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ORDER NO. KMF1105356CE
Multi-Function printer
Model No. KX-MB772CX-V1
(for Asia and Middle Near East)
© Panasonic System Networks Co., Ltd. 2011 Unauthorized copying and distribution is a violation of law.
KX-MB772CX-V1
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KX-MB772CX-V1
TABLE OF CONTENTS
PAGE 1 Safety Precautions----------------------------------------------- 6 1.1. For Service Technicians --------------------------------- 6 1.2. AC Caution -------------------------------------------------- 6 1.3. Personal Safety Precautions --------------------------- 7 1.3.1. Moving Sections of the Unit ------------------------ 7 1.3.2. Live Electrical Sections------------------------------ 7 1.4. Service Precautions--------------------------------------- 7 1.4.1. Precautions to Prevent Damage from Static Electricity---------------------------------------- 7 2 Warning -------------------------------------------------------------- 8 2.1. About Lead Free Solder (PbF: Pb free)-------------- 8 2.1.1. Suggested PbF Solder ------------------------------ 8 2.2. Discarding of P. C. Board-------------------------------- 9 2.3. Insulation Resistance Test ------------------------------ 9 2.4. Battery Caution--------------------------------------------- 9 2.5. Laser Beam And Fuser Unit Section ----------------10 2.6. Note for Repairing ----------------------------------------10 3 Specifications ----------------------------------------------------11 4 General/Introduction -------------------------------------------11 4.1. Optional Accessories ------------------------------------ 11 5 Features ------------------------------------------------------------12 5.1. General Features -----------------------------------------12 5.2. Hardware Requirements for Multi-Function Software ----------------------------------------------------12 6 Technical Descriptions ----------------------------------------13 6.1. Connection Diagram -------------------------------------13 6.2. GENERAL BLOCK DIAGRAM ------------------------14 6.3. MAIN BOARD SECTION -------------------------------16 6.3.1. Data Flow ----------------------------------------------16 6.3.2. RTC BACKUP CIRCUIT ---------------------------25 6.3.3. Modem Circuit Operation --------------------------26 6.3.4. TEL Line Section-------------------------------------27 6.4. NCU Section -----------------------------------------------29 6.4.1. General -------------------------------------------------29 6.4.2. EXT. TEL. Line Relay (RLY100)------------------29 6.4.3. Bell Detection Circuit--------------------------------29 6.4.4. Pulse Dial Circuit-------------------------------------29 6.4.5. Line Amplifier and Side Tone Circuit ------------29 6.4.6. Calling Line Identification Circuit (FSK) --------30 6.4.7. Calling Line Identification Circuit (DTMF)------30 6.4.8. Calling Line Identification Circuit (Western) ---30 6.4.9. Remote FAX Activation Circuit -------------------30 6.4.10. TAM Interface Circuit--------------------------------30 6.5. ITS (Integrated telephone System) and Monitor Section -------------------------------------------31 6.5.1. General -------------------------------------------------31 6.6. CIS Control Section --------------------------------------32 6.7. Motor Drive Section --------------------------------------33 6.7.1. Engine Motor Control Circuit----------------------33 6.7.2. Scanner Motor Drive Circuit-----------------------35 6.8. Timing chart and wave form of scanner motors -------------------------------------------------------38 6.8.1. Normal 1-2 phase excitation (half step) --------38 6.8.2. Flat torque 1-2 phase excitation (half step) ---39 6.8.3. W1-2 phase excitation (Quarter step) ----------40 6.8.4. Drive mode of FB and ADF motor ---------------41 6.9. FAN Motor Section ---------------------------------------42 6.9.1. General -------------------------------------------------42 PAGE 6.9.2. Circuit Diagram of FAN ---------------------------- 42 6.9.3. Fan Control ------------------------------------------- 42 6.9.4. Control table ------------------------------------------ 43 6.9.5. Waveform --------------------------------------------- 44 6.10. Solenoid Driver Section -------------------------------- 45 6.11. LSU (Laser Scanning Unit) Section ----------------- 46 6.12. Sensors and Switches Section ----------------------- 48 6.12.1. Drum Detection ------------------------------------- 49 6.12.2. Pickup Sensor---------------------------------------- 49 6.12.3. Exit Sensor-------------------------------------------- 50 6.12.4. Read Position Sensor ------------------------------ 50 6.12.5. Registration & Manual Paper Sensor ---------- 51 6.12.6. Print Timing Sensor--------------------------------- 51 6.12.7. Document Sensor ----------------------------------- 52 6.12.8. Top Cover Sensor ----------------------------------- 52 6.12.9. Toner Sensor.... "Toner Empty", "Toner Low", "Change Drum" ------------------------------ 53 6.12.10. Handset Hook Switch ------------------------------ 56 6.13. Operation Board Section ------------------------------- 56 6.14. LCD Section ----------------------------------------------- 57 6.15. HVPS (High Voltage Power Supply) Section------ 58 6.15.1. HVPS Specification --------------------------------- 58 6.15.2. CHG-BIAS (Charge BIAS)/GRID/ UNIT ------- 58 6.15.3. DEV DC BIAS UNIT -------------------------------- 59 6.15.4. DEV AC BIAS UNIT -------------------------------- 59 6.15.5. TRA (+) BIAS (Transfer (+) BIAS)/TRA (-) BIAS (Transfer (-) BIAS) UNIT ------------------- 59 6.16. Heat Lamp Control Circuit ----------------------------- 60 6.17. Main Board Power Supply Section ------------------ 66 6.17.1. 3.3V and 1.2V Power Supply--------------------- 66 6.17.2. 5V Power Supply ------------------------------------ 67 6.17.3. Block Diagram of each Power Supply --------- 67 6.18. Power Supply Board Section-------------------------- 69 6.19. Mechanical Operation----------------------------------- 70 6.19.1. Printing ------------------------------------------------- 70 6.19.2. Scanning (ADF)-------------------------------------- 71 Location of Controls and Components------------------ 72 7.1. Overview --------------------------------------------------- 72 7.1.1. Front view --------------------------------------------- 72 7.1.2. Rear view---------------------------------------------- 72 7.2. Control Panel---------------------------------------------- 73 Installation Instructions -------------------------------------- 74 8.1. Installation ------------------------------------------------- 74 8.1.1. OUTPUT TRAY -------------------------------------- 74 8.1.2. RECORDING PAPER ----------------------------- 75 8.1.3. Documents the Unit Can Send ------------------ 78 8.1.4. Rwplacing the Toner Cartridge and the Drum Unit --------------------------------------------- 79 8.1.5. Connecting to a computer------------------------- 83 8.1.6. Installing Multi-Function Station----------------- 83 8.2. Connections ----------------------------------------------- 85 Operating Instructions ---------------------------------------- 87 9.1. Your Logo ------------------------------------------------- 87 9.1.1. To Select Characters with the Dial Keypad --- 88 9.1.2. To Select Characters Using [] or [] -------------- 88 Test Mode---------------------------------------------------------- 89 10.1. Test Functions -------------------------------------------- 89 10.1.1. DTMF Single Tone Transmit Selection--------- 91
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KX-MB772CX-V1
11
12
13 14
10.1.2. Button Code Table ---------------------------------- 91 10.1.3. Print Test Pattern ------------------------------------ 92 Service Mode ----------------------------------------------------- 93 11.1. Programming and Lists --------------------------------- 93 11.1.1. Operation ---------------------------------------------- 93 11.1.2. Operation Flow--------------------------------------- 93 11.1.3. Service Function Table----------------------------- 94 11.1.4. Memory Clear Specification----------------------- 96 11.2. User Mode (The list below is an example of the SYSTEM SETUP LIST the unit prints out.) --- 97 11.3. Service Mode Settings (Example of a printed out list) ------------------------------------------------------ 98 11.4. HISTORY--------------------------------------------------- 99 11.4.1. Descriptions of The History Report ----------- 100 Troubleshooting Guide-------------------------------------- 102 12.1. User Recoverable Errors ----------------------------- 102 12.2. Remote Programming--------------------------------- 104 12.2.1. Entering the Remote Programming Mode and Changing Service Codes ------------------ 105 12.2.2. Program Mode Table ----------------------------- 106 12.3. Troubleshooting Details ------------------------------ 109 12.3.1. Outline------------------------------------------------ 109 12.3.2. Starting Troubleshooting------------------------- 109 12.3.3. Initialization ------------------------------------------110 12.3.4. Simple Check List ----------------------------------111 12.3.5. Simplified Troubleshooting Guide --------------112 12.3.6. CALL SERVICE Troubleshooting Guide------115 12.3.7. Print --------------------------------------------------- 122 12.3.8. Recording Paper Feed --------------------------- 128 12.3.9. ADF (Auto Document Feeder) Section ------ 134 12.3.10. An Abnormal Image Is Copied ----------------- 139 12.3.11. Communication Section ------------------------- 139 12.3.12. Special Service Journal Reports--------------- 144 12.3.13. Initializing Error ------------------------------------ 157 12.3.14. Analog Section and Monitor Section --------- 158 12.3.15. Operation Panel Section------------------------- 161 12.3.16. Sensor Section------------------------------------- 161 12.3.17. Motor Section--------------------------------------- 164 12.3.18. LSU Section ---------------------------------------- 168 12.3.19. CIS Control Section------------------------------- 169 12.3.20. High Voltage Value Check Point --------------- 171 12.3.21. High Voltage Section ----------------------------- 173 12.3.22. USB Section ---------------------------------------- 178 12.3.23. Main Board Section ------------------------------- 182 12.3.24. Power Supply Board Section ------------------- 185 12.4. DOCUMENT JAMS (AUTO DOCUMENT FEEDER)------------------------------------------------- 187 12.5. RECORDING PAPER JAM -------------------------- 189 12.5.1. When the recording paper has jammed inside of the unit ----------------------------------- 189 12.5.2. When the recording paper is not fed into the unit properly------------------------------------ 195 12.5.3. When the recording paper in the manual input tray is not fed into the unit properly---- 196 Service Fixture & Tools ------------------------------------- 197 Disassembly and Assembly Instructions ------------- 198 14.1. ADF Section --------------------------------------------- 199 14.2. Remove ADF Section (1) ---------------------------- 200 14.3. Remove ADF Section --------------------------------- 201 14.4. Remove Top Cover Section ------------------------- 202 14.5. Remove Scanner Glass Section ------------------- 203
14.6. Remove Operation Panel Section------------------ 204 14.7. Left Side Section---------------------------------------- 205 14.8. Remove Main Board ----------------------------------- 205 14.9. Remove Gear Chassis Section --------------------- 206 14.10. Remove Paper Feed Roller -------------------------- 207 14.11. Right Cover Section------------------------------------ 207 14.12. Remove Right Side Cover Section ----------------- 208 14.13. Lower Side Cabinet Section ------------------------- 209 14.14. Remove Right Cassette Guide---------------------- 210 14.15. Remove Pick Up Board ------------------------------- 210 14.16. Remove High Voltage Power Board --------------- 211 14.17. Remove Pick up Roller Unit-------------------------- 212 14.18. Remove Low Voltage Power Board ---------------- 213 14.19. Remove Fuser Unit------------------------------------- 214 14.20. Installation Position of The Lead-------------------- 215 14.20.1. Main Board Section ------------------------------- 215 14.20.2. Bottom Part Section ------------------------------- 216 14.20.3. Side Cabinet Section------------------------------ 217 14.20.4. High Voltage Power Supply Board Section-- 218 14.20.5. Low Voltage Power Supply Board Section -- 219 14.20.6. AC Inlet Section ------------------------------------ 220 14.20.7. Solenoid Lead Section---------------------------- 220 15 Maintenance----------------------------------------------------- 221 15.1. Maintenance Items and Component Locations - 221 15.1.1. Outline ------------------------------------------------ 221 15.1.2. Maintenance Check Items/Component Locations--------------------------------------------- 221 15.2. Maintenance --------------------------------------------- 223 15.2.1. Cleaning the White Plate and Glasses ------- 223 15.2.2. CLEANING THE DOCUMENT FEEDER ROLLERS-------------------------------------------- 227 15.3. Printing Operation Principle -------------------------- 228 15.3.1. Process Chart and Process BIAS ------------- 228 15.3.2. CHARGING ----------------------------------------- 228 15.3.3. Exposing --------------------------------------------- 229 15.3.4. Laser Scanning Unit Locations ----------------- 229 15.3.5. Developing and Transcription------------------- 230 15.3.6. Cleaning of Transfer Roller ---------------------- 231 15.3.7. Fixing-------------------------------------------------- 232 15.4. Terminal Guide of The ICs Transistors and Diodes ----------------------------------------------------- 233 15.4.1. Main Board ------------------------------------------ 233 15.4.2. Operation Board------------------------------------ 234 15.5. How to Replace the Flat Package IC -------------- 235 15.5.1. Preparation ------------------------------------------ 235 15.5.2. Flat Package IC Removal Procedure --------- 235 15.5.3. Flat Package IC Installation Procedure ------ 236 15.5.4. Bridge Modification Procedure ----------------- 236 15.6. Main Board Section ------------------------------------ 237 15.6.1. NG Example----------------------------------------- 238 15.7. Test Chart------------------------------------------------- 239 15.7.1. ITU-T No.1 Test Chart ---------------------------- 239 15.7.2. ITU-T No.2 Test Chart ---------------------------- 240 16 Schematic Diagram ------------------------------------------- 241 16.1. For Schematic Diagram ------------------------------- 241 16.2. Main Board ----------------------------------------------- 242 16.2.1. Main Board (1)-------------------------------------- 242 16.2.2. Main Board (2)-------------------------------------- 246 16.2.3. Main Board (3)-------------------------------------- 248 16.2.4. Main Board (4)-------------------------------------- 250 16.3. Operation Board ---------------------------------------- 252
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KX-MB772CX-V1
16.4. Sensor Board -------------------------------------------- 253 16.5. High Voltage Power Supply Board ----------------- 254 16.6. Low Voltage Power Supply Board------------------ 255 17 Printed Circuit Board----------------------------------------- 257 17.1. Main Board ----------------------------------------------- 257 17.1.1. Main Board: Component View------------------ 257 17.1.2. Main Board: Bottom View------------------------ 258 17.2. Operation Board ---------------------------------------- 259 17.2.1. Operation Board: Component View ----------- 259 17.2.2. Operation Board: Bottom View ----------------- 260 17.3. Sensor Board -------------------------------------------- 261 17.3.1. Toner Sensor Board------------------------------- 261 17.3.2. Fuser Board (Exit Sensor Board) -------------- 261 17.3.3. Pickup Sensor Board ----------------------------- 261 17.3.4. Registration Sensor Board ---------------------- 262 17.3.5. Varistor Sensor Board ---------------------------- 262 17.3.6. Flatbed Relay Board ------------------------------ 263 17.3.7. ADF Sensor Board -------------------------------- 263 17.3.8. Handset Relay Board ----------------------------- 263 17.4. High Voltage Power Supply Board ----------------- 264 17.4.1. High Voltage Power Supply Board: Component View----------------------------------- 264 17.4.2. High Voltage Power Supply Board: Bottom View --------------------------------------------------- 264 17.5. Low Voltage Power Supply Board------------------ 265 17.5.1. Low Voltage Power Supply Board: Component View----------------------------------- 265 17.5.2. Low Voltage Power Supply Board: Bottom View --------------------------------------------------- 265 18 Exploded View and Replacement Parts List --------- 266 18.1. Cabinet, Mechanical and Electrical Parts Location --------------------------------------------------- 266 18.1.1. Operation Panel Section ------------------------- 266 18.1.2. Top Cover Section --------------------------------- 267 18.1.3. ADF Section----------------------------------------- 268 18.1.4. Motor Section --------------------------------------- 269 18.1.5. Lower Cabinet Section --------------------------- 270 18.1.6. Upper Cabinet Section --------------------------- 271 18.1.7. Fuser Section --------------------------------------- 272 18.1.8. Lowerside Cabinet--------------------------------- 273 18.1.9. Gear Section (1) ----------------------------------- 274 18.1.10. Gear Section (2) ----------------------------------- 275 18.1.11. Cassette / Output Tray --------------------------- 276 18.1.12. Actual Size of Screws and Washer------------ 277 18.1.13. Accessories and Packing Materials ----------- 278 18.2. Replacement Parts List ------------------------------- 279 18.2.1. Cabinet and Electrical Parts -------------------- 279 18.2.2. Main Board ----------------------------------------- 282 18.2.3. Operation Board ----------------------------------- 287 18.2.4. Sensor Board Parts ------------------------------- 287 18.2.5. High Voltage Power Board ---------------------- 288 18.2.6. Low Voltage Power Board ----------------------- 288
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KX-MB772CX-V1
1 Safety Precautions
1. 2. 3. 4. 5. Before servicing, unplug the AC power cord to prevent an electric shock. When replacing parts, use only the manufacturer's recommended components. Check the condition of the power cord. Replace if wear or damage is evident. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent the customer from being exposed to shock hazards.
1.1.
For Service Technicians
· Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires, injury or electric shock, which can be caused by improper repair work. 1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced. 3. FASTON terminals shall be plugged straight in and unplugged straight out. · ICs and LSIs are vulnerable to static electricity. When repairing, the following precautions will help prevent recurring malfunctions. 1. Cover the plastic part's boxes with aluminum foil. 2. Ground the soldering irons. 3. Use a conductive mat on the worktable. 4. Do not touch the IC or LSI pins with bare fingers.
