Text preview for : 22F10-UA.pdf part of LG 22F10-UA LCD SERVICE MANUAL



Back to : 22F10-UA.pdf | Home

Internal Use Only
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com




LCD TV
SERVICE MANUAL
CHASSIS : LA85C

MODEL : 22LF10 22LF10-UA

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.




P/NO : MFL41524432 (0904-REV00) Printed in Korea
CONTENTS




CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ......................................................................... 3

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 8

TROUBLE SHOOTING ........................................................................... 11

BLOCK DIAGRAM.................................................................................. 15

EXPLODED VIEW .................................................................................. 22

SVC. SHEET ...............................................................................................




Copyright LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.


General Guidance Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC Do not use a line Isolation Transformer during this check.
power line. Use a transformer of adequate power rating as this Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
protects the technician from accidents resulting in personal injury between a known good earth ground (Water Pipe, Conduit, etc.)
from electrical shocks. and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
It will also protect the receiver and it's components from being with 1000 ohms/volt or more sensitivity.
damaged by accidental shorts of the circuitry that may be Reverse plug the AC cord into the AC outlet and repeat AC voltage
inadvertently introduced during the service operation. measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
If any fuse (or Fusible Resistor) in this TV receiver is blown, 0.5mA.
replace it with the specified. In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
When replacing a high wattage resistor (Oxide Metal Film Resistor, repaired before it is returned to the customer.
over 1W), keep the resistor 10mm away from PCB.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical Good Earth Ground
shock. such as WATER PIPE,
To Instrument's CONDUIT etc.
0.15uF
Leakage Current Cold Check(Antenna Cold Check) exposed
METALLIC PARTS
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1M and 5.2M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.




Copyright LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500°F to 600°F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500°F to 600°F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500°F to 600°F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the

Copyright LG Electronics. Inc. All right reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.

Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Copyright LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range 3. Test method
This specification is applied to the 19"/ 22" Wide LCD TV used 1) Performance: LGE TV test method followed
LA85C chassis. 2) Demanded other specification
- Safety: UL, CSA, IEC specification
2. Requirement for Test - EMC: FCC, ICES, IEC specification
Each part is tested as below without special appointment. Model Market Appliance
19LG30-UA North America Safety : UL1492, CSA C22.2.No.1
1) Temperature: 20±5ºC 22LG30-UA EMC : FCC Class B, IEC Class B
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.



4. General Specification(TV)
No Item Specification Option Remark
1 Receivable System ATSC/64 & 256 QAM/ NTSC-M USA only
2 Available Channel VHF : 02 ~ 13
UHF : 14 ~ 69
DTV : 02 ~ 69
CATV : 01 ~ 135
CADTV : 01 ~ 135
3 Input Voltage 100-240V~, 50/60Hz
4 Market North America
5 Screen Size 19/22 Inch
6 Aspect Ratio 16:9
7 Tuning System FS
8 LCD Module LM190WX1 (1440*900) Wide, LPL
M190A1-L07 (1440*900) Wide, CHI MEI
LM220WE1 (1680*1050) Wide, LPL
M220Z1-L01 (1680*1050) Wide, CHI MEI .
9 Operating Environment Temp : 0 ~ 40 deg
Humidity : ~ 80 %
10 Storage Environment Temp : -20 ~ 60 deg
Humidity : 0 ~ 85 %




Copyright LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Component Video Input (Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Proposed
1 720*480 15.73 59.94 SDTV, DVD 480I(525I)
2 720*480 15.73 60.00 SDTV, DVD 480I(525I)
3 720*480 31.47 59.94 SDTV 480P
4 720*480 31.50 60.00 SDTV 480P
5 1280*720 44.96 59.94 HDTV 720P
6 1280*720 45.00 60.00 HDTV 720P
7 1920*1080 33.72 59.94 HDTV 1080I
8 1920*1080 33.75 60.00 HDTV 1080I
9 1920*1080 27 24 HDTV 1080P
10 1920*1080 33.75 30 HDTV 1080P
11 1920*1080 67.43 59.94 HDTV 1080P
12 1920*1080 67.5 60 HDTV 1080P


