Text preview for : 21062.pdf part of JVC TH-A5 TH-A5 - DVD DIGITAL CINEMA SYSTEM - Service Manual, Part list, Schematics



Back to : TH-A5._DVD_Theater.part1. | Home

TH-A5

SERVICE MANUAL
DVD DIGITAL CINEMA SYSTEM

TH-A5

Area suffix

A ------------------ Australia US -------------- Singapore UB ------------- Hong Kong UW -- Brazil,Mexico,Peru UY --------------- Argentina UJ ------------- U.S.Military UG ------------------ Turkey, South Africa,Egypt

STANDBY/ON AUDIO VCR TV VCR CONTROL ON OFF

TOP MENU

MENU

TV CHANNEL

AUDIO/ FM MODE SUBTITLE

TV VOLUME

DISPLAY RETURN

STEP

TV/VIDEO

TUNER PRESET DOWN REW VCR CHANNEL TUNING B.SEARCH F.SEARCH UP FF

SP-XSA5 2

SP-XCA5

SP-XSA5 2

ENTER

VOLUME DVD FM/AM AUX MUTING

COMPACT

DIGITAL VIDEO

STANDBY AUDIO/FM MODE STANDBY/ON DSP VOLUME SOURCE
DVD DIGITAL CINEMA SYSTEM TH-A5
RM-STHA5U
DVD CINEMA SYSTEM

D I G I T A L

SURROUND
D I G I T A L

XV-THA5

SP-WA5

Contents
Safety precautions Important for laser products Preventing static electricity Disassembly method 1-2 1-3 1-4 1-5 Wiring connection Adjustment method Description of major ICs 1-12 1-13 1-15~33

COPYRIGHT

2002 VICTOR COMPANY OF JAPAN, LTD.

No.21062 Jan. 2002

TH-A5

1. This design of this product contains special hardware and many circuits and components specially for safety purposes. For continued protection, no changes should be made to the original design unless authorized in writing by the manufacturer. Replacement parts must be identical to those used in the original circuits. Services should be performed by qualified personnel only. 2. Alterations of the design or circuitry of the product should not be made. Any design alterations of the product should not be made. Any design alterations or additions will void the manufacturer`s warranty and will further relieve the manufacture of responsibility for personal injury or property damage resulting therefrom. 3. Many electrical and mechanical parts in the products have special safety-related characteristics. These characteristics are often not evident from visual inspection nor can the protection afforded by them necessarily be obtained by using replacement components rated for higher voltage, wattage, etc. Replacement parts which have these special safety characteristics are identified in the Parts List of Service Manual. Electrical components having such features are identified by shading on the schematics and by ( ) on the Parts List in the Service Manual. The use of a substitute replacement which does not have the same safety characteristics as the recommended replacement parts shown in the Parts List of Service Manual may create shock, fire, or other hazards. 4. The leads in the products are routed and dressed with ties, clamps, tubings, barriers and the like to be separated from live parts, high temperature parts, moving parts and/or sharp edges for the prevention of electric shock and fire hazard. When service is required, the original lead routing and dress should be observed, and it should be confirmed that they have been returned to normal, after re-assembling. 5. Leakage currnet check (Electrical shock hazard testing) After re-assembling the product, always perform an isolation check on the exposed metal parts of the product (antenna terminals, knobs, metal cabinet, screw heads, headphone jack, control shafts, etc.) to be sure the product is safe to operate without danger of electrical shock. Do not use a line isolation transformer during this check. Plug the AC line cord directly into the AC outlet. Using a "Leakage Current Tester", measure the leakage current from each exposed metal parts of the cabinet, particularly any exposed metal part having a return path to the chassis, to a known good earth ground. Any leakage current must not exceed 0.5mA AC (r.m.s.). Alternate check method Plug the AC line cord directly into the AC outlet. Use an AC voltmeter having, 1,000 ohms per volt or more sensitivity in the following manner. Connect a 1,500 10W resistor paralleled by a 0.15 F AC-type capacitor between an exposed metal part and a known good earth ground. AC VOLTMETER Measure the AC voltage across the resistor with the AC (Having 1000 ohms/volts, voltmeter. or more sensitivity) Move the resistor connection to each exposed metal part, particularly any exposed metal part having a return path to 0.15 F AC TYPE the chassis, and meausre the AC voltage across the resistor. Place this Now, reverse the plug in the AC outlet and repeat each probe on measurement. Voltage measured any must not exceed 0.75 V each exposed AC (r.m.s.). This corresponds to 0.5 mA AC (r.m.s.). 1500 10W metal part.
Good earth ground

1. This equipment has been designed and manufactured to meet international safety standards. 2. It is the legal responsibility of the repairer to ensure that these safety standards are maintained. 3. Repairs must be made in accordance with the relevant safety standards. 4. It is essential that safety critical components are replaced by approved parts. 5. If mains voltage selector is provided, check setting for local voltage.

! Burrs formed during molding may be left over on some parts of the chassis. Therefore, pay attention to such burrs in the case of preforming repair of this system.

In regard with component parts appearing on the silk-screen printed side (parts side) of the PWB diagrams, the parts that are printed over with black such as the resistor ( ), diode ( ) and ICP ( ) or identified by the " " mark nearby are critical for safety. (This regulation does not correspond to J and C version.)

1-2

TH-A5

Important for laser products
1.CLASS 1 LASER PRODUCT 2.DANGER : Invisible laser radiation when open and inter lock failed or defeated. Avoid direct exposure to beam. 3.CAUTION : There are no serviceable parts inside the Laser Unit. Do not disassemble the Laser Unit. Replace the complete Laser Unit if it malfunctions. 4.CAUTION : The compact disc player uses invisible laserradiation and is equipped with safety switches whichprevent emission of radiation when the drawer is open and the safety interlocks have failed or are de feated. It is dangerous to defeat the safety switches. 5.CAUTION : If safety switches malfunction, the laser is able to function. 6.CAUTION : Use of controls, adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

!

Please use enough caution not to see the beam directly or touch it in case of an adjustment or operation check.

REPRODUCTION AND POSITION OF LABELS CLASS 1 LASER PRODUCT

1-3

TH-A5

Preventing static electricity
1.Grounding to prevent damage by static electricity
Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.

2.About the earth processing for the destruction prevention by static electricity
Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players. Be careful to use proper grounding in the area where repairs are being performed.

2-1 Ground the workbench
Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the traverse unit (optical pickup) on it.

2-2 Ground yourself
Use an anti-static wrist strap to release any static electricity built up in your body.

(caption) Anti-static wrist strap Conductive material (conductive sheet) or iron plate

3. Handling the optical pickup

1. In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical pickup are shorted. After replacement, return the shorted parts to their original condition. (Refer to the text.) 2. Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily destroy the laser diode.

4.Handling the traverse unit (optical pickup)
1. Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit. 2. Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a time when attaching it to the connector. 3. Handle the flexible cable carefully as it may break when subjected to strong force. 4. It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.

Attention when traverse unit is decomposed
*Please refer to "Disassembly method" in the text for pick-up and how to detach the substrate. 1. Solder is put up before the card wire is removed from connector on the pick up board as shown in Figure. (When the wire is removed without putting up solder, the CD pick-up assembly might destroy.) 2. Please remove solder after connecting the card wire with when you install picking up in the substrate.

DVD mechanism assembly (bottom side)

Short land
DVD loading mechanism

(These two points are soldered respectively, and are made to short-circuit)

Connector Pick up board Card wire

DVD loader board

1-4

TH-A5

Disassembly method
Removing the top cover (See Fig.1)
1. Remove the four screws A attaching the top cover on the both sides of the body. 2. Remove the two screws B on the back of the body. 3. Remove the top cover from behind in the direction of the arrow while pulling both sides outward.

Top cover

B

A C
Claw1

2

Fig.1
Front panel assembly

C

Removing the front panel assembly (See Fig.2A, 2B and 3)
Prior to performing the following procedure, remove the top cover. 1. Remove the one screw a and remove the earth wier. 2. Remove the three screws C attaching the front panel assembly on the bottom of the body. 3. Remove the two screws D attaching the front panel assembly on the both sides of the body. 4. Remove the claw1, claw2 and claw3, and detach the front panel assembly toward the front. 5. Disconnect the card wire from the connector DW20 on the DSP board.

(bottom side)

Fig.2A
Front panel assembly Claw2 (both side) Claw3

Removing the power cord

(See Fig.4)

Prior to performing the following procedure, remove the top cover. 1. Disconnect the power cord from the connector CW1 on the main board and pull up the cord stopper upward.
Notes : The power cord is exchangeable.
Power cord CW1 Tie band

D
(both side)

(fixing the earth wire)

a

Fig.2B
DSP board

DW20

Front panel assembly (Inner side) Rear panel

Display board

Fig.4

Power cord stopper

Fig.3
1-5

TH-A5

Removing the DVD mechanism assembly (See Fig.5 and 6)
Prior to performing the following procedure, remove the top cover. 1. Disconnect the card wire from the connector J14 and J21 on the DVD MPEG board. 2. Remove the two screws E attaching the DVD mechanism assembly and pull up with drawing out. 3. Disconnect the harness from the connector J2 on the DVD loader board.

