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INTEGRATED CIRCUITS
DATA SHEET
TDA3868T Quasi-split sound processor for all standards
Preliminary specification File under Integrated Circuits, IC02 January 1992
Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
FEATURES · Quasi-split sound processor for all standards e. g. B/G (FM sound) and L (AM sound) · Reduction of spurious video signals by tracking function and AFC for the vision carrier reference circuit; (indispensable for NICAM) · AF2 signal automatically muted (at B/G) by input signal level · AM signal processing for L standard and audio switching over · Stereo-matrix correction · AM output level typically 500 mV at m = 0.54 (+2.5 dB in comparison to TDA3858) GENERAL DESCRIPTION
TDA3868T
Separate symmetrical IF inputs for FM and AM sound. Gain controlled wideband IF amplifier and input select switch. AGC generation due to peak-sync for FM or mean signal level for AM. Reference amplifier to regenerate the vision carrier. Limiting amplifier optimized for AM suppression of the regenerated vision carrier signal and 90° phase shifter. Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power dissipation at 5 V.
QUICK REFERENCE DATA SYMBOL VP Data at VP = 5 V IP Vi IF Vo THD supply current (pin 24) IF input sensitivity (-3 dB) audio output signal for FM standard B/G (RMS value) audio output signal for AM standard L (RMS value) total harmonic distortion for FM for AM S/N (W) weighted signal-to-noise ratio for FM for FM with 6 kHz sinus vision modulation for AM ORDERING AND PACKAGE INFORMATION EXTENDED TYPE NUMBER TDA3868T Note 1. SOT136-1; 1996 November 25. PACKAGE PINS 28 PIN POSITION mini-pack MATERIAL plastic CODE SOT136A(1) - - - 68 56 56 - - - dB dB dB - - 0.5 1 - - % % - - - - 60 70 1 0.5 72 100 - - mA µV V V PARAMETER supply voltage (pin 24) MIN. 4.5 5 TYP. MAX. 8.8 V UNIT
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3868T
Fig.1 Block diagram (B/G and L standards).
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
PINNING SYMBOL AMIF1 AMIF2 CAGC CAM MODE MATR FM2R1 FM2R2 AF2 AF1 FM1R1 FM1R2 n.c. VC-R1 VC-R2 TRACK CAFAM FM1l CAF1 ICO CAF2 FM2l GND VP n.c. Cref FMIF1 FMIF2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 PIN DESCRIPTION AM IF difference input 1 for L standard (32.4 MHz) AM IF difference input 2 for L standard (32.4 MHz) charge capacitor for AGC (FM and AM) charge capacitor for AM AGC 3-state input for standard select input for stereo matrix correction reference circuit for FM2 (5.74 MHz) reference circuit for FM2 (5,74 MHz) AF2 output (AF out of 5.74 MHz) AF1 output (AF out of 5.5 MHz or AM) reference circuit for FM1 (5.5 MHz) reference circuit for FM1 (5.5 MHz) not connected reference circuit for the vision carrier (38.9 MHz) reference circuit for the vision carrier (38.9 MHz) DC output level for tracking DC-decoupling capacitor for AM demodulator (AF AM) intercarrier input for FM1 (5.5 MHz) DC-decoupling capacitor for FM1 demodulator (AF1) intercarrier output signal (5.5/5.74 MHz) DC-decoupling capacitor for FM2 demodulator (AF2) intercarrier input for FM2 (5.74 MHz) ground (0 V) +5 to +8 V supply voltage not connected charge capacitor for reference voltage IF difference input 1 (B/G standard, 38.9 MHz) IF difference input 2 (B/G standard, 38.9 MHz)
TDA3868T
Fig.2 Pin configuration.
