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USB AUDIO INTERFACE
SERVICE MANUAL
CONTENTS
SPECIFICATIONS .................................................3
DIMENSIONAL DIAGRAM ........................................3
PANEL LAYOUT ......................................4
CIRCUIT BOARD LAYOUT .................5
DISASSEMBLY PROCEDURE ..............................6
LSI PIN DESCRIPTION ...............................8
IC BLOCK DIAGRAM ....................................9
CIRCUIT BOARDS .......................................10
.......................................................12/15
......................................18/23
..................................................28/31
PARTS LIST
BLOCK DIAGRAM
CIRCUIT DIAGRAM
SY 011918
20080801 HAMAMATSU, JAPAN
Copyright (c) Yamaha Corporation. All rights reserved. PDF & '08.07
AUDIOGRAM3
IMPORTANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed that basic
service procedures inherent to the industry, and more specifically Yamaha Products, are already known and understood by the users,
and have therefore not been restated.
WARNING : Failure to follow appropriate service and safety procedures when servicing this product may result in personal injury,
destruction of expensive components and failure of the product to perform as specified. For these reasons, we advise
all Yamaha product owners that all service required should be performed by an authorized Yamaha Retailer or the
appointed service representative.
IMPORTANT : This presentation or sale of this manual to any individual or firm does not constitute authorization certification,
recognition of any applicable technical capabilities, or establish a principal-agent relationship of any form.
The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and service
departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable and changes in
specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to exist, please contact the
distributor's Service Division.
WARNING : Static discharges can destroy expensive components. Discharge any static electricity your body may have accumulated
by grounding yourself to the ground bus in the unit (heavy gauge black wires connect to this bus.)
IMPORTANT : Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power to the unit.
WARNING: This product contains chemicals known to the State of California to cause cancer, or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHAT SO EVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose eyes to solder/
flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling food.
WARNING
Components having special characteristics are marked and must be replaced with parts having specification equal to those
originally installed.
MIC/INST jacks (XLR-type) are wired as follows (IEC60268 standard):
pin 1: ground, pin 2: hot (+), and pin 3: cold (-).
2 1
3
2
AUDIOGRAM3
SPECIFICATIONS
General Specifications
Jacks MIC/INST Input Jack x 1 Combo jack (Mic/HiZ)
LINE Input Jacks (L, R) x 1 Phone jacks
x 1 RCA pin jacks
PHONES Jack x 1 Phone jack
STEREO OUT Jacks (L, R) x 1 Phone jacks
x 1 RCA pin jacks
USB Connector x 1 USB 1.1 44.1/48 kHz, 16 bit
Controls MIC/INST Switch x 1 MIC: for microphones
INST (Hi-Z): for guitars, etc.
LEVEL Control x 2 Adjust the level of CH 1, 2
PHANTOM +48V Switch x 1 48 V, only for CH1
OUT LEVEL Control x 1 Adjusts the overall signal
Indicators Phantom Power x 1 Red
Level Indicators x 1 2 points (green, red)
Power x 1 Green
Power Supply USB bus-powered
Dimensions (W x H x D) 180 x 61 x 112 mm
Net Weight 490 g
Included Accessories Cubase AI 4 DVD-ROM
USB cable
Owner's Manual
DIMENSIONAL DIAGRAM
W: 180 H: 61
52 2
108 D: 112
36
Unit: mm
3
AUDIOGRAM3
PANEL LAYOUT
· Control Panel
· Control panel
q PHANTOM +48V Switch/Indicator q
w MIC/INST Switch w
e LEVEL Controls e
r POWER Indicator r
t Level Indicators t
y OUT LEVEL Control y
u USB Connector u
· Rear Panel
· Rear panel
i MIC/INST Input Jack i
o LINE Input Jacks o
!0 STEREO OUT Jacks !0
!1 PHONES Jack !1
4
AUDIOGRAM3
CIRCUIT BOARD LAYOUT
MIX3
BOTTOM CASE PRINTED
JACK3
BOTTOM CASE PRINTED
PS-USB ASSEMBLY
· PS-USB ASSEMBLY
PSUSB
SHIELD PS-USB
5
AUDIOGRAM3
DISASSEMBLY PROCEDURE
Precautions
During assembly, pay attention that connectors, cables or the like are not pinched by circuit boards, frames, etc.
1. Top Cover Assembly
(Time required: About 1 minute)
1-1 Remove the four (4) screws marked [140]. The top
cover assembly can then be removed. (Fig. 1)
2. MIX3 Circuit Board
(Time required: About 2 minutes)
2-1 Remove the top cover assembly. (See procedure 1.)