DVD mechanism assembly DVD MPEG board

J14

E
J21

Removing the rear panel (See Fig.7 and 8)
Prior to performing the following procedure, remove the top cover and power cord. 1. Disconnect the harness from the connector NW11 on the DSP board. 2. Remove the two screws F, four screws G, five screws I attaching the each boards to the rear panel. 3. Remove the three screws J attaching the rear panel on the back of the body.
Rear panel

Fig.5
DVD mechanism assembly

Removing the tuner pack (See Fig.7 and 8)
Prior to performing the following procedure, remove the top cover. 1. Disconnect the card wire from the connector CON01 on the tuner pack. 2. Remove the two screws F attaching the tuner pack to the rear panel. Fan motor
DVD loader board J2

Fig.6 Rear panel

H

G

Removing the jack board (See Fig.7 and 8)
Prior to performing the following procedure, remove the top cover. 1. Disconnect the card wire from the connector VW2 on the jack board. 2. Remove the four screws G attaching the jack board to the rear panel. 3. Disconnect the connector VW1 on the jack board and pull up the jack board.

J

I
Fig.7 DSP board

J

F

J

CON01

Removing the fan motor (See Fig.7 and 8)
Prior to performing the following procedures, remove the top cover . 1. Disconnect the harness from the connector NW11 on Rear panel the DSP board . 2. Removing the two screws H attaching the fan motor on the rear panel.
1-6

VW2

NW11 (on the DSP board)

VW1

Tuner pack Jack board

Fig.8

TH-A5
Removing the DSP board (See Fig.9)
DSP board VW12 Harness band Main board

Prior to performing the following procedure, remove the top cover, the front panel assembly and jack board. 1. Untied the harness band and disconnect the harness from the connector CW2 on the main board. 2. Disconnect the harness from the connector NW11 on the DSP board. 3. Disconnect the card wire from the connector VW12 on the DSP board. 4. Pull up the DSP board from the front side upwards disconnecting the connector DW10, DW13, DW14 and DW15.
CW2

NW11

(Front panel side)

DW15

DW14 DW13

DW10

Fig.9
Main board

K1

Removing the main board

(See Fig.10)

Prior to performing the following procedure, remove the top cover, front panel assembly, DVD mechanism assembly, jack board and DSP board. 1. Disconnect the card wire from the connector CW4 and CW8 on the main board. 2. Disconnect the harness from the connector CW3 on the main board. 3. Remove the five screws I attaching the speaker terminals and jack to the rear panel (see fig.7). 4. Remove the six screws K1 (short) and one screw K2 (long) attaching the main board. 5. When the rear panel is not removed, pull up the main board from front side.

CW8

K2

Heat sink (to which power transistor is attached)

K1

CW4

CW3 Power ICs

Fig.10
(Each power transistor is fixed) Solder part Solder part Solder part Main board (Reverse side )

Removing the power transistor & power IC (See Fig.10 and 11)
Prior to performing the following procedure, remove the top cover, front panel assembly, DVD mechanism assembly, jack board, DSP board and main board. 1. After removing the solder part soldered to the main board, remove each screw and remove the heat sink from Power transistor. 2. After removing the solder part soldered to the main board, remove each screw and remove the heat sink from Power IC.

Solder part (Power IC is fixed) Heat sink (to which power IC is attached)

Fig.11

(Rear panel side)

1-7

TH-A5
Removing the DVD power board (See Fig.12)
Prior to performing the following procedure, remove the top cover, front panel assembly and DSP board. 1. Disconnect the harness and card wire from the connector PW1, PW2 and PW5 on the DVD power board. 2. Remove the one screw L1 (short) and two screws L2 (long) attaching the DVD power board.
Tie band

L1
PW5 PW2 DVD power board

Power transformer

Removing the power transformer (See Fig.12)
Prior to performing the following procedure, remove the top cover. 1. Cut off the tie band fixing the harness, if needed. 2. Disconnect the harness from the connector CW2 on the main board (see fig.9) and PW1, PW2 on the DVD power board. 3. Remove the four screws M attaching the power transformer.

PW1

L2

M
Fig.12


Removing the display board & switch board (See Fig.1 and 2)
Prior to performing the following procedure, remove the top cover and the front panel assembly. 1. Disconnect the card wire from the connector FW1 on the display board. 2. Remove the five screws A attaching the display board on the inner of the front panel assembly. 3. Remove the four screws B attaching the switch board on the inner of the front panel assembly. 4. Disconnect the harness from connector FW2 on the display board, if needed.
FW1 Display board

Front panel assembly (inner side) Switch board

A

FW2

B

Fig.1

Switch button

C

C

C

Removing the front window (See Fig.2 and 3)
Prior to performing the following procedure, remove the top cover, front panel assembly, display board and switch board. 1. Remove the switch buttons, if needed. 2. Remove the three screws C attaching the front window on the front panel. 3. Remove the eight claws fixing the front window on the front panel. 1-8

Claw

Fig.2
Front panel assembly (front side)

Front window

Fig.3

TH-A5


Removing the DVD loader board (See Fig.1 to 3)
Prior to performing the following procedure, remove the top cover and DVD mechanism assembly. 1. Disconnect the card wire from the connector J6 on the DVD MPEG board. 2. Disconnect the harness from the connector on the motor board. 3. Disconnect the harness from the connector J5 on the DVD loader board. 4. Remove the four screws A attaching the DVD loader board to DVD mechanism assembly.
DVD loader board DVD MPEG board J6

DVD mechanism assembly (top side)

Fig.1
DVD mechanism assembly (bottom side)
Motor board

A

CAUTION!!

(see fig.3)

Before removing the card wire which connects the pickup board and DVD loader board, solder the two soldering parts and make it short-circuit. Moreover, while having removed the card wire, don't remove these solder. 5. Disconnect the card wire from the connector U9 on the DVD loader board. ONE POINT How to eject the DVD tray manually (see fig.2) The white lever of the mark is moved in the direction of the arrow. Then, the tray will be opened. Moreover, the tray is separable from a DVD mechanism assembly by removing two screws of the mark (see fig.1) and drawing out the tray.

U9

J5

Connector

Fig.2

Pick up board

Soldering parts

Motor board

DVD loading mechanism

Fig.3

Removing the DVD loading mechanism (See Fig.4)
Prior to performing the following procedure, remove the top cover, DVD mechanism assembly and DVD loader board. 1. Remove the two screws B and remove the bracket. 2. Remove the one screw C fixing the DVD loading mechanism. 3. Move the lever in the direction of the arrow X. 4. Remove the DVD loading mechanism from the DVD mechanism assembly by moving it in the direction of the arrow Y.

B X
Lever

DVD mechanism assembly (bottom side)
Bracket

DVD loading mechanism

Y C
Fig.4

1-9

TH-A5
Removing the DVD traverse mechanism (See Fig.5)
Prior to performing the following procedure, remove the top cover, DVD mechanism assembly, DVD loader board and DVD loading mechanism. 1. Remove the four screws D attaching the DVD traverse mechanism to DVD loading mechanism.
DVD traverse mechanism

DVD loading mechanism (top side)

D

D

Fig.5

Removing the holder & DVD MPEG board (See Fig.6 and 7)
Holder

Prior to performing the following procedure, remove the top cover, DVD mechanism assembly and DVD loader board. 1. Remove the two claws1, and remove the holder from the DVD mechanism assembly as it is pushed down.
Note: When removing only the DVD MPEG board, it is not necessary to remove this holder.
Claw1

2. Remove the four claws2 and remove the DVD MPEG board from the holder.
DVD mechanism assembly (bottom side)

Fig.6
Holder

DVD MPEG board

Fig.7

Claw2

DVD MPEG board

ONE POINT When inserting DVD MPEG board in holder. (see fig.8) Insert in after uniting with a lower claws, when inserting DVD MPEG board in holder.

Holder

Fig.8

1-10

TH-A5

[SP-XSA5 / Satellite speaker]
It is exchange in a unit.

[SP-XCA5 / Center speaker]
It is exchange in a unit.