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
FUNCTIONAL DESCRIPTION The quasi-split sound processor is for all standards. Dependent on the voltage on pin 5 either FM mode (B/G) or AM mode (L) is selected. B/G standard (FM mode): Pins 27 and 28 are active, AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. With no sound carrier SC2 on pin 22, AF2 output is muted (in mid-position of the standard select switch FM mode without muting of AF2 is selected). The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV on pin 22, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals on pins 27 and 28 generate noise on pin 22, which is present in the intercarrier signal and passes through the 5,74 MHz filter. Noise on pin 22 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder; when non-correlated noise masks the identification signal frequencies, which may be present in sustained tone signals. The stereo decoder remains switched to mono. The series capacitor Cs in 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and has to be adapted to other TV transmission standards if necessary, according to 2 C S = C P ( f VC / f SC ) C P . The result is an improved "intercarrier buzz" (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier. The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation.
TDA3868T
Measurements at the demodulators: For all signal-to-noise measurements the generator must meet the following specifications; phase modulation errors < 0.5 degree for B/W-jumps intercarrier signal-to-noise ratio as measured with "TV-demodulator AMF2" (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal. Signal-to-noise ratios are measured with f = ±50 kHz deviation and fm = 1 kHz; with a deviation of ±27 kHz the S/N ratio is deteriorated by 5.3 dB. L standard (AM mode): Pins 1 and 2 are active, AGC detector uses mean signal level. The audio signal from the AM demodulator is output on AF1 with AF2 output muted.
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL VP VI Ptot Tstg Tamb VESD PARAMETER supply voltages (pin 24) voltage (pins 1, 2, 5, 9, 10, 18, 20, 22, 27 and 28) total power dissipation storage temperature range operating ambient temperature range electrostatic handling
(1)
TDA3868T
MIN. - 0 0 -25 0 ±500 +400 -500 VP
MAX. 8.8 635 150 70 - - - V V
UNIT
mW °C °C V V V
all pins except 1, 2, 27 and 28 pins 1, 2, 27 and 28 pins 1, 2, 27 and 28 Note 1. Equivalent to discharging a 200 pF capacitor through a 0 series resistor.
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3868T
CHARACTERISTICS VP = 5 V and Tamb = 25 °C, measurements taken in Fig.3 with fVC = 38.9 MHz, fSC1 = 33.4 MHz and fSC2 = 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100 % (proportional to 10 % residual carrier). Vision carrier amplitude (RMS value) Vi VC = 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation f = ±50 kHz unless otherwise specified. SYMBOL VP IP RI VI 1,2-27.28 V5 PARAMETER supply voltage.range (pin 24) supply current (pin 24) VP = 5 V CONDITIONS MIN. 4.5 48 - LOW internal set note 1 - 50 5 60 - - 56 TYP. MAX. 8.8 72 V mA V dB UNIT
IF input not activated (pins 1-2 or 27-28) input resistance DC input voltage (pins 1-2 or 31-32) crosstalk attenuation of IF input switch 100 0.1 -
IF source control (pin 5) input voltage in order to obtain standards B/G (FM) with automatic muting B/G (FM) without muting pin 5 connected pin 5 open-circuit pin 5 connected or alternative measure: 22 k to GND L (AM sound) I5 input current pin 5 connected V5 = VP V5 = 0 IF amplifier (pins 27-28 or 1-2) RI CI VI Vi IF input resistance input capacitance DC potential, voltage (pins 1, 2, 27, 28) maximum input signal (RMS value) input signal sensitivity B/G standard (RMS value, pins 27-28) input signal sensitivity L standard (RMS value, pins 1-2) Gv B V3 Vo R14-15 L C IF gain control range IF bandwidth voltage range for gain control (pin 3) -3 dB Gmin-Gmax fo = 38.9 MHz Vo = +1 dB 2.75 1.0 - 70 -3 dB intercarrier signal - reduction on pin 20 -3 dB intercarrier signal - reduction on pin 10 60 50 1.7 - - Fig.3 and 5 CS = 27 pF - - 2.2 1.5 1.75 100 70 70 63 70 - 2.65 2.2 - - 100 100 - - 2.6 - - - - k pF V mV µV µV dB MHz V 0 - - - - - 0.8 100 -300 V µA µA 2.8 - 1.3 - 2.8 - VP1 - 2.3 V V V
Resonance amplifier (pins 14-15) vision carrier amplitude (peak-to-peak value) operating resistance inductance capacitance 270 4 0.247 68 mV k µH pF
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3868T
SYMBOL QL V14, 15 Vo B VVID/V20 VVC R20 Io I20 V20 Vi R18, 22 V18, 22 Vi Vi Vo FTR
PARAMETER Q-factor of resonant circuit DC voltage (pins 14 and 15)
CONDITIONS Qo = 90 - -
MIN.
