikes S/N(W) td weighted signal-to-noise ratio (pins 11 and 12) time difference between non-delayed and delayed output signals (pins 11 and 12)
1996 Dec 17
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Philips Semiconductors
Product specification
Baseband delay line
TDA4665
SYMBOL td ttr
PARAMETER delay of non-delayed signals
CONDITIONS - -
MIN. 40
TYP. 60 350 320 - -
MAX. 80
UNIT ns ns ns
transient time of delayed signal on pins 11 300 ns transient of respectively 12 SECAM signal transient time of non-delayed signal on pins 11 respectively 12 300 ns transient of SECAM signal
Sandcastle pulse input (pin 5) fBK V5 Vslice I5 C5 Notes 1. For SECAM the signal must be blanked line-sequentially. The blanking level must be equal to the non-colour signal. For SECAM, PAL and NTSC the input signal must be equal to the non-colour signal during the internal clamping of TDA4665 (3 to 1 µs before the leading edge of the top pulse of V5). 2. Noise voltage at f = 10 kHz to 1 MHz; RS < 300 . 3. The leading edge of the burst-key pulse or top pulse is used for timing. burst-key frequency/sandcastle frequency top pulse voltage internal slicing level input current input capacitance note 3 14.2 4.0 - - 15.625 - - - 17.0 kHz VP + 1.0 V V5 - 0.5 V 10 10 µA pF
V5 - 1.0 -
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full pagewidth
470 680 10 µH coil: Toko 119LN-A3753 GO 120 pF 27 pF 330 10 nF 220 pF 4 2 220 pF 5 6 10 nF 330 27 pF
1996 Dec 17
11 10 9 8 7
Philips Semiconductors
VP = +12 V
10 nF
APPLICATION INFORMATION
Baseband delay line
0.33 µF
12
13
16 ±(R-Y) comb filtering 16 LINE DELAY 11
TDA4665
10 nF Vi-(R-Y) 1 1 nF 1 nF 14 LINE DELAY ±(B-Y) comb filtering SSC (12V) VCO 10 k 24 5 LINE-LOCKED PLL / PULSE PROCESSING +5.1 V 1 10
(1) (1)
14
colourdifference signals
chrominance signal 20 to 400 mV (p-p) Y 12 4 8 7 2 6 13 15 +5.1 V 9 3
15
Vo-(R-Y) Vo-(B-Y)
220 pF 3 Vi-(B-Y)
CVBS
S-VHS (Y, C)
PAL/NTSC SECAM NTSC FILTERS
TDA4650
i.c. n.c. n.c. n.c. n.c.
7
17 20 47 nF 10 k 0.33 µF 3.3 k 0.1 µF 22 µF 18 VP 18 k 8.8 MHz 7.2 MHz 30 pF 30 pF 6.8 k HUE off PLL off 3.3 k X1 X2 21 19 100 nF 10 10 100 nF 10 k HUE control 5.1 V
PAL SECAM
NTSC-3.58
NTSC-4.43
28 27 26 25
colour standard switching signals
23
22
22 nF
22 nF
560
+12 V
MED850
(1) Capacitors positioned close to pins 9 and 10, 1 and 3.
Product specification
TDA4665
Fig.3 Application circuit with TDA4650.
Philips Semiconductors
Product specification
Baseband delay line
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil)
TDA4665
SOT38-4
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 b2 MH w M (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.030
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
1996 Dec 17
8
Philips Semiconductors
Product specification
Baseband delay line
TDA4665
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE v M A
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 w M L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 0.24 0.23 L 1.05 0.041 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.0098 0.057 0.0039 0.049
0.019 0.0098 0.39 0.014 0.0075 0.38
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-23
1996 Dec 17
9
Philips Semiconductors
Product specification
Baseband delay line
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA4665
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: · A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. · The longitudinal axis of the package footprint must be parallel to the solder flow. · The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
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Philips Semiconductors
Product specification
Baseband delay line
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA4665
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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