Front panel

[SP-WA5 / Woofer]
Removing the front panel (See Fig.1 and 2)
1. Remove the six bosses and remove the front panel.
Notes: It will be good to use the tool with a flat tip, since it is hard to remove. Please take care not to damage the cabinet at this time.
The tool with a flat tip

Fig.1

Front panel (inner side)

2. The packing separates. It removes if needed.
Boss

Removing the speaker unit (See Fig.3 to 5)
1. Remove the four bosses and remove the net assembly.
Notes: It will be good to use the tool with a flat tip, since it is hard to remove. Please take care not to damage the cabinet at this time.
Packing

Fig.2
Net assembly

2. Remove the eight screws A attaching the speaker unit to cabinet.
Boss

3. Disconnect the code from the two terminals of the speaker unit.

Terminals red Code Speaker unit black

Fig.3

A

A

Speaker unit (reverse side)

Cabinet

Fig.5

Fig.4

1-11

Color codes are shown below. 1 Brown 6 Blue 2 Red 7 Violet 3 Orange 8 Gray 4 Yellow 9 White 5 Green 0 Black

JACK BOARD (V-OUT) TUNER PACK VW2 VW1 0 2 CON01 3809-001274

1 C

FU3 FU4 FU2 FU1

PT1

CW5

CW1 CW8 RE3

CW2

MAIN BOARD

RE4

3809-001224
3809-001294

CW6 2

U9 J5 9 DVD LOADER BOARD J3 J4 0 0 9 9 0

J2

0

NW11

CW7 CW4 DW11 DW23
AH39-00104A DSP2 BOARD

CW3 DW10 DW31 8 3 0 9 2 4

2
AH39-00291A DSP1 BOARD

DW13 DW12 AH39-00368A DW14

6 3809-001283 DW32 0 2 9

1

5

0

3

4

3809-001273

3809-001295

0 4 3 2 8 VW11 9 DW15 0 PW5 PW2 PW4 DVD POWER BOARD DW20 9 PW3 PW1

0

2

Wiring connection

DVD MPEG BOARD J21

1

9 2

9

0

6

4

5

3

J6 0 J14 2 0 9 0

POWER TRANCE

6

1

0 6 1 3809-001296 SWITCH BOARD FW3 9 0 AH39-00176A FW2

AH39-50001K

FW1

TH-A5

DISPLAY BOARD

1-12

TH-A5

Adjustment method
1. Tuner

*Adjustment Location of Tuner PCB
AM(MW) RF Adjustment

ITEM

AM(MW) OSC Adjustment

Received FREQ.

A : 522~1629KHz (9k step) US/UB/ : 531~1602KHz (9k step) UW/UJ 530~1600KHz (10k step) MO 1~7.0V

603 KHz

Adjustment point

MA
Maximum Output(Fig1-1)

Output

MAIN PCB

VT

GND

TESTER

Fig 1-1 OSC Voltage

1-13

TH-A5
FM THD Adjustment SSG FREQ. Adjustment point (FD) Output 98 MHz FM DETECTOR COIL 60 dB
Output GND FM S.S.G Speaker T Te Terminal output Distortion Meter
Input

FM Antenna SET T Te Terminal Input Oscilloscope

Minimum Distortion (0.4% below) (Figure 1-2)

Figure1-2 IF CENTER and THD Adjustment

FM Search Level Adjustment SSG FREQ. Adjustment point (SVR3) Output 98 MHz BEACON SENSITIVITY SEMI-VR(20K ) 28 dB( dB)
20 k 28 dB FM Antenna SET FM S.S.G GND FM IN

Adjust SVR1 so that "TUNED" of FL T is lighted (Figure 1-3) *Adjust FM S.S.G level to 28dB

Figure1-3 FM Auto Search Level Adjustment

AM(MW) I.F Adjustment SSG FREQ. Frequency Adjustment point 450 kHz

60cm AM IF

522 kHz
OUTPUT

AM ANT IN Speaker Terminal

AA
AM SSG 450KHZ
INPUT

Maximum output (Figure 1-4)
OUTPUT

VTVM

Oscilloscope

Figure1-4 AM I.F Adjustment

Notes: This set is a non-adjusted set fundamentally. It is adjusted when the tuner pack is exchanged.
1-14

TH-A5

Description of major ICs
BA5983FM (U6) : 4CH driver
1.Block diagram
28 27 26 25 24 23 22 21 20 19
Vcc Vcc STAND BY CH4 10k 10k 10k 10k 10k 20k Level Shift 10k 20k Level Shift 10k 10k

18

17
10k

16
10k

15

10k 10k 10k 10k 10k 10k STAND BY CH1/2/3 Vcc 10k 10k 10k 10k Level Shift

Level Shift

10k

10k

1

2

3

4

5

6

7

8

9

10

11

12

13

14

2.Pin function
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Symbol BLAS IN OPIN1(+) OPIN1(-) OPOUT1 OPIN2(+) OPIN2(-) OPOUT2 GND STBY1 PowVcc1 VO2(-) VO2(+) VO1(-) VO1(+) I/O I I I O I I O I O O O O Function Input for Bias-amplifier Non inverting input for CH1 OP-AMP Inverting input for CH1 OP-AMP Output for CH1 OP-AMP Non inverting input for CH2 OP-AMP Inverting input for CH2 OP-AMP Output for CH2 OP-AMP Substrate ground Input for CH1/2/3 stand by control Vcc for CH1/2 power block Inverted output of CH2 Non inverted output of CH2 Inverted output of CH1 Non inverted output of CH1 Pin No. 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Symbol VO4(+) VO4(-) VO3(+) VO3(-) PowVcc2 STBY2 GND OPOUT3 OPIN3(-) OPIN3(+) OPOUT4 OPIN4(-) OPIN4(+) PreVcc I/O O O O O I O I I O I I Function Non inverted output of CH4 Inverted output of CH4 Non inverted output of CH3 Inverted output of CH3 Vcc for CH3/4 power block Input for Ch4 stand by control Substrate ground Output for CH3 OP-AMP Inverting input for CH3 OP-AMP Non inverting input for CH3 OP-AMP Output for CH4 OP-AMP Inverting input for CH4 OP-AMP Non inverting input for CH4 OP-AMP Vcc for pre block

74VHC574 (DIC16, DIC17) : Flip flop
1. Pin layout
OE D0 D1 D2 D3 D4 D5 D6 D7 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 Vcc O0 O1 O2 O3 O4 O5 O6 O7 CP

2. Pin function Symbol D0-D7 CP OE O0-O7 Function Data Inputs Clock Pulse Input 3-STATE Output Enable Input 3-STATE Outputs

3. Truth table Inputs Dn H L X CP OE L L H Outputs On H L Z

X

H:HIGH Voltage Level L:LOW Voltage Level X:Immaterial Z:High Impedance :HIGH to LOW transition

1-15

TH-A5
ZiVA-5 (U8) : DVD controller
1. Pin layout
DA-IEC958 DA-DATA3 DA-DATA2 VSS VDD_3.3 DA-DATA1 DA-DATA0 DA-BCK DA-LRCK DA-XCK VSS VDDC A_VSS1 A_VDD1 A_VDD2 A_VSS2 XVDD XTAL/VCLK216BP XTAL XVSS VSS_RREF VDAC_RREF VDD_RREF VDAC_DVDD VDAC_DVSS VDAC_0 VDAC_VDD0 VDAC_0B VDAC_1 VDAC_VDD1 VDAC_1B VDAC_2 VDAC_VDD2 VDAC_2B VDAC_3 VDAC_VDD3 VDAC_3B VDAC_4 VDAC_VDD4 VDAC_4B HSYNC/IRQ2 VDATA0 VDATA1 VDATA2 VSS VDD_3.3 VDATA3 VDATA4 VDATA5 VDATA6 VDATA7 VCLK
157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208

156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105

DAI-DATA DAI-BCK/SYSCLKBP DAI-LRCK/IEC958BP I2C_CL I2C_DA RTS1 RXD1 TXD1 CTS1 VSS VDD_3.3 SD-DATA7 SD-DATA6 SD-DATA5 SD-DATA4 VSS VDDC SD-DATA3 SD-DATA2 SD-DATA1 SD-DATA0 SD-REQ SD-EN VSS VDD_3.3 SD-ERROR SD-CLK VSYNC/HIRQ1 RTS2/SPI_CLK RXD2/SPI_MISO TXD2/SPI_MOSI CTS2/SPI_CS VDD_5 HCS4 HCS3 HCS2 HCS1 HCS0 VSS VDD_3.3 TRST TDO TDI TMS TCK RESET ALE VSS VDDC HAD3 HAD2 VSS

104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53

VDD_3.3 VSS MDATA31 MDATA30 MDATA29 MDATA28 VDD_3.3 MDQM3 VSS MDATA27 MDATA26 MDATA25 MDATA24 MDATA23 MDATA22 MDATA21 MDATA20 VDD_3.3 MDQM2 VSS MDATA19 MDATA18 MDATA17 MDATA16 VDDC VSS MDATA15 MDATA14 MDATA13 MDATA12 VDD_3.3 MDQM1 VSS MDATA11 MDATA10 MDATA9 MDATA8 MDATA7 MDATA6 MDATA5 MDATA4 VDD_3.3 MDQM0 VSS MDATA3 MDATA2 MDATA1 MDATA0 MCLK VDD_3.3 VSS MWE

2. Pin function
Name RESET Pin No. 202 105 138 139

VDD_3.3 HA1 HAD15 HAD14 HAD13 HAD12 HAD11 HAD10 HAD9 HAD8 HAD7 VDD_3.3 VSS HAD6 HAD5 HAD4 HAD3 HAD2 HAD1 VDD_3.3 VSS HAD0 HDTACK/WAIT HIRQ0 UDS/UWE LDS/LWE R/W IRRX1 VSS VDDC VSS VDD_3.3 MADDR9 MADDR8 MADDR7 MADDR6 MADDR5 MADDR4 MADDR3 MADDR2 MADDR1 MADDR0 VSS VDD_3.3 MADDR10 MADDR11 BA1 BA0 MCS0 MCS1 MRAS MCAS

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52

(1/4)
Type 1 Description Active Low Reset. Assert for at least 5-milliseconds in the presence of I clock to reset the entire chip. Video clock that outputs 27 MHz. I/O Crystal output. When the internal DCXO is used, a 13.5 MHz crystal O should be con-nected between this pin and the XIN pin. Crystal input. When the internal DCXO is used, a 13.5 MHz crystal should I be con-nected between this pin and the XOUT pin. When an external oscillator or VCXO is used, its output should be connected to this pin. When configured for an external bypass clock, a 216 MHz clock should be connected to this pin. The frequency of an external VCXO can be either 27 or 13.5 MHz.

