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INTEGRATED CIRCUITS

DATA SHEET

TDA3857 Quasi-split sound processor with two FM demodulators
Product specification File under Integrated Circuits, IC02 June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators
FEATURES · Quasi-split sound processor for all FM standards e. g. B/G

TDA3857

· Reducing of spurious video signals by tracking function and AFC for the vision carrier reference circuit; (recommended for NICAM) · Automatic muting of the AF2 signal by the input level · Stereo matrix correction · Layout-compatible with TDA3856 (24 pins) and TDA3858 (32 pins). GENERAL DESCRIPTION Symmetrical IF inputs. Gain controlled wideband IF amplifier. AGC generation due to peak sync. Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90° phase shifter. Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power dissipation at 5 V. QUICK REFERENCE DATA SYMBOL VP IP Vi IF Vo AF THD S/N (W) supply voltage (pin 19) supply current IF input sensitivity (-3 dB) audio output signal (RMS value) total harmonic distortion weighted signal-to-noise ratio PARAMETER MIN. 4.5 - - - - - TYP. 5 60 70 1 0.5 68 MAX. 8.8 72 100 - - - UNIT V mA µV V % dB

ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER TDA3857 Note 1. SOT 146-1; 1996 November 28. PINS 20 PIN POSITION DIL MATERIAL plastic CODE SOT146(1)

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators

TDA3857

Fig.1 Block diagram (standard B/G).

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators
PINNING SYMBOL FMIF1 CAGC MATR FM2R1 FM2R2 AF2 AF1 FM1R1 FM1R2 VC-R1 VC-R2 TRACK FM1I CAF1 ICO CAF2 FM2I GND VP FMIF2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION IF difference input 1 for B/G standard (38.9 MHz) charge capacitor for AGC input for stereo matrix correction reference circuit for FM2 (5.74 MHz) reference circuit for FM2 (5.74 MHz) AF2 output (AF out of 5.74 MHz) AF1 output (AF out of 5.5 MHz) reference circuit for FM1 (5.5 MHz) reference circuit for FM1 (5.5 MHz) reference circuit for the vision carrier (38.9 MHz) reference circuit for the vision carrier (38.9 MHz) DC output level for tracking intercarrier input for FM1 (5.5 MHz) DC decoupling capacitor for FM1 demodulator (AF1) intercarrier output signal (5.5/5.74 MHz) DC decoupling capacitor for FM2 demodulator (AF2) intercarrier input for FM2 (5.74 MHz) ground (0 V) +5 to +8 V supply voltage IF difference input 2 for B/G standard (38.9 MHz)

TDA3857

Fig.2 Pin configuration.

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators
FUNCTIONAL DESCRIPTION The quasi-split sound processor is suitable for all FM standards (e. g. B/G). B/G standard AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. Muting With no sound carrier SC2 at pin 17, AF2 output is muted. The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV at pin 17, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals at pins 1 and 20 generate noise at pin 17, which is present in the intercarrier signal and passes through the 5.74 MHz filter. Noise at pin 17 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder, when non-correlated noise masks the identification signal frequencies, which may be present in sustained tone signals. The stereo decoder remains switched to mono. Sound carrier notch filter for an improved intercarrier buzz The series capacitor Cs in the 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and

TDA3857

has to be adapted to other TV transmission standards if necessary, according to the formula C s = C p ( f vc / f sc ) 2 C p The result is an improved intercarrier buzz (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier. Intercarrier buzz fine tuning with 250 kHz square wave video modulation The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation. Measurements at the demodulators For all signal-to-noise measurements the generator must meet the following specifications: phase modulation errors < 0.5° for B/W-jumps intercarrier signal-to-noise ratio as measured with `TV-demodulator AMF2' (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal. Signal-to-noise ratios are measured with f = ±50 kHz deviation and fmod = 1 kHz; with a deviation of ±30 kHz the S/N ratio is deteriorated by 4.5 dB.

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP VI Ptot Tstg Tamb VESD supply voltage (pin 19) voltage (pins 1, 6, 7, 13, 15, 17 and 20) total power dissipation storage temperature operating ambient temperature electrostatic handling (note 1) all pins except pins 1 and 20 pins 1 and 20 ±500 +400 -500 Note to the Limiting Values 1. Equivalent to discharging a 200 pF capacitor through a 0 series resistor. - - - PARAMETER - 0 0 -25 0 MIN.