1.2.
AC Caution
For safety, before closing the lower cabinet, please make sure of the following precautions. 1. The earth lead is fixed with the screw. 2. The AC connector is connected properly.
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KX-MB772CX-V1
1.3.
1.3.1.
Personal Safety Precautions
Moving Sections of the Unit
Be careful not to let your hair, clothes, fingers, accessories, etc., become caught in any moving sections of the unit. The moving sections of the unit are the rollers and a gear. There is a separation roller and a document feed roller which are rotated by the document feed motor. A gear rotates the two rollers. Be careful not to touch them with your hands, especially when the unit is operating.
1.3.2.
Live Electrical Sections
All the electrical sections of the unit supplied with AC power by the AC power cord are live. Never disassemble the unit for service with the AC power supply plugged in. CAUTION: AC voltage is supplied to the primary side of the power supply unit. Therefore, always unplug the AC power cord before disassembling or service.
1.4.
1.4.1.
Service Precautions
Precautions to Prevent Damage from Static Electricity
Electrical charges accumulate on a person. For instance, clothes rubbing together can damage electric elements or change their electrical characteristics. In order to prevent static electricity, touch a metallic part that is grounded to release the static electricity. Never touch the electrical sections such as the power supply unit, etc.
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KX-MB772CX-V1
2 Warning
2.1. About Lead Free Solder (PbF: Pb free)
Note: In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead. We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver, (Ag), and Copper, (Cu). This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used. Caution · PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please be careful not to heat too long. · PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C). · If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible and be sure that any remaining is melted prior to applying the Pb solder. · When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See figure, below).
2.1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper, (Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
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KX-MB772CX-V1
2.2. 2.3.
Discarding of P. C. Board Insulation Resistance Test
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
1. Unplug the power cord and short the two prongs of the plug with a jumper wire. 2. Turn on the power switch. 3. Measure the resistance value with an ohmmeter between the jumpered AC plug and each exposed metal cabinet part (screw heads, control shafts, bottom frame, etc.). Note: Some exposed parts may be isolated from the chassis by design. These will read infinity. 4. If the measurement is outside the specified limits, there is a possibility of a shock hazard.
2.4.
Battery Caution
CAUTION Danger of explosion if the battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. Dispose used batteries according to the manufacturer's instructions: The lithium battery is a critical component (type No.CR2354). Please observe for the proper polarity and exact location when replacing it and the soldering the replacement litium battery in.
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KX-MB772CX-V1
2.5.
Laser Beam And Fuser Unit Section
· The printer of this unit utilizes a laser. Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. · The fuser unit is inside of the unit and gets hot. Do not touch it when removing the jammed paper or cleaning the lower glass.
2.6.
Note for Repairing
Caution Please inform users of the danger of data being lost at the time of repair. Data will be lost in the following situations. 1. When replacing the ROM ass'y. 2. When replacing the Main board ass'y. 3. When executing mode #550 or #710. There is a possibility of data loss in the following situations. 1. When removing a board. 2. When writing new software to ROM.
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KX-MB772CX-V1
3 Specifications
Applicable Lines: Document Size: Effective Scanning Width: Effective Printing Width: Multi-Function printer Public Switched Telephone Network Max.216 mm in width, Max.600 mm in length 208 mm A4: 202 mm Letter/ Legal: 208 mm Transmission Time*1: Approx. 4 s/page (ECM-MMR Memory transmission)*2 Scanning Density: Scanning resolution: Up to 600 × 1200 dpi (Optical) Up to 9600 × 9600 dpi (Interpolated) Copy resolution: Up to 600 × 600 dpi (Scanner Glass) Up to 600 × 300 dpi (Automatic Document Feeder) FAX resolution: Horizontal: 8 pels/mm Vertical: 3.85 lines/mm-STANDARD 7.7 lines/mm-FINE/PHOTO 15.4 lines/mm-SUPER FINE Photo resolution: 64-level Scanner Type: Color Contact Image Sensor Printer Type: Laser printer Data Compression System: Modified Huffman (MH), Modified READ (MR), Modified Modified READ (MMR) Modem Speed: 33,600 / 31,200 / 28,800 / 26,400 / 24,000 / 21,600 / 19,200 / 16,800 / 14,400 / 12,000 / 9,600 / 7,200 / 4,800 / 2,400 bps; Automatic Fallback Operating Environment: 10°C--32.5°C, 20--70% RH (Relative Humidity) Dimensions (H×W×D): Approx. height 305 mm x width 420 mm x depth 445 mm Mass (Weight): Approx. 13kg Power Consumption: Standby: Approx. 6.5 W Preheat: Approx. 65 W Copy: Approx. 320 W Maximum: Approx. 950 W (When the fuser lamp turns on) Power Supply: 220-240 V AC, 50/60 Hz Memory Capacity (for operation and32 MB storing memory): Fax Memory Capacity: 2 MB in total Approx. 170 pages of memory reception Approx. 150 pages of memory transmission (Based on the ITU-T No. 1 Test Chart in standard resolution.) *1 Transmission speed depends upon the contents of the pages, resolution, telephone line conditions and capability of the other party's machine. *2 Transmission speed is based upon the ITU-T No. 1 Test Chart. (Refer to ITU-T No.1 Test Chart (P.239).) If the capability of the other party's machine is inferior to your unit, the transmission time may be longer. Note: · Design and specifications are subject to change without notice. · The pictures and illustrations in these instructions may vary slightly from the actual product.
4 General/Introduction
4.1. Optional Accessories
Description Replacement toner cartridge Replacement drum unit Specifications 1 toner cartridge 1 drum unit
Model No. KX-FAT92A / KX-FAT92E KX-FAD93A / KX-FAD93E
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KX-MB772CX-V1
5 Features
5.1. General Features
Resolution: Standard/Fine/Super fine/Photo (64 level). STANDARD: For printed or typewritten originals with normalsized characters. FINE: For originals with small printing. SUPER FINE: For originals with very small printing. PHOTO: For originals containing photographs, shaded drawing, etc. Broadcast · 250-sheet paper capacity (60 g/m2 ~ 75 g/m2) Large Memory... Performed by DRAM Approx. 150 pages of memory transmission Approx. 170 pages of memory reception Enhanced Copier Function Multi-copy function (up to 99 copies) Enlargement and reduction 64-Level halftone General · Help function Display: 1. BASIC SETTINGS 2. FEATURE LIST 3. DIRECTORY 4. FAX RECEIVING 5. COPIER 6. REPORTS 7. CALLER ID · LCD (Liquid Crystal Display) readout Plain Paper Facsimile Machine Output tray (approx. 100+50 sheets) Output tray (approx. 150 sheets) Letter/A4/Legal G3 compatible Automatic document feeder (Up to 20 sheets) Quick scan
5.2.
Hardware Requirements for Multi-Function Software
To use Multi-Function Station on your computer, the following are required: Operating System: Windows 98 / Windows Me / Windows 2000 / Windows XP / Windows VistaTM operating system CPU: Windows 98: Pentium® 90 MHz or faster Windows Me: Pentium 150 MHz or faster Windows 2000: Pentium 166 MHz or faster Windows XP: Pentium 300 MHz or faster Windows Vista: Recent Processor (x86) 800 MHz or higher processor RAM: Windows 98: 24 MB (32 MB or more recommended) Windows Me: 32 MB (64 MB or more recommended) Windows 2000: 64 MB or more Windows XP: 128 MB or more Windows Vista: 512 MB or more Other Hardware: CD-ROM drive Hard disk drive with at least 150 MB of available space USB interface WARNING: · To assure continued emission limit compliance; - use only shielded USB cable. Note: · Be sure to use a Hi-Speed USB 2.0 certified cable if your computer is equipped with the Hi-Speed USB 2.0 interface. · USB cable is not supplied. Please purchase a shielded Type-A male/Type-B male USB cable.
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KX-MB772CX-V1
6 Technical Descriptions
6.1. Connection Diagram
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KX-MB772CX-V1
6.2.
GENERAL BLOCK DIAGRAM
MAIN UNIT SOC (IC300) This custom IC is used for general MFP operations.
1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) 14) CPU SDRAM Controller USB Controller with PHY Scanner I/F LSU I/F MOTOR I/F FAN I/F OPERATION PANEL I/F SENSOR I/F I/O PORT A/D, D/A converter RTC MODEM Analog Front End I/F ARM9 operating at 250MHz. Controls SDRAM Memory. Apply to USB2.0 HS Controls the CIS and AFE, and process the scan images. Controls the polygon motor and outputs the VIDEO signal to LSU. Controls the DC motor and Stepping Motor. Controls FAN MOTOR and detect the rotation of FAN MOTOR. Serial interface with Operation Panel. Detects the sensor signal. I/O Port Interface. Sends beep tones, etc. Convert the analog signal to the digital signal. Real time clock. Performs the modulation and the demodulation for FAX communication. Controls the DAA device for TEL/FAX function.