2-2 Remove the screw marked [120]. The MIX3 circuit
board can then be removed. (Fig. 2)
2-3 Pull out the three (3) volume knobs marked [100] and
two (2) push buttons marked [110] from the MIX3 cir-
cuit board. (Fig. 2)
* The volume knobs and push buttons are not compo-
nents of the MIX3 circuit board.
When replacing the MIX3 circuit board, remove the
volume knobs and push buttons and install them on
the new MIX3 circuit board.
< Bottom view >
[140] x2 [110] x2
[140]
x2 [100]
[120]
[100] [100]
MIX3
TOP COVER ASSEMBLY BOTTOM CASE
[140]: BIND HEAD TAPPING SCREW [120]: BIND HEAD B-TIGHT SCREW
3.0X12 MFZN2W3 (WE98740R) 3.0X8 MFZN2W3 (WE774300)
Fig. 1 Fig. 2
6
AUDIOGRAM3
3. PSUSB Circuit Board
(Time required: About 6 minutes)
3-1 Remove the top cover assembly. (See procedure 1.)
3-2 Remove the MIX3 circuit board. (See procedure 2.)
3-3 Remove the two (2) screws marked [80]. The inner
chassis on which the JACK3 circuit board and PS-USB
assembly are installed can then be removed. (Fig. 3)
3-4 Remove the two (2) screws marked [60]. The
can then be removed. (Fig. 4)
3-5 Unsolder the four (4) hooks [A] from the PSUSB cir-
cuit board and turn the hooks until they are in the same
direction as the notches on the circuit board to separate
the PSUSB circuit board and shield PS-USB. (Photo 1)
4. JACK3 Circuit Board
(Time required: About 5 minutes)
4-1 Remove the top cover assembly. (See procedure 1.)
4-2 Remove the MIX3 circuit board. (See procedure 2.)
4-3 Remove the PS-USB assembly.
(See procedures 3-3 and 3-4.)
4-4 Remove the five (5) each hexagonal nuts marked [B] and
washers marked [C], remove the four (4) screws marked
[30] and remove the JACK3 circuit board. (Fig. 4) Hooks (Soldering)
PSUSB
INNER CHASSIS JACK3
PS-USB ASSEMBLY SHIELD PS-USB [A]
Hooks (Soldering)
[80] x2
Photo 1
PS-USB ASSEMBLY
[30] x3
[B] x2
[C] x2 [B] x2
BOTTOM CASE
[30]
[80]: BIND HEAD B-TIGHT SCREW [C] x2
3.0X8 MFZN2W3 (WE774300)
Fig. 3 [B]
[C]
[60] x2
JACK3 INNER CHASSIS
[30]: BIND HEAD B-TIGHT SCREW
3.0X8 MFZN2W3 (WE774300)
[60]: BIND HEAD B-TIGHT SCREW
3.0X8 MFZN2W3 (WE774300)
Fig. 4
7
AUDIOGRAM3
LSI PIN DESCRIPTION LSI
PCM2904DBR (X9570A00) STEREO AUDIO CODEC WITH USB INTERFACE PSUSB: IC102
PIN PIN
NAME I/O FUNCTION NAME I/O FUNCTION
NO. NO.
1 D+ I/O USB differential input/output plus 15 VOUTR O DAC analog output for R-channnel
2 D- I/O USB differential input/output minus 16 VOUTL O DAC analog output for L-channnel
3 VBUS - Connect to USB power (VBUS) 17 VCCP1I - Internal analog power supply for PLL
4 DGNDU - Digital ground for USB transceiver 18 AGNDP - Analog ground for PLL
5 HID0 I HID key state input (mute), active high 19 VCCP2I - Internal analog power supply for PLL
6 HID1 I HID key state input (volume up), active high 20 XTO O Crystal oscillator output
7 HID2 I HID key state input (volume down), active high 21 XTI I Crystal oscillator input
8 SEL0 I 22 AGNDX - Analog ground for oscillator
9 SEL1 I Must be set to high 23 VCCXI - Internal analog power supply for oscillator
10 VCCCI - Internal analog power supply for codec 24 TEST0 I Test pin, must be connected to GND
11 AGNDC - Analog ground for codec 25 TEST1 O Test pin, must be left open
12 VINL I ADC analog input for L-channnel 26 DGND - Digital ground
13 VINR I ADC analog input for R-channnel 27 VDDI - Internal digital power supply
