Sony M200MC free download

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M-200MC SERVICE MANUAL Ver 1.1 2002. 01 US Model Canadian Model AEP Model E Model Chinese Model Model Name Using Similar Mechanism Tape Transport Mechanism Type NEW MZ-200MC-99 SPECIFICATIONS Tape (normal position type) Recording system 2-track 1-channel monaural Speaker Approx. 2.8 cm (11/8 in.) dia. Tape speed 2.4 cm/s (15/16 ips), 1.2 cm/s (15/32 ips) Frequency range 300 - 4 000 Hz (with TAPE SPEED switch at 2.4 cm) Output Earphone jack (minijack) for 8 ­ 300 earphone Power output (at 10% harmonic distortion) 250 mW Power requirements 3 V DC, two R03 (size AAA) batteries/External DC 3V power sources Dimensions (w/h/d) Approx. 27.8 Ч 127 Ч 69 mm (11/8 Ч 5 Ч 23/4 in.) incl. projecting parts and controls Mass Approx. 140 g (5 oz) (main unit only) Design and specifications are subject to change without notice. MICROCASSETTETM-CORDER 9-873-133-12 2002A1600-1 © 2002.1 Sony Corporation Personal Audio Company Published by Sony Engineering Corporation M-200MC TABLE OF CONTENTS 1. GENERAL ·········································································· 3 2. DISASSEMBLY ································································ 4 2-1. 2-2. 2-3. 2-4. 2-5. 2-6. 2-7. 2-8. Lid Assy, Cassette ································································· 4 Lid Assy, Battery Case ·························································· 4 Cabinet (Rear) Assy ······························································ 5 Main Board ··········································································· 5 Microphone, Built-in C-2038 set ·········································· 6 Speaker, LED Board ····························································· 6 Mechanism Deck ·································································· 7 Head, Ceramic (HRPE901, 902) ··········································· 7 3. MECHANICAL ADJUSTMENTS ······························· 8 4. ELECTRICAL ADJUSTMENTS ································· 8 5. DIAGRAMS ········································································ 9 5-1. Block Diagram ···································································· 10 5-2. Printed Wiring Board ·························································· 11 5-3. Schematic Diagram ····························································· 12 6. EXPLODED VIEWS ······················································ 13 6-1. Cabinet Section ··································································· 13 6-2. Mechanism Deck (1) ··························································· 15 6-3. Mechanism Deck (2) ··························································· 16 7. ELECTRICAL PARTS LIST ······································· 17 Notes on Chip Component Replacement · Never reuse a disconnected chip component. · Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing · Keep the temperature of the soldering iron around