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INTEGRATED CIRCUITS

DATA SHEET

TDA3856 Quasi-split sound processor for all standards
Product specification File under Integrated Circuits, IC02 June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards
FEATURES · Quasi-split sound processor for all standards e. g. B/G (FM sound) and L (AM sound) · Automatic muting of the AF2 signal (at B/G) by the input level · AM signal processing for L standard and switching over the audio signal · Layout-compatible with TDA3858 (32 pins) and TDA3857 (20 pins). GENERAL DESCRIPTION

TDA3856

Separate symmetrical IF inputs for FM or AM sound. Gain controlled wideband IF amplifier, input select switch. AGC generation due to peak sync for FM or mean signal level for AM. Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90° phase shifter. Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power dissipation at 5 V. QUICK REFERENCE DATA SYMBOL VP IP Vi IF Vo(RMS) Vo(RMS) THD supply current IF input sensitivity (-3 dB) audio output signal for FM (B/G) audio output signal for AM (L) total harmonic distortion for FM for AM S/N (W) weighted signal-to-noise ratio for FM for AM ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER TDA3856 TDA3856T Note 1. 2. SOT234-1; 1996 November 28. SOT137-1; 1996 November 28. PINS 24 24 PIN POSITION shrink DIL SO MATERIAL plastic plastic CODE SOT234(1) SOT137(2) - - 68 56 - - dB dB - - 0.5 1 - - % % PARAMETER supply voltage (pin 21) - - - - MIN. 4.5 5 60 70 1 0.6 TYP. MAX. 8.8 72 100 - - UNIT V mA µV V V

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

Fig.1 Block diagram (B/G and L).

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards
PINNING SYMBOL AMIF1 AMIF2 CAGC CAM MODE FM2R1 FM2R2 AF2 AF1 FM1R1 FM1R2 VC-R1 VC-R2 CAFAM FM1| CAF1 ICO CAF2 FM2I GND VP CREF FMIF1 FMIF2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION AM IF difference input 1 for L standard (32.4 MHz) AM IF difference input 2 for L standard (32.4 MHz) charge capacitor for AGC (FM and AM) charge capacitor for AM AGC 3-state input for standard select reference circuit for FM2 (5.74 MHz) reference circuit for FM2 (5.74 MHz) AF2 output (AF out of 5.74 MHz) AF1 output (AF out of 5.5 MHz or AM) reference circuit for FM1 (5.5 MHz) reference circuit for FM1 (5.5 MHz) reference circuit for the vision carrier (38.9 MHz) reference circuit for the vision carrier (38.9 MHz) DC decoupling capacitor for AM demodulator (AF-AM) intercarrier input for FM1 (5.5 MHz) DC decoupling capacitor for FM1 demodulator (AF1) intercarrier output signal (5.5/5.74 MHz) DC decoupling capacitor for FM2 demodulator (AF2) intercarrier input for FM2 (5.74 MHz) ground (0 V) +5 to +8 V supply voltage charge capacitor for reference voltage IF difference input 1 for B/G standard (38.9 MHz) IF difference input 2 for B/G standard (38.9 MHz)

TDA3856

Fig.2 Pin configuration.

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards
FUNCTIONAL DESCRIPTION The quasi-split sound processor is suitable for all standards. Dependent on the voltage at pin 5 either FM mode (B/G) or AM mode (L) is selected. B/G standard (FM mode) Pins 23 and 24 are active, AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. Muting With no sound carrier SC2 at pin 19, AF2 output is muted (in mid-position of the standard select switch FM mode without muting of AF2 is selected). The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV at pin 19, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals at pins 23 and 24 generate noise at pin 19, which is present in the intercarrier signal and passes through the 5.74 MHz filter. Noise at pin 19 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder, when non-correlated noise masks the identification signal frequencies, which may be present in sustained tone signals. The stereo decoder remains switched to mono. L standard (AM mode) Pins 1 and 2 are active, AGC detector uses mean signal level. The audio signal from the AM demodulator is output on AF1, with AF2 output muted.