System Services

VCLK XOUT XIN/bypass clk_216

1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.

1-16

TH-A5
2. Pin function
Pin No. VNW 189 VDDP 12, 20, 111, 152, 167, 181, 196 VDD25 32, 44, 55, 63, 74, 87, 98, 104 XVDD 140 VDD 30, 80, 145, 173, 205 VDD_VDAC[4:0] 118, 121, 124, 127, 130 VDAC_DVDD 133 A_VDD[2:1] 142, 143 VDAC_REFVDD 134 GNDP 13, 21, 112, 153, 166, 180, 195, 208 GND 29, 79, 146, 172, 204 GND25 31, 43, 54, 61, 72, 85, 96, 103 VDAC_DVSS 132 AVSS[2:1] 141, 144 VDAC_REFVSS 136 XVSS 137 HCS[4:2]/GPIO[41:43] 190-192 Name Type 1 Power Power Power Power Power Power

(2/4)
Description 5-V supply voltage for 5V-tolerant I/O signals. 3.3-V supply voltage for I/O signals 3.3-V supply voltage for SDRAM I/O signals 3.3V Crystal interface power 1.8-V supply voltage for core logic Analog Video DAC Power 3.3V Digital supply for 5 DACs 3.3-V Analog PLL Power 3.3V Analog Video Reference Voltage Ground for I/O signals Ground for core logic Ground for SDRAM I/O signals Digital VSS for DACs Analog PLL Ground Video Analog Ground Crystal interface ground Host chip select. Host asserts HCS to select the controller for a read or write operation. The falling edge of this signal triggers the read or write operation. General Purpose I/Os 41, 42, and 43, respectively. Host chip select. Host asserts HCS to select the controller for a read or write operation. The falling edge of this signal triggers the read or write operation. Host (muxed address) address bus. 3-bit address bus selects one of eight host inter-face registers. These signals are not muxed in ATAPI master mode. HA[15:0] is the 16-bit (muxed address and data) bi-directional host data bus through which the host writes data to the decoder Code FIFO. MSB of the 32-bit word is writ-ten first. The host also reads and writes the decoder internal registers and local SDRAM/ROM via HA[7:0]. These signals are not muxed for ATAPI master mode. Host Data Transfer Acknowledge. Host interrupt. Open drain signal, must be pulled-up via 4.7k to 3.3 volts. Driven high for 10 ns before tristate. Host Upper Data Strobe. Host high byte data, HA[15:8], is valid when this pin is active. Host Lower Data Strobe. Host low byte data, HA[7:0], is valid when this pin is active. Read/write strobe Address latch enable Memory chip select. Active LOW SDRAM Column Address Strobe. Active LOW SDRAM Row Address Strobe. These pins are the bytes masks corresponding to MD[7:0], [15:8], [23:16] and [31:24]. They allow for byte reads/writes to SDRAM. SDRAM Address SDRAM Data SDRAM Write Enable. Specifies transaction to SDRAM: read (=1) or write (=0) SDRAM Clock SDRAM bank select Horizontal sync. The decoder begins outputting pixel data for a new horizontal line after the falling (active) edge of HSYNC. Host Interrupt Request 2 General Purpose I/O 9 Video clock. Clocks out data on input. VDATA[7:0]. Clock is typically 27 MHz. Video data bus. Byte serial CbYCrY data synchronous with VCLK. At powerup, the decoder does not drive VDATA. During boot-up, the decoder uses configuration parameters to drive or 3-state VDATA. General Purpose I/Os [1:7] Vertical sync. Bi-directional, the decoder outputs the top border of a new field on the first HSYNC after the falling edge of VSYNC. VSYNC can accept vertical synchroni-zation or top/bottom field notification from an external source. (VSYNC HIGH = bot-tom field. VSYNC LOW = Top field) Active Low Host Interrupt Pin General Purpose I/O 36

Power and Ground

Power Ground Ground Ground Ground Ground Ground Ground O

HCS[1:0]

193, 192

I

HA[3:1]

206, 207, 2

I/O

Host Interface

HA[15:0]

3-11, 14-19, 22

I/O

HDTACK/WAIT HIRQ0 HUDS/UWE HLDS/LWE HREAD ALE MCS[1:0] MCAS MRAS MDQM[3:0] MA[11:0] MD[31:0] MWE MCLK BA[1:0] HSYNC/HIRQ2/ GPIO1[9]

23 24 25 26 27 203 50, 49 52 51 97, 86, 73, 62 46, 45, 33-42 102-99, 95-88, 84-81, 78-75, 71-64, 60-57 53 56 47, 48 116

I/OD I/O I/O I/O I/O I/O O O O O O I/O O O O I/O

Digital Video Input/Output

SDRAM Interface

VCLK VDATA[7:0]/GPIO[1:7]

105 106-110, 113-115

I/O I/O

VSYNC/HIRQ1/ GPIO36

184

I/O

1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.

1-17

TH-A5
2. Pin function
Name SDDATA[7]/VDATA2[7] /HDMARQ/GPIO24 Pin No. 168

(3/4)
Type 1 Description I Compressed data from DVD DSP. Bit 7. In parallel mode, bit 7 is the first (earliest in time) bit in the bitstream, while bit 0 is the last bit. Video Data Bus 2, Bit 7 Host DMA Request General Purpose I/O 24 Compressed data from DVD DSP. Bit 6. Video Data Bus 2, Bit 6 ATAPI Transceiver Enable General Purpose I/O 25 Compressed data from DVD DSP. Bit 5. Video Data Bus 2, Bit 5 Host DMA Acknowledge General Purpose I/O 26 Compressed data from DVD DSP. Bit 4. Video Data Bus 2, Bit 4 General Purpose I/O 27 Compressed data from DVD DSP. Bit 3. Video Data Bus 2, Bit 3 General Purpose I/O 28 Compressed data from DVD DSP. Bit 2. Video Data Bus 2, Bit 2 General Purpose I/O 29 Compressed data from DVD DSP. Bit 1. Video Data Bus 2, Bit 1 General Purpose I/O 30 In serial mode, bit 0 should be used as the input, with the unused bits either used as GPIOs or tied to ground. Video Data Bus 2, Bit 0 General Purpose I/O 31 I Data clock. The maximum frequency is 25 MHz for parallel mode, and ???? MHz for serial mode. The polarity of this signal is programmable. I Error in input data. This signal carries the error bit associated with the channel data type (if set, the byte is corrupted). I Data enable. Assertion indicates that data on SDDATA[7:0] is valid. The polarity of this signal is programmable. General Purpose I/O [33] O Bitstream request. controller asserts SDREQ to indicate that the bitstream input buffer has available space. General Purpose I/O 32 Analog O Video DAC Bias Bits[4:0] Analog O DAC video output format: R, V, C, or CVBS. Macrovision encoded. Analog O DAC video output format: B, U, C, or CVBS. Macrovision encoded. Analog O DAC video output format: G or Y. Macrovision encoded. Analog O DAC video output format: C. Macrovision encoded. Analog O DAC video output format: CVBS or Y. Macrovision encoded. Analog I Video DACs Reference Resistor. Connecting to pin 136 through a 1.18K+/- 1% resis-tor is required. I/O System clock that drives internal PLLs. ZiVA-5 27-MHz TTL oscillator. (See descrip-tion of VCLK for Digital Video Output.) Also optional video clock for internal PLLs or external encoder. O PCM Data Out. Eight channels. Serial audio samples relative to BCK and LRCK. General Purpose I/Os [4:1] O PCM Bit Clock. BCK can be either 48 or 32 times the sampling frequency PCM Left Clock. Identifies the channel for each sample. The polarity is O programma-ble. I/O Audio External Frequency clock input or output. BCK and LRCK are derived from this clock. O PCM data out (IEC-958 format ) or compressed data out (IEC-1937 format). General Purpose I/O [14] I PCM data input. General Purpose I/O [15] I PCM input bit clock. BYPASS_SYSCLK: Alternate function TBS. General Purpose I/O [16] I PCM left/right clock. IEC958 input bypass General Purpose I/O [17]