14 VCOM - Common for ADC/DAC (VCCCI /2) 28 SSPND O Suspend flag, active low (Low: suspend,
Hihg: operational)
8
AUDIOGRAM3
IC BLOCK DIAGRAM IC
BA10339F-E2 (X6266A0R) NJM2374AM-TE1 (X9482A00)
MIX3: IC402 PSUSB: IC401, IC501, IC601
Ground Sense Comparator PWM DC/DC Converter
Cs 1 8 CD
OUT2 1 14 OUT3 Cs 1 8 CD Q S
PWM
1.5A Logic
OUT1 2 13 OUT4 Es 2 7 SI R
3 CT 3 6 V+ 160
Vcc 12 VEE
+ - Es 2 7 SI
-IN1 4 - + 11 +IN4 GND 4 5 IN+
Vth=300mV
Maximum
+IN1 5 10 -IN4 ON duty 9.1
OSC BLOCK
-IN2 6 + - 9 +IN3 Ipk Sense
- +
CT 3 6 V+
+IN2 7 8 -IN3
PWM COMP
Vref
1.25V
2%
GND 4 ERR. AMP 5 IN+
BD2056AFJ-E2 (X9691A00) BA4560RF-E2 (X6897A00)
PSUSB: IC301 MIX3: IC301, IC302, IC401
USB High Side Switch Dual Operational Amplifier
EN1 3
GND 1 8 /OC1 8 /OC1 Output 1 1 +V 8 VCC
Gate
Logic1 -Input 1 Output 2
IN 2 7 OUT1 2 7
- +
Charge
EN1 3 6 OUT2 OCD1 TSD1 +Input 1 3 6 -Input 2
pump1 + -
EN2 4 5 /OC2 VEE 4 -V 5 +Input 2
SW1
IN 2 7 OUT1
UVLO
6 OUT2
EN2 4 SW2
Charge
OCD2 pump2 TSD2
5 /OC2
Gate
Logic2
GND 1
NJM072BM-E-TE1 (X4543A01) NJM2068MD-TE2 (X3505A00) NJM4580L (XF195A00)
MIX3: IC101 MIX3: IC201 MIX3: IC303
Dual Operational Amplifier PSUSB: IC201, IC202 Dual Operational Amplifier
Dual Operational Amplifier
+DC Voltage
+
+
A Output 1 +V 8 V+ Output A 1 +V 8
A B
Supply
Inverting - -
A -Input 2 7 B Output 2 7 Output B
- + Input A - +
Non-Inverting Inverting 1 2 3 4 5 6 7 8
A +Input 3 6 B -Input 3
+ -
6
+ - Input A Input B
OUT -IN +IN -V +IN -IN OUT +V
Non-Inverting
V- 4 5 B +Input -DC Voltage Supply 4 -V 5 A A A B B B
Input B
9
AUDIOGRAM3
CIRCUIT BOARDS
JACK3 Circuit Board (X9390D0) .............................................................. 11
MIX3 Circuit Board (X9390D0) ................................................................. 10
PSUSB Circuit Board (X9388C0) ............................................................. 11
Note: See parts list for details of circuit board component parts.
MIX3 Circuit Board
to JACK3-CN101 to JACK3-CN301
MIC
/INST
PHANTOM
PHANTOM POWER
PEAK L PEAK R
LEVEL LEVEL LEVEL
1 2 OUT
SIG L SIG R
to PSUSB-CN702
Component side
Pattern side
MIX3: 2NA-WM90310-1 2
10
AUDIOGRAM3
JACK3 Circuit Board
MIC/INST LINE STEREO OUT
L L
L L
R R R R PHONES
to MIX3-CN102 to MIX3-CN302 Component side
X9390C0
R502
Pattern side
PSUSB Circuit Board
to MIX3-CN501
USB Pattern side
Component side
JACK3: 2NA-WM90310-1 2
PSUSB: 2NA-WW90300-1 1 11
AUDIOGRAM3
INSPECTIONS
1. Measurement condition
1-1 Environment
Temperature (5°C 40°C)
Humidity (30% 90%)
1-2 Power supply
Power is supplied from a personal computer. (Powered through USB bus)
2. Electric characteristics
2-0 0 dBu = 0.775 Vrms
2-1 Preparation
Load resistor of each output terminal is as follows:
PHONES (L, R) : 40 (3 W or more)
Others : 10k
2-2 Unless otherwise specified, the operation elements shall be set as follows,
· INPUT1
LEVEL control (GAIN control) : Maximum
MIC/INST switch : OFF (MIC)
INPUT1 INPUT2 OUTPUT
· INPUT2
LEVEL control (GAIN control) : Maximum
· OUTPUT
LEVEL control (MASTER level control) : Maximum
· Others PHANTOM switch
PHANTOM switch : OFF Level control Level control Level control
(GAIN control) (GAIN control) (MASTER Level control)
MIC/INST switch
2-3 Use 1 kHz sine wave for input signal unless otherwise specified.
2-4 Signal source impedance should be 150 .
2-5 Power indicator
Check that the POWER LED lights when the personal computer is connected.
