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INTEGRATED CIRCUITS
DATA SHEET
TBA120U Sound I.F. amplifier/demodulator for TV
Product specification File under Integrated Circuits, IC02 March 1986
Philips Semiconductors
Product specification
Sound I.F. amplifier/demodulator for TV
GENERAL DESCRIPTION
TBA120U
The TBA120U is an i.f. amplifier with a symmetrical FM demodulator and an a.f. amplifier with adjustable output voltage. The a.f. amplifier is also provided with an output for volume control and an input for VCR operation. The input and output of the TBA120U are especially designed for LC-circuits, but the input can also be used with a ceramic filter. QUICK REFERENCE DATA Supply voltage (pin 11) Supply current I.F. voltage gain at f = 5,5 MHz Input voltage starting limiting AM suppression at f = ± 50 kHz A.F. output voltage adjustment range (pin 8) A.F. output voltage at f = ± 50 KHz (r.m.s. value) at pin 8 at pin 12 PACKAGE OUTLINE 14-lead DIL; plastic (SOT27); SOT27-1; 1996 November 19. Vo af (rms) Vo af (rms) typ. typ. 1,2 1,0 V V Vp IP Gv if Vi Vo af typ. typ. typ. typ. typ. typ. 12 13,5 68 30 60 85 V mA dB µV dB dB
March 1986
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Philips Semiconductors
Product specification
Sound I.F. amplifier/demodulator for TV
TBA120U
Fig.1 Block diagram.
March 1986
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Philips Semiconductors
Product specification
Sound I.F. amplifier/demodulator for TV
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 11) Adjustment voltage (pin 5) Total power dissipation By-pass resistance Storage temperature range Operating ambient temperature range CHARACTERISTICS VP = 12 V; Tamb = 25 °C; f = 5,5 MHz I.F. voltage gain Input voltage starting limiting at f = ± 50 kHz; fm = 1 kHz I.F. output voltage at limiting (peak-to-peak value) AM suppression at f = ± 50 kHz; Vi = 500 µV; fm = 1 kHz; m = 30% I.F. residual voltage without de-emphasis at pin 12 at pin 8 A.F. voltage gain A.F. adjustment at R4-5 = 5 k; R5-1 = 13 k A.F. output voltage control range Adjustment resistor( note 2) D.C. voltage portion at the a.f. outputs pin 12 pin 8 Output resistance of the a.f. outputs pin 12 pin 8 Input resistance of the a.f. input Stabilized reference voltage Source resistance of reference voltage source R4-1 typ. Ro 12-1 Ro 8-1 Ri 3-1 V4-1 = Vref typ. typ. typ. typ. V12-1 V8-1 typ. typ. Vo af Vo af R4-5 typ. > typ. 1 to 10 Vif 12 Vif 8 Gv af 8-3 typ. typ. typ. > typ. Vo if (p-p) typ. Vi typ. < Gv if 6-14 typ. VP = V11-1 V5-1 Ptot R13-14 Tstg Tamb max. max. max. max. 0 to + 70
TBA120U
18 6 1
V (1) V k °C °C
400 mW
-40 to + 125
68 30 60 250 50 60 30 20 7,5 20 to 36 28 70 85
dB µV µV mV dB dB mV mV dB dB dB dB k
5,6 4,0 1,1 1,1 2 4,2 to 5,3 4,8 12
V V k k k V V
March 1986
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Philips Semiconductors
Product specification
Sound I.F. amplifier/demodulator for TV
Hum suppression at pin 12 at pin 8 Supply current (pin 11) I.F. input impedance A.F. output voltage at f = ± 50 kHz; fm = 1 kHz; Vi = 10 mV; Qo = 45; r.m.s. value at pin 12 at pin 8 Distortion at f = ± 50 kHz; fm = 1 kHz; Vi = 10 mV; Qo = 20 Notes 1. 2. Supply voltage operating range is 10 to 18 V. Pin 5 must be connected to pin 4, when volume control adjustment is not applicable. dtot typ. Vo af (rms) Vo af (rms) typ. typ. V12/V11 V8/V11 IP = I11 typ. |Zi| typ. > typ. typ.
TBA120U
30 35 9,5 to 17,5 13,5
dB dB mA mA
40 k/4,5 pF 15 k/< 6 pF
1,0 1,2 1
V V %
Fig.2 Application example using TBA120U.
March 1986
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Philips Semiconductors
Product specification
Sound I.F. amplifier/demodulator for TV
TBA120U
Fig.3
The a.f. output voltage at pin 8 as a function of the resistance values as shown in Fig.4.
Fig.4 Resistor conditions for curves in Fig.3.
(1) Vo af with de-emphasis at f = ± 50 kHz; fm = 1 kHz; dtot = 1,5%; 0 dB 770 mV. (2) Vi: 0 dB 200 mV at 60 .
(1) Vo af with de-emphasis at fm = 1 kHz; 0 dB 770 mV; curve a: f = ± 50 kHz; dtot = 3%; curve b: f = ± 25 kHz; dtot = 1%. (2) Vi: 0 dB 200 mV at pin 14.
Fig.5
The a.f. output voltage at pin 8 as a function of the input voltage with SFC 5,5 MA at the input (see Fig.2).
Fig.6
The a.f. output voltage at pin 8 as a function of the input voltage with broadband input (60 ).
March 1986
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Philips Semiconductors
Product specification
Sound I.F. amplifier/demodulator for TV
TBA120U
Fig.8 Fig.7 The a.f. output voltages at pins 8 and 1 as a function of the supply voltage; 0 dB 770 mV.
Total distortion as a function of the a.f. output voltage change. ____ 0 dB 900 mV over i.f. (pin 8) - - - - 0 dB 1,15 V (pin 8)
Fig.9
Supply current and the reference voltage at pin 4 as a function of supply voltage.
March 1986
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Philips Semiconductors
Product specification
Sound I.F. amplifier/demodulator for TV
PACKAGE OUTLINE DIP14: plastic dual in-line package; 14 leads (300 mil)
TBA120U
SOT27-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 14 8 MH w M (e 1)
pin 1 index E
1
7
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
March 1986
8
Philips Semiconductors
Product specification
Sound I.F. amplifier/demodulator for TV
SOLDERING Introduction
TBA120U
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Short-form specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
March 1986
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