SDDATA6/VDATA2[6] /HXCVR_EN/GPIO25

169

Parallel DVD/CD or Serial CD Interface

SDDATA5/VDATA2[5] HDMACK/GPIO26

170

SDDATA4/VDATA2[4]/ GPIO27 SDDATA3/ VDATA2[3]/GPIO28 SDDATA2/ VDATA2[2]/GPIO29 SDDATA1/ VDATA2[1]/GPIO30 SDDATA0/ VDATA2[0]/GPIO31

171

174

175

176

177

SDCLK SDERROR SDEN/GPIO33

183 182 179

SDREQ/GPIO32

178

Analog Video Output

VDAC_[4B:0B] VDAC_4 VDAC_3V DAC_2 VDAC_1 VDAC_0 VDAC_REF VCLK

117, 120, 123, 126, 129 119 122 125 128 131 135 105

ADATA[3:0]/GPIO[4:1]

155, 154, 151, 150 149 148 147 156 157 158

Audio Interface Digital Mic In

BCK LRCK XCK IEC958/GPIO14 DAI_DATA/GPIO15 DAI_BCK/ BYPASS_SYSCLK/ GPIO16 DAI_LRCK/ IEC958BP/GPIO17

159

1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.

1-18

TH-A5
2. Pin function
IR Name IRRX1/GPIO0 IDC_CL/GPIO18 IDC Pin No. 28 160

(4/4)
Type 1 Description IR Remote Receive. This input connects to an integrated (photo diode, I band pass, demodulator) IR receiver. General Purpose I/O 0 Serial clock signal for IDC data transfer. It should be pulled up to the I/O positive supply voltage, depending on the device) using an external pull-up resistor. General Purpose I/O [18] Serial data signal for IDC data transfer. It should be pulled up to the supply voltage using an external pull-up resistor. General Purpose I/O [19] Ready to send, UART1 O General Purpose I/O [20] Receive data, UART1 I General Purpose I/O [21] Transmit data, UART1 O General Purpose I/O [22] Clear to send, UART1 I General Purpose I/O [23] Ready to send, UART2 O Serial Peripheral Interface Clock General Purpose I/O [37] Receive data, UART2 I Serial Peripheral Interface - Master Input/Slave Output General Purpose I/O [38] Transmit data, UART2 O Serial Peripheral Interface - Master Output/Slave Input General Purpose I/O [39] Clear to send, UART2 I Serial Peripheral Interface ???? General Purpose I/O [40] Test reset. BST reset - resets the TAP controller. I This signal must be pulled low. Test data Out. BST serial data output. O Test data In. BST serial data chain input. I General Purpose Input pin 0. Test mode select. Controls state of test access port (TAP) controller. I General Purpose Input pin 1. Test clock. Boundary scan test (BST) serial data clock. I

IDC_DA/GPIO19 RTS1/GPIO20 UART1 RXD1/GPIO21 TXD1/GPIO22 CTS1/GPIO23 RTS2/SPI_CLK/ GPIO37 RXD2/SPI_MISO/ GPIO38 TXD2/SPI_MOSI/ GPIO39 CTS2/SPI_CS/ GPIO40 TRST JTAG TDO TDI/GPI0 TMS/GPI1 TCK

161 162 163 164 165 185

186

UART2

187

188

197 198 199 200 201

1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.

3. Block diagram
32-128Mbit SDRAM

SDRAM Controller CCIR 656 Digital Video Composite Y/R C Cr/Pr/G Cb/Pb/B

Parallel/serial DVD Interface

Track Buffer Processor Audio Input Unit

Decryption ZiVA A/V Core Graphics Engine

I2S Stereo In

Interlaced/ Progressive Video Encoder

Five 10-bit Video DACs

System Control Bus SPARC Microprocessor Bus Interface Unit Phase Lock Loop IEC 958/1937 Downmix Left/right Center/subwoofer Left/ right/surround

Audio Output Unit

ASYNC BUS IR

GPIO SPI

UART1&2 ATAPI IDC

JTAG Interface

Remote Control

13.5 MHz Crystal

1-19

TH-A5
CS493292 (DIC11) : Audio decoder
1. Pin layout
A1,SCDIN RD,R/W,EMOE,GPIO11 WR,DS,EMWR,GPIO10 AUDATA3,XMT958 DGND1 VD1 MCLK SCLK LRCLK AUDATA0 AUDATA1
6 5 4 3 2 1 44 43 42 41 40 39 7 38 8 37 9 36 10 35 11 34 12 33 13 32 14 31 15 30 16 29 17 18 19 20 21 22 23 24 25 26 27 28 AUDATA2 DC DD RESET AGND VA FILT1 FILT2 CLKSEL CLKIN CMPREQ,LRCLKN2

A0,SCCLK DATA7,EMAD7,GPIO7 DATA6,ENAD6,GPIO6 DATA5,EMAD5,GPIO5 DATA4,EMAD4,GPIO4 VD2 DGND2 DATA3,EMAD3,GPIO3 DATA2,EMAD2,GPIO2 DATA1,EMAD1,GPIO1 DATA0,EMAD0,GPIO0

2. Block diagram
SCDIO RD WR DATA7:0 R/W DS SCDOUT A0 EMAD7:0 EMOE EMWR PSEL GPIO7:0 CS GPIO11 GPIO10 GPIO9 SCCLK

CS SCDIO,SCDOUT,PSEL,GPIO9 ABOOT,INTERQ EXTMEM,GPIO8 SDATAN1 VD3 DGND3 SCLKN1,STCCLK2 LRCLKN1 CMPDAT,SDATAN2,RCV958 CMPCLK,SCLKN2

RESET

A1 ABOOT EXTMEM SCDIN INTERQ GPIO8

CMPDAT SDATAN2 CMPCLK SCLKN2 CMPREQ LRCLKN2 Compressed Data Input Interface

Parallel or Serial Host Interface

DC DD

Framer Shifter Input Buffer Controller

24-Bit DPS Processing RAM Program Memory ROM Program Memory RAM Data Memory ROM Data Memory

MCLK SCLK RAM Output Buffer

SCLKN1 STCCLK2 LRCLKN1 SDATAN1

Output Formatter

LRCLK AUDATA[2.0]

Digital Audio Input Interface

CLKIN CLKSEL

PLL Clock Manager FILT1 FILT2 VA AGND

RAM Input Buffer

STC

XMT958 /AUDATA3

DGND[3:1]

VD[3:1]

1-20

TH-A5
3. Pin function
Pin No. 1,12,23 2,13,24 3 4 5 6 7 8 9 10 11 14 15 16 17 18 19 20 21 22 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 Symbol VD1,VD2,VD3 DGND1,DGND2,DGND3 AUDATA3,XMT958 WR,DS,EMWR,GPIO10 RD,R/W,EMOE,GPIO11 A1,SCDIN A0,SCCLK DATA7,EMAD7,GPIO7 DATA6,ENAD6,GPIO6 DATA5,EMAD5,GPIO5 DATA4,EMAD4,GPIO4 DATA3,EMAD3,GPIO3 DATA2,EMAD2,GPIO2 DATA1,EMAD1,GPIO1 DATA0,EMAD0,GPIO0 CS SCDIO,SCDOUT,PSEL,GPIO9 ABOOT,INTERQ EXTMEM,GPIO8 SDATAN1 SCLKN1,STCCLK2 LRCLKN1 CMPDAT,SDATAN2 CMPCLK,SCLKN2 CMPREQ,LRCLKM2 CLKIN CLKSEL FILT1 TILT2 VA AGND RESET DC DD AUDATA2 AUDATA1 AUDATA0 LRCLK SCLK MCLK Function Digital Positive Supply Digital Supply Ground SPDIF Transmitter Output, Digital Audio Output 3 Host write strobe or Host data strobe or External Memory write enable or General purpose input& output Number 10 Host Parallel Output Enable or Host Parallel R/W or External Memory Output Enable or General Purpose Input & Output Number11 Host Address Bit One or SPI Serial Control Data Input Host Parallel Address Bit Zero or Serial Control Port Clock Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Host Parallel Chip Select, Host Serial SPI Chip Select Serial Control Port Data Input and Output, Parallel Port Type Select Control Port Interrupt Request, Automatic Boot Enable External Memory Chip Select or General Purpose Input & Output Number 8 PCM Audio Data Input Number One PCM Audio Input Bit Clock PCM Audio Input Sample Rata Clock PCM Audio Data Input Number Tow PCM Audio Input bit Clock PCM Audio Input Sample Rate Clock Master Clock Input DSP Clock Select Phase Locked Loop Filter Phase-Locked Loop Filter Analog Positive Supply Analog Supply Ground Master Reset Input Reserved Reserved Digital Audio Output 2 Digital Audio Output 1 Digital Audio Output 0 Audio Output Sample Rate Clock Audio Output Bit Clock Audio Master Clock

BA4560 (IC2, IC5, IC6, IC7, CIC11, CIC13, FIC2, FIC4, FIC5, FIC6, FIC11, RIC11, RIC13)
: Dual op amp. 1.Pin layout

OUT1 1

8

VCC

IN1 2 + IN1 3

1ch

7

OUT2

+
2ch

+



6

IN2

VEE 4

5

+ IN2

1-21

TH-A5 SP3721A (U7) : DVD driver
1.Pin layout

64 ~ 49 1 ~ 48 ~ 33 17 ~ 32

16

2.Pin function
Pin No.