6. RGB Input (PC)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark Proposed
PC DDC
1 640*350 31.469 70.08 25.17 DOS
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
6 1280*768 47.776 59.87 79.50 VESA(WXGA) O
7 1360*768 47.712 60.01 85.50 VESA(WXGA) O
8 1440*900 55.5 59.90 88.750 WXGA
9 1400*1050 64.744 59.948 101.00 22LG30-UA only WSXGA
10 1680*1050 62.290 59.954 146.25 22LG30-UA only WSXGA



7. HDMI input (DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark Proposed
PC DDC
1 640*480 31.469 59.94 25.17 VESA(VGA) O
2 800*600 37.879 60.31 40.00 VESA(SVGA) O
3 1024*768 48.363 60.00 65.00 VESA(XGA) O
4 1280*768 47.776 59.87 79.50 CVT(WXGA) O
5 1360*768 47.720 59.799 84.75 CVT(WXGA) O
6 1440*900 55.5 59.90 88.750 19/22LG30-UA only WXGA
7 1400*1050 64.744 59.948 101.00 22LG30-UA only WSXGA
8 1680*1050 65.290 59.954 146.25 22LG30-UA only WSXGA
DTV
1 720*480 31.469 59.94 27.00 SDTV 480P
2 720*480 31.500 60.00 27.03 SDTV 480P
3 1280*720 44.96 59.94 74.17 HDTV 720P
4 1280*720 45.00 60.00 74.25 HDTV 720P
5 1920*1080 33.72 59.94 74.17 HDTV 1080I
6 1920*1080 33.75 60.00 74.25 HDTV 1080I
7 1920*1080 27 24.00 74.25 HDTV 1080P
8 1920*1080 33.75 30.00 74.25 HDTV 1080P
9 1920*1080 67.43 59.94 148.35 HDTV 1080P
10 1920*1080 67.5 60.00 148.50 HDTV 1080P

Copyright LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range
(5)
This specification sheet is applied for all of the LCD TV with
LA85C chassis. filexxx.bin

(7) ........ OK




2. Specification
1) The adjustment is according to the order which is (6)
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment : 100-240V~, 50/60Hz
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes 3.2. ADC Process
6) Adjustment equipments: Color Analyzer(CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
3.2.1. PC input ADC
Adjustment Jig equipment, SVC remote control
(1) Auto RGB Gain/Offset Adjustment
1) Convert to PC in Input-source
I2C COMMAND:0xF4(SELECT INPUT) 0x00 0x60(RGB)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT),
3. Main PCB check process 0x60(RGB), 0x90(HDMI)
* APC - After Manual-Insult, executing APC 2) Signal equipment displays
Output Voltage : 700 mVp-p
3.1. Software download Impress Resolution XGA (1024x 768 @ 60Hz)
Model : 60 in Pattern Generator
1) Execute ISP program "Mstar ISP Utility" and then click
Pattern : 29 in Pattern Generator (MSPG-925 Series)
"Config" tab.
[gray pattern that left & right is black and center is
2) Set as below, and then click "Auto Detect" and check "OK"
white signal (Refer below picture)].
message. If display "Error", Check connect computer, jig,
and set.
3) Click "Connect" tab. If display "Can't", Check connect
computer, jig, and set.

(1) (3)




Please Check Speed :
To us speed between from 200 KHz

to 400 KHz

(2) OK 3) Adjust by commanding AUTO_COLOR _ADJUST
(0xF1) 0x00 0x02 instruction.

