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LCD TV
SERVICE MANUAL
CHASSIS : ML-012A
MODEL : LN-15A15
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
Contents .................................................................................................. 2
Safety Precautions ..................................................................................3
Servicing Precautions ............................................................................ 4
Adjustment Instruction ............................................................................6
Troubleshooting .....................................................................................12
Exploded View ...................................................................................... 14
Exploded View Parts List .......................................................................15
Replacement Parts List ........................................................................ 16
SVC. Sheet .................................................................................................
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in
the Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to
prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source,
An lsolation Transformer should always be used during connect an electrical jumper across the two AC plug prongs.
the servicing of a receiver whose chassis is not isolated from Place the AC switch in the on positioin, connect one lead of
the AC power line. Use a transformer of adequate power rating ohm-meter to the AC plug prongs tied together and touch other
as this protects the technician from accidents resulting in ohm-meter lead in turn to each exposed metallic parts such as
personal injury from electrical shocks. antenna terminals, phone jacks, etc.
If the exposed metallic part has a return path to the chassis, the
It will also protect the receiver and it's components from being measured resistance should be between 1M and 5.2M.
damaged by accidental shorts of the circuitary that may be When the exposed metal has no return path to the chassis the
inadvertently introduced during the service operation. reading must be infinite.
An other abnormality exists that must be corrected before the
If any fuse (or Fusible Resistor) in this TV receiver is blown, receiver is returned to the customer.
replace it with the specified.
Leakage Current Hot Check (See below Figure)
When replacing a high wattage resistor (Oxide Metal Film Plug the AC cord directly into the AC outlet.
Resistor, over 1W), keep the resistor 10mm away from PCB. Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
Keep wires away from high voltage or high temperature parts. between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Due to high vacuum and large surface area of picture tube, Measure the AC voltage across the resistor using AC
extreme care should be used in handling the Picture Tube. voltmeter with 1000 ohms/volt or more sensitivity.
Do not lift the Picture tube by it's Neck. Reverse plug the AC cord into the AC outlet and repeat AC
voltage measurements for each esposed metallic part. Any
Before returning the receiver to the customer, voltage measured must not exceed 0.75 volt RMS which is
corresponds to 0.5mA.
always perform an AC leakage current check on the exposed In case any measurement is out of the limits sepcified, there is
metallic parts of the cabinet, such as antennas, terminals, etc., possibility of shock hazard and the set must be checked and
to be sure the set is safe to operate without damage of repaired before it is returned to the customer.
electrical shock.
Leakage Current Hot Check circuit
AC Volt-meter
Good Earth Ground
such as WATER PIPE,
To Instrument's CONDUIT etc.
0.15uF
exposed
METALLIC PARTS
1.5 Kohm/10W
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service transistors and semicounductor "chip" components. The
manual and its supplements and addenda, read and follow the following techniques should be used to help reduce the
SAFETY PRECAUTIONS on page 3 of this publication. incidence of component damage caused by static by static
NOTE: If unforeseen circumstances create conflict between the electricity.
following servicing precautions and any of the safety 1. Immediately before handling any semiconductor component
precautions on page 3 of this publication, always follow the or semiconductor-equipped assembly, drain off any
safety precautions. Remember: Safety First. electostatic charge on your body by touching a known earth
ground. Alternatively, obtain and wear a commercially
General Servicing Precautions available discharging wrist strap device, which should be
1. Always unplug the receiver AC power cord from the AC removed to prevent potential shock reasons prior to
power source before; applying power to the unit under test.
a. Removing or reinstalling any component, circuit board 2. After removing an electrical assembly equipped with ES
module or any other receiver assembly. devices, place the assembly on a conductive surface such as
b. Disconnecting or reconnecting any receiver electrical plug aluminum foil, to prevent electrostatic charge buildup or
or other electrical connection. exposure of the assembly.
c. Connecting a test substitute in parallel with an electrolytic 3. Use only a grounded-tip soldering iron to solder or unsolder
capacitor in the receiver. ES devices.
CAUTION: A wrong part substitution or incorrect 4. Use only an anti-static type solder removal device. Some
polarity installation of electrolytic capacitors may result solder removal devices not classified as "anti-static" can
in an explosion hazard. generate electrical charges sufficent to demage ES devices.
d. Discharging the picture tube anode. 5. Do not use freon-propelled chemicals. These can generate
2. Test high voltage only by measuring it with an appropriate electrical charges sufficient to damage ES devices.
high voltage meter or other voltage measuring device (DVM, 6. Do not remove a repalcement ES device from its protective
FETVOM, etc) equipped with a suitable high voltage probe. package until immediately before you are ready to install it.