TYP. 40 Vp-1 95 43 8.5 10 3 0.5 30 - - 1.75
MAX. - - V
UNIT
Intercarrier mixer output (pin 20) output signal for 5.5 MHz (RMS value) output signal for 5.74 MHz (RMS value) IF bandwidth residual video AM on intercarrier residual vision carrier (RMS value) output resistance (emitter follower) allowable AC output current (pin 20) allowable DC output current DC voltage -3 dB AF signal -1 dB -3 dB note 2 1st/2nd harmonic; (38.9/77.8 MHz) 1 mA emitter current 71 32 - - - - - - - - - 200 - - only 5.74 MHz channel - - 125 56 - - 10 1 - ±0.7 -2 - mV mV MHz MHz % mV mA mA V µV mV V mV dB
Limiting amplifiers (pins 18 and 22) minimum input signal (RMS value) maximum input signal (RMS value) input resistance DC voltage level detector threshold for no muting (RMS value, pin 22) hysteresis of level detector 300 - 560 0 1 5 450 - - - - - VP1-1 - - - - - - mV/kHz mV/kHz mV/kHz
Tracking automatic frequency control (AFC) of the vision carrier reference circuit. tracking output voltage range (pin 16) tracking reducing factor for black picture white test picture 50 % grey picture S AFC steepness (open loop) for black picture white test picture 50 % grey picture - - - -8 -3 -5.5 - - - 9 4 6 note 3 VP1-3.3 - V
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3868T
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
FM1 and FM2 demodulators Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with Vi IF (rms) = 10 mV (fmod = 1 kHz, deviation f = ±50 kHz) at pins 18 and 22 without ceramic filters, RS = 50 . De-emphasis 50 µs and VS = VP (B/G standard). QL-factor = 11 for resonant circuits at pins 7-8 and 11-12. VIC VDC Vo Vo R9, 10 V9, 10 I9, 10 I9, 10 THD Vo AM S/N(W) B CR V6 GAF2 V19, 21 intercarrier signals (RMS values, pins 7-8 and 11-12) DC voltage (pins 7, 8, 11 and 12) AF output signals (RMS values, pins 9 and 10) difference of AF signals between channels (pins 9 and 10) output resistance DC voltage allowed AC current of emitter output (peak value) maximum allowed DC output current total harmonic distortion AF output signal (RMS value) AM suppression weighted signal-to-noise ratio AF bandwidth crosstalk attenuation (pins 9-10) adjusting voltage for AF2 signal (pin 6) minimum gain range typical gain range DC voltage (pins 19 and 21) SC = 32.4 MHz; fmod = 1 kHz, m = 0.54; Vi AM = 10 mV rms 400 - note 5 - - - Fig.4 CCIR 468-3 -3 dB - 50 0.02 - 500 100 - - 2.1 1 56 - 2 600 - ±1.5 -2 - 2 - 100 - mV mA mA V % dB kHz V AM mode, input signal at pins 1-2 note 6 due to V6 due to V6 THD = 1.5 % 1 kHz, m = 0.3 CCIR 468-3 -3 dB note 5 pin 6 open-circuit; note 4 - - 0.75 - - - - - - 1.25 48 64 0.02 60 0 -1.5 -2.5 - 100 1.8 0.95 - 100 2.1 - - 0.5 - 54 68 - 70 - - - 1.7 - - 1.20 1 - - ±1.5 -2 1.0 - - - 100 - 5 1.0 1.5 - mV V V dB V mA mA % V dB dB kHz dB V dB dB V
Vo R10 Io I10 V10 THD S/N(W) B V17
AF output signal on pin 10 (RMS value) output resistance (pin 10) maximum AC output current (peak value) maximum DC output current DC voltage total harmonic distortion weighted signal-to-noise ratio AF bandwidth DC voltage (pin 17)
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3868T
