Agilent 5991-3686EN Mapping the Mechanical Properties of SAC 305 Solder with Express Test - Application Note free download

File name 5991-3686EN Mapping the Mechanical Properties of SAC 305 Solder with Express Test - Application Note

Keysight Technologies Mapping the Mechanical Properties of SAC 305 Solder with Express Test Application Note Abstract Electronic packaging reliability depends largely on the me- chanical integrity of soldered interconnects. Thus, the purpose of this work was to use a new nano-indentation technique, Express Test, to map the hardness of a SAC 305 solder joint with gold plating. In this study after extended aging, the solder joint comprised three constituents: a tin-rich matrix, a bulk intermetallic AuSn4, and an interfacial intermetallic (Cu, Ni, Au)6Sn51. The softest material was the tin-rich matrix, which had a hardness of 0.51