Do not test high voltage by "drawing an arc". (Most replacement ES devices are packaged with leads
3. Discharge the picture tube anode only by (a) first connecting electrically shorted together by conductive foam, aluminum
one end of an insulated clip lead to the degaussing or kine foil or comparable conductive material).
aquadag grounding system shield at the point where the 7. Immediately before removing the protective material from
picture tube socket ground lead is connected, and then (b) the ieads of a replacement ES device, touch the protective
touch the other end of the insulated clip lead to the picture material to the chassis or circuit assembly into which the
tube anode button, using an insulating handle to avoid device will be installed.
personal contact with high voltage. CAUTION:Be sure no power is applied to the chassis or
4. Do not spray chemicals on or near this receiver or any of its circuit, and observe all other safety precautions.
assemblies. 8. Minimize bodily motions when handling unpackaged
5. Unless specified otherwise in this service manual, clean replacement ES devices. (Otherwise harmless motion such
electrical contacts only by applying the following mixture to as the bruching together of your clothes fabric or the lifting
the contacts with a pipe cleaner, cotton-tipped stick or of your foot from a carpeted floor can generate static
comparable nonabrasive applicator; 10% (by volume) electricity sufficient to damage an ES device.)
Acetone and 90% (by volume) isopropyl alcohol (90%-99%
strength) General Soldering Guidelines
CAUTION: This is a flammable mixture. 1. Use a grounded-tip, low-wattage soldering iron and
Unless specified otherwise in this service manual, lubrication appropriate tip size and shape that will maintan tip
of contacts in not required. temperature within the range or 500cF to 600cF.
6. Do not defeat any plug/socket B+ voltage interlocks with 2. Use an appropriate gauge of RMA resin-core solder
which receivers covered by this service manual might be composed of 60 parts tin/40 parts lead.
equipped. 3. Keep the soldering iron tip clean and well tinned.
7. Do not apply AC power to this instrument and/or any of its 4. Thorohly clean the surfaces to be soldered. Use a mall
electrical assemblies unless all solid-state device heat sinks wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
are correctly installed. Do not use freon-propelled spray-on cleaners.
8. Always connect the test receiver ground lead to the 5. Use the following unsoldering technique
receiver chassis ground before connecting the test receiver a. Allow the soldering iron tip to reach normal temperature.
positive lead. (500cF to 600cF)
Always remove the test receiver ground lead last. b. Heat the component lead until the solder melts.
9. Use with this receiver only the test fixtures specified in this c. Quickly draw the melted solder with an anti-static,
service manual. suction-type solder removal device or with solder braid.
CAUTION: Do not connect the test fixture ground strap to CAUTION: Work quickly to avoid overheating the
any heatsink in this receiver. circuiboard printed foil.
6. Use the following soldering technique.
Electrostatically Sensitive (ES) Devices a. Allow the soldering iron tip to reach a normal
Some semiconductor (solid state) devices can be damaged temperature (500cF to 600cF)
easily by static electricity. Such components commonly are b. First, hold the soldering iron tip and solder the strand
called Electrostatically Sensitive (ES) Devices. Examples of against the component lead until the solder melts.
typical ES devices are integrated circuits and some fieldeffect
c. Qulckly move the soldering iron tip to the junction of the Fuse and Conventional Resistor
component lead and the printed circuit foil, and hold it Removal/Replacement
there only until the solder flows onto and around both the 1. Clip each fuse or resistor lead at top of the circuit board
component lead and the foil. hollow stake.
CAUTION: Work quickly to avoid overheating the circuit 2. Securely crimp the leads of replacement component around
board printed foil. notch at stake top.
d. Closely inspect the solder area and remove any excess 3. Solder the connections.
or splashed solder with a small wire-bristle brush. CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board
IC Remove/Replacement to prevent excessive component temperatures.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the Circuit Board Foil Repair
circuit foil. When holes are the slotted type, the following Excessive heat applied to the copper foil of any printed circuit
technique should be used to remove and replace the IC. When board will weaken the adhesive that bonds the foil to the circuit
working with boards using the familiar round hole, use the board causing the foil to separate from or "lift-off" the board.
standard technique as outlined in parapraphs 5 and 6 above. The following guidelines and procedures should be followed
whenever this condition is encountered.
Removal
1. Desolder and straighten each IC lead in one operation by At IC Connections
gently prying up on the lead with the soldering iron tip as the To repair a defective copper pattern at IC connections use the
solder melts. following procedure to install a jumper wire on the copper
2. Draw away the melted solder with an anti-static suction- pattern side of the circuit board. (Use this technique only on IC
type solder removal device (or with solder braid) before connections).
removing the IC.
Replacement 1. Carefully remove the damaged copper pattern with a sharp
1. Carefully insert the replacement IC in the circuit boare. knife. (Remove only as much copper as absolutely
2. Carefully bend each IC lead against the circuit foil pad and necessary).
solder it. 2. carefully scratch away the solder resist and acrylic coating
3. Clean the soldered areas with a small wire-bristle brush. (if used) from the end of the remaining copper pattern.
(It is not necessary to reapply acrylic coating to the areas). 3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
"Small-Signal" Discrete Transistor 4. Route the jumper wire along the path of the out-away
Removal/Replacement copper pattern and let it overlap the previously scraped end
1. Remove the defective transistor by clipping its leads as of the good copper pattern. Solder the overlapped area and
close as possible to the component body. clip off any excess jumper wire.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board. At Other Connections
3. Bend into a "U" shape the replacement transistor leads. Use the following technique to repair the defective copper
4. Connect the replacement transistor leads to the pattern at connections other than IC Pins. This technique
corresponding leads extending from the circuit board and involoves the installation of a jumper wire on the component
crimp the "U" with long nose pliers to insure metal to metal side of the circuit board.
contact then solder each connection.