(1/2) I/O Function I RF Signal Inputs. Differential RF signal attenuator input pins. I I I/O I/O I I I O I O I O I CD Photo detector Interface Inputs. Inputs from the CD photo detector error outputs. Photo Detector Interface Inputs. AC coupled inputs for the DPD from the main beam Photo detector matrix outputs. Differential Phase tracking LPF pin. An external capacitance is connected between this pin and the CN pin. Differential Phase tracking LPF pin. An external capacitance is connected between this pin and the CP pin. Photo Detector Interface Inputs. Inputs from the main beam Photo detector matrix outputs. CD tracking Error Inputs. Inputs from the CD photo detector error outputs. CD Tracking. E-F Opamp output for feedback. Reference Voltage input. DC bias voltage input for the servo input reference. No Connect. Ground. Ground pin for the servo block. APC Input. DVD APC input pin from the monitor photo diode. APC output. DVD APC output pin to control the laser power. APC Input. DVD APC input pin from the monitor photo diode. APC output. DVD APC output pin to control the laser power. APC output. on/off. APC output control pin. A low level activates the LD output. (open high) Reference Voltage output. This pin provides the internal DC bias reference voltage (+2.5+ fix). Output impedance is less than 50 ohms. Reference Voltage input. DC bias voltage input for the servo input reference. Power. Power supply pin for the servo block. Mirror Detect Output. Mirror Detect comparator output. Pseudo CMOS output. MIRR signal Peak hold pin. An external capacitance is connected to between this pin and VPB. MIRR signal Bottom hold pin. An external capacitance is connected to between this pin and VPB. Low Impedance Enable. A TTL compatible input pin that activates the FDCHG switches. A low level activates the switches and the falling edge of the internal FDCHG triggers the fast decay for the NIRR bottom hold circuit. (open high) MIRR signal LPF pin. An external capacitance is connected between this pin and VPB.

Symbol 1 DVDRFP 2 DVDRFN 3,4 PD1,PD2 5~6 A2,B2 7~ 8 C2,D2 9 CP 10 CN

11~14 A,B,C,D 15~16 E,F 17 CDTE 18 VCI2 19 NC 20 VNB 21 DVDPD 22 DVDLD 23 CDPD 24 CDLD 25 LDON# 26 27 28 29 30 31 32 VC VCI VPB MIRR MP MB FDCHG#

33 1-22

MLPF

-

TH-A5
2.Pin function
Pin No.

(2/2) Function I/O O SIGO Bottom Envelope Output. Bottom envelope for Mirror detection. I RF signal Input for Mirror. AC coupled inputs for the mirror detection circuit from the pull-in signal output. (PI) O Pull-in Signal Output. The summing signal output of A,B,C,D or PD1, PD2 for mirror detection. Reference to VCI. O Defect Output. Pseudo CMOS output. When a defect is detected, the DFT output goes high. Also the servo AGC output can be monitored at this pin, When CAR bits 7-4 are '0011'. - PI Top Hold pin. An external capacitance is connected between this pin and VPB. - SIGO Bottom Envelope pin. An external capacitance is connected between this pin and VPB. I Mirror Envelope Input. The SIGO envelope input pin. O Tracking Error Signal Output. Tracking error output reference to VCI. O Focusing Error Signal Output. Focus error output reference to VCI. O Center Error Signal Output. Center error out put reference to VCI. - Center Error LPF pin. An external capacitance is connected between this pin and the LCP pin. - Center Error LPF pin. An external capacitance is connected between this pin and the LCN pin. I Serial Clock. Serial Clock CMOS input. The clock applied to this pin is synchronized with the data applied to SDATA. (Not to be left open). I/O Serial Data. Serial data bi-directional CMOS pin. NRZ programming data for the internal registers is applied to this input. (Not to be left open) I Serial Data Enable. Serial enable CMOS input. A high level input enables the serial port. (Not to be left open) I Hold Control. ATTL compatible control pin which, when pulled high, disables the RF AFC charge pump and holds the RE AGC amplifier gain at its present value. (open high) - Ground. Ground pin for the RF block and serial port. O Differential Normal Output. Filter normal outputs. O Differential Normal Output. Filter normal outputs. I Analog inputs for RF Single Buffer. Differential analog inputs to the RF single-ended output buffer and full wave rectifier. I Analog inputs for RF Single Buffer. Differential analog inputs to the RF single-ended output buffer and full wave rectifier. - Reference Resistor Input. An external 8.2 kohm, 1% resistor is connected from this pin to ground to establish a precise PTAT (proportional to absolute temperature) reference current for the filter. I/O The RF AGC integration capacitor CBYP, is connected between BYP and VPA. O Single Ended Normal Output. SIngle-ended RF output. - Power. Power supply pin for the RF block and serial port. I AGC Amplifier Inputs. Differential AGC amplifier input pins. I AGC Amplifier Inputs. Differential AGC amplifier input pins. O Differential Attenuator Output. Attenuator outputs. O Differential Attenuator Output. Attenuator outputs. I RF Signal Input. Single-ended RF signal attenuator input pin. O CD RF Signal Output. Single ended CD RF summing output.

34 35 36 37

Symbol MEVO MIN PI DFT

38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55

TPH MEV MEI TE FE CE LCN LCP SCLK SDATA SDEN HOLD1 VNA FNN FNP DIP DIN RX

56 57 58 59 60 61 62 63 64

BYP SIGO VPA AIP AIN ATON ATOP CDRF CDRFDC

1-23

TH-A5

W986432DH (U5) : SDRAM
1. Pin layout
QDQ14 VCCQ VCCQ VCCQ DQM1 DQM3 VCCQ VSSQ VSSQ DQ10 DQ28 DQ27 VSSQ 46 41 VCCQ
ROW DECODER

DQ12

DQ11

DQ30

DQ29

DQ26

DQ25

DQ15

DQ13

DQ31

CKE

VSS

VSS

DQ24 45 42 DQ23

DQ9

DQ8

VSS

CLK

Vss

NC

NC

86

85

84

83

82

81

80

79

78

77

76

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

NC

A9

A8

A7

A6

A5

A4

A3

56

55

54

53

52

51

50

49

48

47

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

A10/AP

DQM0

DQM2

VSSQ

DQ16

DQ19

DQ17

DQ18

DQ20

DQ21

DQ22

VCC

DQ0

DQ1

DQ2

DQ5

DQ6

DQ7

VCC

CAS

RAS

BS0

DQ3

DQ4

BS1

NC

WE

NC

VCC

NC

A0

A1

CS

A2

VCCQ

VCCQ

VCCQ

VSSQ

VSSQ

2. Block diagram
CLK CLOCK BUFFER CKE

CONTROL

CS
SIGNAL

RAS CAS

GENERATOR

COMMAND

DECODER WE
ROW DECODER

COLUMN DECODER

VSSQ

COLUMN DECODER

A10

CELL ARRAY BANK #0

VCC
CELL ARRAY BANK #1 SENSE AMPLIFIER

A0 ADDRESS BUFFER

MODE REGISTER

SENSE AMPLIFIER

A9 BS0 BS1

43

1

2

3

4

5

6

7

8

9

44

VSS

NC

DATA CONTROL CIRCUIT COLUMN COUNTER

DQ BUFFER

DQ0 DQ31

REFRESH COUNTER

DQM0~3

3. Pin function
ROW DECODER

COLUMN DECODER
ROW DECODER

COLUMN DECODER

Symbol A0-A10 BS0, BS1 DQ0-DQ31 CS RAS CAS WE DQM0-DQM3 CLK CKE VCC VSS VCCQ VSSQ NC

Function Address Bank Select Data Input/Output Chip Select Row Address Strobe Column Address Strobe Write Enable Input/output mask Clock Inputs Clock Enable Power(+3.3V) Ground Power(+3.3V) for I/O buffer Ground for I/O buffer No Connection