TDA3856

Sound carrier notch filter for an improved intercarrier buzz The series capacitor Cs in the 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and has to be adapted to other TV transmission standards if necessary, according to the formula Cs = CP (fvc/fsc)2 - CP. The result is an improved intercarrier buzz (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier. Intercarrier buzz fine tuning with 250 kHz square wave video modulation The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation. Measurements at the demodulators For all signal-to-noise measurements the generator must meet the following specifications: phase modulation errors < 0.5° for B/W-jumps intercarrier signal-to-noise ratio as measured with `TV-demodulator AMF2' (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal. Signal-to-noise ratios are measured with f = ±50 kHz deviation and fmod = 1 kHz; with a deviation of ±30 kHz the S/N ratio is deteriorated by 4.5 dB.

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP1 VI Ptot Tstg Tamb VESD supply voltage (pin 21) voltage (pins 1, 2, 5, 8, 9, 15, 17, 19, 23 and 24) total power dissipation storage temperature operating ambient temperature electrostatic handling (note 1) all pins except pins 1, 2, 23 and 24 pins 1, 2, 23 and 24 ±500 +400 -500 Note to the Limiting Values 1. Equivalent to discharging a 200 pF capacitor through a 0 series resistor. - - - PARAMETER - 0 0 -25 0 MIN.

TDA3856

MAX. 8.8 VP 650 +150 +70 V V

UNIT

mW °C °C V V V

CHARACTERISTICS VP = 5 V and Tamb = +25 °C; measurements taken in Fig.3 with fvc = 38.9 MHz, fSC1 = 33.4 MHz and fSC2 = 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100% (proportional to 10% residual carrier). Vision carrier amplitude (RMS value) Vi VC = 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation f = 50 kHz, unless otherwise specified. SYMBOL VP IP V5 PARAMETER supply voltage (pin 21) supply current (pin 21) CONDITIONS MIN. 4.5 48 TYP. 5 60 MAX. 8.8 72 UNIT V mA

IF source control (pin 5) input voltage in order to obtain standards B/G (FM) with automatic muting B/G (FM) without muting pin 5 connected pin 5 open-circuit pin 5 connected or alternative measure: 22 k to GND pin 5 connected V5 = VP V5 = 0 V IF input not activated (pins 1-2 or 23-24) RI VI 12-13 RI CI June 1994 input resistance DC input voltage (pins 1, 2 or 23, 24) crosstalk attenuation of IF input switch LOW set internally note 1 - - 50 - - 56 100 0.1 - - 2.6 V dB 2.8 - 1.3 - 2.8 - VP - 2.3 V V V

L (AM sound) I5 input current

0 - -

- - -

0.8 100 -300

V µA µA

IF amplifier (pins 1-2 or 23-24) input resistance input capacitance 6 1.8 - 2.2 2.0 k pF

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

SYMBOL VI Vi IF (RMS)

PARAMETER DC potential, voltage (pins 1, 2, 23, 24) maximum input signal (RMS value) input signal sensitivity B/G standard (RMS value, pins 32-24) input signal sensitivity L standard (RMS value, pins 1-2)

CONDITIONS Vo = +1 dB -3 dB intercarrier signal reduction at pin 17 -3 dB intercarrier signal reduction at pin 9

MIN. - 70 - - 1.7 60

TYP. 1.75 100 70 70 - 63 70

MAX. - - 100 100 2.6 - - - - - -

UNIT V mV µV µV V dB MHz

V3 Gv B

voltage for gain control (pin 3) IF gain control IF bandwidth -3 dB

50 - -

Resonance amplifier (pins 12-13) Vo (p-p) R12-13 L C QL V12, 13 Vo (RMS) B VVID/V17 VVC(RMS) R17 Io I17 V17 vision carrier amplitude (peak-to-peak value) operating resistance inductance capacitance Q-factor of resonant circuit DC voltage (pins 12 and 13) Qo = 90 Figs 3 and 5 fo = 38.9 MHz 270 4 68 40 mV k µH pF V