1. Remove the defective copper pattern with a sharp knife.
Power Output, Transistor Device Remove at least 1/4 inch of copper, to ensure that a
Removal/Replacement hazardous condition will not exist if the jumper wire opens.
1. Heat and remove all solder from around the transistor leads. 2. Trace along the copper pattern from both sides of the
2. Remove the heatsink mounting screw (if so equipped). pattern break and locate the nearest component that is
3. Carefully remove the transistor from the heat sink of the directly connected to the affected copper pattern.
circuit board. 3. Connect insulated 20-gauge jumper wire from the lead of
4. Insert new transistor in the circuit board. the nearest component on one side of the pattern break to
5. Solder each transistor lead, and clip off excess lead. the lead of the nearest component on the other side.
6. Replace heatsink. Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so
Diode Removal/Replacement the it does not touch components or sharp edges.
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicula y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them
and if necessary, apply additional solder.
ADJUSTMENT INSTRUCTION
1. Application Object 3. PC Input Mode Adjustment
This instruction is for the application to the LCD TV.
3-1. Required Test Equipment
(1) A pattern generator being in proportion to 801GF(or
VG819) ; Gray Pattern of 16(11) tones
2. Notes (2) A Service remote control
(1) This set uses an adapter, so connect the adapter and the 3-2. Preparation for Adjustment
set correctly before adjustment. (1) Perform `Heat Run' for more than 30 minutes in white
(2) The adjustment must be performed under the correct pattern.
sequence. (2) Connect the signal of pattern generator with LCD TV of PC
(3) The adjustment must be performed in the circumstance of Input Jack(D-Sub).
25!5cC of temperature and 65!10% of relative humidity if
there is no specific designation. 3-3. Auto Gray Adjustment
(4) The input voltage of the receiver must keep 100~220V, (1) Apply the gray signal of XGA(1024X768) 16 tones(H: 31-
50/60Hz in adjusting. 214 Pattern, V: 60-84 Pattern) by using 801GF.
(5) The set must be operated for 30 minutes preliminarily Or apply the gray signal of Pattern Generator 16(11) tones
before adjustment if there is no specific designation. by using VG819.
(2) Pressing ADJ Key(or SVC Key) of Remote Control for
[ `Heat Run' must be performed with the full white signal or TV Adjustment, adjust the Auto gay from 0 to 1 by using
noise signal in the internal part of the set. Volume + Key.
[ The time for `Heat Run' can be changed owing to production
plan.
3-4. Position of Mode Adjustment
Timing of Mode Table * H[dot]/V[line]
Mode VGA-60 VGA-67 VGA-72 VGA-75 VGA-85 SVGA-56 SVGA-60 SVGA-72
H_Total 800 864 832 840 832 1024 1056 1040
H_Display 640 640 656 640 640 800 800 800
H_Blanking 160 224 176 200 192 224 256 240
H_Sync 96 64 40 64 56 72 128 120
H Polarity NEG. NEG. NEG. NEG. NEG. POS POS POS