TDA3857

MAX. 8.8 VP 635 +150 +70

UNIT V V mW °C °C V V V

CHARACTERISTICS VP = 5 V and Tamb = +25 °C; measurements taken in Fig.3 with fVC = 38.9 MHz, fSC1 = 33.4 MHz and fSC2 = 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100% (proportional to 10% residual carrier). Vision carrier amplitude (RMS value) Vi VC = 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation f = 50 kHz, unless otherwise specified. SYMBOL VP IP RI CI VI Vi IF (RMS) PARAMETER supply voltage (pin 19) supply current (pin 19) CONDITIONS MIN. 4.5 48 TYP. 5 60 MAX. 8.8 72 - 2.6 - - 100 - 2.6 - - - - - V mA UNIT

IF amplifier (pins 1 and 20) input resistance input capacitance DC input voltage maximum input signal (RMS value, pins 1-20) input signal sensitivity (RMS value) Gv V2 B IF gain control voltage for gain control (pin 2) IF bandwidth -3 dB Vo = +1 dB -3 dB intercarrier signal reduction at pin 15 1.8 - - 70 - 60 1.7 50 - - Figs 3 and 4 - - 6 2.2 2.0 1.75 100 70 63 - 70 k pF V mV µV dB V MHz

Resonance amplifier (pins 10-11) Vo (p-p) R10-11 L C June 1994 vision carrier amplitude (peak-to-peak value) operating resistance inductance capacitance fo = 38.9 MHz 270 4 0.247 68 mV k µH pF

Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators

TDA3857

SYMBOL QL V10, 11 Vo (RMS)

PARAMETER Q-factor of resonance circuit DC voltage (pins 10 and 11)

CONDITIONS Qo = 90 - -

MIN.

TYP. 40

MAX. - V

UNIT

VP - 1 - 95 43 8.5 10 3 0.5 30 - - 1.75 125 56 - - 10 1 - ±0.7 -2 2.0

Intercarrier mixer output (pin 15) output signal for 5.5 MHz (RMS value) output signal for 5.74 MHz (RMS value) B VVID/V15 VVC (RMS) R15 Io I15 V15 IF bandwidth residual video AM on intercarrier residual vision carrier (RMS value) output resistance (emitter follower) allowable AC output current (pin 15) allowable DC output current DC voltage LC-circuit at pin 10, 11 adjusted to minimum video content at pin 15 -3 dB AF signal -1 dB -3 dB note 1 1st/2nd harmonic (38.9/77.8 MHz) 1 mA emitter current 71 32 6 7 - - - - - 1.5 mV mV MHz MHz % mV mA mA V

Limiting amplifiers (pins 13 and 17) Vi (RMS) R13, 17 V13, 17 Vi (RMS) Vi minimum input signal (RMS value) maximum input signal (RMS value) input resistance DC voltage level detector threshold for no muting (RMS value, pin 17) hysteresis of level detector only 5.74 MHz channel - 200 450 - 0.8 4 300 - 560 0 1.2 7 450 - 700 - 1.7 12 µV mV V mV dB

FM1 and FM2 demodulators Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with Vi IF (RMS) = 10 mV (fmod = 1 kHz, deviation f = ±50 kHz) at pins 13 and 17 without ceramic filters, Rs = 50 . De-emphasis 50 µs. QL-factor = 11 for resonant circuits at pins 4-5 and 8-9 (including IC). VIC (RMS) V Vo (RMS) Vo R6, 7 V6, 7 intercarrier signals (RMS values, pins 4-5 and 8-9) DC voltage (pins 4, 5, 8 and 9) AF output signals (RMS values, pins 6 and 7) difference of AF signals between channels (pins 6 and 7) output resistance DC voltage note 2 - - 0.84 - 75 1.8 100 1.8 0.95 - 100 2.1 - - 1.07 1 130 2.4 mV V V dB V

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators

TDA3857

SYMBOL I6, 7 (M) I6, 7 THD Vo (RMS) AM S/N(W) B

PARAMETER allowed AC current of emitter output (peak value) maximum allowed DC output current total harmonic distortion AF output signal (RMS value) AM suppression weighted signal-to-noise ratio AF bandwidth (-3 dB) lower limit upper limit

CONDITIONS note 3 - - - THD = 1.5% 1 kHz; m = 0.3 CCIR468-3

MIN.