- - - -

0.247 -

VP- 1 - 95 43 8.5 10 3 0.5 30 - - 1.75 125 56 - - 10 1 - ±0.7 -2 2.0

Intercarrier mixer output (pin 17) output signal for 5.5 MHz (RMS value) output signal for 5.74 MHz (RMS value) IF bandwidth residual video AM on intercarrier residual vision carrier (RMS value) output resistance (emitter follower) allowable AC output current (pin 17) allowable DC output current DC voltage LC-circuit at pin 12, 13 adjusted to minimum video content at pin 17 -3 dB AF signal -1 dB -3 dB note 2 1st/2nd harmonic (38.9/77.8 MHz) 1 mA emitter current 71 32 6 7 - - - - - 1.5 mV mV MHz MHz % mV mA mA V

Limiting amplifiers (pins 15 and 19) Vi (RMS) R15, 19 V15, 19 Vi (RMS) Vi minimum input signal (RMS value) maximum input signal (RMS value) input resistance DC voltage level detector threshold for no muting (RMS value, pin 19) hysteresis of level detector only 5.74 MHz channel - 200 450 - 0.8 4 300 - 560 0 1.2 7 450 - 700 - 1.7 12 µV mV V mV dB

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

FM1 and FM2 demodulators Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with Vi IF (RMS) = 10 mV (fmod = 1 kHz, deviation f = ±50 kHz) at pins 15 and 19 without ceramic filters, Rs = 50 . De-emphasis 50 µs and V5 = VP (B/G standard). QL-factor = 11 for resonant circuits at pins 6-7 and 10-11 (including IC). VIC (RMS) V Vo(RMS) Vo R8, 9 V8, 9 I8, 9(M) I8, 9 THD Vo(RMS) AM S/N(W) B intercarrier signals (RMS values, pins 6-7 and 10-11) DC voltage (pins 6, 7, 10 and 11) AF output signals (RMS values, pins 8 and 9) difference of AF signals between channels (pins 8 and 9) output resistance DC voltage allowed AC current of emitter output (peak value) maximum allowed DC output current total harmonic distortion AF output signal (RMS value) AM suppression weighted signal-to-noise ratio AF bandwidth (-3 dB) lower limit upper limit CR V16, 18 crosstalk attenuation (pins 9-8) DC voltage (pins 16 and 18) - 100 60 - - - 70 1.8 20 - - - Hz kHz dB V THD = 1.5% 1 kHz; m = 0.3 CCIR468-3 note 3 - - 0.84 - 75 1.8 - - - 1.25 48 64 100 1.8 0.95 - 100 2.1 - - 0.5 - 54 68 - - 1.07 1 130 2.4 ±1.5 -2 1.0 - - - mV V V dB V mA mA % V dB dB

AM demodulator V5 = 0 V (AM mode) input signals at pins 1-2: SC = 32.4 MHz; fmod = 1 kHz; m = 0.8; Vi AM (RMS) = 10 mV Vo (RMS) R9 Io (M) I9 V9 THD S/N(W) B AF output signal at pin 9 (RMS value) output resistance (pin 9) maximum AC output current (peak value) maximum DC output current DC voltage total harmonic distortion weighted signal-to-noise ratio AF bandwidth (-3 dB) lower limit upper limit V14 DC voltage (pin 14) - 100 - - - 2 20 - - Hz kHz V Fig.4 CCIR468-3 note 3 530 75 - - 1.8 - 50 600 100 - - 2.1 1 56 675 130 ±1.5 -2 2.4 2 - mV mA mA V % dB

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

SYMBOL AF signal switches

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

input signals: AM carrier into pin 1, 2 FM intercarrier into pin 15 no signal in pin 19 (AF2)

see part AM demodulator see part FM demodulator

the output signals are related to the signals described in the demodulator parts. Vo/Vomute VoAM/VoFM AF2 mute attenuation (pin 8) AF1 FM signal (pin 9) attenuation of unwanted FM signal AF1 AM signal (pin 9) attenuation of unwanted AM signal DC jump at the AF outputs B/G mode; V5 = VP L mode; V5 = 0; FM: modulated; AM: unmodulated B/G mode; V5 = VP; FM: unmodulated; AM: modulated switching to FM or AM sound or Mute 70 70 - - - - dB dB