H_Bp 48 96 120 120 80 128 88 64
H_Fp 16 64 16 16 56 24 40 56
H-Freq[KHz] 31.469 35.0 37.861 37.5 43.269 35.156 37.879 48.077
/Clk[MHz] 25.175 30.24 31.5 31.5 36.0 36.0 40.0 50.0
V_Total 525 525 520 500 509 625 628 666
V_Display 480 480 496 480 480 600 600 600
V_Blanking 45 45 24 20 29 25 28 66
V_Sync 2 3 3 3 3 2 4 6
V Polarity NEG NEG NEG NEG NEG POS POS POS
V_Bp 33 39 20 16 25 22 23 23
V_Fp 10 3 1 1 1 1 1 37
Mode SVGA-75 SVGA-85 XGA-60 XGA-70 XGA-75 MAC-75 XGA-85
H_Total 1056 1048 1344 1328 1312 1152 1376
H_Display 800 800 1024 1024 1024 832 1024
H_Blanking 256 248 320 304 288 320 352
H_Sync 80 64 136 136 96 64 96
H Polarity POS POS NEG POS NEG POS
H_Bp 160 152 136 144 176 224 208
H_Fp 16 32 160 24 16 32 48
H-Freq[KHz] 46.875 53.674 48.363 56.476 60.023 49.725 68.677
/Clk[MHz] 49.5 56.25 65.0 75.0 78.75 57.283 84.997
V_Total 625 631 806 806 800 667 808
V_Display 600 600 768 768 768 624 768
V_Blanking 25 31 38 38 32 43 40
V_Sync 3 3 6 6 3 3 3
V Polarity POS POS NEG NEG POS NEG POS
V_Bp 21 27 29 29 28 39 36
V_Fp 1 1 3 3 1 1 1
Mode VGA350-70 VGA350-85 VGA400-70 VGA400-85
H_Total 800 832 800 832
H_Display 640 640 640 640
H_Blanking 160 192 160 192
H_Sync 96 64 96 64
H Polarity POS POG NEG NEG
H_Bp 48 96 48 96
H_Fp 16 32 16 32
H-Freq[KHz] 31.468 37.86 31.46 37.86
/Clk[MHz] 25.17 31.47 25.17 31.5
V_Total 449 445 449 445
V_Display 350 350 400 400
V_Blanking 99 95 49 45
V_Sync 2 3 2 3
V Polarity NEG NEG POS POS
V_Bp 60 60 35 41
V_Fp 37 32 12 1
4. EDID(The Extended Display Identification Data)
EDID Table
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 00 FF FF FF FF FF FF 00 30 E5 D7 3A 01 00 00 00
10 00 0B 01 01 78 1F 17 70 E8 C3 A0 A3 54 4C 97 24
20 14 50 54 BF E8 80 31 59 3B D9 45 59 61 59 71 59
30 81 40 81 80 01 01 10 0E 01 01 01 01 01 01 01 01
40 01 01 01 01 01 01 01 01 F9 15 01 01 01 01 01 01
50 01 01 01 01 01 01 01 01 01 01 64 19 00 40 41 00
60 26 30 18 88 36 00 0E C3 10 00 00 1E 00 00 00 FD
70 00 32 55 1E 46 0D 00 0A 20 20 20 20 20 20 00 C8
5. Option1 data(200PR~A2 ST:1bit,SYS:2bit)
OPTION OPTION
200PR TEXT I/II SV TOP SCART A2 ST SYS 200PR TEXT I/II SV TOP SCART A2 ST SYS
Data Data
0 0 0 0 0 0 0 0 32 0 0 1 0 0 0 0
1 0 0 0 0 0 0 1 33 0 0 1 0 0 0 1
2 0 0 0 0 0 0 2 34 0 0 1 0 0 0 2
3 0 0 0 0 0 0 3 35 0 0 1 0 0 0 3
4 0 0 0 0 0 1 0 36 0 0 1 0 0 1 0
5 0 0 0 0 0 1 1 37 0 0 1 0 0 1 1
6 0 0 0 0 0 1 2 38 0 0 1 0 0 1 2
7 0 0 0 0 0 1 3 39 0 0 1 0 0 1 3
8 0 0 0 0 1 0 0 40 0 0 1 0 1 0 0
9 0 0 0 0 1 0 1 41 0 0 1 0 1 0 1
10 0 0 0 0 1 0 2 42 0 0 1 0 1 0 2
11 0 0 0 0 1 0 3 43 0 0 1 0 1 0 3
12 0 0 0 0 1 1 0 44 0 0 1 0 1 1 0
13 0 0 0 0 1 1 1 45 0 0 1 0 1 1 1
14 0 0 0 0 1 1 2 46 0 0 1 0 1 1 2
15 0 0 0 0 1 1 3 47 0 0 1 0 1 1 3
16 0 0 0 1 0 0 0 48 0 0 1 1 0 0 0
17 0 0 0 1 0 0 1 49 0 0 1 1 0 0 1
18 0 0 0 1 0 0 2 50 0 0 1 1 0 0 2
19 0 0 0 1 0 0 3 51 0 0 1 1 0 0 3
20 0 0 0 1 0 1 0 52 0 0 1 1 0 1 0
21 0 0 0 1 0 1 1 53 0 0 1 1 0 1 1
22 0 0 0 1 0 1 2 54 0 0 1 1 0 1 2
23 0 0 0 1 0 1 3 55 0 0 1 1 0 1 3
24 0 0 0 1 1 0 0 56 0 0 1 1 1 0 0
25 0 0 0 1 1 0 1 57 0 0 1 1 1 0 1
26 0 0 0 1 1 0 2 58 0 0 1 1 1 0 2