(2) Confirmation
1) We confirm whether "0xB6" address of EEPROM
"0xA2" is "0xAA" or not.
4) Click "Read" tab, and then load download file(XXXX.bin) by
2) If "0xB6(RGB)" address of EEPROM "0xB2" isn't
clicking "Read".
"0xAA", we adjust once more.
3) We can confirm the ADC values from "0xB0~0xB5
(4) (RGB)" addresses in a page "0xA2"

filexxx.bin * Manual ADC process using Service Remote control. After
enter Service Mode by pushing "ADJ" key, execute "Auto-
adjust" by pushing "G" key at "0. ADC CALIBRATION".

EZ ADJUST
0. ADC CALIBRATION : RGB
1. ADC ADJUST
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN : OFF
5. 2HOUR OFF : ON
6. OAD
5) Click "Auto" tab and set as below 7. UART DOWNLOAD
6) click "Run". 8. FACTORY MODE : ON
9. DEBUG MODE : OFF
7) After downloading, check "OK" message.


Copyright LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
3.2.2. COMPONENT input ADC 3.3. Function Check
(1) Component Gain/Offset Adjustment
1) Convert to Component in Input-source
I2C command : 0xF4(Select input) 0x00 0x40(Component) 3.3.1. Check display and sound
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT), - Check Input and Signal items. (cf. work instructions)
0x60(RGB), 0x90(HDMI) 1) TV
2) AV (CVBS/ S-Video)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In and H/P Out
* Display and Sound check is executed by Remote control.




4. Total Assembly line process
2) Signal equipment displays
Impress Resolution 480i
MODEL : 209 in Pattern Generator(480i Mode) 4.1. Adjustment Preparation
PATTERN : 08 in Pattern Generator(MSPG-925 Series) 1) Heat-run above 30 minutes in RF no signal.
3) Adjust by commanding AUTO_COLOR_ADJUST (0xF1) 2) 15 Pin D-sub jack is connected to the auto W/B equipment.
0x00 0x02 instruction.
4) Signal equipment display
-Impress Resolution : 1080i 4.2. Adjust color coordinate of Cool
- MODEL: 223 in Pattern Generator(1080i Mode) 1) Set Input to RGB.
- PATTERN: 08 in Pattern generator(MAPG-925 series) 2) Set Temperature : Cool
5) Adjust by commanding AUTO_COLOR ADJUST(0xF1) 3) Adjust x=0.285±0.005, y=0.293±0.005 (9300ºK±1000ºK) or
0x00 0x02 instruction. not.

* Manual ADC process using Service Remote control. After
enter Service Mode by pushing "ADJ" key, execute "Auto-
adjust" by pushing "G" key at "0. ADC CALIBRATION".
4.3. Adjust color coordinate of Medium
1) Set Input to RGB.
EZ ADJUST 2) Set Temperature : Medium
0. ADC CALIBRATION : COMPONENT 3) Adjust x=0.295±0.005, y=0.305±0.005 (8000ºK±1000ºK) or
1. ADC ADJUST not.
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN : OFF
5. 2HOUR OFF
6. OAD
: ON 4.4. Adjust color coordinate of Warm
7. UART DOWNLOAD 1) Set Input to RGB.
8. FACTORY MODE : ON 2) Set Temperature : Warm
9. DEBUG MODE : OFF 3) Adjust x=0.313±0.005, y=0.329±0.005 (8000ºK±1000ºK) or
not.
(2) Confirmation
1) We confirm whether "0xBF(480i)/0xC8(1080i)" address * Manual ADC Confirmation using Service Remocon. After
of EEPROM "0xA2" is "0xAA" or not. enter Service Mode by pushing "INSTART" key.
2) If "0xBF(480i)/0xC8(1080i)" address of EEPROM "0xA2"
isn't "0xAA", we adjust once more. EZ ADJUST
0. ADC CALIBRATION : RGB
3) We can confirm the ADC values from "0xB9~0xBE(480i)/ 1. ADC ADJUST
0xC2~(1080i)" addresses in a page "0xA2". 2. SUB B/C ADJUST
3. W/B ADJUST
* Manual ADC Confirmation using Service Remocon. After 4. WHITE PATTERN : OFF
enter Service Mode by pushing "INSTART" key. 5. 2HOUR OFF : ON
6. OAD
7. UART DOWNLOAD
MODEL : 22LG30_UA_UA/LPL_LM220WT7
8. FACTORY MOD : ON
S/W VER : 3.00.1
9. DEBUG MODE : OFF
UTT : 6
ADC CAL.
RGB : OK * Adjust "R/G/B - GAIN" by pushing "F", "G" key at "Cool"
YPbPr(SD) : OK
* Adjust "R/G/B - GAIN" by pushing "F", "G" key at "Medium"
YPbPr(HD) : OK
0. STEREO DETECT * Adjust "R/G/B - GAIN" by pushing "F", "G" key at "Warm"
1. SYNC LEVEL
2. DTV SNR
3. SCREEN MUTE
4. POWER OFF HISTORY