12
AUDIOGRAM3
2-6 Gain
Check that the output level of each output terminal is within the range shown in the [Table 2-6.1] and [Table 2-6.2].
* Check that the difference in the level between channels is 2.0 dB or less.
Table 2-6.1 INPUT1 [dBu]
Input LEVEL STEREO OUT L STEREO OUT R
INPUT
level control (PHONE) (PHONE)
q PHONE -66.0 Maximum -2.0 ± 2.0
w XLR -22.0 Minimum -3.0 ± 2.0 -3.0 ± 2.0
e PHONE -50.0 Maximum -2.0 ± 2.0 *1
r (UNBAL) -6.0 Minimum -2.0 ± 2.0 *1
*1 Set the MIC/INST switch to ON (INST).
Table 2-6.2 INPUT2 [dBu]
Input LEVEL STEREO OUT L STEREO OUT R
INPUT PHONES L PHONES R
level control (PIN) (PIN)
t PHONE -2.0 ± 2.0 -14.8 ± 2.0
-40.0 Maximum
y (UNBAL) -2.0 ± 2.0 -14.8 ± 2.0
u -2.0 ± 2.0
PIN +4.0 Minimum
i -2.0 ± 2.0
2-7 Frequency characteristics
In the signal path of q to i in the [Table 2-6.1] and [Table 2-6.2], check that the output level of each output terminal is within
the range of +1.0/-3.0 dB compared with that of 1 kHz when the signal frequency is set to 20 Hz and 20 kHz.
(LEVEL control (GAIN control) : Minimum)
* Check that the frequency characteristics is within the range of +1.0/-4.5 dB when the signal frequency is set to 20 Hz and 20
kHz and the LEVEL control (GAIN control) is at maximum.
2-8 Crosstalk
Input signal from the INPUT2 L and check that the leakage level to the STEREO OUT R is -57.0 dBu or less when the output
level of the STEREO OUT L is +10.0 dBu.
Input signal from the INPUT2 R and check that the leakage level to the STEREO OUT L is -57.0 dBu or less when the output
level of the STEREO OUT R is +10.0 dBu.
* Set the LEVEL control of the INPUT1 and INPUT2 to minimum.
* Set the LEVEL control of the OUT to NOMINAL. (Direction of clock hand at 3 o'clock)
2-9 MASTER PEAK/SIGNAL indicator
Check that the MSTER PEAK/SIGNAL LED lights up when a signal within the range shown in the [Table 2-9.1] is fed to the input.
Table 2-9.1 [dBu]
Input level
INPUT
PEAK SIGNAL
1 -44.0 ± 2.0 -64.0 ± 2.0
2-10 Distortion
In the signal path of w, r, u and i of the [Table 2-6.1] and [Table 2-6.2], check that the distortion (T.H.D.) is 0.1% or less
when the output level of the STEREO OUT L, R is +8.0 dBu.
* Change the input signal frequency to "20 Hz", "1 kHz" and "20 kHz" and measure distortion (T.H.D.).
* Set the LEVEL controls of the channels which are not measured to minimum.
13
AUDIOGRAM3
2-11 Maximum output
Input signal to the INPUT1 and check that the distortion (T.H.D.) is 1.0 % or less when the output signal at the STEREO OUT L,
R is +14.0 dBu.
Check that the distortion (T.H.D.) is 1.0% or less when the output level at the PHONES L, R is 0.0 dBu.
* Set the LEVEL control of the INPUT2 to minimum.
* Do not connect a load resistor to the PHONES L, R when measuring the STEREO OUT L, R.
2-12 Equivalent input noise
Check that the noise level of the STEREO OUT L, R is -61.0 dBu or less when the pin 2 and pin 3 of the XLR terminal are
connected with the resistance of 150 .
If the noise level is -61.0 dBu or more, check that the input equivalent noise level is -125.0 dBu or less.
* [Equivalent input noise level] = [Noise level] - [Channel gain]
* Set the LEVEL control of the INPUT2 to minimum.
* Use the 12.7 kHz, -6 dB/octave Low Pass Filter when measuring the noise level.
* Set the parameter of the analyzer to the "Mean value" when measuring noise level.
2-13 Residual Noise
Set the LEVEL control of the INPUT part to minimum.
Check that the noise level of the STEREO OUT L, R is equal to or less than the one shown in the [Table 2-13.1] when the LEV-
EL control of the "OUT" is set to maximum or minimum.
* Use the 12.7 kHz, -6 dB/octave Low Pass Filter when measuring the noise level.
* Set the parameter of the analyzer to the "Mean value" when measuring noise level.
Table 2-13.1 [dBu]
MASTER level STEREO OUT
control L, R
Maximum -70.0
Minimum -98.0
2-14 USB
2-14.1 Recording
In the state of the [Table 2-14.1], record onto a personal computer via USB.
