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A B C D E
1 1
Compal Confidential
2 2
JALA0 M/B Schematics Document
Intel Penryn Processor with Cantiga + DDRII + ICH9M
(With Ati & nVidia MXM/B)
3
2008-04-18 3
REV:1.0
4 4
om
Compal Electronics, Inc.
l.c
Security Classification Compal Secret Data
ai
Issued Date 2007/09/20 Deciphered Date 2008/09/20 Title
tm
SCHEMATIC MB A4221
ho
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Size Document Number Rev
f@
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
C
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS 401552
in
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
xa
Date: Friday, May 16, 2008 Sheet 1 of 50
A B C D E
he
A B C D E
Compal Confidential
Intel Penryn Processor Thermal Sensor Clock Generator
Fan Control
Model Name : JALA0 page 36
SMSC EMC1402-1 ICS9LPRS387
uPGA-478 Package page 4 page 16
File Name : LA-4221P
(Socket P) page 4,5,6
1 1
FSB
H_A#(3..35) 667/800/1066MHz H_D#(0..63)
HDMI Conn. LCD Conn. CRT Conn.
page 20 page 18 page 19
LVDS Intel Cantiga Memory BUS(DDRII) 200pin DDRII-SO-DIMM X2
CH7318 Dual Channel
(HDMI/B) SDVO (PM / GM / GL ) BANK 0, 1, 2, 3 page 14,15
page 25 1.8V DDRII 667 / 800
LVDS uFCBGA-1329
PCI-Express page 7,8,9,10,11,12,13
TMDS MXM II VGA/B 16X
nVidia 9MGS(256MB/GDDR2)
nVidia 9PGE2(256MB/GDDR3) DMI C-Link USB conn x2 Bluetooth CMOS Finger Print
Ati M82M(256MB/GDDR2) USB port 0, 2 Conn Camera Upek TCS4EA
page 17
PCI-Express
2
Intel ICH9-M 3.3V 48MHz USB
2
Card Reader
JMB385 3.3V 24.576MHz/48Mhz HD Audio
page 26 S-ATA
BGA-676
MINI Card x2 LAN(GbE)
Broadcom page 21,22,23,24
5 in 1 WLAN, Robson2 BCM5764M port 0 port 1
socket page 29 page 27 GMCH HDA MDC 1.5 HDA Codec
page 26 Conn 33 ALC268
page 08 page page 34
SATA HDD CDROM
Conn. page 30
Conn. page 30 PCI Bus
DOCKING RJ45
3.3V 33MHz
page 28
(DVI/LAN/ Audio AMP
CRT/USB/AUDIO) page 35
page 38
SPI FLASH ROM (2MB)
3
ME for iTPM only page 23 CardBus 3
PWR/B Conn. LPC BUS OZ601 Phone Jack x3
RTC CKT. page 25 page 35
page 32
page 22
ENE KB926
Power On/Off CKT. FUN/B Conn. page 31
Slot 0
page 32 page 25
page 33 SPI FLASH ROM (2MB)
EC BIOS / SYS BIOS / FP(PBA)
USB/B Conn. / HDCP page 32
DC/DC Interface CKT.
USB port 4
page 37 page 29 Touch Pad Int.KBD
page 32
Power Circuit DC/DC EC I/O Buffer
4
page 39,40,41,42 4
43,44,45,46 page 32
Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2007/09/20 Deciphered Date 2008/09/20 Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
SCHEMATIC MB A4221
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
B C
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
401552
Date: Friday, May 16, 2008 Sheet 2 of 50
A B C D E
A B C D E
SIGNAL
STATE SLP_S1# SLP_S3# SLP_S4# SLP_S5# +VALW +V +VS Clock
Voltage Rails
Full ON HIGH HIGH HIGH HIGH ON ON ON ON
Power Plane Description S1 S3 S5 S1(Power On Suspend) LOW HIGH HIGH HIGH ON ON ON LOW
VIN Adapter power supply (19V) N/A N/A N/A S3 (Suspend to RAM) LOW LOW HIGH HIGH ON ON OFF OFF
B+ AC or battery power rail for power circuit. N/A N/A N/A
1
S4 (Suspend to Disk) LOW LOW LOW HIGH ON OFF OFF OFF 1
+CPU_CORE Core voltage for CPU ON OFF OFF
+0.9VS 0.9V switched power rail for DDR terminator ON OFF OFF S5 (Soft OFF) LOW LOW LOW LOW ON OFF OFF OFF
+1.05VS 1.05V switched power rail ON OFF OFF
+1.25VS 1.25V switched power rail ON OFF OFF
+1.5VS 1.5V switched power rail ON OFF OFF Board ID / SKU ID Table for AD channel
+1.8V 1.8V power rail for DDR ON ON OFF Vcc 3.3V +/- 5%
+1.8VS 1.8V switched power rail ON OFF OFF Ra/Rc/Re 100K +/- 5%
+2.5VS 2.5V switched power rail ON OFF OFF Board ID Rb / Rd / Rf V AD_BID min V AD_BID typ V AD_BID max
+3VALW 3.3V always on power rail ON ON ON* 0 0 0 V 0 V 0 V
+3V 3.3V power rail for SB ON ON X 1 8.2K +/- 5% 0.216 V 0.250 V 0.289 V
+3V_LAN 3.3V power rail for LAN ON ON X 2 18K +/- 5% 0.436 V 0.503 V 0.538 V
+3VS 3.3V switched power rail ON OFF OFF 3 33K +/- 5% 0.712 V 0.819 V 0.875 V
+5VALW 5V always on power rail ON ON ON* 4 56K +/- 5% 1.036 V 1.185 V 1.264 V
+5VS 5V switched power rail ON OFF OFF 5 100K +/- 5% 1.453 V 1.650 V 1.759 V
+VSB VSB always on power rail ON ON ON* 6 200K +/- 5% 1.935 V 2.200 V 2.341 V
+RTCVCC RTC power ON ON ON 7 NC 2.500 V 3.300 V 3.300 V
2 2
Note : ON* means that this power plane is ON only with AC power available, otherwise it is OFF.
