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2SJ550(L), 2SJ550(S)
Silicon P Channel MOS FET
REJ03G0897-0300 (Previous: ADE-208-633A) Rev.3.00 Sep 07, 2005

Description
High speed power switching

Features
· Low on-resistance RDS (on) = 0.075 typ. · Low drive current. · 4 V gate drive devices. · High speed switching.

Outline
RENESAS Package code: PRSS0004AE-A (Package name: LDPAK (L) )
4 4 1. Gate 2. Drain 3. Source 4. Drain

RENESAS Package code: PRSS0004AE-B (Package name: LDPAK (S)-(1) )
D

G 1 1 2 3 S 2 3

Rev.3.00 Sep 07, 2005 page 1 of 8

2SJ550(L), 2SJ550(S)

Absolute Maximum Ratings
(Ta = 25°C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel temperature Storage temperature Notes: 1. PW 10 µs, duty cycle 1% 2. Value at Tc = 25°C 3. Value at Tch = 25°C, Rg 50 Symbol VDSS VGSS ID ID (pulse) IDR
Note 1

Value ­60 ±20 ­15 ­60 ­15 ­15 19 50 150 ­55 to +150

Unit V V A A A A mJ W °C °C

IAP Note 3 EAR Pch Tch
Note 2

Note 3

Tstg

Electrical Characteristics
(Ta = 25°C)
Item Drain to source breakdown voltage Gate to source breakdown voltage Zero gate voltage drain current Gate to source leak current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note: 4. Pulse test Symbol V (BR) DSS V (BR) GSS IDSS IGSS VGS (off) RDS (on) RDS (on) |yfs| Ciss Coss Crss td (on) tr td (off) tf VDF trr Min ­60 ±20 -- -- ­1.0 -- -- 6.5 -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- 0.075 0.105 11 850 420 110 12 75 125 75 ­1.1 70 Max -- -- ­10 ±10 ­2.0 0.095 0.155 -- -- -- -- -- -- -- -- -- -- Unit V V µA µA V S pF pF pF ns ns ns ns V ns Test Conditions ID = ­10 mA, VGS = 0 IG = ±100 µA, VDS = 0 VDS = ­60 V, VGS = 0 VGS = ±16 V, VDS = 0 ID = ­1 mA, VDS = ­10 V Note 4 ID = ­8 A, VGS = ­10 V ID = ­8 A, VGS = ­4 V Note 4 ID = ­8 A, VDS = ­10 V VDS = ­10 V VGS = 0 f = 1 MHz VGS = ­10 V ID = ­8 A RL = 3.75 IF = ­15 A, VGS = 0 IF = ­15 A, VGS = 0 diF/dt = 50 A/µs
Note 4

Rev.3.00 Sep 07, 2005 page 2 of 8

2SJ550(L), 2SJ550(S)

Main Characteristics
Power vs. Temperature Derating
80 1000 300

Maximum Safe Operation Area

Pch (W)

ID (A)

60

100 30 10 3 1 0.3
PW

10 µs
0 µs 1 =1 m s 0m Op s( era 1s tio ho n( t) Tc Operation in =2 this area is 5° C) limited by RDS (on) 10

Channel Dissipation

Drain Current

40

DC

20

Ta = 25°C 0 0 50 100 150 200 0.1 0.1 0.3 1 3 10 30 100

Case Temperature

Tc (°C)

Drain to Source Voltage

VDS (V)

Typical Output Characteristics
­20 ­10 V ­6 V ­20 ­4 V Pulse Test ­3.5 V ­12

Typical Transfer Characteristics
VDS = ­10 V Pulse Test

ID (A)

­16

ID (A) Drain Current

­16

­12

Drain Current

­8

­3 V

­8 25°C ­4 Tc = 75°C ­25°C

­4 VGS = ­2.5 V 0 0 ­2 ­4 ­6 ­8 ­10

0

0

­1

­2

­3

­4

­5

Drain to Source Voltage

VDS (V)

Gate to Source Voltage

VGS (V)

Drain to Source Saturation Voltage VDS (on) (V)

Drain to Source Saturation Voltage vs. Gate to Source Voltage
­4.0 Pulse Test ­3.2

Static Drain to Source on State Resistance vs. Drain Current
Static Drain to Source on State Resistance RDS (on) ()
10 Pulse Test 3 1 0.3 VGS = ­4 V 0.1 0.03 0.01 ­0.1 ­0.3 ­10 V

­2.4

­1.6 ID = ­15 A ­0.8 ­10 A ­5 A 0 ­4 ­8 ­12 ­16 ­20

0

­1

­3

­10

­30

­100

Gate to Source Voltage

VGS (V)

Drain Current

ID (A)

Rev.3.00 Sep 07, 2005 page 3 of 8

2SJ550(L), 2SJ550(S)
Static Drain to Source on State Resistance vs. Temperature
Forward Transfer Admittance |yfs| (S) Static Drain to Source on State Resistance RDS (on) ()
0.40 Pulse Test 0.32 ­5 A 0.24 VGS = ­4 V ­10 A ID = ­15 A 100 30 Tc = ­25°C 10 3 75°C 1 0.3 0.1 ­0.1 25°C

Forward Transfer Admittance vs. Drain Current

0.16

0.08 ­10 V 0 ­40 0 40 ­5 A, ­10 A, ­15 A 80 120 160

VDS = ­10 V Pulse Test ­0.3 ­1 ­3 ­10 ­30 ­100

Case Temperature

Tc (°C)