ROM (IC402) This 8MB FLASH ROM contains all of the program instructions on the unit operations. And support the backup of user setting and FAX receive data. SYNCHRONOUS DYNAMIC RAM (IC400) This 256Mbit SDRAM is used for CPU work and receiving memory and page memory. POWER SUPPLY DC-DC converters generate 3.3V and 1.2V for system power. Regurator generates 5V for peripheral devices. TEL/FAX I/F Composed of ITS circuit and NCU circuit. 3 ICs called SDAA(Silicon Direct Access Arrangement) control Telephone line, Speaker, and Handset. READ SECTION CIS Unit to read transmitted documents. CIS Unit is connected to FLATBED transit Unit. Scan data is converted by AFE(IC503). MOTOR This model has 1 DC motor and 2 stepping motors. IC300 drives the DC motor for printing. IC502 and IC700 drive the stepping motor for Auto Document Feeder motor and CIS carriage. LSU Forms the images on the OPC DRUM by rotating polygon motor and reflecting the laser beam against polygon. SENSORS Composed of 2 switches and 5 sensors. POWER SUPPLY BOARD Supplies +24V and +7V to the Main unit and controls the Heat Lamp. HIGH VOLTAGE POWER SUPPLY BOARD Supplies bias need for the printing operation: bias of the DRUM, Developing and Transcription. FIXING UNIT Composed heat lamp, thermistor and thermostats.
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MB2000 series System Schematic
Color CIS FFC 12 Carriage motor JST4 ADF motor Document Sensor AMP4 JST4 AMP4(Blue) RP Sensor
Flat Bed
Operation Panel Board
Ope G/A Thermistor (Room)
2Line LCD
FB Transit
AMP12
AMP8
Regist Solenoid AFE IC503
JST2
Main Board
Motor Driver (FB) IC502 Motor Driver (ADF) IC700
Varistor
JST2
Pick Up Solenoid SDRAM
(256Mbit)
FAN (left) IC402 IC400
JST3
(64Mbit)
FLASH
HVPS
AMP8
15
DC motor IC300
24V 3.3V/1.8V DC-DC
JST 8
Sirius Lite
Phy IC505
DAA block
EXT TEL JST8 TEL
Hand Set
AMP5 LAN USB AMP7 (Blue) Not used
LSU
AMP2 Speaker
AMP7
FAN (right)
AMP10 AMP4 JST3 AMP5 Pick Up Sensor EXIT Sensor 2 Thermistor (Heater)
Heater
Thermostat
SMPS
(PE)
Thermostat
: Harness for Primary : Harness for PE
AC INLET
SW
POWER SW
AMR SENSOR Toner Sensor
AMP4 Register Sensor PTOP Sensor
KX-MB772CX-V1
KX-MB772CX-V1
6.3.
6.3.1.
MAIN BOARD SECTION
Data Flow
1. An analog image data is output from CIS unit to IC503. IC503 decode the analog data to digital data, and output to IC300. Scanner I/F in IC300 process image data and store it in IC400 through SDRAM I/F. 2. CPU compress the data in IC400. 3. CPU transfer the data to MODEM and output it to TEL LINE through AFE IC and Analog DAA circuit.
[FAX Tx]
CI S unit FB tr ansit Board
CN61
CN59
Main Board
CN510
AFE
IC503
IC300
LSU
TEL LINE
CN100
Analog DAA
AFE
MODEM
CPU
Scanner I/F
Print I/F
IC400
PC Not used
IC750
CN750
SDRAM I/F
SDRAM
LAN
PHY
LAN I/F
USB I/F
JBIG
DSP
USB
[FAX Rx]
1. FAX data is input from TEL LINE to MODEM in IC300 through Analog DAA circuit and AFE IC. And then store it in IC400 through SDRAM I/F. CI S unit FB tr ansit Board
CN61
CN300
2. CPU decompress the data in IC400. 3. Print I/F retrieve the data from IC400 and output it to LSU.
CN59
Main Board
CN510
AFE
IC503
IC300
CN500
LSU
TEL LINE
CN100
Analog DAA
AFE
MODEM
CPU
Scanner I/F
Print I/F
IC400
PC Not used
IC750
SDRAM I/F
SDRAM
LAN
CN750
PHY
LAN I/F
USB I/F
JBIG
DSP
USB
CN300
16
CN500
KX-MB772CX-V1
[PC Scan]
CI S unit FB tr ansit Board
CN61
1. An analog image data is output from CISunit to IC503. IC503 decode the analog data to digital data, and output to IC300. Scanner I/F in IC300 process image data and store it in IC400 through SDRAM I/F. 2. If necessary, the data is compressed via DSP. 3. When you use the USB, the data is output to PC through the USB I/F.
CN59
Mai n Board
CN510
AFE
IC503
IC300
LSU
TEL LINE
CN100
Analog DAA
AFE
MODEM
CPU
Scanner I/F
Print I/F
IC400
PC Not used
IC750
SDRAM I/F
SDRAM
LAN
CN750
PHY
LAN I/F
USB I/F
JBIG
DSP
USB
[PC print]
CI S unit FB tr ansit Board
CN61
CN300
1.The print data is output from PC through USB and pass the USB I/F in IC300. then the data is stored in IC400 through SDRAM I/F. 2. Print I/F retrieve the data from IC400 and output it to LSU.
CN59
Main Board
CN510
AFE
IC503
IC300
CN500
LSU
TEL LINE
CN100
Analog DAA
AFE
MODEM
CPU
Scanner I/F
Print I/F
IC400
PC
Not used
IC750
SDRAM I/F
SDRAM
LAN
CN750
PHY
LAN I/F
USB I/F
JBIG
DSP
USB
CN300
17
CN500
KX-MB772CX-V1
[Copy]
CI S unit FB tr ansit Board
CN61
1. An analog image data is output from CISunit to IC503. IC503 decode the analog data to digital data, and output to IC300. Scanner I/F in IC300 process image data and store it in IC400 through SDRAM I/F. 2. If necessary, the data is compressed via JBIG. 3. Print I/F retrieve the data from IC400 and output it to LSU.