Copyright LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
W/B ADJUST 4.6. HDCP setting
0. MODE : RGB
1. WHITE PATTERN : White
(High-Bandwidth Digital Contents Protection)
2. TEMPERATURE : Cool
3. R - GAIN : 128 1) Connect D-sub Signal Cable to D-Sub Jack.
4. G - GAIN : 128 2) Input HDCP key with HDCP-key- in-program.
5. B - GAIN : 128 3) HDCP Key value is stored on EEPROM(AT24C512) which
6. R ­ OFFSET : 128
7. G ­ OFFSET : 128
is 80~A1 addresses of 0xA0~0xA2 page
8. B ­ OFFSET : 128 4) AC off/ on and on HDCP button of MSPG925 and confirm
9. RESET whether picture is displayed or not of using MSPG925
5) HDCP Key value is different among the sets.



4.5. DDC EDID WRITE
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Connect HDMI Signal Cable to HDMI Jack.
3) Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
4) Check whether written EDID data is correct or not. (Refer to
Product spec).
5) Remark : A week manufacture in address 0x10 can be
changed. And thus Checksum (Address: 0x7F)
can be also changed.

4.5.1. 22LG30 EDID DATA
(1) ANALOG DATA 128Byte




- Remark: A week manufacture in address 0x10 can be
changed. And thus Checksum (Address: 0x7F)
can be also changed.

(2) DIGITAL DATA 256Byte




- Remark: A week manufacture in address 0x10 can be
changed. And thus Checksum (Address: 0x7F)
can be also changed.




1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum

Copyright LG Electronics. Inc. All right reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
TROUBLE SHOOTING
1. No Power (LED indicator off)

Start check




Fail Check short
Check 15V or
of Main board or
5V of P701.
change LIPS.


Pass


Pass Fail
Pass Check output
Change Q701.
of Q701.




Fail
Check Output Change IC705.
of IC705.


Pass



Fail
Check LED Assy. Change LED Assy.




Pass


Check P304 & Connector.




Copyright LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
2. No RASTER

Start check




Fail
Check LED status Repeat No power (1) PROCESS.
On Display Unit.


Pass

Check
IC700, IC702, Fail Change IC700, IC702, IC703, IC704,
IC703, IC704, IC705, IC706,
IC705, IC706, IC708, IC709, IC710.
IC708, IC709,
IC710.

Pass



Fail
Check input/output Change IC100
of IC00.



Pass


Check the Fail
inverter connector or Change inverter connector or inverter
inverter.



Pass


Fail
Check LVDS cable Change LVDS cable or module.
or module.


Pass


Check input source cable & jack.




Copyright LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
3-1. No Raster on AV signal (AV/ COMPONENT/ S-VIDEO RGB-PC)
3-2. NO Raster on RF signal (TV)

Start Check 3-1 Start Check 3-2

Pass Pass


Fail Fail Check 5V of TU400.
Repeat No power(1) Check output Re-Soldering or change
process. of TU400. the defect part.