VoFM/VoAM

70

-

-

dB

dV8, 9

-

5

25

mV

AF performance for FM operation (standard B/G) input signals: B/G IF input signal (pin 23, 24) unmodulated sound carriers different video modulation (100%) the output signals are related to the signals described in the demodulator parts. (S+N)/N(W) weighted signal-to-noise ratio black picture 2T/20T pulses with white bar 6 kHz sine wave, B/W-modulated 250 kHz square wave, B/W-modulated black picture 2T/20T pulses with white bar 6 kHz sine wave, B/W-modulated 250 kHz square wave, B/W-modulated CCIR468-3; de-emphasis 50 µs fi = 5.5 MHz fi = 5.5 MHz fi = 5.5 MHz fi = 5.5 MHz fi = 5.742 MHz fi = 5.742 MHz fi = 5.742 MHz fi = 5.742 MHz VR(p-p) = 200 mV; fR = 70 Hz 59 57 52 50 57 55 50 48 63 61 56 54 61 59 54 52 - - - - - - - - - dB dB dB dB dB dB dB dB

Ripple rejection of the AF outputs (B/G and L standard) RR ripple rejection Vripple on VP / Vripple on Vout 30 40 dB

Notes to the characteristics 1. Crosstalk attenuation of IF input switch, measured at R12-13 = 470 (instead of LC circuit); input signal Vi (RMS) = 20 mV (pins 23-24). AGC voltage V3 set to a value to achieve Vo (RMS) = 20 mV (pins 12-13). After switching (V5 = 0 V) measure attenuation. IF coupling with OFWG3203 and OFWL9350 (Siemens). (A = signal at sync; B = signal with 100% picture modulation). For larger current: RL > 2.2 k (pin 8 or 9 to GND) in order to increase the bias current of the output emitter follower.

2. Spurious intercarrier AM: m = (A - B)/A 3.

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

Fig.3 Test and application circuit for standards B/G and L (for application SAW-filters must be used).

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

Fig.4 Total harmonic distortion (THD) as function of audio frequency at AM standard (V5 = 0).

(1) simple resonant circuit (2) resonant circuit with CP = 68 pF Cs = CP (fVC/fSC)2 - CP Cs = 27 pF (see Fig.3)

Fig.5 Frequency response of the 38.9 MHz reference circuit.

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards
APPLICATION INFORMATION

TDA3856

Fig.6 Internal circuits (continued in Fig.7).

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

Fig.7 Internal circuits (continued from Fig.6).

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards
PACKAGE OUTLINES SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)

TDA3856

SOT234-1

D seating plane

ME

A2

A

L

A1 c Z e b 24 13 b1 w M (e 1) MH

pin 1 index E

1

12

0

5 scale

10 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A max. 4.7 A1 min. 0.51 A2 max. 3.8 b 1.3 0.8 b1 0.53 0.40 c 0.32 0.23 D (1) 22.3 21.4 E (1) 9.1 8.7 e 1.778 e1 10.16 L 3.2 2.8 ME 10.7 10.2 MH 12.2 10.5 w 0.18 Z (1) max. 1.6

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT234-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION

ISSUE DATE 92-11-17 95-02-04

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

SO24: plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

D

E

A X

c y HE v M A

Z 24 13

Q A2 A1 pin 1 index Lp L 1 e bp 12 w M detail X (A 3) A

0

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)



0.9 0.4

0.012 0.096 0.004 0.089

0.019 0.013 0.014 0.009

0.043 0.055 0.016

0.035 0.004 0.016

8 0o

o

Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION

ISSUE DATE 92-11-17 95-01-24

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). SDIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

TDA3856

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: · A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. · The longitudinal axis of the package footprint must be parallel to the solder flow. · The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

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Philips Semiconductors

Product specification

Quasi-split sound processor for all standards
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values

TDA3856

This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

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