CN59
Main Board
CN510
AFE
IC503
IC300
LSU
TEL LINE
CN100
Analog DAA
AFE
MODEM
CPU
Scanner I/F
Print I/F
IC400
PC
Not used
IC750
SDRAM I/F
SDRAM
LAN
CN750
PHY
LAN I/F
USB I/F
JBIG
DSP
USB
CN300
18
CN500
KX-MB772CX-V1
Description of Pin Distribution (IC300) SOC (System On Chip)
PIN NO. A02 A03 A04 A05 A06 A07 A08 A09 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 AA01 AA02 AA03 AA04 AA23 AA24 AA25 AA26 AB01 AB02 AB03 AB04 AB23 AB24 AB25 AB26 AC01 AC02 AC03 AC04 AC05 AC06 AC07 AC08 AC09 AC10 AC11 AC12 AC13 AC14 AC15 AC16 AC17 AC18 AC19 AC20 AC21 AC22 AC23 AC24 AC25 PinName LEDONB NCCDON AFEMCLK NCCDCP CCDCLK PIO29 PIO57 PIO53 PIO50 PIO46 PIO42 NFRCE FRMD0 FRMD3 FRMD7 FRMA3 FRMA6 FRMA10 THRMAVDD FRMA11 FRMA15 FRMA17 FRMA20 FRMA22 SDMD8 SDMD9 SDMA7 SDMA6 VDD1.2 AFERST RING EXTINT SDMD10 SDMD11 SDMA5 VDD1.2 VSS BTXD BRXD AFECLK SDMD12 SDMD13 SDMA4 VSS VSS VDD1.2 TXD0 TX_ER RXD1 VDD3.3 TEST USBREXT VDD1.2 VDD3.3 USBXIN LSI_SCAN_ENABLE VDD1.2 NWDTRST LSI_TN PSCIO2 PSCIO6 VDD1.2 VSS ATXD BBITCLK I/O O O O O O O O O O O O O I/O I/O I/O O O O O O O O O I/O I/O O O O I I I/O I/O O O I O I/O I/O O O O I I I I I O I I O O I/O POWER SUPPLY VOLTAGE 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 1.2V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 1.2V GND 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND GND 1.2V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 1.2V 3.3V 3.3V 3.3V 1.2V 3.3V 3.3V 3.3V 3.3V 1.2V GND 3.3V 3.3V EXPLANATION SCANNER INTERFACE SCANNER INTERFACE SCANNER INTERFACE NOT USED NOT USED OPERATION PANEL INTERFACE CARRIAGE MOTOR INTERFACE CARRIAGE/ADF MOTOR INTERFACE CARRIAGE/ADF MOTOR INTERFACE FAN1 CONTROL DC MOTOR INTERFACE FLASH MEMORY CHIP SELECT FLASH MEMORY DATA BUS 0 FLASH MEMORY DATA BUS 3 FLASH MEMORY DATA BUS 7 FLASH MEMORY ADDRESS BUS 3 FLASH MEMORY ADDRESS BUS 6 FLASH MEMORY ADDRESS BUS 10 POWER SUPPLY FLASH MEMORY ADDRESS BUS 11 FLASH MEMORY ADDRESS BUS 15 FLASH MEMORY ADDRESS BUS 17 FLASH MEMORY ADDRESS BUS 20 FLASH MEMORY ADDRESS BUS 22 SDRAM DATA BUS 8 SDRAM DATA BUS 9 SDRAM ADDRESS BUS 7 SDRAM ADDRESS BUS 6 POWER SUPPLY NCU INTERFACE NCU INTERFACE NCU INTERFACE SDRAM DATA BUS 10 SDRAM DATA BUS 11 SDRAM ADDRESS BUS 5 POWER SUPPLY GND NCU INTERFACE NCU INTERFACE NCU INTERFACE SDRAM DATA BUS 12 SDRAM DATA BUS 13 SDRAM ADDRESS BUS 4 GND GND POWER SUPPLY ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE POWER SUPPLY NOT USED USB INTERFACE POWER SUPPLY POWER SUPPLY CRYSTAL(12MHz) INPUT NOT USED POWER SUPPLY WATCH DOG TIMER RESET OUTPUT NOT USED INPUT PORT (FANDET1) NOT USED POWER SUPPLY GND NCU INTERFACE NCU INTERFACE
19
KX-MB772CX-V1
PIN NO. AC26 AD01 AD02 AD03 AD04 AD05 AD06 AD07 AD08 AD09 AD10 AD11 AD12 AD13 AD14 AD15 AD16 AD17 AD18 AD19 AD20 AD21 AD22 AD23 AD24 AD25 AD26 AE01 AE02 AE03 AE04 AE05 AE06 AE07 AE08 AE09 AE10 AE11 AE12 AE13 AE14 AE15 AE16 AE17 AE18 AE19 AE20 AE21 AE22 AE23 AE24 AE25 AE26 AF02 AF03 AF04 AF05 AF06 AF07 AF08 AF09 AF10 AF11 AF12 AF13 AF14 AF15
PinName BSPCLK SDMD14 SDMD15 VSS NBATRST VDD2RTC CRS TXD1 RX_DV RXD2 RX_ER CLKSEL USBVSSA33_BIAS USBVSSA33 USBVDDA12_SQ USBVSSA12 LSI_TRSTN LSI_TDO NRST HTRCTL PSCIO3 PSCIO7 PSCIO15 NC VSS ASPCLK ARXD SDLDM1 VSS SYSPLLVSS1 RTCCLKOUT RTCPWRDWN TX_CLKI TXD2 RX_CLKI RXD3 MDC NC USBID USBDM USBVSSA12_SQ USBVDDA12PLL USBVDDA12 LSI_TDI LSI_PROCMON LSI_IDDT PSCIO1 PSCIO5 PSCIO13 MDMCLKOUT MDMPLLVDD VSS ABITCLK SYSPLLVDD1 VDD3.3OSC RTCCLKIN COL TX_EN TXD3 RXD0 MDIO MGTINT USBVBUS USBVDDA33_BIAS USBDP USBVDDA33 USBVSSA12PLL
I/O I/O I/O I/O I I O I I I I I O I O I O I I/O I O O I I O I I O O I/O I O I I O I O I/O I I O O I I/O I O I/O -
POWER SUPPLY VOLTAGE 3.3V 3.3V 3.3V GND 3.3V 1.2V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND GND 1.2V GND 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND 3.3V 3.3V 3.3V GND GND 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND 1.2V 1.2V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND
EXPLANATION NCU INTERFACE SDRAM DATA BUS 14 SDRAM DATA BUS 15 GND BATTERY RESET INPUT POWER SUPPLY ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE NOT USED GND GND POWER SUPPLY GND NOT USED NOT USED SYSTEM RESET INPUT HEATER CONTROL INPUT PORT (POUT) NOT USED INPUT PORT (RPS) NOT USED GND NCU INTERFACE NCU INTERFACE SDRAM DQML1 GND GND CRYSTAL(32.768KHz) OUTPUT RTC POWER DOWN ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE NOT USED NOT USED USB INTERFACE GND POWER SUPPLY POWER SUPPLY NOT USED NOT USED NOT USED INPUT PORT (PICK) NOT USED INPUT PORT (TNR) CRYSTAL(24.576MHz) OUTPUT POWER SUPPLY GND NCU INTERFACE POWER SUPPLY POWER SUPPLY CRYSTAL(32.768KHz) INPUT ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE ETHERNET INTERFACE USB INTERFACE POWER SUPPLY USB INTERFACE POWER SUPPLY GND
20
KX-MB772CX-V1
PIN NO. AF16 AF17 AF18 AF19 AF20 AF21 AF22 AF23 AF24 AF25 B01 B02 B03 B04 B05 B06 B07 B08 B09 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 C01 C02 C03 C04 C05 C06 C07 C08 C09 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 D01 D02 D03 D04 D05
PinName USBXOUT LSI_TMS LSI_TCK LSI_CW_TAP PSCIO0 PSCIO4 PSCIO12 PSCIO14 MDMCLKIN MDMPLLVSS AFEADC0 VSS LEDONG AFERSMP AFEVSMP NCCDRS PIO30 MMPWR PIO54 PIO51 PIO47 PIO43 NFROE FRMD1 FRMD4 FRMA0 FRMA4 FRMA7 THRMAVSS TONE FRMA12 FRMA16 FRMA19 FRMA21 VSS DOTPLLVSS AFEADC3 AFEADC1 VSS LEDONR OEB CCDSH PIO31 OPMPWR PIO55 PIO52 PIO49 PIO45 NFRWE FRMD2 FRMD6 FRMA2 FRMA5 FRMA9 THRMSTR0 TONEAVDD FRMA14 FRMA18 FRMA23 VSS DOTPLLVDD DOTCLKIN AFEADC5 AFEADC4 AFEADC2 VSS VSS
I/O I I I I I O I I I I O O O O I/O O O O O O O I/O I/O O O O O O O O O I I O O O O O O O O O O I/O I/O O O O I O O O I I I I -
POWER SUPPLY VOLTAGE 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND 3.3V GND 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND 3.3V 3.3V 3.3V 3.3V 3.3V GND GND 3.3V 3.3V GND 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND 3.3V 3.3V 3.3V 3.3V 3.3V GND GND