* For recording procedure, refer to "Recording using the Cubase AI 4" on page 18 or "Recording using the TWE" on page 28.
Table 2-14.1 [dBu]
INPUT Input level
XLR 1 -50.0
2-14-2 Gain
Check that output level at the STEREO OUT L, R is within a range of +14.0 ± 3.0 dBu when the recorded file is played back via
USB.
* Set the Windows volume control to maximum.
3. Phantom power
Connect the resistance of 4.7 k (1W or more, margin of error should be 1% or less) between the pin 1 and pin 2 of the XLR
terminal and short circuit between the pin 2 and pin 3.
Check that the voltage obtained between the pin 1 and pin 2 is between +25.8 V and +29.8 V when the PHANTOM switch is
turned on (LED should light).
4. Initial setting
All volumes : Minimum
All Switches : OFF
14
AUDIOGRAM3
INPUT1 INPUT2 OUTPUT
PHANTOM switch
Level control Level control Level control
(GAIN control) (GAIN control) (MASTER Level control)
MIC/INST switch
15
AUDIOGRAM3
Input LEVEL STEREO OUT L STEREO OUT R
INPUT
level control (PHONE) (PHONE)
q PHONE -66.0 -2.0 ± 2.0
w XLR -22.0 -3.0 ± 2.0 -3.0 ± 2.0
e PHONE -50.0 -2.0 ± 2.0 *1
r (UNBAL) -6.0 -2.0 ± 2.0 *1
Input LEVEL STEREO OUT L STEREO OUT R
INPUT PHONES L PHONES R
level control (PIN) (PIN)
t PHONE -2.0 ± 2.0 -14.8 ± 2.0
-40.0
y (UNBAL) -2.0 ± 2.0 -14.8 ± 2.0
u -2.0 ± 2.0
PIN +4.0
i -2.0 ± 2.0
[dBu]
Input level
INPUT
PEAK SIGNAL
1 -44.0 ± 2.0 -64.0 ± 2.0
16
AUDIOGRAM3
[dBu]
MASTER level STEREO OUT
control L, R
-70.0
-98.0
[dBu]
INPUT Input level
XLR 1 -50.0
17
AUDIOGRAM3
RECORDING USING THE CUBASE AI 4
* Insert the attached DVD-ROM (X8515B00) and install the Cubase AI 4.
("Cubase AI 4" is a trademark of Steinberg Media Technologies GmbH.)
Connection
-50.0 dBu +14.0 ± 3 dBu
MIC (XLR) STEREO OUT (L/R)
OFF MIC
USB cable
Maximum Maximum Computer
1 Launch Cubase AI 4.
Click [Start] [All Program] [Steinberg Cubase AI 4] [Cubase AI 4] to launch the program. If the ASIO Multimedia
dialog window appears, click [Yes].
2 Select [Device Setup] from the [Device] menu to open the Device Setup window.
Select [VST Audio System] in the [Device] field on the left side of the window. Select [ASIO DirectX Full Duplex Driver] in the
[ASIO Driver] field on the right side of the window. A dialog box will appear asking "Do you want to switch the ASIO driver?".
Click [Switch].
3 Select [ASIO DirectX Full Duplex Driver] in the [Devices] field on the left side of the Device
Setup window and click the [Control Panel] button to the right side.
18
AUDIOGRAM3
4 The ASIO Direct Sound Full Duplex Setup dialog box will be displayed. Check only the input
port and output port [USB Audio CODEC] checkboxes and click [OK] to close the dialog box.
5 Check that [USB Audio CODEC-1] and [USB Audio CODEC-2] are assigned to the [Port System
Name] in the [Ports] field of the Device Setup window and tick the [Visible] checkboxes. Then,
click [OK] to close the Device Setup window.
(If the checkboxes are already ticked, just click [OK].)
* If the "State" is not "Active", refer to page 22.
NOTE · If the [Port System Name] field does not change, close and restart the Cubase AI 4, then open the Device Setup
window.
· In case of Windows Vista, input port names may not be indicated. In that case, go through the following steps.
1. From the [START] menu click [Control Panel], then double-click the "Sound" icon to open the "Sound" dialog
window.
2. Click the "Recording" tab, right-click the "2-USB Audio CODEC" icon and select "Properties."
3. Click the "Advanced" tab, then select "2 channel, 16 bit, 44100 Hz (CD Quality)" or "2 channel, 16 bit, 48000 Hz
(DVD Quality)" in the "Default Format" field.
19
AUDIOGRAM3
6 Select [New Project] from the [File] menu to create a new project file.
Move the cursor to a place around the arrow in the figure above, click the right mouse button and select "Add Audio Track". "Add
Audio Track" dialog window will appear. Click [OK] if the setup is as shown below.