BOARD ID Table BTO Option Table
External PCI Devices Board ID PCB Revision BTO Item BOM Structure
Device IDSEL# REQ#/GNT# Interrupts
0 0.1 Discrete_H PM@
Cardbus OZ601 AD16 0 PIRQE
1 0.2 UMA GM@
2 0.3 UMA_H UMAGM@
3 1.0 UMA_L UMAGL@
4 1A Kinabalu_H MAIN@
5 Kinabalu_L VALUE@
6 RTC Batt 45@
7 ICH9M BASE ICH9MB@
ICH9M ENHANCE ICH9ME@
SB ROM(2MB) SPI2MB@
EC SM Bus1 address EC SM Bus2 address SB ROM(4MB) SPI4MB@
3 3
Device Address Device Address Kinabalu_L : UMA(GL) & w/o Dock & w/o Mini card 2
Smart Battery 0001 011X b ADT7421 1001 100X b & w/o iTPM
EEPROM(24C16/02) 1010 000X b (LAN BCM5764M) Reserved
GPU(MXM/B) 1001 111X b
ICH9M SM Bus address
Device Address
Clock Generator
(ICS9LPRS387) 1101 001Xb
DDR DIMM0 1001 000Xb
DDR DIMM1 1001 010Xb
LAN BCM5764M Reserved
(MINI CARD_WL_Robson) Reserved
4 4
om
Compal Electronics, Inc.
l.c
Security Classification Compal Secret Data
ai
Issued Date 2007/09/20 Deciphered Date 2008/09/20 Title
tm
SCHEMATIC MB A4221
ho
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Size Document Number Rev
f@
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
B C
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS 401552
in
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
xa
Date: Friday, May 16, 2008 Sheet 3 of 50
A B C D E
he
5 4 3 2 1
H_A#[3..35]
7 H_A#[3..35]
H_REQ#[0..4]
7 H_REQ#[0..4]
H_RS#[0..2]
7 H_RS#[0..2]
JCPU1A
H_A#3 J4 H1 H_ADS# 7
A[3]# ADS#
ADDR GROUP_0
H_A#4 L5 E2 H_BNR# 7
H_A#5 A[4]# BNR#
D L4 A[5]# BPRI# G5 H_BPRI# 7 D
H_A#6 K5
H_A#7 A[6]#
M3 A[7]# DEFER# H5 H_DEFER# 7
H_A#8 N2 F21
A[8]# DRDY# H_DRDY# 7
H_A#9 J1 E1
A[9]# DBSY# H_DBSY# 7
H_A#10 N3
H_A#11 A[10]#
P5 A[11]# BR0# F1 H_BR0# 7
H_A#12 P2 A[12]#
CONTROL
H_A#13 L2 D20 H_IERR#
H_A#14 A[13]# IERR#
P4 A[14]# INIT# B3 H_INIT# 22
H_A#15 P1
H_A#16 A[15]#
R1 A[16]# LOCK# H4 H_LOCK# 7
7 H_ADSTB#0 M1 ADSTB[0]#
C1 H_RESET# H_RESET# 7
H_REQ#0 RESET# H_RS#0
K3 REQ[0]# RS[0]# F3
H_REQ#1 H2 F4 H_RS#1
H_REQ#2 REQ[1]# RS[1]# H_RS#2
K2 REQ[2]# RS[2]# G3
H_REQ#3 J3 G2 H_TRDY# 7
H_REQ#4 REQ[3]# TRDY#
L1 REQ[4]#
HIT# G6 H_HIT# 7
H_A#17 Y2 E4
A[17]# HITM# H_HITM# 7
H_A#18 U5
H_A#19 A[18]#
R3 A[19]# BPM[0]# AD4
ADDR GROUP_1
H_A#20 W6 AD3
H_A#21 A[20]# BPM[1]#
U4 A[21]# BPM[2]# AD1
H_A#22 Y5 AC4
A[22]# BPM[3]#
XDP/ITP SIGNALS
H_A#23 U1 AC2
H_A#24 A[23]# PRDY# XDP_BPM#5
R4 A[24]# PREQ# AC1
H_A#25 T5 AC5 XDP_TCK