CELL ARRAY BANK #2

CELL ARRAY BANK #3

SENSE AMPLIFIER

SENSE AMPLIFIER

1-24

TH-A5
LC86P6548 (UIC1) : Microcontroller
S47/PF7 S46/PF6 S45/PF5 S44/PF4 S43/PF3 S42/PF2 S41/PF1 S40/PF0 VDD4 S39/PE7 S38/PE6 S37/PE5 S36/PE4 S35/PE3 S34/PE2 S33/PE1 S32/PE0 S31/PD7 S30/PD6 S29/PD5 S28/PD4 S27/PD3 S26/PD2 S25/PD1 S24/PD0 S23/PC7 S22/PC6 S21/PC5 S20/PC4 VP
81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100

1.Pin layout

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51

2.Block diagram
Interrupt Control IR PLA
A15-A0 D7-D0 TA CE OE DASEC

Standby Control

Clock Generator

CF RC X' tal

BaseTimer

SIO0

SIO1

Timer 0

Timer 1

ADC

INT0-3 Noise Filt er SIO Automatic transmission

RAM 128 bytes

VFD Controller Watchdog Timer High voltage Output

P16/BUZ P17/PWM0 P30 P31 P32 P33 P34 P35 P36 P37 P70/INT0 RES XT1/P74 XT2/P75 VSS1 CF1 CF2 VDD1 P80/AN0 P81/AN1 P82/AN2 P83/AN3 P84/AN4 P85/AN5 P86/AN6 P87/AN7 P71/INT1 P72/INT2/T0I P72/INT3/T0I S0/T0

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

S48/PG0 S49/PG1 S50/PG2 S51/PG3 P00 P01 P02 P03 VSS2 VDD2 P04 P05 P06 P07 P10/SO0 P11/SI0/SB0 P12/SCK0 P13/SO1 P14/SI1/SB1 P15/SCK1

50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31

S19/PC3 S18/PC2 S17/PC1 S16/PC0 VDD3 S15/T15 S14/T14 S13/T13 S12/T12 S11/T11 S10/T10 S9/T9 S8/T8 S7/T7 S6/T6 S5/T5 S4/T4 S3/T3 S2/T2 S1/T1

PROM Control

PROM(48KB)

PC

Bus Interface

ACC

Port 1

B Register

Port 3

C Register

Port 7 ALU Port 8

PSW

RAR

RAM

Stack Poi nter

Port 0

1-25

TH-A5
M11B416256A (U1) : DRAM
1. Pin layout
Vcc I/O0 I/O1 I/O2 I/O3 Vcc I/O4 I/O5 I/O6 I/O7 NC NC WE RAS NC A0 A1 A2 A3 Vcc 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 Vss I/O15 I/O14 I/O13 I/O12 Vss I/O11 I/O10 I/O9 I/O8 NC CASL CASH OE A8 A7 A6 A5 A4 Vss

2. Pin function
Symbol Pin No. A0~A10 16~19,22~26 RAS 14 CASH 28 CASL 29 WE 13 OE 27 2~5,7~10,31~34,36~39 I/O0~I/O15 Vcc 1,6,20 Vss 21,35,40 NC 11,12,15,30 I/O I I I I I I I/O Supply Ground Function Address Input Row Address Strobe Column Address Strobe/Upper Byte Control Column Address Strobe/Lower Byte Control Write Enable Output Enable Data Input/ Output Power, 5V Ground No Connect

3. Block diagram

WE CASL CASH

CAS

CONTROL LOGIC

DATA-IN BUFFER
16

NO.2 CLOCK GENERATOR COLUMN ADDRESS BUFFER REFRESH CONTROLLER DATA-OUT BUFFER
16

I/O0 . . I/O15

9

A0 A1 A2 A3 A4 A5 A6 A7 A8

9

COLUMN DECODER
512
8 8

CE

SENSE AMPLIFIERS I/O RATING

REFRESH COUNTER

512 x 16

ROW DECODER

9

512

9

ROW ADDRESS BUFFERS(9)

512 x 512 x 16 MEMORY ARRAY

9

RAS

NO.1 CLOCK GENERATOR

Vcc Vss

1-26

TH-A5
M6759 (U3) : MTP microcontroller
1. Pin layout
44 43 42 41 40 39 38 37 36 35 34

2. Pin function
Pin No. Symbol I/O Description 44 VDD I Power supply for internal operation, 5V input 22 GND I Ground 36,37,38,39, P0.7-P0.0 I/O 8 bits bi-directional I/O port 40,41,42,43, AD7-0 I/O Multiplexed address/data bus 10 RST I Reset signal 21 XTAL1 I Crystal In 20 XTAL2 O Crystal out 32 /PSEN O Program Store Enable Output 33 ALE O Address Latch Enable 9,8,7,6, P1.7-P1.0 I/O 8 bits bi-directional I/O port 5,4,3,2 T2EX(P1.1) I External timer/counter 2 trigger T2(P1.0) I External timer/counter 2. 31,30,29,28, P2.7 I/O 8 bits bi-directional I/O port 27,26,25,24 A15-A8 O 19,18,17,16, P3.7-P3.0 I/O 8-bit bi-directional I/O port 15,14,13,11 /RD(P3.7) O External data memory read strobe /WR(P3.6) O External data memory write strobe T1(P3.5) I External timer/counter 1 T0(P3.4) I External timer/counter . /INT1(P3.3) I External interrupt 1 (Negative Edge Detect) /INT0(P3.2) I External interrupt 0 (Negative Edge Detect) TXD(P3.1) O Serial port output RXD(P3.0) I Serial port input 35 /EAVPP I 1,12,23,34 NC -

1 2 3 4 5 6 7 8 9 10

33 32 31 30 29 28 27 26 25 24

12

13

14

15

16

17

18

19

20

21

3. Block diagram
P0.7:0 P2.7:0 P1.7:0 P3.7:0

Port 0 Drivers

Port 2 Drivers

22

11

23

Port 1 Drivers Serial Port Timer Interrupt Logic

Port 3 Drivers

Port Latch

Port Latch

Port Latch

Data Bus

Data Bus

ACC Program Address Register ALU REG1 64K bytes MTP Memory Program Counter Incrementer Buffer DPTR 512 Bytes RAM RAM Addr. Register ALU REG2

B Register

Data Bus

PSW ALU

Stack Pointer

Data Bus

Instruction Register

OSC

Clock and Control

RST /EAVPP ALE /PSEN

XTAL2 XTAL1

1-27

TH-A5 SST39VF800A (U6) : 8M Flash memory
1. Pin layout
A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# NC NC NC NC A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 NC Vss DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VDD DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# Vss CE# A0

2. Block diagram EEPROM Cell Array

X-Decoder

Memory Address

Address Buffer & Latches Y-Decoder

CE# OE# WE#

Control Logic

I/O Buffers & Data Latches DQ15-DQ0

3. Pin function
To provide memory addresses. During Sector-Erase AMS-A11 address lines will select the sector. During Block-Erase AMS-A15 address lines will select the block. DQ15- DQ0 Data Input/Output To output data during Read cycles and receive input data during Write cycles. Data is internally latched during a Write cycle. The outputs are in tri-state when OE# or CE# is high. To activate the device when CE# is low. CE# Chip Enable OE# Output Enable To gate the data output buffers. To control the Write operations. WE# Write Enable VDD Power Supply To provide power supply voltage: 2.7-3.6V

Symbol AMS- A0

Pin name Address Inputs

Function

Vss NC

Ground No Connection

Unconnected pins.

1-28

TH-A5
LC75725E (UIC10) : VFD driver
1. Pin layout
S9 S10 S11 S12 S13 S14 S15 S16 S17 S18 S19 S20 S21 S22 S23 S24

2. Block diagram
G11 G10 S43 S42 G2 G1 S2
MPX BLK VFL LATCH ADDRESS DETECTOR OSCI OSCO CLOCK GENERATOR

S8 S7 S6 S5 S4 S3 S2 S1 Vss OSCO OSCI VDD BLK CE CL DI

48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 49 32 50 31 51 30 52 29 53 28 54 27 55 26 56 25 57 24 58 23 59 22 60 21 61 20 62 19 63 18 64 17 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

S25 S26 S27 S28 S29 S30 S31 S32 S33 S34 S35 S36 S37 S38 S39 S40

DIGIT DRIVER

SEGMENT DRIVER

GRID CONTROL

DIMMRE TIMING GENERATOR

SHIFT REGISTER TIMING GENERATOR DRIVER

VFL G1 G2 G3 G4 G5 G6 G7 G8 G9 G10 G11 VFL S43 S42 S41

Vss

S1 VDD

DI

CL

3. Pin function Pin No. Symbol
1,13 60 57 59 58 61 VFL VDD Vss OSCI OSCO BLK

I/O
I O I

Function
Driver block power supply connection. (Both pins must be connected.) Logic block power supply connection. Provide a voltage between 4.5 and 5.5V. Power supply connection. Connect to the ground. Oscillator connection. An oscillator circuit is formed by connecting an external resistor and capacitor to these pins. Display off contort input. BLK = Low (Vss)...Display off.(S1 toS43 and G1 to G11 at VFL level.) BLK = High (VDD)...Display on. Note that serial data can be transferred while the display is turned off. Serial data transfer inputs. These pins must be connected to the system microcontroller. CL: Synchronization clock DI: Transfer data CE: Chip enable Digit outputs. These pins are P-channel open drain outputs with pull-down resistors. Segment outputs for displaying the display data transferred by serial data input. These pin are P-channel open drain outputs with pull-down resistors.