EXPLANATION CRYSTAL(12MHz) OUTPUT NOT USED NOT USED NOT USED INPUT PORT (REGIST) NOT USED INPUT PORT (POUT) INPUT PORT (DOCU) CRYSTAL(24.576MHz) INPUT GND NOT USED GND SCANNER INTERFACE NOT USED SCANNER INTERFACE SCANNER INTERFACE OPERATION PANEL INTERFACE NOT USED CARRIAGE/ADF MOTOR INTERFACE CARRIAGE/ADF MOTOR INTERFACE NOT USED DC MOTOR INTERFACE FLASH MEMORY CHIP OUTPUT ENABLE FLASH MEMORY DATA BUS 1 FLASH MEMORY DATA BUS 4 FLASH MEMORY ADDRESS BUS 0 FLASH MEMORY ADDRESS BUS 4 FLASH MEMORY ADDRESS BUS 7 GND ANALOG(TONE) OUTPUT FLASH MEMORY ADDRESS BUS 12 FLASH MEMORY ADDRESS BUS 16 FLASH MEMORY ADDRESS BUS 19 FLASH MEMORY ADDRESS BUS 21 GND GND NOT USED NOT USED GND SCANNER INTERFACE NOT USED SCANNER INTERFACE OPERATION PANEL INTERFACE NOT USED CARRIAGE/ADF MOTOR INTERFACE CARRIAGE/ADF MOTOR INTERFACE OUTPUT PORT(HSSPMUTE) DC MOTOR INTERFACE FLASH MEMORY CHIP WRITE ENABLE FLASH MEMORY DATA BUS 2 FLASH MEMORY DATA BUS 6 FLASH MEMORY ADDRESS BUS 2 FLASH MEMORY ADDRESS BUS 5 FLASH MEMORY ADDRESS BUS 9 ANALOG INPUT(THERMISTOR) POWER SUPPLY FLASH MEMORY ADDRESS BUS 14 FLASH MEMORY ADDRESS BUS 18 FLASH MEMORY ADDRESS BUS 23 GND POWER SUPPLY CRYSTAL(20MHz) INPUT SCANNER INTERFACE SCANNER INTERFACE NOT USED GND GND
21
KX-MB772CX-V1
PIN NO. D06 D07 D08 D09 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 E01 E02 E03 E04 E23 E24 E25 E26 F01 F02 F03 F04 F23 F24 F25 F26 G01 G02 G03 G04 G23 G24 G26 H01 H02 H03 H04 H23 H24 H25 H26 J01 J02 J03 J04 J23 J24 J25 J26 K01 K02 K03 K04 K23 K24 K25
PinName VDD1.2 PIO32 CRMPWR PIO56 VDD1.2 PIO48 PIO44 VDD3.3 VDD1.2 FRMD5 FRMA1 VDD3.3 FRMA8 THRMSTR1 TONEAVSS FRMA13 VDD1.2 VSS NC DOTCLKOUT PIO66 SDUDM0 AFEADC7 AFEADC6 VSS VDD1.2 FRMA24 PIO65 PIO64 SDMD16 SDMD17 AFESIFCLK VDD1.2 PIO24 PIO61 PIO60 PIO3 SDMD18 SDMD19 AFESIFDIN AFESIFEN PSCIO24 PIO2 PIO58 SDMD20 SDMD21 NSDCS2 AFESIFDOUT PIO63 PIO62 PIO28 PIO21 SDMD22 SDMD23 SDMA3 SDMA2 PIO6 PIO27 PIO5 PIO4 VSS SDCLK2 VSS VDD3.3 VDD1.2 PIO41 PIO40
I/O O O O O O I/O O O I O O O O I I O O O I/O I/O O I O O O I/O I/O I O I O O I/O I/O O O O O O O I/O I/O O O O O O O O O O
POWER SUPPLY VOLTAGE 1.2V 3.3V 3.3V 3.3V 1.2V 3.3V 3.3V 3.3V 1.2V 3.3V 3.3V 3.3V 3.3V 3.3V GND 3.3V 1.2V GND 3.3V 3.3V 3.3V 3.3V 3.3V GND 1.2V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 1.2V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND 3.3V GND 3.3V 1.2V 3.3V 3.3V
EXPLANATION POWER SUPPLY OPERATION PANEL INTERFACE MOTOR CURRENT CONTROL ADF MOTOR INTERFACE POWER SUPPLY NOT USED DC MOTOR INTERFACE POWER SUPPLY POWER SUPPLY FLASH MEMORY DATA BUS 5 FLASH MEMORY ADDRESS BUS 1 POWER SUPPLY FLASH MEMORY ADDRESS BUS 8 ANALOG INPUT(THERMISTOR) GND FLASH MEMORY ADDRESS BUS 13 POWER SUPPLY GND NOT USED CRYSTAL(20MHz) OUTPUT NOT USED SDRAM DQMU0 SCANNER INTERFACE SCANNER INTERFACE GND POWER SUPPLY FLASH MEMORY ADDRESS BUS 24 NOT USED NOT USED SDRAM DATA BUS 16 SDRAM DATA BUS 17 SCANNER INTERFACE POWER SUPPLY LSU INTERFACE OUTPUT PORT(SPMUTE) NOT USED LSU INTERFACE SDRAM DATA BUS 18 SDRAM DATA BUS 19 SCANNER INTERFACE SCANNER INTERFACE LSU INTERFACE LSU INTERFACE OUTPUT PORT(CIDRLY) SDRAM DATA BUS 20 SDRAM DATA BUS 21 SDRAM CHIP SELECT 2 SCANNER INTERFACE LSU INTERFACE LSU INTERFACE NOT USED LSU INTERFACE SDRAM DATA BUS 22 SDRAM DATA BUS 23 SDRAM ADDRESS BUS 3 SDRAM ADDRESS BUS 2 HIGH VOLTAGE UNIT INTERFACE NOT USED HIGH VOLTAGE UNIT INTERFACE HIGH VOLTAGE UNIT INTERFACE GND SDRAM CLOCK 2 GND POWER SUPPLY POWER SUPPLY NOT USED NOT USED
22
KX-MB772CX-V1
PIN NO. K26 L01 L02 L03 L04 L11 L12 L13 L14 L15 L16 L23 L24 L25 L26 M01 M02 M03 M04 M11 M12 M13 M14 M15 M16 M23 M24 M25 M26 N01 N02 N03 N04 N11 N12 N13 N14 N15 N16 N23 N24 N25 N26 P01 P02 P03 P04 P11 P12 P13 P14 P15 P16 P23 P24 P25 P26 R01 R02 R03 R04 R11 R12 R13 R14 R15 R16
PinName PIO39 SDMD24 SDMD25 SDMA1 SDMAÇO VSS VSS VSS VSS VSS VSS PIO37 PIO38 PIO36 PIO35 SDMD26 SDMD27 SDMA10 SDBA1 VSS VSS VSS VSS VSS VSS PIO33 PIO34 PIO26 PIO25 SDMD28 SDMD29 SDBA0 VDD1.2 VSS VSS VSS VSS VSS VSS VDD3.3 PIO23 PIO22 PIO20 SDMD30 SDMD31 NSDCS VDD3.3 VSS VSS VSS VSS VSS VSS VDD1.2 PIO16 PIO17 PIO18 SDUDM1 SDLDM0 BZVDD33 BZRST33 VSS VSS VSS VSS VSS VSS O I/O I/O O O I O O O I/O I/O O O O O O O I/O I/O O O O O I/O I/O O I I I O O -
I/O
POWER SUPPLY VOLTAGE 3.3V 3.3V 3.3V 3.3V 3.3V GND GND GND GND GND GND 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND GND GND GND GND GND 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 1.2V GND GND GND GND GND GND 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND GND GND GND GND GND 1.2V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND GND GND GND GND GND
EXPLANATION NOT USED SDRAM DATA BUS 24 SDRAM DATA BUS 25 SDRAM ADDRESS BUS 1 SDRAM ADDRESS BUS 0 GND GND GND GND GND GND INPUT PORT (RING) NOT USED NOT USED NOT USED SDRAM DATA BUS 26 SDRAM DATA BUS 27 SDRAM ADDRESS BUS 10 SDRAM BANK ADDRESS 1 GND GND GND GND GND GND NOT USED NOT USED NOT USED OUTPUT PORT(CNGMUTE) SDRAM DATA BUS 28 SDRAM DATA BUS 29 SDRAM BANK ADDRESS 0 POWER SUPPLY GND GND GND GND GND GND POWER SUPPLY NOT USED NOT USED NOT USED SDRAM DATA BUS 30 SDRAM DATA BUS 31 SDRAM CHIP SELECT 1 POWER SUPPLY GND GND GND GND GND GND POWER SUPPLY INPUT PORT INPUT PORT HIGH VOLTAGE UNIT INTERFACE SDRAM DQMU1 SDRAM DQML0 POWER SUPPLY POWER SUPPLY GND GND GND GND GND GND
23
KX-MB772CX-V1
PIN NO. R23 R24 R25 R26 T01 T02 T03 T04 T11 T12 T13 T14 T15 T16 T23 T24 T25 T26 U01 U02 U03 U04 U23 U24 U25 U26 V01 V02 V03 V04 V23 V24 V25 V26 W01 W02 W03 W04 W23 W24 W25 W26 Y01 Y02 Y03 Y04 Y23 Y24 Y25 Y26
PinName PIO13 PIO12 PIO14 PIO15 SDMD0 SDMD1 NSDCAS NSDRAS VSS VSS VSS VSS VSS VSS PIO9 PIO8 PIO10 PIO11 SDMD2 SDMD3 NSDWE VDD1.2 VDD3.3 PIO0 PIO1 PIO7 SDMD4 SDMD5 SDCKE SDMA12 PSCIO20 PSCIO21 PSCIO22 PSCIO23 SDMD6 SDMD7 SDMA11 SDMA9 PSCIO16 PSCIO17 PSCIO18 PSCIO19 VSS SDCLK SDMA8 VSS AFESEL0 AFESEL1 EXMDMCS DP
I/O O O O I I/O I/O O O O O O O I/O I/O O I O O I/O I/O O O I O O O I/O I/O O O O I I I O O I I O O
POWER SUPPLY VOLTAGE 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND GND GND GND GND GND 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 1.2V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V GND 3.3V 3.3V GND 3.3V 3.3V 3.3V 3.3V
EXPLANATION NOT USED NOT USED NOT USED INPUT PORT SDRAM DATA BUS 0 SDRAM DATA BUS 1 SDRAM CAS SDRAM RAS GND GND GND GND GND GND OUTPUT PORT(SNPICK) NOT USED NOT USED OUTPUT PORT(SNREG) SDRAM DATA BUS 2 SDRAM DATA BUS 3 SDRAM WRITE ENABLE POWER SUPPLY POWER SUPPLY INPUT PORT (HOOK) OUTPUT PORT(EXTRLY) NOT USED SDRAM DATA BUS 4 SDRAM DATA BUS 5 SDRAM CLOCK ENABLE SDRAM ADDRESS BUS 12 INPUT PORT (CIS HOME) NOT USED NOT USED NOT USED SDRAM DATA BUS 6 SDRAM DATA BUS 7 SDRAM ADDRESS BUS 11 SDRAM ADDRESS BUS 9 NOT USED INPUT PORT (FANDET2) INPUT PORT (TOPCVR) INPUT PORT (PSTART) GND SDRAM CLOCK 1 SDRAM ADDRESS BUS 8 GND NCU INTERFACE NCU INTERFACE NOT USED NCU INTERFACE
24
KX-MB772CX-V1
6.3.2.
