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INTEGRATED CIRCUITS
DATA SHEET
TDA3825 Single FM TV-sound demodulator circuit
Product specification File under Integrated Circuits, IC02 September 1988
Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
GENERAL DESCRIPTION The TDA3825 is a single FM demodulator system with external AF input and mute. Features · Supply voltage range from 4.5 V to 13.2 V · AC coupled AF stage · Multiple input AF operational amplifier with offset compensation · External AF input · High AF output voltage with low distortion · AF gain of 0 dB without external components · Frequency response can be determined by external components · High ripple rejection · Low switching noise between AF and mute QUICK REFERENCE DATA PARAMETER Supply voltage (pin 11) Supply current (pin 11) VP = 5.0 V VP = 12 V FM demodulator AF output voltage (pin 5) (RMS value) Signal plus weighted-noise to weighted-noise ratio Total harmonic distortion Source selector AF output voltage (pin 12) (RMS value) THD 0.1%; Vu = 6 dB V12-1 - 1.0 - (S + W)/W THD 65 - 70 0.3 - f = 50 kHz; QB = 11 V5-1 - 0.5 - IP IP - - 16 18 - - CONDITIONS SYMBOL VP MIN. 4.5 TYP. 5.0
TDA3825
MAX. 13.2 V
UNIT
mA mA
V
dB %
0.5
V
PACKAGE OUTLINE 14-lead DIL; plastic (SOT27); SOT27-1; 1996 November 25.
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Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
TDA3825
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Fig.1 Block diagram.
Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage (pin 11) External DC load resistance Total power dissipation Storage temperature range Operating ambient temperature range CONDITIONS SYMBOL VP RL Ptot Tstg Tamb 5 - -25 0 MIN. 4.5
TDA3825
MAX. 13.2 - 400 + 125 + 70
UNIT V k mW °C °C
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Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
TDA3825
CHARACTERISTICS VP = 5 V; Tamb = 25 °C; Vi = 10 mV; fo = 5.5 MHz; fAF = 1 kHz; f = 50 kHz; all parameters were measured with the test circuit of Fig. 2; unless otherwise specified PARAMETER Supply voltage (pin 11) Total current consumption Limiting amplifier Input voltage (pin 14) (RMS value) V14-1 3 dB signal reduction DC voltages pin 2 pin 13 pin 14 Input resistance Input capacitance FM demodulator DC voltages pin 7 pin 8 AF output voltage (pin 5) (RMS value) AM suppression Total harmonic distortion Output impedance (pin 5) Signal plus weighted-noise to weighted-noise ratio Signal plus noise-to-noise ratio Residual RF signal (pin 5) (RMS value) Ripple rejection Source selector (pin 12) Open loop gain Noise output voltage (RMS value) Bnoise = 20 kHz V12-1 - 20 - µV Gol 50 60 - dB 2 x fo without de-emphasis fR = 70 Hz; VR = 100 mV(p-p) V5-1 R - 40 30 45 - - mV dB in accordance with DIN4505; CCIR468-3 Bnoise = 20 kHz (S + W)/W (S + N)/N 65 75 70 80 - - dB dB QB = 11 fAM = 400 Hz; m = 0.3; Vi = 500 µV(rms) V5-1 AM THD Z5-1 - 50 - - 0.5 - 0.3 6 - - 0.5 - V dB % k V7-1 V8-1 - - 3.2 3.2 - - V V V2-1 V13-1 V14-1 R14-13 C14-13 - - - 15 - 2 2 2 - - - - - - 6 V V V k pF V14-1 - - - - 200 50 mV µV CONDITIONS SYMBOL VP Itot 4.5 - MIN. 16 TYP. 5.0 20 MAX. 13.2 UNIT V mA
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Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
TDA3825
PARAMETER Slew rate
CONDITIONS
SYMBOL V 12 1 ------------------t 2
MIN. -
TYP. -
MAX.
UNIT V/µs
Maximum AF output voltage (RMS value) Input impedance (pin 4) (pin 10) -1 dB small signal bandwidth DC output current Output load capacitance Feedback resistor (pin 3 to pin 6) (pin 3 to pin 12) DC output voltage AF suppression for mute Crosstalk attenuation Offset voltage between any two source selector positions Source selector control Source coltrol voltage (pin 9) Mute active input voltage input current Input 1 active (pin 4) input voltage input current Input 2 active (pin 10) input voltage input current Input voltage at pin 9 for I9 = 0 µA V9-1 - V P 0.7 -------------------2 - V V9-1 I9 2/3 VP + 0.7 - -600 - VP -40 V µA V9-1 I9 1/3 VP -200 - - 2/3 VP-0.7 +200 V µA V9-1 I9 0 10 - - 1/3VP-1 500 V µA see Fig.3 V12-6 - - 50 mV R3-6 R3-12 V12-1 mute 4/10 - 0 - 70 64 - - 2.27 76 70 10 - - - - k V dB dB Z4-1 Z10-1 Baf I12 CL 50 50 100 - - - - - - - - - - 1 500 k k kHz mA pF THD 0.1%; Vu = 6 dB V12-1 1.1 - - V
Reference source (pin 6) Reference voltage input Output current Vref I6 2.17 - 2.27 250 2.37 - V µA
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Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
TDA3825
Fig.2 Test circuit.
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Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
TDA3825
Fig.3 Source selector logic diagram.
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Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
TDA3825
Fig.4 Input/output loading diagram.
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Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
APPLICATION INFORMATION
TDA3825
Fig.5 Application diagram.
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Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
PACKAGE OUTLINE DIP14: plastic dual in-line package; 14 leads (300 mil)
TDA3825
SOT27-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 14 8 MH w M (e 1)
pin 1 index E
1
7
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
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Philips Semiconductors
Product specification
Single FM TV-sound demodulator circuit
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA3825
with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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