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Cartridge Packaging 16

16.1 Introduction
Intel has introduced a variety of innovative package designs over the years: surface mount, small
out-line, very thin package, multilayer molded plastic quad flatpacks (PQFP), and the Tape Carrier
Package (TCP) format. Recent configurations for optimum microprocessor performance are the
Single Edge Contact (S.E.C.) cartridge and the Mobile Mini-Cartridge.

The S.E.C. cartridge typically combines an area array packaged processor core, L2 cache, other
components, and a thermal solution attach point. The entry of the S.E.C. cartridge technology
continues the commitment to provide packaging solutions which meet Intel's rigorous criteria for
quality and performance.

The mobile mini-cartridge is a packaging technology aimed at the notebook PC market, where
minimum form factor is required. It is designed to protect the electronic components of the product
and enables a controlled thermal interface between the processor and the thermal solution in the
notebook system (see Figure 1). The mini-cartridge provides a socketable microprocessor
solution, i.e. it enables the OEM to mount the processor via a motherboard-mounted connector,
rather than by soldering it, and mechanically securing it with screws in a manner similar to other
notebook components such as hard disk drives.

Several times throughout this chapter you will be referred to Intel's website. The URL for the Intel
website is http://www.intel.com. Intel's developers website can also be accessed through this site.


16.2 Single Edge Contact Cartridge Technology
The S.E.C. cartridge has the following standard features: a plastic enclosure and a substrate with an
edge finger connection. The plastic enclosure protects the surface mount components and provides
features for mechanical stability when the processor is mounted in a retention mechanism on a
motherboard. The edge finger connection maintains socketability for system configuration. There
are two edge finger connectors: SC 242 for the Pentium II