Drain Current ID (A) Typical Capacitance vs. Drain to Source Voltage
10000 3000

Body-Drain Diode Reverse Recovery Time
500

Reverse Recovery Time trr (ns)

Capacitance C (pF)

200 100 50

1000 300 100

Ciss

Coss

20 10 5 ­0.1 ­0.2 di / dt = 50 A / µs VGS = 0, Ta = 25°C ­0.5 ­1 ­2 ­5 ­10 ­20

Crss 30 10 VGS = 0 f = 1 MHz 0 ­10 ­20 ­30 ­40 ­50

Reverse Drain Current

IDR (A)

Drain to Source Voltage VDS (V)

Dynamic Input Characteristics
VDS (V)
VDD = ­10 V ­25 V ­50 V

Switching Characteristics
VGS (V)
0 1000 500 VGS = ­10 V, VDD = ­30 V PW = 5 µs, duty 1 %

0

­20

­4

Drain to Source Voltage

Gate to Source Voltage

Switching Time t (ns)

­40 VDS ­60 VDD = ­50 V ­25 V ­10 V

VGS

­8

200 100 50 tr 20

td(off) tf

­12

­80 ID = ­15 A 0 8 16 24 32

­16

td(on) 10 ­0.1 ­0.2 ­0.5 ­1 ­2 ­5 ­10 ­20

­100

­20 40

Gate Charge

Qg (nc)

Drain Current

ID (A)

Rev.3.00 Sep 07, 2005 page 4 of 8

2SJ550(L), 2SJ550(S)
Reverse Drain Current vs. Source to Drain Voltage
­20

Maximum Avalanche Energy vs. Channel Temperature Derating

Repetitive Avalanche Energy EAR (mJ)

20 IAP = ­15 A VDD = ­25 V duty < 0.1 % Rg 50

Reverse Drain Current IDR (A)

­16 ­10 V ­5 V ­8 VGS = 0, 5 V

16

­12

12

8

­4 Pulse Test 0 0 ­0.4 ­0.8 ­1.2 ­1.6 ­2.0

4

0 25

50

75

100

125

150

Source to Drain Voltage

VSD (V)

Channel Temperature Tch (°C)

Normalized Transient Thermal Impedance vs. Pulse Width

Normalized Transient Thermal Impedance s (t)

3 Tc = 25°C 1 D=1 0.5 0.3

0.2

0.1
0.1
0.05

ch ­ c (t) = s (t) · ch ­ c ch ­ c = 2.5°C/W, Tc = 25°C PDM
pu lse

0.02
0.03
0.0
1s

D= PW T

PW T

1

t ho

0.01 10 µ

100 µ

1m

10 m

100 m

1

10

Pulse Width PW (S)

Avalanche Test Circuit

Avalanche Waveform 1 · L · IAP2 · 2 VDSS VDSS ­ VDD
V(BR)DSS IAP VDD ID VDS

VDS Monitor

L IAP Monitor

EAR =

Rg

D.U.T

Vin ­15 V

50 VDD

0

Rev.3.00 Sep 07, 2005 page 5 of 8

2SJ550(L), 2SJ550(S)
Switching Time Test Circuit
Vin Vin Monitor D.U.T. RL 90% Vin ­10 V 50 VDD = ­30 V Vout td(on) 10% tr td(off) 10% tf 90% 90% Vout Monitor 10%

Waveform

Rev.3.00 Sep 07, 2005 page 6 of 8

2SJ550(L), 2SJ550(S)

Package Dimensions
JEITA Package Code


RENESAS Code
PRSS0004AE-A

Package Name LDPAK(L) / LDPAK(L)V

MASS[Typ.] 1.40g

Unit: mm

(1.4)

4.44 ± 0.2 10.2 ± 0.3 1.3 ± 0.15

11.3 ± 0.5 0.3 10.0 + 0.5 ­

8.6 ± 0.3

1.3 ± 0.2 1.37 ± 0.2

0.76 ± 0.1 2.54 ± 0.5 2.54 ± 0.5

11.0 ± 0.5

0.2 0.86 + 0.1 ­

2.49 ± 0.2

0.4 ± 0.1

JEITA Package Code SC-83

RENESAS Code PRSS0004AE-B

Package Name LDPAK(S)-(1) / LDPAK(S)-(1)V

MASS[Typ.] 1.30g

Unit: mm

4.44 ± 0.2 10.2 ± 0.3

(1.4)

8.6 ± 0.3

+ 0.3 ­ 0.5

10.0

(1.5)

(1.5)

2.49 ± 0.2 0.2 0.1 + 0.1 ­

7.8 7.0

2.2

1.37 ± 0.2 1.3 ± 0.2 2.54 ± 0.5
0.3 3.0 + 0.5 ­
0.2 0.86 + 0.1 ­

0.4 ± 0.1

2.54 ± 0.5

Rev.3.00 Sep 07, 2005 page 7 of 8

1.7

1.3 ± 0.15

7.8 6.6

2SJ550(L), 2SJ550(S)

Ordering Information
Part Name 2SJ550L-E 2SJ550STL-E 500 pcs 1000 pcs Quantity Box (Sack) Taping Shipping Container

Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.

Rev.3.00 Sep 07, 2005 page 8 of 8

Sales Strategic Planning Div.
Keep safety first in your circuit designs!

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