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DVD MICRO
COMPONENT
SYSTEM
Model Name MM-D470D
Model Code MM-D470D/XN




SERVICE MANUAL
DVD MICRO COMPONENT SYSTEM Contents

1. Precaution

2. Product Specification

3. Disassembly & Reassembly

4. Troubleshooting

5. PCB Diagram
MM-D470D
6. Schematic Diagram




Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents



Contents
1. Precaution........................................................................................................................................ 1 - 1
1.1. Safety Precautions ................................................................................................................... 1 - 1
1.2. Servicing Precautions ............................................................................................................... 1 - 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 - 4
2. Product Specification ......................................................................................................................... 2 - 1
2.1. Product Feature ....................................................................................................................... 2 - 1
2.2. Specifications.......................................................................................................................... 2 - 2
2.3. Specifications Analysis ............................................................................................................. 2 - 3
2.4. Accessories ............................................................................................................................ 2 - 4
2.4.1. Supplied Accessories ................................................................................................... 2 - 4
3. Disassembly & Reassembly ................................................................................................................ 3 - 1
3.1. Main Disassembly & Reassembly ............................................................................................... 3 - 1
3.2. DECK Disassembly & Reassembly ............................................................................................. 3 - 4
4. Troubleshooting ................................................................................................................................ 4 - 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 - 1
4.2. No Power ............................................................................................................................... 4 - 2
4.3. No Output .............................................................................................................................. 4 - 4
4.4. Measures to be taken when the Protection Circuit operates............................................................... 4 - 6
4.4.1. Check AMP in Power Protection .................................................................................... 4 - 6
4.4.2. MICOM, MPEG Initialization & Update.......................................................................... 4 - 7
4.5. Buyer-Region Code Setting Method ............................................................................................ 4 - 8
4.5.1. Inserting the Region Code after replacing the Main PCB ..................................................... 4 - 8
5. PCB Diagram ................................................................................................................................... 5 - 1
5.1. Wiring Diagram....................................................................................................................... 5 - 1
5.2. TOUCH KEY PCB Top ............................................................................................................ 5 - 2
5.3. TOUCH KEY PCB Bottom ....................................................................................................... 5 - 3
5.4. VFD PCB Top......................................................................................................................... 5 - 4
5.5. VFD PCB Bottom.................................................................................................................... 5 - 5
5.6. MAIN PCB Top ...................................................................................................................... 5 - 6
5.6.1. Pin Connection ........................................................................................................... 5 - 7
5.6.2. Test Point Wave Form .................................................................................................. 5 - 8
5.7. MAIN PCB Bottom.................................................................................................................. 5 - 9
6. Schematic Diagram ........................................................................................................................... 6 - 1
6.1. Overall Block Diagram ............................................................................................................. 6 - 1
6.2. TOUCH KEY-1 ....................................................................................................................... 6 - 2
6.3. TOUCH KEY-2 ....................................................................................................................... 6 - 3
6.4. FRONT ................................................................................................................................. 6 - 4
6.5. MAIN-1................................................................................................................................. 6 - 5

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