ch_05.pdf part of Intel ch 05 ch_05.pdf, Intel Legacy Package_databook_1999 ch

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Physical Constants of IC Package
Materials 5
Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC
packages.

Table 5-1. Case Material Characteristics
Alumina Molding Sealing Cu-W
Cu
Properties Units (92%) Kovar Compound Glass (90%)

Density kg/m3 3600- 8400 1790-1850 4700 17000 8900
(g/cc) 3700 (8.4) (1.79-1.85) (4.7) (17) (8.9)
(3.6-3.7)
Modulus of Elasticity GPa 55 138 E1 = 11.7 5.7 255 125
E2 = 0.1
Tensile Strength MPa 157 627 19.98 270
Thermal Conductivity W/mK 18 17.5 0.58 -0.67 0.6 180 - 200
(20