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INTEGRATED CIRCUITS
DATA SHEET
TDA1082 East-West correction driver circuit
Product specification File under Integrated Circuits, IC02 March 1986
Philips Semiconductors
Product specification
East-West correction driver circuit
GENERAL DESCRIPTION
TDA1082
The TDA1082 is a monolithic integrated circuit driving east-west correction of colour tubes in television receivers. The circuit can be used for class-A and class-D operation and incorporates the following functions: · differential input amplifier · squaring stage · differential output amplifier with driver stage · protection stage with threshold · switching off the correction during flyback · voltage stabilizer QUICK REFERENCE DATA Supply voltage (pin 1) Current consumption Total power dissipation Operating ambient temperature range Collector voltage drift external transistor PACKAGE OUTLINE 16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 19. VP IP Ptot Tamb VC typ. typ. typ. max. 12 17 600 0 to + 70 0,7 V mA mW °C V
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March 1986
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Philips Semiconductors
Product specification
East-West correction driver circuit
TDA1082
March 1986
3
Fig.1 Block diagram with external components (class-A operation). Also used as test circuit.
Philips Semiconductors
Product specification
East-West correction driver circuit
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 1) Output current (pin 15) Total power dissipation Storage temperature range Operating ambient temperature range Voltages with respect to ground (pin 2) Pins 1, 5, 7, 8, 9, 12, 13 and 16 Pins 3 and 4 Pins 10, 11 and 15 Currents Pins 3, 4 and 6 Pin 14 Pins 15 and 16 (-I15 and +I16) - 0 0 min. 0 0 0 VP -IO Ptot Tstg Tamb max. max. max.
TDA1082
16 50 600
V mA mW °C °C
-25 to + 150 0 to + 70
max. 16 - 5 V V V
5 1,5 50
mA mA mA
CHARACTERISTICS VP = 12 V (range 10,5 to 14 V); Tamb = 25 °C; measured in circuit Fig.1 with colour tube A66-500X; unless otherwise specified Supply Voltage range Voltage peak value Current range Current typical value Sawtooth signal (pin 10 or 11) Input voltage d.c. value Input resistance Correcting signals (pin 13) Input voltage d.c. value Input current Flyback keying (pin 3) Input current range Peak value, d = 5% Threshold (pin 14) Input voltage at I14 = 200 µA for switching off the driver stage Vi typ. 7,2 to 8 8,8 V V I3 I3 0,05 typ. to 5 20 mA mA V13 I13 typ. typ. 0,6 0,5 V mA Vi Ri typ. typ. < 2,5 5,6 7,0 V k k VP VPM IP IP 10,5 max. 11 typ. to to 14 15 30 17 V V mA mA
March 1986
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Philips Semiconductors
Product specification
East-West correction driver circuit
TDA1082
Output stage (pin 6) Generator current Flyback differential amplifier (pin 5) D.C. value output voltage Output resistance Squaring stage (pin 7) D.C. value output voltage Peak to peak value output voltage Output resistance Correction trapezoidal deformation (pins 9 and 12) D.C. voltage Output resistance Driver output (pin 15) Output current Drift of d.c. collector voltage Of external transistor in closed loop Tamb = 15 to 70 °C; VCO = 8 V VC typ. 0,7 V - I15 < 50 mA V9, 12 R9, 12 typ. typ. 5 7,5 V k V7 V7(p-p) R7 typ. typ. 5,6 typ. to 6 1,5 9,4 7,5 V V k k V5 R5 typ. typ. 6 5,6 V k I6 typ. 1 mA
March 1986
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Philips Semiconductors
Product specification
East-West correction driver circuit
TDA1082
March 1986
6
Fig.2 Application circuit E-W-correction (class-D operation).
Philips Semiconductors
Product specification
East-West correction driver circuit
PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA1082
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH w M (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
ISSUE DATE 92-10-02 95-01-19
March 1986
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Philips Semiconductors
Product specification
East-West correction driver circuit
SOLDERING Introduction
TDA1082
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
March 1986
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