20
AUDIOGRAM3
7 Click the RECORDING button to start recording. When the recording is to be stopped,
click the STOP button .
8 Click the PLAY button to play back.
Check that the output is +14.0 ± 3.0 dBu.
* If the cursor is not at the top, click to put the cursor to the top before starting playback.
Cursor
21
AUDIOGRAM3
If the "State" is not "Active".
If the State is not Active, check the VST connection.
1. Select [Device] [VST connection].
2. "Not connected" is assigned to "Audio Device" field. Change to ASIO DirectX Full Duplex Driver.
22
AUDIOGRAM3
OFF MIC
1
2
3
23
AUDIOGRAM3
4
5
NOTE
24
AUDIOGRAM3
6
25
AUDIOGRAM3
7
8
26
AUDIOGRAM3
27
AUDIOGRAM3
RECORDING USING THE TWE
* Download the TWE from the Yamaha Official site.
Connection
-50.0 dBu +14.0 ± 3 dBu
MIC (XLR) STEREO OUT (L/R)
OFF MIC
USB cable
Maximum Maximum Computer
1 Launch TWE.
2 Select [Windows Sound Device Configuration] from the [Options] menu to open the Windows
Sound Device Configuration dialog box.
3 Set the Input and Output to USB Audio CODEC and click [OK] to close the dialog box.
28
AUDIOGRAM3
4
29
AUDIOGRAM3
5 Click the RECORDING button to start recording. When the recording is to be stopped,
click the STOP button .
6 Click the PLAY button to play back.
Check that the output is +14.0 ± 3.0 dBu.
* If the cursor is not at the top, click to put the cursor to the top before starting playback.
[Enlarged display]
Cursor
30
AUDIOGRAM3
OFF MIC
1
2
3
31
AUDIOGRAM3
4
32
AUDIOGRAM3
5
6
33
USB AUDIO INTERFACE
PARTS LIST
CONTENTS
OVERALL ASSEMBLY ..................................... 2
ELECTRICAL PARTS ............................... 48
Notes : DESTINATION ABBREVIATIONS
A: Australian model M : South African model
B: British model O : Chinese model
C: Canadian model Q : South-east Asia model
D: German model T : Taiwan model
E: European model U : U.S.A. model
F: French model V : General export model (110V)
H: North European model W: General export model (220V)
I : Indonesian model N,X: General export model
J : Japanese model Y : Export model
K: Korean model
WARNING
Components having special characteristics are marked and must be replaced with parts having
specification equal to those originally installed.
· The numbers "QTY" show quantities for each unit.
· The parts with "--" in "PART NO." are not available as spare parts.
· This mark " } " in the REMARKS column means these parts are interchangeable.
· The second letter of the shaded ( ) part number is O, not zero.
· The second letter of the shaded ( ) part number is I, not one.
·
·
·
· }
·
·
AUDIOGRAM3
OVERALL ASSEMBLY
O model K model
160 L75
L95
L90
160
140 x2
150 140 x2
110 x2
160
120 150 x2
150
100
100 x2
90
40 130
130b
130a
50
30 x3
50b
50a 10
30
20
60 x2
80 x2
70
2
AUDIOGRAM3
REF NO. PART NO. DESCRIPTION REMARKS QTY RANK
OVERALL ASSEMBLY AUDIOGRAM3
-- OVERALL ASSEMBLY (WN32630)
* 10 WN372300 INNER CHASSIS
* 20 WN211800 CIRCUIT BOARD JACK3
30 WE774300 BIND HEAD B-TIGHT SCREW 3.0X8 MFZN2W3 4 01
40 -- WIRING ASSEMBLY PSUSB3 PH 12P (WN42080)
50 -- PS-USB ASSEMBLY (WN49770)
* 50a WM903200 CIRCUIT BOARD PSUSB
* 50b WN328500 SHIELD PS-USB
60 WE774300 BIND HEAD B-TIGHT SCREW 3.0X8 MFZN2W3 2 01