27 0 0 0 1 1 0 3 59 0 0 1 1 1 0 3
28 0 0 0 1 1 1 0 60 0 0 1 1 1 1 0
29 0 0 0 1 1 1 1 61 0 0 1 1 1 1 1
30 0 0 0 1 1 1 2 62 0 0 1 1 1 1 2
31 0 0 0 1 1 1 3 63 0 0 1 1 1 1 3
-8-
OPTION OPTION
200PR TEXT I/II SV TOP SCART A2 ST SYS 200PR TEXT I/II SV TOP SCART A2 ST SYS
Data Data
64 0 1 0 0 0 0 0 110 0 1 1 0 1 1 2
65 0 1 0 0 0 0 1 111 0 1 1 0 1 1 3
66 0 1 0 0 0 0 2 112 0 1 1 1 0 0 0
67 0 1 0 0 0 0 3 113 0 1 1 1 0 0 1
68 0 1 0 0 0 1 0 114 0 1 1 1 0 0 2
69 0 1 0 0 0 1 1 115 0 1 1 1 0 0 3
70 0 1 0 0 0 1 2 116 0 1 1 1 0 1 0
71 0 1 0 0 0 1 3 117 0 1 1 1 0 1 1
72 0 1 0 0 1 0 0 118 0 1 1 1 0 1 2
73 0 1 0 0 1 0 1 119 0 1 1 1 0 1 3
74 0 1 0 0 1 0 2 120 0 1 1 1 1 0 0
75 0 1 0 0 1 0 3 121 0 1 1 1 1 0 1
76 0 1 0 0 1 1 0 122 0 1 1 1 1 0 2
77 0 1 0 0 1 1 1 123 0 1 1 1 1 0 3
78 0 1 0 0 1 1 2 124 0 1 1 1 1 1 0
79 0 1 0 0 1 1 3 125 0 1 1 1 1 1 1
80 0 1 0 1 0 0 0 126 0 1 1 1 1 1 2
81 0 1 0 1 0 0 1 127 0 1 1 1 1 1 3
82 0 1 0 1 0 0 2 128 1 0 0 0 0 0 0
83 0 1 0 1 0 0 3 129 1 0 0 0 0 0 1
84 0 1 0 1 0 1 0 130 1 0 0 0 0 0 2
85 0 1 0 1 0 1 1 131 1 0 0 0 0 0 3
86 0 1 0 1 0 1 2 132 1 0 0 0 0 1 0
87 0 1 0 1 0 1 3 133 1 0 0 0 0 1 1
88 0 1 0 1 1 0 0 134 1 0 0 0 0 1 2
89 0 1 0 1 1 0 1 135 1 0 0 0 0 1 3
90 0 1 0 1 1 0 2 136 1 0 0 0 1 0 0
91 0 1 0 1 1 0 3 137 1 0 0 0 1 0 1
92 0 1 0 1 1 1 0 138 1 0 0 0 1 0 2
93 0 1 0 1 1 1 1 139 1 0 0 0 1 0 3
94 0 1 0 1 1 1 2 140 1 0 0 0 1 1 0
95 0 1 0 1 1 1 3 141 1 0 0 0 1 1 1
96 0 1 1 0 0 0 0 142 1 0 0 0 1 1 2
97 0 1 1 0 0 0 1 143 1 0 0 0 1 1 3
98 0 1 1 0 0 0 2 144 1 0 0 1 0 0 0
99 0 1 1 0 0 0 3 145 1 0 0 1 0 0 1
100 0 1 1 0 0 1 0 146 1 0 0 1 0 0 2
101 0 1 1 0 0 1 1 147 1 0 0 1 0 0 3
102 0 1 1 0 0 1 2 148 1 0 0 1 0 1 0
103 0 1 1 0 0 1 3 149 1 0 0 1 0 1 1
104 0 1 1 0 1 0 0 150 1 0 0 1 0 1 2
105 0 1 1 0 1 0 1 151 1 0 0 1 0 1 3
106 0 1 1 0 1 0 2 152 1 0 0 1 1 0 0
107 0 1 1 0 1 0 3 153 1 0 0 1 1 0 1
108 0 1 1 0 1 1 0 154 1 0 0 1 1 0 2
109 0 1 1 0 1 1 1 155 1 0 0 1 1 0 3
OPTION OPTION
200PR TEXT I/II SV TOP SCART A2 ST SYS 200PR TEXT I/II SV TOP SCART A2 ST SYS
Data Data
156 1 0 0 1 1 1 0 202 01 1 0 0 1 0 2
157 1 0 0 1 1 1 1 203 1 1 0 0 1 0 3
158 1 0 0 1 1 1 2 204 1 1 0 0 1 1 0
159 1 0 0 1 1 1 3 205 1 1 0 0 1 1 1
160 1 0 1 0 0 0 0 206 1 1 0 0 1 1 2
161 1 0 1 0 0 0 1 207 1 1 0 0 1 1 3
162 1 0 1 0 0 0 2 208 1 1 0 1 0 0 0
163 1 0 1 0 0 0 3 209 1 1 0 1 0 0 1
164 1 0 1 0 0 1 0 210 1 1 0 1 0 0 2
165 1 0 1 0 0 1 1 211 1 1 0 1 0 0 3
166 1 0 1 0 0 1 2 212 1 1 0 1 0 1 0
167 1 0 1 0 0 1 3 213 1 1 0 1 0 1 1
168 1 0 1 0 1 0 0 214 1 1 0 1 0 1 2
169 1 0 1 0 1 0 1 215 1 1 0 1 0 1 3
170 1 0 1 0 1 0 2 216 1 1 0 1 1 0 0
171 1 0 1 0 1 0 3 217 1 1 0 1 1 0 1
172 1 0 1 0 1 1 0 218 1 1 0 1 1 0 2
173 1 0 1 0 1 1 1 219 1 1 0 1 1 0 3
174 1 0 1 0 1 1 2 220 1 1 0 1 1 1 0
175 1 0 1 0 1 1 3 221 1 1 0 1 1 1 1
176 1 0 1 1 0 0 0 222 1 1 0 1 1 1 2
177 1 0 1 1 0 0 1 223 1 1 0 1 1 1 3
178 1 0 1 1 0 0 2 224 1 1 1 0 0 0 0
179 1 0 1 1 0 0 3 225 1 1 1 0 0 0 1
180 1 0 1 1 0 1 0 226 1 1 1 0 0 0 2
181 1 0 1 1 0 1 1 227 1 1 1 0 0 0 3
182 1 0 1 1 0 1 2 228 1 1 1 0 0 1 0
