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INTEGRATED CIRCUITS

DATA SHEET

TDA2555 TDA2557 Dual TV sound demodulator circuits
Product specification File under Integrated Circuits, IC02 March 1986

Philips Semiconductors

Product specification

Dual TV sound demodulator circuits
GENERAL DESCRIPTION

TDA2555 TDA2557

The circuits incorporate two FM demodulator systems to perform the demodulator functions required in a dual sound carrier TV system for demodulating the sound carriers. The difference between TDA2555 and TDA2557 is the number of stages of the limiting amplifier. Eight (TDA2555) or five (TDA2557) stage limiting amplifier Quadrature demodulator for FM detection De-emphasis stage Output amplifier Mute function for each FM demodulator QUICK REFERENCE DATA Supply voltage (pins 13 and 15) Supply current (pins 13 and 15) AF output voltage (pins 2 and 8) Total harmonic distortion (note 1) Signal to weighted noise ratio PACKAGE OUTLINE 18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 19. VP IP Vo(rms) THD (S + N)/N typ. typ. typ. < typ. 12 24,5 600 0,1 70 V mA mV % dB

March 1986

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Philips Semiconductors

Product specification

Dual TV sound demodulator circuits

TDA2555 TDA2557

Fig.1 Block diagram. TDA2555 with 8-stage limiting amplifier; TDA2557 with 5-stage limiting amplifier.

March 1986

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Philips Semiconductors

Product specification

Dual TV sound demodulator circuits
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pins 13 and 15) Total power dissipation Storage temperature range Operating ambient temperature VP Ptot Tstg Tamb max. max.

TDA2555 TDA2557

13,2 400

V mW C C

-40 to + 150 0 to + 70

March 1986

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Philips Semiconductors

Product specification

Dual TV sound demodulator circuits
CHARACTERISTICS VP = V13, 15-14 = 12 V; Tamb = 25 C; fIF1 = 5,5 MHz; fIF2 = 5,74 MHz; fm1 = 1 kHz; f = 30 kHz; Vi(rms) = 5 mV for TDA2555; Vi(rms) = 10 mV for TDA2557; see test circuit Fig.3, voltages with respect to ground (pin 14), unless otherwise specified. PARAMETER Total current consumption LIMITING AMPLIFIER Maximum input voltage Input voltage for start of limiting (3 dB AF signal reduction) TDA2555 TDA2557 DC voltage (input limiting amplifier) pins 11, 12, 16, 17 to 14 DC voltage (feedback loop) FM DEMODULATOR IF reference signal voltage DC voltage AF output voltage Difference of output signals V3-4(rms) V6-7(rms) V3,4,6,7-14 V2-14(rms) V 2 14 --------------V 8 14 THD AMS - - 450 - 200 3,1 600 0,1 - - 750 0,5 V10,18-14 - 2,0 - Vi - 2,0 - V11-12(rms) V16-17(rms) V11-12(rms) V16-17(rms) - - 50 250 100 500 V11-12(rms) V16-17(rms) - 200 - SYMBOL I13, 15 18 MIN. 24,5 TYP. 30 MAX.

TDA2555 TDA2557

UNIT mA

mV

V V

V

V

mV V mV dB

Total harmonic distortion at outputs AF1 and AF2 (note 1) A.M. suppression at outputs AF1 and AF2, fFM = 70 Hz; f = 50 kHz; fAM = 1 kHz; m = 0,3 Signal to noise ratio at outputs AF1 and AF2 (CCIR weighted, quasi peak) Residual IF-signal without de-emphasis Ripple rejection at outputs AF1 and AF2 f = 50 Hz to 20 kHz; Vi(rms) = 200 mV RR - 40 - dB V2,8-14(rms) - 30 - mV (S + N)/N 65 70 - dB 50 - - dB - - 0,5 %

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Philips Semiconductors

Product specification

Dual TV sound demodulator circuits

TDA2555 TDA2557
MIN. TYP. MAX. UNIT

PARAMETER AUDIO OUTPUT STAGE emitter follower with 1,0 mA bias current DC output voltage External DC load resistance AC output current (note 2) De-emphasis input resistance (note 3) DC voltage (de-emphasis) Crosstalk attenuation f = 1 kHz (note 4) Crosstalk attenuation f = 10 kHz (note 4) Output impedance AF output level (Fig.2, note 5) MUTE function Vi(rms) < 60 mV Switching input current V5-14 = 0 V V5-14 = VP Internal d.c. voltage no mute (pin 5 not connected) Notes to the characteristics

SYMBOL

V2,8-14 R2,8-14 -I2,8-14(p-p) R1,9-14 V1,9-14 12,21 12,21 R2,8-14

3,0 2 - 0,8 3,7 60 60 -

4,0 - - 1,0 4,7 - - 25

5,0 - 0,5 1,2 5,7 - - -

V k mA k V dB dB

60 - - -

- - - 6,2

- 500 500 -

dB A A V

-I5 I5 V5-14

1. THD < 0,1% requires a double tuned demodulator circuit (QL = 20). With a single tuned circuit a THD of < 0,5% is possible (see Fig.1 and Fig.3). 2. If higher a.c. output current is required an external resistor must be applied from output (pins 2 and 8) to ground (min. 2 k) in order to improve the THD performance (-I2,8 < 4 mA). 3. The de-emphasis time constant is 50 s. V 2 14 unmodulated 4. Crosstalk attenuation is defined as: o 12 = ------------------------------------------------------V 8 14 V 8 14 unmodulated o 21 = -------------------------------------------------------. V 2 14

5. In the MUTE state the a.f. output level attenuation is more than 60 dB. The MUTE function is only guaranteed for an r.m.s. value of the input voltage lower than 60 mV. See also Fig.2.

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Philips Semiconductors

Product specification

Dual TV sound demodulator circuits

TDA2555 TDA2557

Fig.2 Mute function.

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Philips Semiconductors

Product specification

Dual TV sound demodulator circuits

TDA2555 TDA2557

Fig.3 Test and application circuit.

March 1986

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Philips Semiconductors

Product specification

Dual TV sound demodulator circuits
PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil)

TDA2555 TDA2557

SOT102-1

D seating plane

ME

A2

A

L

A1

c Z e b1 b 18 10 b2 MH w M (e 1)

pin 1 index E

1

9

0

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.044 b1 0.53 0.38 0.021 0.015 b2 1.40 1.14 0.055 0.044 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION

ISSUE DATE 93-10-14 95-01-23

March 1986

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Philips Semiconductors

Product specification

Dual TV sound demodulator circuits
SOLDERING Introduction

TDA2555 TDA2557

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.

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