RTC BACKUP CIRCUIT
1. Function This unit has a lithium battery (BAT300) which works for the Real Time Clock IC (RTC: inside IC300). The RTC continues to work, backed up by a lithium battery even when the power switch is OFF. 2. RTC Inside (IC300) Backup Circuit Operation When the power switch is turned ON, power is supplied to the RTC (inside IC300). At this time, the voltage at pin AF3 of the IC300 is +3.3V. When the power switch is turned OFF, the BAT300 supplies power to RTC through DA300. When the power switch is OFF and the voltage of +3.3V decreases, pin AF3 of RTC (IC300) becomes roughly the same voltage as the battery voltage. RTC goes into the backup mode, in which the power consumption is lower.
25
KX-MB772CX-V1
6.3.3.
Modem Circuit Operation
The modem (Included IC300) has all the hardware satisfying the CCITT standards mentioned previously. ALL processing is controlled by the SOC (IC300) according to CCITT procedures. This modem (Included IC300) has an automatic application equalizer. With training signal 1 or 2 at the time of G3 reception, it can automatically establish the optimum equalizer. Facsimile Transmission/DTMF Line Send The digital image data sent on ATXD line from modem (Included IC300). AFE IC (IC200) and Analog DAA*1 circuit to the telephone line. Facsimile Reception The analog image data which is received from the telephone line passes through Analog DAA circuit and enters AFE IC(IC200). The signals are changed to digital data in AFE IC and IC300. In this case, the image signals from the telephone line are transmitted serially. Here, the internal equalizer circuit reduces the image signals to a long-distance receiving level. This is designed to correct the characteristics of the frequency band centered around 3 kHz and maintain a constant receiving sensitivity. In this case, the image signals from the telephone line are transmitted serially. Here, the internal equalizer circuit reduces the image signals to a long-distance receiving level. This is designed to correct the characteristics of the frequency band centered around 3 kHz and maintain a constant receiving sensitivity. Busy/Dial Tone Detection The path is the same as Facsimile Reception. Call Tone Transmission This is the call signal which is generated the SOC (IC300) and sent to the speaker.
*1 DAA : Direct Access Arrangement
26
KX-MB772CX-V1
6.3.4. 6.3.4.1.
TEL Line Section Description of Block Diagram in Analog Section
Composed of ITS circuit and NCU circuit.
Function The analog section works as an interface between the telephone line. DAA control ITS circuit and NCU circuit. DAA control signals are output from Soc IC300. Circuit Operation [NCU]: Network Control Unit the NCU comprises of the following; DC loop forming circuit to connect with the telephone line; Switching circuit for other interconnected telephones; Bell detection circuit; Remote fax activation circuit. Refer to NCU Section (P.29) for the details.
27
6.3.4.2.
KX-MB772CX-V1
Block Diagram
28
KX-MB772CX-V1: MAIN BOARD BLOCK DIAGRAM
KX-MB772CX-V1
6.4.
6.4.1.
NCU Section
General
NCU is the with the telephone line. It is composed of Bell detection circuit, Pulse dial circuit, Line amplifier and sidetone circuits. The following is a brief explanation of each circuit.
6.4.2.
EXT. TEL. Line Relay (RLY100)
1. Circuit Operation Normally, this relay switches to the external telephone side and switches to the open side while OFF-HOOK. IC300 (U25) High LevelQ201 ONRLY100 (ON)
6.4.3.
Bell Detection Circuit
1. Circuit Operation The signal waveform for each point is indicated below. The signal (low level section) input to pin 10 of BBIC IC4 on the digital board. TEL LINE PC103 (1, 2 4) IC300 (L23)
6.4.4.
Pulse Dial Circuit
The pulse dial is generated by operating the transistor Q201 while OFF-HOOK (RLY100 ON) condition. Make state: IC300 (U25) High Level Q201 ON RLY100 ON Break state: IC300(U25) LOW Level Q201 OFF PC100 OFF
6.4.5.
Line Amplifier and Side Tone Circuit
1. Circuit Operation The reception signal output from the line transformer T100 is input to pin (2) of IC201 via C256, R224 and then the signal is amplified at pin (1) of IC201 and sent to the reception system at through the LPF.
29
KX-MB772CX-V1
6.4.6.
Calling Line Identification Circuit (FSK)
1. Function This unit is compatible with the Caller ID service offered by your local telephone company. To use this feature, you must subscribe to a Caller ID service. The data for the caller ID from the telephone exchange is sent during the interval between the first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an SK (Frequency Shift Keying) format. Data "0" is a 1200 Hz sine wave, and data 1 a 2200 Hz sine wave. There are two type of the message format which can be received: i.e.the single data message format and multiple data message format. The multiple data format allows to transmit the name and data code information in addition to the time and telephone number data. When there is multiple data in the unit, the name or telephone number are displayed. 2. Circuit Operation Same route as FSK Caller ID. Refer to Check Sheet for Signal Route of caller ID signal (P.158)
6.4.7.
Calling Line Identification Circuit (DTMF)
1. Function This unit is compatible with the Caller ID service offered by your local telephone company. To use this feature, you must subscribe to a Caller ID service. This data for the caller ID from the telephone exchange is sent before the first rings of the bell signal. The data from the telephone exchange is a DTMF signal. 2. Circuit Operation Refer to Check Sheet for Signal Route of caller ID signal (P.158)
6.4.8.
Calling Line Identification Circuit (Western)
1. Function This unit is compatible with the Caller ID service offered by your local telephone company. To use this feature, you must subscribe to a Caller ID service. The data for the caller ID from the telephone exchange is sent during the interval between the first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK (Frequency Shift Keying) format. Data "0" is a 1300 Hz sine wave, and data 1 a 2100 Hz sine wave. There are two type of the message format which can be received:i.e.the single data message format and multiple data message format. The multiple data format allows to transmit the name and data code information in addition to the time and telephone number data. When there is multiple data in the unit, the name or telephone number are displayed. 2. Circuit Operation Same route as FSK Caller ID. Refer to Check Sheet for Signal Route of caller ID signal (P.158)
6.4.9.
Remote FAX Activation Circuit
1. Function Another telephone connected to same line activates the unit to the FAX mode by using a DTMF signal. 2. Signal Path Refer to Check Sheet for Signal Route of CNG/DTMF/Caller ID detection (P.158)
6.4.10. TAM Interface Circuit
This circuit is to switch between FAX receiving and the external TAM's message recording automatically. For details, please refer to TAM Interface Section (P.31).
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6.5.
6.5.1.
ITS (Integrated telephone System) and Monitor Section
General
The general ITS operation is performed by IC203 which has a handset circuit. The alarm tone, the key tone, and the beep are output from Soc IC300.
6.5.1.1.
Telephone Monitor
1. Function This is the function when you are not holding the handset and can hear the caller's voice from the line. 2. Circuit Operation (Telephone Monitor Signal Path) Signals received from the telephone line are output through at the speaker via the following path. 3. Signal Path Refer to Check Sheet for Signal Route of MONITER RX (P.158).
6.5.1.2.
Monitor Circuit
1. Function This circuit monitors various tones, such as (1) DTMF tone, (2) Alarm/Beep/Key tone/Bell. 2. Signal Path a. DTMF MONITOR (Speaker Operation) Refer to Check Sheet for Signal Route of DTMF Monitor (Speaker) (P.158). (Handset Operation) Refer to Check Sheet for Signal Route of DTMF Monitor (Handset) (P.158). b. ALARM/BEEP/KEY TONE/BELL Refer to Check Sheet for Signal Route of Ringing/Alarm/Beep/Key tone (P.158).
