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INTEGRATED CIRCUITS
DATA SHEET
TDA3843 Sound-IF circuit for TV AM-sound standard L and L'
Product specification File under Integrated Circuits, IC02 March 1991
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound standard L and L'
GENERAL DESCRIPTION The TDA3843 performs the AM-sound demodulation for the L- and L'-standard. Features · 5 to 8 V power supply and an alternative 12 V power supply · Low power consumption (200 mW) at 5 V supply voltage · New AC-coupled wideband IF-amplifier (high dynamic ranges, less intermodulation) · In-phase wideband AM demodulator without external reference circuit · Reduced THD figures even for low AF frequencies (typical 1%) · Stabilizer circuit for ripple rejection and constant output signals · All pins are ESD protected QUICK REFERENCE DATA PARAMETER Supply voltage (pin 14) Supply voltage (pin 11) Supply current Minimum IF input (RMS value) IF control range AF output signal (RMS value) Signal plus weighted-noise to weighted-noise ratio (CCIR 468-3) PACKAGE OUTLINE 16-lead DIL; plastic (opposite bent leads) (SOT38WBE); SOT38-1; 1996 December 4. S + W/W 50 56 - VP1 VP2 I11, 14-13 V1-16 GV V6-13 SYMBOL MIN. 4.5 10.8 - - 60 - 5 12 40 70 63 550 TYP.
TDA3843
MAX. 8.8 13.2 48 100 - - V V
UNIT
mA µV dB mV
dB
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Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound standard L and L'
TDA3843
Fig.1 Block diagram.
March 1991
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Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound standard L and L'
TDA3843
March 1991
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Fig.2 Input/output loading diagram.
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound standard L and L'
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage (pin 14) Supply voltage (pin 11) Operating ambient temperature range Storage temperature range Total power dissipation at VP2 VP1 VP2 Tamb Tstg Ptot SYMBOL 4.5 10.8 0 -25 - MIN.
TDA3843
MAX. 8.8 13.2 + 70 + 125 635 V V
UNIT
°C °C mW
CHARACTERISTICS VP1 = 5 V (see note 1); Tamb = 25 °C; unless otherwise specified PARAMETER Current consumption IF amplifier Input resistance Input capacitance Minimum IF input signal (RMS value) Maximum IF input signal (RMS value) Gain control range IF bandwidth DC potential AM demodulator AF output signal (RMS value) AF bandwidth Total harmonic distortion Signal plus weighted-noise to weighted-noise ratio (CCIR 468-3) DC potential Output resistance emitter follower with 0.5 mA bias current note 7 note 6 S+W/W V6-13 50 - 56 1.8 - - dB V -3 dB, note 5 note 4 V6-13 V6-13 THD 440 0.02 - 550 - 1 660 >100 2 mV kHz % -3 dB V1/16-3 note 3 V1-16 70 60 50 - 100 63 70 1.7 - - - - mV dB MHz V note 2 V1-16 - 70 100 µV R1-16 C1-16 - - 2 2.5 - - k pF CONDITIONS SYMBOL I11 - MIN. TYP. 40 MAX. 48 UNIT mA
R6 ±I6 -I6
- - -
200 - -
- 0.3 1
mA mA
Allowable AC output current (peak-to-peak value) Allowable DC output current
March 1991
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Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound standard L and L'
PARAMETER Ripple rejection CONDITIONS Vripple < 200 mV (peak-to-peak), 50 to 100 Hz, measured at 70 Hz RR = Vripple on VP/Vripple on VO RR 30 40 SYMBOL MIN. TYP.
TDA3843
MAX.
UNIT
AF signal output
-
dB
IF filter Proposal for sound carrier filter for L-standard Notes to the characteristics 1. Using the power supply voltage range VP1 = 5 to 8 V, the performance will not essentially change. Using the power supply voltage range, VP2 = 12 V, the performance will be comparable with the performance at VP1 = 5 to 8 V. The unused power supply pin must not be connected. 2. Start of gain control (low IF input signal) at -3 dB AF signal reduction at pin 6. 3. End of gain control (high IF input signal) at +1 dB AF signal expansion at pin 6. 4. Sound carrier = 32.4 MHz modulated with f = 1 kHz and a modulation depth m = 80%. IF input signal V1-16 = 10 mV (RMS value). 5. A maximum value of 100 kHz is guaranteed, but, typically a maximum value of 700 kHz is found. 6. The capacitor at pin 4 may be omitted, but then the S+W/W figure will be degraded by up to 8 dB in the IF voltage range 1 mV up to 100 mV. 7. If a higher AC output current is required, an external resistor must be connected from the output to ground. This is to increase the bias current of the emitter follower (note, the maximum allowable DC output current). Fig.5
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Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound standard L and L'
TDA3843
Fig.3 Test circuit, 5 V supply.
Fig.4 Test circuit, 12 V supply.
March 1991
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Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound standard L and L'
TDA3843
Where SC = sound carrier and PC = picture carrier.
Fig.5 AM IF filter for standard L.
March 1991
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Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound standard L and L'
PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA3843
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH w M (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
ISSUE DATE 92-10-02 95-01-19
March 1991
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Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound standard L and L'
SOLDERING Introduction
TDA3843
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
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