* 70 WN497800 BOTTOM CASE PRINTED
80 WE774300 BIND HEAD B-TIGHT SCREW 3.0X8 MFZN2W3 2 01
* 90 WM903400 CIRCUIT BOARD MIX3
100 V966520R VOLUME KNOB WHITE/GRAY S WHITE/M-GRAY LEVEL(1, 2, OUT) 3 01
110 WF776200 PUSH BUTTON D-GRAY/WHITE PHANTOM +48V, MIC/INST (1) 2 01
120 WE774300 BIND HEAD B-TIGHT SCREW 3.0X8 MFZN2W3 01
* 130 WN497600 TOP COVER ASSEMBLY
130a -- TOP COVER PRINTED (WM82330)
130b -- SHEET SHIELD (WN32750)
140 WE98740R BIND HEAD TAPPING SCREW 3.0X12 MFZN2W3 4 01
150 WH091200 FOOT GOMUASHI MX-48HF 4 01
160 -- LABEL NAME PLATE (WN49800)
L75 -- LABEL CCC AV O (WA65000)
L90 -- LABEL E LIMIT MARK O (WK53580)
L95 -- LABEL MIC K (WQ37390)
ACCESSORIES
* X8515B00 OPTICAL DISK K,Y,O
V 8 1 0 0 4 0 0 CABLE 4P 1.5M USB(A-B) 03
*: New Parts RANK: Japan only
3
AUDIOGRAM3
ELECTRICAL PARTS
JACK3/MIX3
REF NO. PART NO. DESCRIPTION REMARKS QTY RANK
ELECTRICAL PARTS AUDIOGRAM3
* WN211800 CIRCUIT BOARD JACK3 (WM90310)(X9390C0/D0)
* WM903400 CIRCUIT BOARD MIX3 (WM90310)(X9390C0/D0)
* WM903200 CIRCUIT BOARD PSUSB (WM90300)(X9388C0)
* WN211800 CIRCUIT BOARD JACK3 (WM90310)(X9390C0/D0)
* WM903400 CIRCUIT BOARD MIX3 (WM90310)(X9390C0/D0)
A220 WF765800 SPACER LED3 EMX5014C 6
A230 -- WIRE HARNESS SMV2J P=2.0 9-50 (WH52570)
CN101 VI878700 CABLE HOLDER 51048 9P TE
CN102 VK025300 WIRE TRAP 52147 9P TE
CN301 VI878700 CABLE HOLDER 51048 9P TE
CN302 VK025300 WIRE TRAP 52147 9P TE
CN501 VB39080R CONNECTOR EH TYPE,TOP PH 12P TE 01
IC303 XF195A00 IC NJM4580L OP AMP
* JK101 WK387600 CANON JACK JACK NCJ6FAV-0-Y MIC/INST (1)
JK201 WH919000 PHONE JACK ST MSJ-064-30B B LINE L (2)
JK202 WH919000 PHONE JACK ST MSJ-064-30B B LINE R (2)
JK203 WC29570R PIN JACK MSP-532HV1-01 NI LINE L/R (2) 01
JK301 WC29570R PIN JACK MSP-532HV1-01 NI STEREO OUT L/R (OUT) 01
JK302 WH919000 PHONE JACK ST MSJ-064-30B B STEREO OUT L (OUT)
JK303 WH919000 PHONE JACK ST MSJ-064-30B B STEREO OUT R (OUT)
JK304 WH919000 PHONE JACK ST MSJ-064-30B B PHONES (OUT)
LD401 V979040R LED RED HFR203PJ-3-00 PEAK L (OUT)
LD402 WA09750R LED GREEN HFG203PJ-3-00 SIGNAL L (OUT)
LD403 V979040R LED RED HFR203PJ-3-00 PEAK R (OUT)
LD404 WA09750R LED GREEN HFG203PJ-3-00 SIGNAL R (OUT)
LD501 V979040R LED RED HFR203PJ-3-00 PHANTOM +48V (1)
LD502 WA09750R LED GREEN HFG203PJ-3-00 POWER
SW101 WH918700 PUSH SWITCH PS-22E85L-02 MIC/INST (1) 01
SW501 WH918700 PUSH SWITCH PS-22E85L-02 PHANTOM +48V (1) 01
VR101 V979050R ROTARY VARIABLE RES. RD 10.0K XV09213YN LEVEL (1) 03
VR201 WN156700 ROTARY VARIABLE RESISTOR C 20.0K XV012313YG LEVEL (2)
VR301 WN156600 ROTARY VARIABLE RESISTOR A 20.0K XV012313YG LEVEL (MASTER)
C101 US063100 CHIP MULTILAYER CERAMIC 1000P 50V K RECT.
C102 US063100 CHIP MULTILAYER CERAMIC 1000P 50V K RECT.
C103 US061220 CHIP MULTILAYER CERAMIC 22P 50V J RECT.
C104 US061220 CHIP MULTILAYER CERAMIC 22P 50V J RECT.
C110 US062220 CERAMIC CAP. 1608 220PF 220P 50V J RECT.
C111 US062220 CERAMIC CAP. 1608 220PF 220P 50V J RECT.
C113 US062470 CHIP MULTILAYER CERAMIC 470P 50V J RECT.
C114 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
C115 US126100 CERAMIC CHIP CAPACITOR 1UF 1.0000 10V Z RECT. 01
C118 US062470 CHIP MULTILAYER CERAMIC 470P 50V J RECT.
