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8SR533P Schematics Revision 3.0
SHEET TITLE
D D
1 COVER SHEET
2 BOM & PCB MODIFY HISTORY
3 BLOCK DIAGRAM
4,5,6 INTEL CPU_WMT_478
7-10 SIS645 (NORTH BRIDGE) HOST; DDR; AGP,HYPER ZIP
11-14 SIS961 (SOUTH BIRDGE)
15 CLOCK GENERATOR (ICS952001)
C C
16,17 DDR SDRAM DIMMS 1,2,3
18 AGP SLOT
19,20 PCI SLOT 1,2,3,4,5,6
21 IDE,FRONT USB,PCIRST#
22 LPCIO_IT8705
23 BIOS
24 COM,PRT,FDD,KB/MS,IR
B B
25 AUDIO (CT5880)/AC 97
26 AUDIO JACK,GAME PORT
27 FAN, SMB PORT
28 PANEL,STR LED,FANS ,CPU GN
29 VCORE PHASE PWM HIP 6302 + 6602
30 DDR POWER,3VDUAL,VDDQ DC POWER PCB Size: 294*200 mm
COMPONENT SIDE
(1 oz. Copper)
31 ATX CONN, GPIO LIST VCC LAYER
(1 oz. Copper)
A
GND LAYER A
(1 oz. Copper)
32 RTL8100BL SOLDER SIDE
(1 oz. Copper)
GIGABYTE
Title
COVER SHEET
Size Document Number Rev
Custom
GA-8SR533P 3.0
Date: Thursday, September 26, 2002 Sheet 1 of 32
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Model Name: 8SR533P Circuit or PCB layout change
for next version
Version:3.0 Date Change Item Reason
D D
91/4/16 Change Intel Front Panel Costermer Request
Component value change history AUTOBOM
91/4/16
Change 6-channel
CODEC(ALC650) Costermer Request
91/ /
Date Change Item Reason 91/7/11
Add H/W monitor schematic PM Request
91/09/09 Change SB to SIS962L Customer request Add IR connector PM Request
91/7/11
91/09/12 EC37 change to 22uF Fix some DDR resume from "S3" fail issue Add PCI damping Fix AHA2940U2W SCSI card fail issue
91/7/11 Resistor(AD0~31)
Add solder side Cap. For 645 over-clock to FSB533 stability. Shot all 0 ohm Resistor Cost Down
91/7/11
91/09/19 Change Hi-side MOS damping Reduced PWM switching noise
3.0C resistor to 4.7ohm Change all 330uF to Cost Down
91/7/11 1000uF
91/09/27 Add Hi-side & Lo-side MOS