TYP. - - 0.5 - 54 68 - - 70 0 5 -2.5 1.5 1.8

MAX. ±1.5 -2 1.0 - - - 20 - - - - - - -

UNIT mA mA % V dB dB Hz kHz dB V V dB dB V

1.25 48 64 - 100 60

CR V3

crosstalk attenuation (pins 6-7) adjustment voltage for AF2 note 4 minimum output signal maximum output signal

- - -1.5 1.0 -

GAF2min GAF2max V14, 16 Vo 12 FTR

gain for minimum Vout gain for maximum Vout DC voltage (pins 14 and 16)

V3 = 0 V V3 = 5 V

Tracking Automatic Frequency Control (AFC) of the vision carrier reference circuit tracking output voltage (pin 12) tracking reducing factor for black picture white test picture 50% grey picture S AFC steepness (open loop) for black picture white test picture 50% grey picture AF signal switches input signals: FM intercarrier into pin 13 no signal in pin 17 (AF2) the output signals are related to the signals described in the demodulator part. Vo/Vomute dV6 AF2 mute attenuation (pin 6) DC jump at the AF2 output switching to Mute 70 - - 5 - 25 dB mV see part FM demodulator - - - -8 -3 -5.5 - - - mV/kHz mV/kHz mV/kHz - - - 9 4 6 - - - note 5 VP - 3.3 - VP - 1 V

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators

TDA3857

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

AF performance for FM operation (standard B/G) input signals: B/G IF input signal (pin 1, 20) unmodulated sound carriers different video modulation (100%) the output signals are related to the signals described in the demodulator part. (S+N)/N(W) weighted signal-to-noise ratio black picture 2T/20T pulses with white bar 6 kHz sine wave, B/W-modulated black picture 2T/20T pulses with white bar 6 kHz sine wave, B/W-modulated Ripple rejection of the AF outputs RR ripple rejection Vripple on VP / Vripple on Vout VR(p-p) = 200 mV; fR = 70 Hz 30 40 - dB CCIR468-3; de-emphasis 50 µs fi = 5.5 MHz fi = 5.5 MHz fi = 5.5 MHz fi = 5.742 MHz fi = 5.742 MHz fi = 5.742 MHz 59 57 52 50 57 55 50 48 63 61 56 54 61 59 54 52 - - - - - - - - dB dB dB dB dB dB dB dB

250 kHz square wave, B/W-modulated fi = 5.5 MHz

250 kHz square wave, B/W-modulated fi = 5.742 MHz

Notes to the characteristics 1. Spurious intercarrier AM: M = (A - B)/A 2. AF signal can be adjusted by V3. 3. For larger current: RL > 2.2 k (pin 6 or 7 to GND) in order to increase the bias current of the output emitter follower. 4. If not used, pin 3 should not be connected. 5. Automatic Frequency Control (AFC) of the vision carrier reference circuit (pins 10 and 11) for reducing spurious video signals in the stereo/dual sound modes. The factor of reducing FTR at deviation fVC specifies the ratio of spurious signals with/without tracking function. (A = signal at sync; B = signal with 100% picture modulation).

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators

TDA3857

(1) CP = 47 pF with optional use of tracking (because of Co of the varicaps).

Fig.3 Test and application circuit for standard B/G (for application SAW-filters must be used).

(1) simple resonant circuit (2) resonant circuit with CP = 68 pF CS = CP (fVC/fSC)2 - CP CS = 27 pF (see Fig.3)

Fig.4 Frequency response of the 38.9 MHz reference circuit.

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators
APPLICATION INFORMATION

TDA3857

Fig.5 Internal circuits (continued in Fig.6).

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators

TDA3857

Fig.6 Internal circuits (continued from Fig.5).

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators
PACKAGE OUTLINE DIP20: plastic dual in-line package; 20 leads (300 mil)

TDA3857

SOT146-1

D seating plane

ME

A2

A

L

A1

c Z e b1 b 20 11 MH w M (e 1)

pin 1 index E

1

10

0

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)

E

(1)

e 2.54 0.10

e1 7.62 0.30

L 3.60 3.05 0.14 0.12

ME 8.25 7.80 0.32 0.31

MH 10.0 8.3 0.39 0.33

w 0.254 0.01

Z (1) max. 2.0 0.078

26.92 26.54 1.060 1.045

6.40 6.22 0.25 0.24

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION

ISSUE DATE 92-11-17 95-05-24

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Philips Semiconductors

Product specification

Quasi-split sound processor with two FM demodulators
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact

TDA3857

with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.

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