Pass
Pass


Check Change signal of
the signal of R622, Fail R622, R623, R681,
R623, R681, R615, R616, R615, R616, R617,
R617, R640,R641, R640,R641,R642.
R642.


Pass



Fail Re-soldering or change defect part.
Check input/output
of IC100. Check X100.



Pass

Check input source cable and jack.




Copyright LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
4. No sound

Start Check




Fail
Check the input Change source input.
Source.


Pass


Fail Re-soldering or change the defect part.
Check input/Output
of IC100. Check the X100.




Pass




Check the input/ Fail Re-soldering or change
output of IC500. the defect part.




Pass



Fail
Check the Speaker. Change the speaker.




Pass



Check the Speaker wire.




Copyright LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
Copyright
1.2V 3.3V 1.25V 3.3V 3.3V
AIR CABLE


1. Main
AVDD_DVI
CLK_ 25MHz X100
6212AB2872A 12MHz
2.5V
IF-P 2 2 VDD_DDR
2 IF-N IN[55] OUT[54] IN[255] OUT[254]
IFP[3]
IFN[4] TP DATA[0-7]
5V VSB/QAM TS0-7[86,87,88,89,90,91,92,93] G-5V
IF_AGC IFAGC[22] [20,22,24,26,
19 /22
MSCL SCLM1[127]
Receiver SCL[38] 27,28,29,31]
SCL_TU[11] SDA[36]
HY5DU561622F
SDAM1[126]
(LGDT3304)
SDA_TU[13] MSDA 256M (DDR)




Only for training and service purposes
TPCLK[33] TSCLK[96]
[12]
0ICTMLG019C
TPSOP[34] TSSYNC[95]
[N:11]
[P:10] TPVALID[19] TSVALID[94] HY5DU561622F
[3] SCL[8] SDA[7]
TPERR[17]
256M (DDR)
VCOM0
ATSC/NTSC Tuner [16] 1.0Vp-p CVBS(ATV) VCOM0[45]
Buffer TUNER_CVBS
CVBS0[44]
(TDVF-H051F) Buffer SIFM0[50] 1CH LVDS[137-146]
LG Innotek [15] 96dBuV SIF SIFM0
SIFP0[51] 2CH LVDS[137-146, L
SIFP0 CVBS1[42] 150-159]




LG Electronics. Inc. All right reserved.
RXE/RXO LVDS(8Bit) C
AUL_IN0[54]
AUR_IN[55] D
Rear AV_1 V, LR EAG35541101 Video/Audio SW IN1 AV1_SW[111]
LGE1854C
SV_C0[38]
Rear S_1 YC EAG35541101 IN1 SV_Y0[39] MSTAR
S_SW[82] SCL_EEPROM[136]
TXCLK-[2] EAN37156404 3.3V
HDMI 6612B00015C B_TX0-[4] Air : 8VSB SDA_EEPROM[135] EEPROM(512K)
TXCLK+[3] EEPROM(512K)
B_TX0+[5] 24C512
G_TX1-[7]
Cable : 256/64QAM 24C512
HPDCTRL[12] G_TX1[8] ¥RGB/YPbYr*2 3.3V




- 15 -
EEPROM 5V 0IMMRAL025A
EAN35989901
R_TX2-[10] ¥CVBS*3 SPI_CK[129]
6612B00015C DDCDA_SDA[14] R_TX2+[11] SPI_DI[130]
DDCDA_SCL[15] PB_IN[26] ¥YC*2 Flash (64M)
Flash (64M)
POWER_HDMI[110] SOY[29] SPI_DO[131]
Head Phone 6612F00001D
¥L/R-IN*3 SPI_CZ[132] S25FL064A
S25FL064A
OP-AMP Y_IN[28]
TPA6110A20 HP_L/r[70,71] PR_IN[31]
¥SIF
SAR3[121] EAN42961201
Comp_1 YPbPr/LR Comp1 AUL_IN1[56]