C H_A#26 A[25]# TCK XDP_TDI C
T3 A[26]# TDI AA6
H_A#27 W2 AB3
H_A#28 A[27]# TDO XDP_TMS
W5 A[28]# TMS AB5
H_A#29 Y4 AB6 XDP_TRST#
H_A#30 A[29]# TRST# XDP_DBRESET#
U2 A[30]# DBR# C20 XDP_DBRESET# 23
H_A#31 V4
H_A#32 A[31]# +1.05VS
W3 A[32]#
H_A#33 AA4 THERMAL
H_A#34 A[33]#
AB2 A[34]#
H_A#35 AA3 D21 H_PROCHOT#
A[35]# PROCHOT# H_THERMDA_R
7 H_ADSTB#1 V1 ADSTB[1]# THERMDA A24 DVT
B25 H_THERMDC_R XDP_TDI R25 1 2 54.9_0402_1%
THERMDC
22 H_A20M# A6 A20M#
ICH
ICH
22 H_FERR# A5 FERR# THERMTRIP# C7 H_THERMTRIP# 8,22 left NC if no ITP
22 H_IGNNE# C4 IGNNE# DVT
XDP_TMS R18 1 2 54.9_0402_1% 39Ohm
22 H_STPCLK# D5 STPCLK#
C6 H CLK XDP_BPM#5 R10 1 2 54.9_0402_1%
22 H_INTR LINT0
B4 A22 DEL_DVT(ESD) @
22 H_NMI LINT1 BCLK[0] CLK_CPU_BCLK 16
22 H_SMI# A3 SMI# BCLK[1] A21 CLK_CPU_BCLK# 16
M4 H_PROCHOT# R42 2 1 56_0402_5%
RSVD[01]
N5 RSVD[02]
T2 H_IERR# R41 2 1 56_0402_5%
RSVD[03]
V3 RSVD[04]
RESERVED
B2 RSVD[05] Layout Note:
D2 RSVD[06]
D22 H_THERMDA&H_THERMDC Trace / Space = 10 / 10 mil DVT
RSVD[07]
D3 RSVD[08]
B XDP_TRST# R11 54.9_0402_1% B
F6 RSVD[09] 2 1
XDP_TCK R9 1 2 54.9_0402_1%
Penryn
CONN@
+3VS
C107
0.1U_0402_16V4Z
1 2
JALA0
2
R64 DVT
+1.05VS R56 0_0402_5% 10K_0402_5%
BSEL2 BSEL1 BSEL0 BCLK H_THERMDA_R 1 2 H_THERMDA @
U9
1
0 0 0 266 1 VDD SCLK 8 EC_SMB_CK2 27,31
1
1
R60 C108 2 7
D+ SDATA EC_SMB_DA2 27,31
0 1 0 200 56_0402_5%
2200P_0402_50V7K
@ 3 D- ALERT/THERM2 6 1 2 +3VS
2 @ R652
2
0 1 1 166 R55 0_0402_5% THERM# 4 5 10K_0402_5% DVT(JALA0)
H_THERMDC_R THERM GND
1 2 H_THERMDC
2
B
EMC1402-1-ACZL-TR_MSOP8
DVT
E
H_PROCHOT# 3 1 OCP# 23
A A
C
Q5 DVT(JALA0) SMSC : SA00001Z700(S IC EMC1402-1-ACZL-TR MSOP 8P SENSOR)
MMBT3904_SOT23-3
@
Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2007/09/20 Deciphered Date 2008/09/20 Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
SCHEMATIC MB A4221
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
C
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
401552
Date: Friday, May 16, 2008 Sheet 4 of 50
5 4 3 2 1
5 4 3 2 1
H_D#[0..63] JCPU1C
H_D#[0..63] 7
+CPU_CORE A7 VCC[001] VCC[068] AB20 +CPU_CORE
JCPU1B A9 AB7
H_D#0 H_D#32 VCC[002] VCC[069]
E22 D[0]# D[32]# Y22 A10 VCC[003] VCC[070] AC7
D H_D#1 F24 AB24 H_D#33 A12 AC9 D
H_D#2 D[1]# D[33]# H_D#34 VCC[004] VCC[071]
E26 D[2]# D[34]# V24 A13 VCC[005] VCC[072] AC12
DATA GRP 0
H_D#3 G22 V26 H_D#35 A15 AC13
DATA GRP 2
H_D#4 D[3]# D[35]# H_D#