183 1 0 1 1 0 1 3 229 1 1 1 0 0 1 1
184 1 0 1 1 1 0 0 230 1 1 1 0 0 1 2
185 1 0 1 1 1 0 1 231 1 1 1 0 0 1 3
186 1 0 1 1 1 0 2 232 1 1 1 0 1 0 0
187 1 0 1 1 1 0 3 233 1 1 1 0 1 0 1
188 1 0 1 1 1 1 0 234 1 1 1 0 1 0 2
189 1 0 1 1 1 1 1 235 1 1 1 0 1 0 3
190 1 0 1 1 1 1 2 236 1 1 1 0 1 1 0
191 1 0 1 1 1 1 3 237 1 1 1 0 1 1 1
192 1 1 0 0 0 0 0 238 1 1 1 0 1 1 2
193 1 1 0 0 0 0 1 239 1 1 1 0 1 1 3
194 1 1 0 0 0 0 2 240 1 1 1 1 0 0 0
195 1 1 0 0 0 0 3 241 1 1 1 1 0 0 1
196 1 1 0 0 0 1 0 242 1 1 1 1 0 0 2
197 1 1 0 0 0 1 1 243 1 1 1 1 0 0 3
198 1 1 0 0 0 1 2 244 1 1 1 1 0 1 0
199 1 1 0 0 0 1 3 245 1 1 1 1 0 1 1
200 1 1 0 0 1 0 0 246 1 1 1 1 0 1 2
201 1 1 0 0 1 0 1 247 1 1 1 1 0 1 3
OPTION
200PR TEXT I/II SV TOP SCART A2 ST SYS
Data
248 1 1 1 1 1 0 0
249 1 1 1 1 1 0 1
250 1 1 1 1 1 0 2
251 1 1 1 1 1 0 3
252 1 1 1 1 1 1 0
253 1 1 1 1 1 1 1
254 1 1 1 1 1 1 2
255 1 1 1 1 1 1 3
6. Option2 data(ACMS~BBACK:1bit,LANG:3bit)
OPTION
ACMS VOL HIDEV
Data
0 0 0 0
1 0 0 1
2 0 1 0
3 0 1 1
4 1 0 0
5 1 0 1
6 1 1 0
7 1 1 1
7. Option3 data(IIC AFT~CH+AU:1bit)
OPTION
IIC AFT MD SAVE MONO CH+AUS
Data
0 0 0 0 0
1 0 0 0 1
2 0 0 1 0
3 0 0 1 1
4 0 1 0 0
5 0 1 0 1
6 0 1 1 0
7 0 1 1 1
8 1 0 0 0
9 1 0 0 1
10 1 0 1 0
11 1 0 1 1
12 1 1 0 0
13 1 1 0 1
14 1 1 1 0
15 1 1 1 1
TROUBLESHOOTING
1. General Features
No. Symptom Cause Check Point
1 Button doesn't 1) Broken components and 1) Check button with eyes
function soldering of them Check and repair soldering
2) P2 connector error 2) Check and repair the P2 connector
2 No screen Input error of inverter connector 1) Bend the pin legs of P1 connector -> recheck them
2) Check and repair the IC804,805 SI4925
P902 and Pin 21 connector 1) Check and fix P902 connector
being slipped out 2) Check and fix the components at P902 LCD module
and at main board.
3) Check Pin21.
Cracked components and 1) Check and repair tuner board and main board
soldering at tuner board 2) Solder Q102.
3 Dark screen 1) Defective LCD lamp 1) Replace the inverter
2) Defective inverter 2) Replace the LCD lamp
3) Input error of inverter connector 3) Check the connector input.
2. PC Mode
No. Symptom Cause Check Point
4 Screen noise Clock or phase being 1) Resettig is needed according to the video card of each
not able to be adjusted PC
2) Horizontal noise : adjust phase until no horizontal
noise occurres
3) Vertical noise : adjust clock in menu until no vertical
noise occurres
5 Screen position error Screen position error 1) Play the Auto Configure in Menu.
horizontally or vertically 2) Adjust horizontal and vertical position until the screen
displayes normally
6 Color beat noise Soldering D-SUB Jack of JA202 Recheck and repair JA202,IC202
and IC202.
3. TV and external input
No. Symptom Cause Check Point
7 No sound Defective Reset IC of IC603 1) Check volume and speaker
- Speaker Defective MSP3440G of IC601 - Sound comes out only when being inputted into Audio
- Earphone Defective B+(8V,5V) of IC604,605. L/R
2) Check after replacing IC603
3) Replace IC601
4) Check and replace B+ of IC604,605.