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Audio frequency performance for FM operation in B/G standard (V5 = VP) unless otherwise specified. Measurements on AF outputs (pins 9 and 10) Vo signal attenuation of AF signal switches mute: AF2 on pin 9 AM mode: not required signal AF1 on pin 10 (from FM) FM mode: not required signal AF1 on pin 10 (from AM) dV9, 10 S/N(W) DC level deviation (pins 9 and 10) weighted signal-to-noise ratio on output pin 10 black picture 2T/20T pulses with white bar 6 kHz sine wave, B/W-modulated on output pin 9 black picture 2T/20T pulses with white bar 6 kHz sine wave, B/W-modulated RR ripple rejection fi = 5.742 MHz fi = 5.742 MHz fi = 5.742 MHz all standards; fR = 70 Hz; VR = 200 mV (p-p) 57 55 50 50 30 61 59 54 56 40 - - - - dB dB dB dB dB V5 = 0 5.5 MHz on pin 18; V5 = 0; Vi = 10 mV signal for L standard (pins 1-2); V5 = VP when switching to FM or AM sound or Mute CCIR 468-3 de-emphasis 50 µs fi = 5.5 MHz fi = 5.5 MHz fi = 5.5 MHz 59 57 52 50 63 61 56 56 - - - - dB dB dB dB 70 70 70 - - - - 5 - - - 25 dB dB dB mV
250 kHz square wave B/W-modulated fi = 5.5 MHz
250 kHz square wave B/W-modulated fi = 5.742 MHz
Notes 1. Crosstalk attenuation of IF input switch, measured at R14-15 = 470 (instead of LC circuit); input signal Vi = 20 mV rms (pins 27-28). AGC voltage V3 set to a value to achieve Vo = 20 mV rms (pins 14-15). After switching (V5 =(0 V) measure attenuation. IF coupling with OFWG3203 and OFWL9350 (Siemens). 2. Spurious intercarrier AM: m = (A-B)/A (wherein A = signal at sync; B = signal with 100 % picture modulation.) 3. Automatic frequency control (AFC) of the vision carrier reference circuit (pins 14 and 15) for reducing spurious video signals in the stereo/dual sound modes. The factor of reducing FTR at a deviation fVC specifies the ratio of spurious signals with/without tracking function. 4. AF2 signal can be adjusted by V6 5. For larger current: RL > 2.2 k (pin 9 or 10 to GND) in order to increase the bias current of the output emitter follower. 6. If not used, pin 6 should not be connected.
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3868T
Fig.3 Test and application circuit for standards B/G and L (for application SAW-filters must be used).
Fig.4 Total harmonic distortion (THD) as a function of audio frequency at AM standard (V5 = 0).
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
APPLICATION INFORMATION
TDA3868T
(1) simple resonance circuit (without CS) (2) resonance circuit with CS = 27 pF CS = CP ( fVC / fSC)2 - CP CS = 27 pF (Fig.3)
Fig.5 Frequency response of the 38.9 MHz reference circuit.
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3868T
Fig.6 Internal circuits; (continued in Fig.7).
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3868T
Fig.7 Internal circuits; (continued from Fig.6).
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
PACKAGE OUTLINE SO28: plastic small outline package; 28 leads; body width 7.5 mm
TDA3868T
SOT136-1
D
E
A X
c y HE v M A
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 w M detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-24
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. Wave soldering
TDA3868T
Wave soldering techniques can be used for all SO packages if the following conditions are observed: · A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. · The longitudinal axis of the package footprint must be parallel to the solder flow. · The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA3868T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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