C119 US06168R CERAMIC CAPACITOR-SL 68P 50V J RECT. 01
C120 US062100 CHIP MULTILAYER CERAMIC 100P 50V J RECT.
C121 US06168R CERAMIC CAPACITOR-SL 68P 50V J RECT. 01
C125 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
C126 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
C128 US061100 CHIP MULTILAYER CERAMIC 10P 50V D RECT.
C207 US062100 CHIP MULTILAYER CERAMIC 100P 50V J RECT.
C208 US062100 CHIP MULTILAYER CERAMIC 100P 50V J RECT.
C209 US061470 CHIP MULTILAYER CERAMIC 47P 50V J RECT.
C210 US061470 CHIP MULTILAYER CERAMIC 47P 50V J RECT.
C214 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
C215 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
C301 US062100 CHIP MULTILAYER CERAMIC 100P 50V J RECT.
C302 US062100 CHIP MULTILAYER CERAMIC 100P 50V J RECT.
C303 US061470 CHIP MULTILAYER CERAMIC 47P 50V J RECT.
C304 US061470 CHIP MULTILAYER CERAMIC 47P 50V J RECT.
C305 US062150 CERAMIC CAPACITOR-SL 150P 50V J RECT.
C306 US062150 CERAMIC CAPACITOR-SL 150P 50V J RECT.
C307 US061390 CHIP MULTILAYER CERAMIC 39P 50V J RECT.
C308 US061390 CHIP MULTILAYER CERAMIC 39P 50V J RECT.
C315 US06233R CHIP MULTILAYER CERAMIC 330P 50V J RECT. 01
C316 US06233R CHIP MULTILAYER CERAMIC 330P 50V J RECT. 01
C321 US062220 CERAMIC CAP. 1608 220PF 220P 50V J RECT.
C322 US062220 CERAMIC CAP. 1608 220PF 220P 50V J RECT.
C323 US063100 CHIP MULTILAYER CERAMIC 1000P 50V K RECT.
C324 US063100 CHIP MULTILAYER CERAMIC 1000P 50V K RECT.
*: New Parts RANK: Japan only
4
AUDIOGRAM3
JACK3/MIX3
REF NO. PART NO. DESCRIPTION REMARKS QTY RANK
C325 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
-328 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
C330 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
C331 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
C405 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
C406 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
C408 US064100 CHIP MULTILAYER CERAMIC 0.0100 50V K RECT.
D401 VR49650R DIODE MA111 FLAT MA2J1110GL TP 01
-404 VR49650R DIODE MA111 FLAT MA2J1110GL TP 01
D401 VT332900 DIODE TIP ISS355 1SS355 TE-17 TP
-404 VT332900 DIODE TIP ISS355 1SS355 TE-17 TP
IC101 X4543A0R IC NJM072BM-E(TE1) OP AMP 02
IC201 X3505A00 IC NJM2068M-D(TE2) OP AMP
IC301 X6897A00 IC BA4560RF-E2 OPAMP OP AMP
IC302 X6897A00 IC BA4560RF-E2 OPAMP OP AMP
IC401 X6897A00 IC BA4560RF-E2 OPAMP OP AMP
IC402 X6266A0R IC BA10339F-E2 COMPARATOR 01
* Q101 WE014600 FET 2SK209-BL(TE85L,F)
Q102 WC529400 TRANSISTOR KTC3875S-Y,GR-RTK/ 01
Q103 V742170R TRANSISTOR 2SC3324-GR,BL(TE85
Q104 WC529400 TRANSISTOR KTC3875S-Y,GR-RTK/ 01
Q105 V742170R TRANSISTOR 2SC3324-GR,BL(TE85
Q106 WC529400 TRANSISTOR KTC3875S-Y,GR-RTK/ 01
Q401 WC529500 TRANSISTOR KTA1504S-Y,GR-RTK/
Q402 WC529500 TRANSISTOR KTA1504S-Y,GR-RTK/
Q501 VV655400 DIGITAL TRANSISTOR DTC114EKA TP
Q502 VV655400 DIGITAL TRANSISTOR DTC114EKA TP
Q503 VV655000 DIGITAL TRANSISTOR DTA114EKA TP
Q504 VD303700 TRANSISTOR A,B 2SC3326 -A,B(TE85R
-507 VD303700 TRANSISTOR A,B 2SC3326 -A,B(TE85R
R104 RD358100 CARBON RESISTOR (CHIP) 100.0K 63M J RECT.
R105 RD358100 CARBON RESISTOR (CHIP) 100.0K 63M J RECT.
R107 RD359100 CARBON RESISTOR (CHIP) 1.0M 63M J RECT.
R108 RF35647R CARBON RESISTOR 4.7K D 1608