8 Video color beat noise Earphone shield case being touched Check the mold of shield and JA203, Replace shield case
Soldering IC301 and IC912 Re-soldering
MEMO
EXPLODED VIEW
521
400
500
P801
A4
410
121
120 540
541
300
112
530
310
420
430
440
EXPLODED VIEW PARTS LIST
No. PART NO. DESCRIPTION
112 6304FLP006B LCD,LC151X01-C3P1 LG PHILPS TFT CO
120 6400VA0017A SPEAKER,GENERAL T401SX-095K14 LG C&D 8 OHM 1.0
121 4950V00010A METAL,HOLDER SPK SBHG NON
300 3091V00226R CABINET ASSEMBLY,LN-15A15 ACBLKC ML012A
310 5020V00360B BUTTON,CONTROL RUBBER SET
400 3809V00275J BACK COVER ASSEMBLY
410 4950V00025B METAL,TITLING ASSY
420 4950V00006A METAL,STAND SECC
430 4930V00103B HOLDER,STAND ABS AF-303S(04431B,WHITE
440 3550V00081A COVER,BASE LN-15A1
500 3141VMNC22M CHASSIS ASSEMBLY,MAIN ML012A
530 6871VSMA56A PCB ASSEMBLY,SUB CONT ML-012A LE-15A15
540 6633VA0003K INVERTER ASSEMBLY,12VOLT VOLT ECT ALPS4LAMP
541 4814V00228A SHIELD,CASE INVERTER ET-C 32X203 400
REPLACEMENT PARTS LIST
For Capacitor & Resistors, the CC, CX, CK, CN : Ceramic RD : Carbon Film
charactors at 2nd and 3rd digit CQ : Polyestor RS : Metal Oxide Film
in the P/No. means as follows; CE : Electrolytic RN : Metal Film RUN DATE : 2002.7.2
RF : Fusible
LOCA. NO PART NO DESCRIPTION LOCA. NO PART NO DESCRIPTION
Q704 0TR388009BB KTC3880-Y TP KEC SOT23 CHIP
IC
Q705 0TR388009BB KTC3880-Y TP KEC SOT23 CHIP
IC1 0IZZVC0042F M37136EFSP 52P ST ML-012A
Q706 0TR388009BB KTC3880-Y TP KEC SOT23 CHIP
IC2 0IAL241600B AT24C16-10PC 8D EEPROM 16K
Q707 0TR388009BB KTC3880-Y TP KEC SOT23 CHIP
IC3 0IFA752700A KA75270Z 3 TP RE-SET IC MC-007
Q708 0TR388009BB KTC3880-Y TP KEC SOT23 CHIP
IC4 0IMCRNS002A LM1881M NATIONAL SEMICONDUCTOR
Q709 0TR388009BB KTC3880-Y TP KEC SOT23 CHIP
IC201 0IAL242110A AT24C21-10SI-2.5 8P,SOP TP 1K
Q711 0TR150400BA CHIP 2SA1504S(ASY) KEC
IC202 0IPH740800M 74F08D 14P SOIC R/TP QUAD 2-IN
Q712 0TR387500AA CHIP 2SC3875S(ALY) KEC
IC301 0IIT323000D VPC3230D QA B4 80P QFP TRAY SO
Q713 0TR387500AA CHIP 2SC3875S(ALY) KEC
IC302 0IHY100100A LGTV1001 64P QFP BK PROGRESSIV
Q714 0TR387500AA CHIP 2SC3875S(ALY) KEC
IC601 0IMCRMN014A MSP3440G QA B8 V3 MICRONAS 80
Q715 0TR387500AA CHIP 2SC3875S(ALY) KEC
IC602 0ISA428200A LA4282 12S 2CHX10W AUDIO AMP
Q720 0TR102009AG CHIP KRC102S SOT-23 TP KEC
IC603 0IKE704200J KIA7042AF SOT-89 TP 4.2V VOLTA
Q721 0TR102009AG CHIP KRC102S SOT-23 TP KEC
IC604 0IMCRFA009A KA78M08RTM, FAIRCHILD 2P D-PAK
Q722 0TR102009AG CHIP KRC102S SOT-23 TP KEC
IC605 0IMCRFA008A KA78M05RTM, FAIRCHILD 2P D-PAK
Q723 0TR102009AG CHIP KRC102S SOT-23 TP KEC
IC701 0ISG747410A M74HC74M1R 14P,SOP TP DUAL DTY
Q725 0TR102009AG CHIP KRC102S SOT-23 TP KEC
IC702 0ISG747410A M74HC74M1R 14P,SOP TP DUAL DTY
Q726 0TR102009AG CHIP KRC102S SOT-23 TP KEC
IC801 0ITC786000A SI786 28SSOP TP DUAL-OUTPUT PO
Q727 0TR102009AG CHIP KRC102S SOT-23 TP KEC
IC901 0IMCRG2004B JAGASM A4 SAGE 352BA
Q728 0TR102009AG CHIP KRC102S SOT-23 TP KEC
IC902 0IPH806520A 80C652 40 PLCC ST 8-BIT MICROC
Q801 0TR387500AA CHIP 2SC3875S(ALY) KEC
IC903 0IPH743730E 74HCT373D 20SOP R/TP ADDRESS L
Q901 0TR387500AA CHIP 2SC3875S(ALY) KEC
IC904 0IZZVC0041A M27C512_10F1 DIP BK
Q903 0TR387500AA CHIP 2SC3875S(ALY) KEC