63 64 62 2-12 56-14

CL DI CE G1-G11 S1-S43

I

O O

W27L010 (DIC21) : EPROM
1. Pin layout
Vpp A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 Vcc PGM NC A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3

2. Block diagram
PGM CE OE

3. Pin function OUTPUT BUFFER
Q0 Q7
Symbol A0~A16 Q0~Q7 CE OE PGM VPP Vcc GND NC Function Address Inputs Data Inputs/Outputs Chip Enable Output Enable Program Enable Program/Erase Supply Voltage Power Supply Ground No connection

CONTROL

A0
DECODER

A16 Vcc GND VPP

CORE ARRAY

CE

1-29

TH-A5

74VHCT244A (DIC12) : Buffer/Line driver
1. Pin layout
OE1 1 I0 2 O4 3 I1 4 O5 5 I2 6 O6 7 I3 8 O7 9 GND10 20 Vcc 19 OE2 18 O0 17 I4 16 O1 15 I5 14 O2 13 I6 12 O3 11 I7 OE2 L L H
H:HIGH Voltage Level L:LOW Voltage Level I:Immaterial Z:High Impedance

2. Pin function
Symbol OE1,OE2 I0-I7 O0-O7 Function 3-STATE Output Enable Inputs Inputs 3-STATE Outputs

3. Truth table
Inputs OE1 L L H Inputs In L H X In L H X Outputs (Pins12,14,16,18) L H Z Outputs (Pins3,5,7,9) L H Z

74LVT573 (U10, U11, U12) : Latch
1. Pin layout
OE D0 D1 D2 D3 D4 D5 D6 D7 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 Vcc O0 O1 O2 O3 O4 O5 O6 O7 LE

2. Pin function Symbol D0-D7 LE OE O0-O7 Function Data Inputs Latch Enable Input Output Enable Input 3-STATE Latch Outputs

3. Truth table Inputs LE X H H L OE H L L L Dn X L H X Outputs On Z L H O0

H:HIGH Voltage Level L:LOW Voltage Level Z:High Impedance X:Immaterial O0:Previous O0 before HIGH to LOW transition of Latch Enable

MM74HCT245 (U15) : Transceiver
1. Pin layout
ENABLE Vcc 20 G 19 B1 18 B2 17 B3 16 B4 15 B5 14 B6 13 B7 12 B8 11

2. Truth table
Control Inputs G L L H DIR L H X Operation 245 B data to A bus A data to B bus isolation

H=HIGH Level L=LOW Level X=Irrelevant

1 DIR

2 A1

3 A2

4 A3

5 A4

6 A5

7 A6

8 A7

9 A8

10 GND

1-30

TH-A5

CS8415A (DIC14) : Digital audio receiver
1. Pin layout
SDA/CDOUT AD0/CS EMPH RXP0 RXN0 VA+ AGND FILT RST RMCK RERR RXP1 RXP2 RXP3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 SCL/CCLK AD1/CDIN RXP6 RXP5 H/S VD+ DGND OMCK U INT SDOUT OLRCK OSCLK RXP4

2. Pin function
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12,13 14,15 25,26 16 17 18 19 20 21 22 23 24 27 28 Symbol SDA/CDOUT AD0/CS EMPH RXP0 RXN0 VA+ AGND FILT RST RMCK RERR RXP1,RXP2 RXP3,RXP4 RXP5,RXP6 OSCLK OLRCK SDOUT INT U OMCK DGND VD+ H/S AD1/CDIN SCL/CCLK I/O I/O I/O O I I I O O I/O O I Function Serial Control Data I/O(I2C) / Data Out(SPI) Address Bit 0(I2C) / Control Port Chip Select(SPI) Pre-Emphasis AES3/SPDIF Receiver Power Positive Analog Power Analog Ground PLL Loop Filter Reset Input Section Recovered Master Clock Receiver Error Additional AES3/SPDIF Receiver Port

I/O I/O O O O I I I I I I

Serial Audio Output Bit Clock Serial Audio Output Left/Right Clock Serial Audio Output Data Interrupt User Data System Clock Digital Ground Positive Digital Power Hardware/Sofrware Mode Control Address Bit 1(I2C) / serial Control Data in (SPI) Control Port Clock

3. Block diagram
VA+ AGND FILT RERR RMCK VD+ DGND OMCK

RSN0

Receiver

Clock & Data Recovery

AES S/PDIF Decoder

C&U bit Data Buffer

Serial Audio Output

OLRCK OSCLK SDOUT

RXP6 RXP5 RXP4 RXP3 RXP2 RXP1 RXP0

7:1 MUX Misc. Control

Control Port & Registers

H/S

RST

EMPH U

SCL/ AD1/ SDA/ CDOUT CCLK CDIN

AD0/ CS

INT

1-31

TH-A5

FAN8082 (U10) : DC motor driver
1.Pin layout
GND

2. Block diagram

1

8

VO2

GND VO1

1

DRIVER OUT

8

VO2

VO1

2

7

PVCC

2

7

PVCC

PRE DRIVER VCTL

3

5

SVCC

VCTL

3

TSD

BIAS

6

SVCC

VIN1

4

6

VIN2

VIN1

4

LOGIC SWITCH

5

VIN2

3. Pin function
Pin No. 1 2 3 4 5 6 7 8 Symbol GND VO1 VCTL VIN1 VIN2 SVCC PVCC VO2 I/O O I I I O Ground Output 1 Motor speed control Input 1 Input 2 Supply voltage (Signal) Supply voltage (Power) Output 2 Function

KA78R05 (PQ2,PQ6)/ KA78R08 (PQ5)/ KA278R05 (PQ1)/ KA278R33 (PQ4) : Regulator
1. Block diagram
Vin 1 Q1 2 Vo

THERMAL SHUTDOWN

OVERVOLTAGE PROTECTION

BANDGAP REFERENCE

+ R1

SOA PROTECTION HIGH / LOW Vdis 4 + OUTPUT ON / OFF

1.4V

SHORT-CIRCUIT SHORTCIRCUIT
PROTECTION

R2

3 GND

1-32

TH-A5
CS4228A (DIC15) : D/A converter
1. Pin layout
SDIN3 SDIN2 SDIN1 SDOUT SCLK LRCK DGND VD VL MCLK SCL/CCLK SDA/CDIN AD0/CS RST 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 SUB CENTER SR SL FR FL AGND VA AINL+ AINLFILT AINRAINR+ MUTEC

2. Pin function Pin No.
1,2,3 4 5 6 7 8 9 10 11 12 13 14 15 16,17 19,20 18 21 22 23,24,25 26,27,28

Symbol
SDIN1 SDIN2 SDIN3 SDOUT SCLK LRCK DGND VD VL MCLK SCL/CCLK SDA/CDIN ADO/CS RST MUTEC AINR+,AINRAINL+,AINLFILT VA AGND FR,FL,SR,SL SUB,CENTER

Function Serial Audio Data In Serial Audio Data Out Serial Clock Left/Right Clock Digital Ground Digital Power Digital Interface Power Master Clock Serial Control Interface Clock Serial Control Data I/O Address Bit 0/ Chip Select Reset Mute Control Differential Analog Inputs Internal Voltage Filter Analog Power Analog Ground Analog Outputs

74LCX244 (DIC13) : Bus buffer
1. Pin layout 2. Pin function Pin No.
1G 1 1A1 2 2Y4 3 1A2 4 2Y3 5 1A3 6 2Y2 7 1A4 8 2Y1 9 GND10 20 Vcc 19 2G 18 1Y1 17 2A4 16 1Y2 15 2A3 14 1Y3 13 2A2 12 1Y4 11 2A1

Symbol 1G 1A1 to 1A4 2Y1 to 2Y4 2A1 to 2A4 1Y1 to 1Y4 2G GND Vcc

Function Output Enable Input Data Inputs Data Outputs Data Inputs Data Outputs Outputs Enable Input Ground(0V) Positive Supply Voltage

1 2,4,6,8 9,7,5,3 11,13,15 17 18,16,14 12 19 10 20

3. Truth table INPUT G L L H An L H X OUTPUT Yn L H Z

X:"H"or"L" Z:High impedance

1-33

TH-A5

VICTOR COMPANY OF JAPAN, LIMITED AUDIO & COMMUNICATION BUSINESS DIVISION PERSONAL & MOBILE NETWORK BUSINESS UNIT. 10-1,1chome,Ohwatari-machi,Maebashi-city,371-8543,Japan

(No.21062)

200201(V)