6.5.1.3.
TAM Interface Section
1. Function When TAM is connected to this unit, the unit receives documents for FAX calls or the external TAM records a voice message automatically. 2. Circuit Operation The TAM INTERFACE circuit consists of Soc(IC300) to detect the other party CNG signal, and RLY100 to separate EXT.TAM. a. CNG signal detection circuit The CNG signal from the other party's FAX is detected in Soc IC300 (Signal path) Refer to Check Sheet for Signal Route of CNG/DTMF detection (P.158). b. Remote receiving This is the parallel-connected DTMF signal for the TEL or EXT.TEL mode between T and R. When the other party is a FAX, the unit switches to FAX receiving. (Signal Path) Refer to Check Sheet for Signal Route of DTMF detection (ON-Hook) (P.158).
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6.6.
CIS Control Section
The scanning block of this device consists of a control circuit and a CIS (contact image sensor), and AFE(Analog Front End) include A/D Converter.
When an original document is inserted and the start button pressed, pin A3 of IC300 goes to a low level and the transistor Q518 turns on. This applies voltage to the CIS. The CIS is driven by each of the CCDSH, CCDCLK signals output from IC300, and the original image illuminated by the LED to output an analog image signal. The analog image signal is input to the AFE on VINP(20pin of IC503) and converted into 16-bit data by the A/D converter inside IC503. Then this signal undergoes digital processing in order to obtain a high-quality image.
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6.7.
6.7.1.
Motor Drive Section
Engine Motor Control Circuit
1. Functions All driving forces of printer engine part are supplied by this engine motor. Engine motor is controlled so as to rotate at constant speed during printing and copying. 2. Motor operation In order to start the motor rotation, following 3 signals are supplied from IC300. 1. SS signal (Output pin: Pin B12/Output Signal: "H") When this signal is inverted by transistor Q502 and becomes "L", motor recognize this signal as "start" signal. 2. Clock signal (Output pin: Pin A12/Output Signal: Pulse) Pulse frequency :approx. 2.2KHz (at normal printing speed) Pulse frequency :approx. 1.1KHz.(at half printing speed) This signal is also inverted by transistor Q525, and supplied to motor as "clock" signal. 3. Brake signal (Output pin: Pin C12/Output Signal: "H") When this signal is inverted by transistor Q526 and becomes "L", motor recognize this signal as "brake off" signal. When motor reaches constant speed, "L" signal is supplied from motor to IC300 pin D12 as "Lock detect (LD)" signal. If "LD" signal does not becomes "L" within predetermined period after "SS" signal becomes "H", or if "LD" signal becomes "H" during rotation, it is judged that motor Error occurred. Timing Chart of Start operation
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In order to stop the motor rotation, following 2 signals are supplied from IC300. 1. SS signal (Output pin: Pin B12/Output Signal: "L") When this signal is inverted by transistor Q502 and becomes "H", motor recognize this signal as "stop" signal. 2. Brake signal (Output pin: Pin C12/Output Signal: "L") When this signal is inverted by transistor Q526 and becomes "H", motor recognize this signal as "brake on" signal. Timing Chart of Stop operation
6.7.1.1.
Engine Motor Drive Circuit
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6.7.2.
Scanner Motor Drive Circuit
1. General Scanner motor drive circuit consists of "Motor driver", "Motor current control circuit", "O.C.P (Over Current Protection) circuit" and "Relay drive circuit (ADF equipped model only)" One motor driver IC controls both FB (Flat Bed) and ADF (Auto Document Feeder/ADF equipped model only) motors. Outputs of motor driver are alternatively selected by the relay circuit. (1) FB Motor This motor feeds CIS unit in FB scan, FB copy, and FB FAX mode. A one step rotation of this motor feeds CIS unit 0.021mm. (2) ADF Motor (ADF equipped model only) This motor feeds documents which are set to ADF in ADF scan, ADF copy, and ADF FAX mode. A one step rotation of this motor feeds document 0.042mm. 2. Block Diagram of Scanner motor Drive circuit
6.7.2.1.
Motor driver
Motor driver IC502 can drive motors up to 0.8A/phase and support up to W1-2 phase excitation. When "Power save" signal (IC502_pin20) becomes "H", motor driver is activated. Stepping pulses are output from IC300 pins A9, B9, C9, A10, B10, and C10. Frequency and pattern of these pulses determine the motor rotation speed and excitation mode respectively. Corresponding to these pulses, current are supplied from IC502_pin4, pin6, pin7 and pin9 to each motor coil.
6.7.2.2.
Motor current control circuit
1. Function According to the scan speed, motor current is controlled for appropriate value. For example, when scan speed is low, motor has enough driving force. So to prevent the vibration and noise during motor rotation, motor drive current should be reduced. When scan speed is high, motor needs much driving force. so much current should be supplied. In order to control the motor current, Vref voltage of IC502 is controlled. When Vref voltage is high, motor current is increased, and the voltage is low, motor current is reduced. 2. Circuit Diagram Please refer to the circuit diagram shown in the block diagram of Scanner Motor Drive Circuit (P.35). 3. Circuit explanation For the sake of Vref voltage control, PWM pulse is supplied from IC300_pinD8. PWM pulse is integrated by R538, R539 and C509, then converted to DC voltage. This DC voltage is supplied to Vref pin of IC502. When duty of PWM pulse is high, Vref voltage is increased and when duty is low, Vref voltage is decreased.
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4. Timing chart of current control Following timing charts are the example of Vref voltage corresponding to PWM pulse duty
6.7.2.3.
O.C.P (Over Current Protection) circuit
1. Function If motor driver can supply more than 15 watts, FB and ADF motors may become fire hazards. To prevent the risk of fire, this circuit is provided. 2. Circuit Diagram
3. Circuit explanation When the current supplied from 24V exceeds 0.44A, the voltage between two registers R572 and R575 becomes more than 0.6V (=0.44A*2.7ohm/2), consequently both Q603 and Q602 turn on. If Q602 turns on, IC502_pin20 becomes "Low" level. As a result IC502 is deactivated and motor currents are cut off. So the current which IC502 can supply is limited to less than 0.44A and the wattage is also limited to less than 10.7W (=0.44A*24V). By limiting the wattage less than 15W, risk of fire hazard is eliminated.
6.7.2.4.
Relay Drive circuit (ADF equipped model only)
1. Function A relay is used to select which motor's currents should be supplied from IC502. When relay is off, FB motor is selected, and when relay is on, ADF motor is selected. 2. Circuit diagram Please refer to the circuit diagram shown in the block diagram of section 6.7.2. 3. Circuit explanation When IC300_pinD9 is "L", since Q700 is turned off, the relay RL700 is not activated (FB motor is selected). On the other hand, when IC300_pinD9 is "H", since Q700 is turned on, the relay RLY700 is activated (ADF motor is selected). R710 is provided to reduce the current of Relay coil, and D700 is provided to prevent the damage of Q700 from reverse voltage which is generated by Relay coil. Relay should be switched during motor stop condition, because reveres voltage which is generated during motor rotation may cause damage to IC502. To prevent the damage caused by accidental switching of relay during motor rotation, D701 is provided.
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6.7.2.5.
FB (Flat Bed) motor drive circuit
1. General FB (Flat Bed) motor drive circuit consists of "Motor driver", "Motor current control circuit", and "O.C.P (Over Current Protection) circuit". FB motor feeds CIS unit in FB scan, FB copy, and FB FAX mode. A one step rotation of this motor feeds CIS unit 0.021mm 2. Block Diagram of FB motor Drive circuit
3. Circuit Explanation For detail circuit explanation of each block, please refer to following sections. Motor driver: Motor driver (P.35) Motor current control: Motor current control circuit (P.35) O.C.P: O.C.P (Over Current Protection) circuit (P.36)
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6.8.
6.8.1.
Timing chart and wave form of scanner motors
Normal 1-2 phase excitation (half step)
Control sequence and waveform of both FB and ADF motor are almost same.
1. Timing chart
2. Wave form
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6.8.2.
Flat torque 1-2 phase excitation (half step)
1. Timing chart
2. Wave form
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6.8.3.
W1-2 phase excitation (Quarter step)
1. Timing chart
2. Wave form
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6.8.4.
Drive mode of FB and ADF motor
Correspondent table of operation
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6.9.
6.9.1.
FAN Motor Section
General
This unit is equipped with two FAN motors to prevent the developing devices, Power Supply Unit (PSU) and other devices from overheating during printing. The FAN rotates at high speed (Approx. 3000rpm) while printing. After printing is finished, FAN rotates at low speed (Approx.2200rpm) while predetermined period.
6.9.2.
Circuit Diagram of FAN
Two FAN motors are controlled