IC905 0ISS416162C K4S161622E-TC80 50TSOP R/TP SD
Q904 0TR387500AA CHIP 2SC3875S(ALY) KEC
IC906 0ISS416162C K4S161622E-TC80 50TSOP R/TP SD
IC907 0IPH740400G 74HC04D HEX INVERTER 14P,SOP T DIODE
IC908 0IAL241610A AT24C16N-10SI 8P SOIC ST EEPRO
D1 0DD181009AB KDS181 TP KEC - 85V - - - 300M
IC909 0IMCRFA020A RC1587DT_36 FAIRCHIL
D2 0DD181009AB KDS181 TP KEC - 85V - - - 300M
IC914 0IMCRTH001A THC63LVDM83R THINE E
D601 0DD181009AB KDS181 TP KEC - 85V - - - 300M
TRANSISTOR D602 0DD181009AB KDS181 TP KEC - 85V - - - 300M
D701 0DD181009AB KDS181 TP KEC - 85V - - - 300M
IC802 0TFVI80001A FETS,VISHAY SI4808DY R/TP SO-8 30V
D702 0DD181009AB KDS181 TP KEC - 85V - - - 300M
IC803 0TFVI80001A FETS,VISHAY SI4808DY R/TP SO-8 30V
D801 0DD181009AB KDS181 TP KEC - 85V - - - 300M
IC804 0TFVI80005A FETS,VISHAY SI4963DY R/TP SO-8 -20V
D802 0DD181009AB KDS181 TP KEC - 85V - - - 300M
IC805 0TF492509AA FET,SI4925DY TP TEMIC 30V 6.1A SO
D805 0DD181009AB KDS181 TP KEC - 85V - - - 300M
IC913 0TF492509AA FET,SI4925DY TP TEMIC 30V 6.1A SO
LD1 0DL112100AB LED,SM3411(DL-11S2GN1) BK Y-GREEN
Q3 0TR387500AA CHIP 2SC3875S(ALY) KEC
ZD101 0DZ330009BA ZENER,HZT33(TP) HITACHI
Q5 0TR387500AA CHIP 2SC3875S(ALY) KEC
ZD211 0DZRM00178A ZENER,UDZS TE-17 5.1B ROHM R/TP SMD
Q102 0TR387500AA CHIP 2SC3875S(ALY) KEC
ZD700 0DZRM00178A ZENER,UDZS TE-17 5.1B ROHM R/TP SMD
Q204 0TR387500AA CHIP 2SC3875S(ALY) KEC
Q205 0TR387500AA CHIP 2SC3875S(ALY) KEC CAPACITOR
Q206 0TR387500AA CHIP 2SC3875S(ALY) KEC
C17 0CE107SF6DC 100UF MVG 16V M
Q207 0TR387500AA CHIP 2SC3875S(ALY) KEC
C20 0CE107SF6DC 100UF MVG 16V M
Q208 0TR387500AA CHIP 2SC3875S(ALY) KEC
C21 0CE106SF6DC 10UF MVG 16V 20%
Q209 0TR387500AA CHIP 2SC3875S(ALY) KEC
C24 0CE107SF6DC 100UF MVG 16V M
Q210 0TR387500AA CHIP 2SC3875S(ALY) KEC
C25 0CE227VF6DC 220UF MV 16V 20%
Q301 0TR387500AA CHIP 2SC3875S(ALY) KEC
C60 0CK224DF56A 220000PF 2012 16V 10%
Q605 0TR150400BA CHIP 2SA1504S(ASY) KEC
C63 0CE476SF6DC 47UF MVG 16V M
Q702 0TR388009BB KTC3880-Y TP KEC SOT23 CHIP
C69 0CE105VK6DC 1UF MV 50V 20%
Q703 0TR388009BB KTC3880-Y TP KEC SOT23 CHIP
C101 0CE476DH618 47UF STD 25V 20%
For Capacitor & Resistors, the CC, CX, CK, CN : Ceramic RD : Carbon Film
charactors at 2nd and 3rd digit CQ : Polyestor RS : Metal Oxide Film
in the P/No. means as follows; CE : Electrolytic RN : Metal Film
RF : Fusible
LOCA. NO PART NO DESCRIPTION LOCA. NO PART NO DESCRIPTION
C105 0CE106DK618 10UF STD 50V M C653 0CE107DF618 100UF STD 16V M
C107 0CE108DD618 1000UF STD 10V M C654 0CK224DF56A 220000PF 2012 16V 10%
C113 0CE105DK618 1UF STD 50V M C655 0CK224DF56A 220000PF 2012 16V 10%
C115 0CE107DF618 100UF STD 16V M C801 0CE476DK618 47UF STD 50V M
C209 0CE225VK6DC 2.2UF MV 50V 20% C802 0CE477DF618 470UF STD 16V 20%
C214 0CE476SF6DC 47UF MVG 16V M C803 0CE477DF618 470UF STD 16V 20%
C217 0CE106SF6DC 10UF MVG 16V 20% C804 0CE477DF618 470UF STD 16V 20%
C220 0CE106SF6DC 10UF MVG 16V 20% C805 0CE477DF618 470UF STD 16V 20%
C221 0CE106SF6DC 10UF MVG 16V 20% C806 0CE477DF618 470UF STD 16V 20%
C302 0CE476SF6DC 47UF MVG 16V M C807 0CE477DF618 470UF STD 16V 20%
C323 0CE106SF6DC 10UF MVG 16V 20% C808 0CE227DH618 220UF STD 25V M
C331 0CK224DF56A 220000PF 2012 16V 10% C814 0CE107DH618 100UF STD 25V M
C332 0C